JPH088239B2 - ECR plasma device - Google Patents

ECR plasma device

Info

Publication number
JPH088239B2
JPH088239B2 JP63022245A JP2224588A JPH088239B2 JP H088239 B2 JPH088239 B2 JP H088239B2 JP 63022245 A JP63022245 A JP 63022245A JP 2224588 A JP2224588 A JP 2224588A JP H088239 B2 JPH088239 B2 JP H088239B2
Authority
JP
Japan
Prior art keywords
microwave
solenoid
substrate
vacuum container
ecr plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63022245A
Other languages
Japanese (ja)
Other versions
JPH01196826A (en
Inventor
潔 大岩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP63022245A priority Critical patent/JPH088239B2/en
Publication of JPH01196826A publication Critical patent/JPH01196826A/en
Publication of JPH088239B2 publication Critical patent/JPH088239B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、マイクロ波を発生する手段と、このマイ
クロ波を伝達する手段と、このマイクロ波伝達手段と結
合されて前記マイクロ波が導入されかつガス供給手段を
介して送入されたガスをこのマイクロ波との共鳴効果に
よりプラズマ化して活性な原子,分子またはイオンを生
ずる磁力線を発生するソレノイドにより同軸に包囲され
るとともに磁力線に沿って移送される前記活性は原子,
分子またはイオンにより表面にエッチングが施されまた
は薄膜が生成される基板が配される真空容器と、この真
空容器の排気を行う排気手段とを備えたECRプラズマ装
置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a means for generating a microwave, a means for transmitting the microwave, and a microwave which is coupled to the means for transmitting the microwave. The gas introduced through the gas supply means is coaxially surrounded by a solenoid that generates magnetic lines of force that generate active atoms, molecules, or ions by plasmaizing the gas by the resonance effect with the microwaves, and is transported along the magnetic lines of force. Said activity being an atom,
The present invention relates to an ECR plasma device provided with a vacuum container in which a substrate whose surface is etched or molecules are formed by molecules or ions is arranged, and an exhaust means for exhausting the vacuum container.

〔従来の技術〕[Conventional technology]

第3図に従来のECRプラズマ装置の構成例を示す。こ
の装置は、ここには図示されていないが、マイクロ波を
発生する手段としてのマグネトロンから発振されたマイ
クロ波を伝達する導波管1と、誘電体からなる真空窓2
を介して前記マイクロ波が導入されかつガス供給手段4
を介して送入されたガスを前記導入されたマイクロ波と
の共鳴効果によりプラズマ化して活性な原子,分子また
はイオンを生ずる磁力線8を発生する励磁ソレノイド6
により同軸に包囲されるとともに磁力線8に沿って移送
される前記活性な原子,分子またはイオンにより表面に
エッチングが施されまたは薄膜が生成される基板11が配
される真空容器3と、この真空容器の排気を行う,図示
されない排気手段とを備えてなっている。
FIG. 3 shows a configuration example of a conventional ECR plasma device. Although not shown here, this device includes a waveguide 1 for transmitting microwaves oscillated from a magnetron as a means for generating microwaves, and a vacuum window 2 made of a dielectric material.
The microwave is introduced through the gas supply means 4
Exciting solenoid 6 for generating a magnetic force line 8 which turns the gas introduced through the plasma into a plasma by the resonance effect with the introduced microwave and produces active atoms, molecules or ions.
A vacuum container 3 in which is arranged a substrate 11 whose surface is etched or a thin film is formed by the active atoms, molecules or ions that are coaxially surrounded by and are transported along the magnetic field lines 8, and this vacuum container. And an exhaust means (not shown) for exhausting the exhaust gas.

このように構成されたECRプラズマ装置により基板表
面にエッチング加工を施す際には、ガス供給手段4から
エッチング用ガスを真空容器3内のプラズマ発生部7へ
送り込んでプラズマ化し、このプラズマ化により生じた
活性な原子,分子またはイオンを磁力線8に沿って基板
表面まで移送して基板表面をエッチングする。また、基
板表面に薄膜を生成する場合には、まずガス供給手段4
からN2などのプラズマ原料ガスを真空容器3内のプラズ
マ発生部7ほ送り込んでこれをプラズマ化する。このプ
ラズマはプラズマ発生部の開口7aから磁力線8に沿って
処理部9へ押し出され、成膜ガス供給手段12を介してこ
の処理部内へ送入された成膜ガスを活性化して基板表面
に作用させ、基板表面に薄膜を生成させる。
When the substrate surface is etched by the ECR plasma apparatus configured as described above, the etching gas is sent from the gas supply means 4 to the plasma generation unit 7 in the vacuum container 3 to generate plasma, which is generated by this plasma generation. The active atoms, molecules or ions are transferred to the substrate surface along the magnetic lines of force 8 to etch the substrate surface. When a thin film is formed on the surface of the substrate, first, the gas supply means 4
From this, a plasma source gas such as N 2 is sent to the plasma generation part 7 in the vacuum container 3 to turn it into plasma. This plasma is extruded from the opening 7a of the plasma generation unit to the processing unit 9 along the magnetic lines of force 8, and activates the film forming gas fed into the processing unit through the film forming gas supply means 12 to act on the substrate surface. Then, a thin film is formed on the surface of the substrate.

〔発明が解決しようとする課題〕[Problems to be Solved by the Invention]

このように構成されたECRプラズマ装置における問題
点はつぎの通りである。すなわち、プラズマ発生部7で
生成されたプラズマは磁力線8に沿って処理部9へ移送
される。このため、基板表面の励磁ソレノイド軸線位置
まわりの中心部に基板に作用するプラズマが集中する傾
向を生じ、エッチングもしくは薄膜生成時の基板の加工
速度が基板中央部で速く、周縁部でおそくなり、処理速
度の分布を一様にすることができなかった。
The problems with the ECR plasma device configured as described above are as follows. That is, the plasma generated by the plasma generating unit 7 is transferred to the processing unit 9 along the magnetic lines of force 8. Therefore, the plasma acting on the substrate tends to concentrate in the central portion around the excitation solenoid axis position on the substrate surface, the processing speed of the substrate during etching or thin film formation is high in the central portion of the substrate, and slow in the peripheral portion, The distribution of processing speed could not be made uniform.

この発明の目的は、従来のECRプラズマ装置における
前記従来の欠点を除去し、基板表面の処理速度の分布を
一様にして基板表面が均一にエッチングされあるいは均
一な薄膜が生成されるECRプラズマ装置を提供すことで
ある。
An object of the present invention is to eliminate the above-mentioned conventional drawbacks in the conventional ECR plasma apparatus, and to make the processing speed distribution on the substrate surface uniform so that the substrate surface is uniformly etched or a uniform thin film is generated. Is to provide.

〔課題を解決するための手段〕[Means for solving the problem]

上記目的を達成するために、この発明によれば、マイ
クロ波を発生する手段と、このマイクロ波を伝達する手
段と、このマイクロ波伝達手段と結合されて前記マイク
ロ波が導入されかつガス供給手段を介して送入されたガ
スをこのマイクロ波との共鳴効果によりプラズマ化して
活性な原子,分子またはイオンを生ずる磁力線を発生す
るソレノイドより同軸に包囲されるとともに磁力線に沿
って位相される前記活性な原子,分子またはイオンによ
り表面にエッチングが施されまたは薄膜が生成される基
板が配される真空容器と、この真空容器の排気を行う排
気手段とを備えたECRプラズマ装置において、前記基板
の近傍に前記ソレノイドの軸線と直交する磁力線を発生
させるとともにこの磁力線を前記ソレノイドの軸線を直
交する平面内で回転させる、電圧位相が90度ずれた二相
交流電源に接続される2組のソノイドもしくは電圧位相
が60度ずれた三相交流電源に接続される3組のソレノイ
ドにより構成される回転磁場発生手段を前記真空容器の
外側に備えしめるものとする。
In order to achieve the above object, according to the present invention, means for generating microwaves, means for transmitting the microwaves, and means for supplying the microwaves coupled to the means for transmitting the microwaves and gas supply means The gas that has been introduced through the plasma is converted into plasma by the effect of resonance with the microwave and is surrounded by a solenoid that generates lines of magnetic force that generate active atoms, molecules or ions, and is phased along the lines of magnetic force. In an ECR plasma device equipped with a vacuum container in which a substrate whose surface is etched or a thin film is formed by various atoms, molecules or ions is arranged, and an exhaust means for exhausting the vacuum container, in the vicinity of the substrate. Generate a magnetic field line orthogonal to the solenoid axis and rotate the magnetic field line in a plane orthogonal to the solenoid axis. A rotating magnetic field generating means composed of two sets of sonoids connected to a two-phase AC power supply with a voltage phase shift of 90 degrees or three sets of solenoids connected to a three-phase AC power supply with a voltage phase shift of 60 degrees. It should be provided outside the vacuum container.

〔作用〕[Action]

このように、基板の近傍に励磁ソレノイドの軸線と直
交する磁力線を発生させるととにこの磁力線を励磁ソレ
ノイドの軸線と直交する平面内で回転させる、電圧位相
が90度ずれた二相交流電源に接続される2組のソノイド
もしくは電圧位相が60度ずれた三相交流電源に接続され
る3組のソレノイドにより構成される回転磁場発生手段
を真空容器の外側に設けることにより、基板中央部に到
達しようとする,密度の高いプラズマは、回転磁場発生
手段が発生する,励磁ソレノイドの軸線と直交する磁力
線に沿って基板周縁部へ移動しながら励磁ソレノイドの
軸線まわりに回転する,渦巻き軌道の移動成分を与えら
れる。これにより、プラズマ密度の低い基板周縁部の処
理速度が促進され、基板表面のより均一なエッチング加
工または薄膜生成が可能になる。
In this way, when a magnetic field line that is orthogonal to the axis of the excitation solenoid is generated near the substrate, and this magnetic field line is rotated in a plane that is orthogonal to the axis of the excitation solenoid, a two-phase AC power source with a 90 ° voltage phase shift is created. By providing the rotating magnetic field generating means composed of two sets of connected sonoids or three sets of solenoids connected to a three-phase AC power supply with a voltage phase difference of 60 degrees outside the vacuum container, the central portion of the substrate is reached. The high-density plasma to be rotated rotates around the axis of the exciting solenoid while moving to the peripheral portion of the substrate along the line of magnetic force generated by the rotating magnetic field generating means and orthogonal to the axis of the exciting solenoid. Is given. As a result, the processing speed of the peripheral portion of the substrate having low plasma density is promoted, and more uniform etching processing or thin film formation on the substrate surface becomes possible.

〔実施例〕〔Example〕

第1図に、本発明に基づいて構成されるECRプラズマ
装置の一実施例を示す。第3図と同一の部材には同一の
符号を付して説明を省略する。基板近傍の真空容器13の
外側に真空容器13を挟んで2個の磁心入りソレノイド24
を対向配置する。さらに、この2個のソレノイド24に共
通の軸線と励磁ソレノイド6の軸線とに直角方向にも2
個の磁心入りソレノイド25を対向配置する。この2組の
ソレノイド24,25の配置状況を第2図の平面図に示す。
この2組のソレノイドに流す電流を交流とし、かつこの
電流の位相が90度ずれるようにすることによって、励磁
ソレノイド6の軸線と直交する平面内で時間的に方向が
回転する磁界を発生させることができる。すなわち、電
圧位相が90度ずれた二相交流電源に接続される2組のソ
レノイドが回転磁界発生手段を構成する。これにより、
プラズマ発生部17で発生したプラズマは、処理部19に配
した基板11に均一に移送される。
FIG. 1 shows an embodiment of an ECR plasma device constructed according to the present invention. The same members as those in FIG. 3 are designated by the same reference numerals and the description thereof will be omitted. Two solenoids with a magnetic core 24 sandwiching the vacuum container 13 outside the vacuum container 13 near the substrate 24
Are opposed to each other. In addition, the axis common to the two solenoids 24 and the axis of the exciting solenoid 6 are also perpendicular to each other.
The solenoids 25 with magnetic cores are arranged to face each other. The arrangement of the two sets of solenoids 24, 25 is shown in the plan view of FIG.
A magnetic field whose direction rotates temporally in a plane orthogonal to the axis of the exciting solenoid 6 is generated by making alternating currents flowing through the two sets of solenoids and shifting the phases of the currents by 90 degrees. You can That is, two sets of solenoids connected to a two-phase AC power source whose voltage phases are shifted by 90 degrees form a rotating magnetic field generating means. This allows
The plasma generated in the plasma generation unit 17 is uniformly transferred to the substrate 11 arranged in the processing unit 19.

なお、回転磁界の発生は、三相交流電源に接続され
る,同一平面内に60度づつずれて配された3組のソレノ
イドによっても可能であることは明らかである。
It is obvious that the rotating magnetic field can also be generated by three sets of solenoids that are connected to a three-phase AC power supply and are arranged in the same plane and are deviated by 60 degrees.

〔発明の効果〕〔The invention's effect〕

以上に述べたように、本発明によれば、マイクロ波を
発生する手段と、このマイクロ波を伝達する手段と、こ
のマイクロ波伝達手段とを結合されて前記マイクロ波が
導入されかつガス供給手段を介して送入されたガスをこ
のマイクロ波との共鳴効果によりプラズマ化して活性な
原子,分子またはイオンを生ずる磁力線を発生するソレ
ノイドにより同軸に包囲されるとともに磁力線に沿って
位相される前記活性な原子,分子またはイオンにより表
面にエッチングが施されまたは薄膜が生成される基板が
配される真空容器と、この真空容器の排気を行う排気手
段とを備えたECRプラズマ装置において、前記基板の近
傍に前記ソレノイドの軸線と直交する磁力線を発生する
とともにこの磁力線を前記ソレノイドの軸線と直交する
平面内で回転させる、電圧位相が90度ずれた二相交流電
源に接続される2組のソノイドもしくは電圧位相が60度
ずれた三相交流電源に接続される3組のソレノイドによ
り構成される回転磁場発生手段を前記真空容器の外側に
備えしめたので、真空容器内のプラズマ発生部から励磁
ソレノイドが発生する磁力線に沿って基板方向へ移送さ
れる,中心部の密度の高いプラズマが、基板近傍におい
て、前記励磁ソレノイドの軸線と直交する平面内で基板
中央部から周縁部へ渦巻き状に軌道を画こうとする移動
成分を与えられるから、密度の高い中心部のプラズマが
基板周縁部へ向かって移動し、周縁部の処理速度が促進
され、基板表面のより均一なエッチング加工または薄膜
形成が可能になる。しかも本発明による装置構成は従来
の装置本体に何らの変更を加えることなく可能であり、
基板表面のより均一な加工が安直に可能となるメリット
がある。
As described above, according to the present invention, means for generating a microwave, means for transmitting the microwave, and means for transmitting the microwave are combined to introduce the microwave and gas supply means. The gas, which is sent through the plasma, is coaxially surrounded by a solenoid that generates lines of magnetic force that generate active atoms, molecules, or ions by plasmaizing the gas by the resonance effect with the microwave, and the phase is aligned with the lines of magnetic force. In an ECR plasma device equipped with a vacuum container in which a substrate whose surface is etched or a thin film is formed by various atoms, molecules or ions is arranged, and an exhaust means for exhausting the vacuum container, in the vicinity of the substrate. A line of magnetic force orthogonal to the axis of the solenoid is generated, and the line of magnetic force is rotated in a plane orthogonal to the axis of the solenoid. The rotating magnetic field generating means composed of two sets of sonoids connected to a two-phase AC power supply with a phase difference of 90 degrees or three sets of solenoids connected to a three-phase AC power supply with a phase difference of 60 degrees is used as the vacuum. Since it is provided on the outside of the container, plasma having a high density at the center is transferred from the plasma generating part in the vacuum container toward the substrate along the magnetic field lines generated by the exciting solenoid. In the plane orthogonal to the axis, a moving component that attempts to draw a spiral trajectory from the substrate center to the peripheral edge is given, so that the plasma in the central area with high density moves toward the peripheral edge of the substrate, The processing speed is accelerated, and more uniform etching processing or thin film formation on the substrate surface becomes possible. Moreover, the device configuration according to the present invention is possible without making any changes to the conventional device body,
There is an advantage that more uniform processing of the substrate surface can be performed easily.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の一実施例によるECRプラズマ装置の縦
断面図、第2図は回転磁場発生手段を構成するソレノイ
ドの真空容器まわりの配置状況を示す平面図、第3図は
従来例によるECRプラズマ装置の構成を示す縦断面図で
ある。 1:導波管(マイクロ波伝達手段)、3,13:真空容器、4:
ガス供給手段、6:励磁ソレノイド(ソレノイド)、7,1
7:プラズマ発生部、8:磁力線、9,19:処理部、24,25:ソ
レノイド。
FIG. 1 is a vertical sectional view of an ECR plasma device according to an embodiment of the present invention, FIG. 2 is a plan view showing the arrangement of solenoids constituting a rotating magnetic field generating means around a vacuum container, and FIG. 3 is a conventional example. FIG. 3 is a vertical sectional view showing the configuration of an ECR plasma device. 1: Waveguide (microwave transmission means), 3, 13: Vacuum container, 4:
Gas supply means, 6: Excitation solenoid (solenoid), 7,1
7: Plasma generating part, 8: Magnetic field lines, 9,19: Processing part, 24, 25: Solenoid.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】マイクロ波を発生する手段と、このマイク
ロ波を伝達する手段と、このマイクロ波伝達手段と結合
されて前記マイクロ波が導入されかつガス供給手段を介
して送入されたガスをこのマイクロ波との共鳴効果によ
りプラズマ化して活性な原子,分子またはイオンを生じ
る磁力線を発生するソレノイドにより同軸に包囲される
とともに磁力線に沿って移送される前記活性な原子,分
子またはイオンにより表面にエッチングが施されまたは
薄膜が生成される基板が配される真空容器と、この真空
容器の排気を行う排気手段を備えたECRプラズマ装置に
おいて、前記基板の近傍に前記ソレノイドの軸線と直交
する磁力線を発生させるとともにこの磁力線を前記ソレ
ノイドの軸線と直交する平面内で回転させる、電位移送
が90度ずれた二相交流電源に接続される2組のソレノイ
ドもしくは電圧移送が60度ずれた三相交流電源に接続さ
れる3組のソレノイドにより構成される回転磁場発生手
段を前記真空容器の外側に備えていることを特徴とする
ECRプラズマ装置。
1. A means for generating a microwave, a means for transmitting the microwave, and a gas which is coupled to the microwave transmitting means and into which the microwave is introduced and which is fed through a gas supply means. The active atoms, molecules or ions are coaxially surrounded by a solenoid that generates lines of magnetic force to generate active atoms, molecules or ions that are plasmatized by the resonance effect with the microwave and are transferred along the lines of magnetic force to the surface. In an ECR plasma device equipped with a vacuum container in which a substrate on which etching or a thin film is formed is arranged, and an ECR plasma device equipped with exhaust means for exhausting the vacuum container, a magnetic field line orthogonal to the axis of the solenoid is provided in the vicinity of the substrate. Generate and rotate this line of magnetic force in a plane orthogonal to the axis of the solenoid. A rotating magnetic field generating means constituted by two sets of solenoids connected to a power source or three sets of solenoids connected to a three-phase alternating current power source with a voltage shift of 60 degrees is provided outside the vacuum container. To
ECR plasma equipment.
JP63022245A 1988-02-02 1988-02-02 ECR plasma device Expired - Lifetime JPH088239B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63022245A JPH088239B2 (en) 1988-02-02 1988-02-02 ECR plasma device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63022245A JPH088239B2 (en) 1988-02-02 1988-02-02 ECR plasma device

Publications (2)

Publication Number Publication Date
JPH01196826A JPH01196826A (en) 1989-08-08
JPH088239B2 true JPH088239B2 (en) 1996-01-29

Family

ID=12077410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63022245A Expired - Lifetime JPH088239B2 (en) 1988-02-02 1988-02-02 ECR plasma device

Country Status (1)

Country Link
JP (1) JPH088239B2 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0565212A2 (en) * 1986-12-19 1993-10-13 Applied Materials, Inc. Iodine etch process for silicon and silicides
JPS63244615A (en) * 1987-03-30 1988-10-12 Mitsubishi Electric Corp Plasma treatment system

Also Published As

Publication number Publication date
JPH01196826A (en) 1989-08-08

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