JPH0878121A - Ic socket - Google Patents

Abstract

PURPOSE: To provide an IC socket by continuously operating a contact pin at two steps with the rotation of an operating shaft member in one direction to make contact with, separate from and wipe an electronic part. CONSTITUTION: A plurality of contact pins 4 juxtaposed in a base plate 2 have an external connecting terminal 4b, a contact part 4c, a first spring part 4d, a second spring part 4e, a projection 4g and an extension part 4f. An arm 3a is juxtaposed in an operating shaft member 3 and projections 3b, 3c and a rib 3d are alternately juxtaposed along the axial direction. A projection 4g is brought into contact between the projections 3b, 3c. When the operating shaft member 3 is rotated clockwise, the projection 4g follows the projection 3b to bring the contact part 4c into contact with the electronic part 1, and next, the contact part 4c is pushed by the projection 3c to slide the contact part 4c, thereby wiping the terminal surface of the electronic part 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is characterized in that it is connected and arranged mainly on a printed wiring board, an electronic component such as an IC is exchangeably loaded, and the electronic component is electrically connected to the printed wiring board. IC socket.

[0002]

2. Description of the Related Art Usually, when an electronic component is loaded in an IC socket, the electronic component is placed in a housing portion of the IC socket from above by a hand or an automatic device, and is moved by a holding member provided in the IC socket. By holding it so that it cannot be held, good contact with the contact pin provided in the IC socket is maintained. The electronic component loaded in such an IC socket is usually in the form of a flat package sealed with epoxy resin or the like. The terminals are classified into those directly provided on the surface of the substrate parallel to the package and those of the lead type, and those of the lead type include those in which the leads are extended in the horizontal direction of the package and those in the vertical direction. Some have been extended to.

Of the above, the present invention is used for an electronic component in which terminals are directly provided on a substrate surface of a package or a surface equivalent thereto, and an electronic component in which leads extend in the horizontal direction of the package, and The present invention relates to an IC socket of a type in which a contact pin, instead of the pressing member, presses an electronic component from above at its loading position.

Conventionally, this type of IC socket is provided with a member called a cover on the upper portion of the socket body, and by pushing the cover from above, the contact pin resists its urging force. By retreating to the side, the electronic parts can be attached / detached, and by releasing the pressing by the cover, the contact pin is returned to the upper part of the electronic parts to securely hold the electronic parts. . Then, as an example in which this contact pin is actuated by a cover through a rotating body, for example, Japanese Patent Laid-Open No. 5-15
Those described in Japanese Patent No. 2392 and Japanese Patent Laid-Open No. 5-258820 are known.

[0005]

Since the terminals of electronic parts are usually made of copper or copper alloy and further solder-plated thereon, an oxide film is often formed on the terminal surfaces. . Also, various dirt such as dust may be attached to the terminal surface. All of these points are harmful for obtaining good electrical continuity. However, in any of the conventional IC sockets as described above, the contact portion of the contact pin is simply brought into contact with and separated from the electronic component by the rotating body, and the contact portion rubs the terminal surface of the electronic component to cause the oxide film to be formed. Since the action of removing dirt and stains was incidental, the oxide film and stains could not be removed in some cases, and conduction failure sometimes occurred.

The present invention has been made to solve the above problems, and an object of the present invention is to continuously rotate a contact pin in two stages by rotating the rotating member in one direction. It is an object of the present invention to provide an IC socket which is operated so as to contact and slide with respect to an electronic component.

[0007]

In order to achieve the above object, the IC socket of the present invention has a spring portion between a contact portion capable of contacting a terminal of a loaded electronic component and an external connection terminal. And a plurality of contact pins having engaging portions formed between the contact portion and the spring portion and arranged in parallel on the base plate, and each contact pin having an arm at least at one end. An engaging portion which engages with the engaging portion of the contact pin is formed on a peripheral surface of the engaging portion and is arranged along the juxtaposed direction of the contact pins, and a rotational force is applied by a spring member.
By making one of the engaging portion of the contact pin and the engaging portion of the actuating shaft member convex and the other concave, the actuating shaft member has two engagements in the rotational direction with respect to the contact pin. The contacts are sequentially performed, and the contact portion is brought into contact with and separated from the electronic component by one engagement,
The other contact is adapted to slide the contact portion with respect to the electronic component during loading.

Further, preferably, the engaging portion of the actuating shaft member has a concave shape so that the engaging portion pushes a side surface of the electronic component when the electronic component is loaded and the contact pin is attached to the contact pin. Forms an extension that extends from between the external connection terminal and the spring portion, holds the actuating shaft member by the engagement portion of the contact pin and the extension portion, and at the electronic component loading position, The electronic component is sandwiched between the contact portion and the tip of the extension portion.

[0009]

First Embodiment A first embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a plan view showing a state in which a cover is removed when an electronic component is loaded. FIG. 2 is a side view in which a part is cross-sectioned.
3 is a sectional view taken along the line AA in FIG. 2, and FIG. 4 is a sectional view taken along the line BB in FIG. 5 is a perspective view of the base plate and the actuating shaft member in FIG. 3, and FIG. 6 is a cross-sectional view showing a state in which an electronic component can be attached and detached, similarly to FIG.

In FIG. 1, the substrate 1a of the electronic component 1 has a square shape, and terminals (lands) are arranged along the four sides thereof, but they are not shown. The base plate 2 of the IC socket formed of synthetic resin also has a square shape, and the configuration along the four sides is the same. The four corners of the base plate 2 have shafts 2a with slits on three sides.
Has been planted. Note that some electronic components have terminals arranged only on two opposite sides, but in the case of a dedicated IC socket for such electronic components, the configuration described below is provided only on the two opposite sides. Just do it.

As shown in FIGS. 3, 5 and 6, the base plate 2 is provided with long grooves 2b, and ribs 2c are formed on both sides of the long groove 2b on the upper surface. This rib 2c
Is also formed on the side surface of the long groove 2b and on the side surface of the base plate 2. Further, one set of such ribs 2c is one set more than the number of contact pins which will be described later, and the ribs 2c are arranged along the side of the base plate 2 at predetermined intervals.

The operating shaft member 3 made of synthetic resin is attached to the base plate 2 via a plurality of contact pins which will be described later. However, it does not matter if the base plate 2 is provided with a bearing portion. Arms 3a are provided at both ends of the operating shaft member. Further, two protrusions 3b and 3c are provided on the circumferential surface thereof, and these form an engaging portion. And
A concave portion formed between them can be engaged with a contact pin to be actuated, which will be described later. Further, the operating shaft member 3 is provided with a rib 3d in a part of the periphery thereof along the axial direction by one more than the number of contact pins described later.

In the contact pin 4, the mounting portion 4a has a long groove 2b.
Are press-fitted so as to enter between adjacent ribs 2c provided on the side surface of the base plate 2 and are attached to the base plate 2. An external connection terminal 4b connected to the printed wiring board is formed at one end of the contact pin 4, and the substrate 1a of the electronic component 1 is formed at the other end.
Is formed from above, and a contact portion 4c that contacts a terminal (not shown) is formed. A first spring portion 4d and a second spring portion 4e are formed between them, and a second spring portion 4e is formed. Urges the contact portion 4c downward.
Further, the extending portion 4f protruding from between the external connection terminal 4b and the second spring portion 4e is in contact with the operating shaft member 3 from below, and the tip thereof contacts the lower surface of the substrate 1a in FIG. Is supporting.

Further, the contact portion 4c and the first spring portion 4d
A protrusion 4g serving as an engaging portion is formed between and, and the concave portion between the protrusions 3b and 3c formed as the engaging portion of the actuating shaft member 3 can engage with each other. In this embodiment, the plurality of contact pins 4 having such a structure are sandwiched between the adjacent ribs 2c provided on the base plate 2 and between the adjacent ribs 3d provided on the actuating shaft member 3. The operating shaft member 3 is rotatably attached to the base plate 2.

As can be seen from FIG. 2, the cover 5 has a through hole 5a in which a large diameter portion and a small diameter portion are continuously provided, and the shaft 2a is vertically inserted into the base plate 2 by press-fitting the shaft 2a from the small diameter portion. Installed as possible. Further, the cover 5 has an operating portion 5b for pushing the arm 3a and rotating the operating shaft member 3.
Is provided. The operating shaft member 3 has a coil spring 6 having one end supported by the base plate 2 and the other end supported by the operating shaft member 3.
Is wound and urges the operating shaft member 3 to rotate clockwise in FIG. In FIG.
The state where the cover 5 is pushed down against the force of the coil spring 6 is shown.

Next, the loading operation of the electronic component 1 in this embodiment will be described. FIG. 6 shows a state in which the electronic component can be attached and detached. In this state, the cover 5 is pushed down, and the operating portion 5b pushes the arm 3a to rotate the operating shaft member 3 against the force of the coil spring 6. At this time, in the first spring portion 4d of the contact pin 4, the protrusion 4g is
It is pushed to the left by b and pushed upward at the root of the protrusion 3b, that is, at the bottom of the concave shape formed between the protrusions 3b and 3c. Therefore, the contact portion 4
c is retracted to a position where the electronic component 1 can be attached and detached.

In order to bring the electronic component 1 into the loaded state from this state, the pressing force by the cover 5 may be released. As a result, the operating shaft member 3 is rotated clockwise by the coil spring 6 and the restoring force of the first spring portion 4d of the contact pin, and the projection 3b of the operating shaft member moves in the lower right direction. In the process, when the second spring portion 4e moves the protrusion 4g downward and the first spring portion 4d reaches the substantially neutral point where elasticity disappears, the contact portion 4c is provided on the substrate 1a of the electronic component 1. The second spring portion 4 reaches the terminal surface (not shown).
By the action of e, it contacts this terminal surface.

The operating shaft member 3 further rotates clockwise from this state. As a result, the protrusion 3c is in contact with the protrusion 4g and the first spring portion 4d is tensed and pushed in the opposite direction from the neutral position. Therefore, in the process, the contact portion 4c slides on the terminal surface of the substrate 1a, and when an oxide film is formed or dirt is attached, it can be scraped off to improve the conductivity. Such an action is usually called wiping. Then, the protrusion 3b is brought into contact with the side surface of the substrate 1a to be in the loading state shown in FIG.

By the way, when the electronic component 1 is placed on the extension 4f of the contact pin 4 as shown in FIG. 6, it is unlikely that the electronic component 1 is placed at the ideal position.
Therefore, when the protrusion 3b is engaged with the side surface of the substrate 1a,
Any of the operating shaft members arranged on the four sides of the IC socket pushes the electronic component 1. Therefore, the protrusion 3
b serves to regulate the position of the electronic component 1 in the horizontal direction and at the same time contributes to the wiping described above.

When replacing the electronic component from the state shown in FIG. 3, the cover 5 may be pressed. In that case, the movement opposite to that described above is performed, and the protrusion 4g first moves the first spring portion 4d.
Follows the protrusion 3c to the neutral position. After that, the protrusion 3b
Is engaged, the first spring portion 4d is tensioned and moved to the upper left, reaching the position shown in FIG. From this state, the electronic component 6 is taken out from the accommodation portion to the outside by hand or a machine tool. When the next electronic component is not mounted, when the pressing force of the cover 5 is released, the arm 3a further rotates from the position shown in FIG. 3 and stops at the position blocked by the operating portion 5b.

In this embodiment, the cover 5 is provided, but as can be seen from FIG. 3, the presence of the cover 5 considerably increases the height of the entire IC socket. This causes a considerable loss in space when a plurality of printed wiring boards to which IC sockets are connected are arranged so as to overlap each other in various devices. for that reason,
The present invention does not prevent the removal of such a cover 5. In that case, a restraining means for restraining the rotation of the actuating shaft member 3 by the coil spring 6 may be provided on the base plate 2 such that the angular position of the arm 3a is preferably 30 degrees or less in FIG. Good. Therefore, in that case, the electronic component can be attached / detached by using a jig corresponding to the cover 5 instead of the cover 5.

Further, if the horizontal distance from the contact position of the operating portion 5b of the cover with the arm 3a to the center of rotation of the operating shaft member 3 is increased, the force of pushing down the cover 5 can be reduced by the lever principle. Further, in this embodiment, the contact position of the operating portion 5b of the cover with the arm 3a is
Since the upper surface of the base plate 2 and the contact pins 4 are in contact with each other in the upward direction and on the surface parallel to the surface perpendicular to the upper surface of the base plate 2, the cover 5 has the shaft 2a.
When the contact pin 4 is guided vertically to be pushed down vertically to the upper surface of the base plate 2, only the force vertically pushing to the upper surface of the base plate 2 is applied to the contact pin 4, and there is no force in the other directions. Therefore, the strength of the base plate 2 and the force for supporting the contact pins 4 need not be so strong as compared with the case where the contact position of the operation portion 5b of the cover with the arm 3a is arranged at another position. The plate 2 can be thinned. In particular, since the base plate 2 becomes thin and the strength of the bottom portion of the long groove 2b decreases, it is desirable to set the contact position with the arm 3a of the operating portion 5b of the cover as in this embodiment.

Further, in this embodiment, the operating shaft member 3 is provided with the ribs 3d, which is one more than the number of the contact pins 4, but an insulating coating is formed on a part of the side surface of the contact pins 4. Thus, the ribs 3d may be provided at every several contact pins 4, or in some cases, the ribs 3d may not be provided at all. In those cases, the base plate 2 needs the bearing of the actuating shaft member 3. Becomes Further, the contact pin 4 is connected to the external connection terminal 4b, the first spring portion 4d, the second
It is also possible to configure the first contact pin having the spring portion 4e and the contact portion 4c and the second contact pin having the external connection terminal 4b and the extension portion 4f as two independent components.

Further, in this embodiment, the electronic component 1 is sandwiched by the tips of the contact portion 4c and the extension portion 4f. Therefore, the electronic component 1 having a terminal surface on the lower surface or the terminal surface facing downward It can be used when loaded, and of course it can be used for electronic parts having both surfaces as conducting surfaces, and can be applied to all kinds of surface mount type electronic parts. In this case, the wiping by the tip portion of the extending portion 4f causes the protrusion 3c of the operating shaft member to be the electronic component 1 as described above.
Is performed by moving horizontally. The present invention is not limited to such a configuration, and the electronic component 1 may be sandwiched between the base portion 2e and the contact portion 4c provided on the base plate 2 as shown in FIG. I do not care. Further, in the present embodiment, the contact pin 4 is provided with the first spring portion 4d and the second spring portion 4e, which are different in biasing direction, respectively, but the biasing force acts in a substantially lower right direction in FIG. You may form in one spring part.

Second Embodiment A second embodiment of the present invention will be described with reference to FIGS. 8 and 9.
FIG. 8 is a sectional view showing an electronic component mountable / unmountable state similar to FIG. 6 used in the description of the first embodiment, and FIG. 9 is a sectional view showing an electronic component loaded state similar to FIG. . In these drawings, the same reference numerals are applied to the same components as those shown in the first embodiment. Therefore, the description of the configurations thereof will be omitted.

The present embodiment differs from the first embodiment in that the engaging portions formed on the actuating shaft member 3 and the contact pin 4 are formed in the opposite relationship. That is, the actuating shaft member 3 is provided with one protrusion 3e, and the contact pin 4 is provided with two protrusions 4h and 4i.

FIG. 8 shows a state in which the electronic component can be attached / detached. In this state, the protrusion 4i of the first spring portion 4d of the contact pin 4 is pushed leftward by the protrusion 3e, and the protrusion 4h. Is pushed upward by the peripheral surface of the operating shaft member 3. In this state, the pressing force of the cover 5 is released,
When the operating shaft member 3 rotates in the clockwise direction, the protrusion 4i follows the protrusion 3e while engaging with the protrusion 3e. Then, the contact portion 4c comes into contact with the terminal surface provided on the substrate 1a of the electronic component 1 at a substantially elastic neutral position of the first spring portion 4d. The operating member 3 further rotates clockwise from this state. As a result, the protrusion 3e comes into contact with the protrusion 4h, and the first spring portion 4
Pushing the protrusion 4h while tensioning d. Therefore, the above wiping is performed, and thereafter, the state shown in FIG. 9 is reached and stopped, and the action of the second spring portion 4e causes the contact portion 4 to move.
c is pressed against the electronic component 1.

The state shown in FIG. 9 is, when the loading operation is completed,
The arm 3a is located at a position where its rotation is just blocked by the operating portion 5b, but this is unlikely. Therefore, in the case of this embodiment, the rib 3d is formed on the substrate 1a.
It is preferable to set the position in contact with the side surface of the base plate 2 as the loading completion position, but without doing so, the restraining means may be provided on the base plate 2 as described above. It should be noted that the operation at the time of exchanging the electronic component is performed by pushing down the cover 5, but as will be understood from the description of the first embodiment, the operation is performed in the reverse of the case of the loading operation, and therefore the description thereof will be omitted. . Further, with respect to the modified examples and usage patterns of the present embodiment other than the above description, all the description made in connection with the description of the first embodiment can be applied to the case of the present embodiment.

[0029]

As described above, according to the present invention, the engaging portion of one of the actuating shaft member and the contact pin is made convex and the other is made concave so that the actuating shaft member can be rotated in one direction. Since the engagements are sequentially performed twice, the contact portion is brought into contact with and separated from the electronic component by one engagement, and the wiping is performed by the contact portion at the other engagement, so that the conductivity is always good. Various electronic parts can be loaded.

[Brief description of drawings]

FIG. 1 is a plan view of a first embodiment of the present invention showing a state in which a cover is removed when an electronic component is loaded.

FIG. 2 is a partial cross-sectional side view of the first embodiment of the present invention.

3 is a cross-sectional view taken along the line AA in FIG.

FIG. 4 is a sectional view taken along line BB in FIG.

5 is a partial perspective view showing a base plate and an operating shaft member in FIG.

FIG. 6 is a cross-sectional view showing a state in which an electronic component can be attached and detached, as viewed in the same manner as FIG.

FIG. 7 is a sectional view similar to FIG. 3 when a modified contact pin is used.

FIG. 8 is a cross-sectional view of a second embodiment showing a detachable state of an electronic component as in FIG.

FIG. 9 is a cross-sectional view of a second embodiment showing a loaded state of electronic components as in FIG.

[Explanation of symbols]

 1 electronic component 1a substrate 2 base plate 2a shaft 2b long groove 2c, 3d rib 2e stand part 3 operating shaft member 3a arm 3b, 3c, 3e, 4g, 4h, 4i protrusion 4 contact pin 4a mounting part 4b external connection terminal 4c contact part 4d 1st spring part 4e 2nd spring part 4f Extension part 5 Cover 5a Through hole 5b Operation part 6 Coil spring

Claims (8)

[Claims] 1. A spring portion is formed between a contact portion capable of contacting a terminal of a loaded electronic component and an external connection terminal, and an engagement portion is formed between the contact portion and the spring portion. A plurality of contact pins that are arranged in parallel on the base plate, and an engaging portion that has an arm at least at one end and that engages with the engaging portion of each contact pin is formed on the peripheral surface of the contact pin. An operating shaft member that is arranged along the installation direction and to which a rotational force is applied by a spring member, and one of the engaging portion of the contact pin and the engaging portion of the operating shaft member is convex. By making the other concave, the actuating shaft member sequentially makes two engagements in the rotation direction of the contact pin, and one engagement makes contact of the contact portion with the electronic component. Separation The IC socket is characterized in that the contact portion is slid with respect to the electronic component at the time of loading by the other engagement. 2. The engaging portion of the actuating shaft member has a concave shape, and the engaging portion pushes a side surface of the electronic component when the electronic component is loaded. The described IC socket. 3. The contact pin is formed with an extending portion protruding from between the external connection terminal and the spring portion, and the engaging portion of the contact pin and the extending portion sandwich the operating shaft member. The IC socket according to claim 1 or 2, wherein 4. At the loading position of the electronic component, the electronic component is sandwiched between the contact portion and the tip portion of the extension portion, and at least one of the contact portion and the tip portion is electrically connected to the electronic component. The IC socket according to claim 3, wherein the IC socket is an electrically conductive terminal. 5. The spring portion includes a first spring portion provided on the contact portion side and a second spring portion provided on the external connection terminal side. The IC socket according to any one of 1 to 4. 6. The IC socket according to claim 1, wherein a plurality of ribs are arranged side by side on the actuating shaft member, and the contact pins are isolated by the ribs. 7. The IC according to claim 1, wherein the base plate is provided with means for suppressing rotation of the actuating shaft member by the spring member at a predetermined angular position. socket. 8. A cover member attached to the base plate so as to be vertically movable so that the actuating shaft member can be rotated against the force of the spring member via the arm. Item 8. The IC socket according to any one of items 1 to 7.