JP3101808B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, and more particularly, to an IC socket having a large number of terminals.
Insertion Force).

[0002]

2. Description of the Related Art Recent microprocessors and other ICs
Due to a demand for improved performance of an electronic component (Integrated Circuit) (herein, simply referred to as “IC”), an IC having a very large number of pins, that is, an IC having many terminals is used. Such an IC
The so-called ZIF type is widely used as an IC socket for mounting the.

[0003]

When an IC having a large number of terminals as described above is mounted on a substrate, the
GA (Pin Grid Array) and BGA (Ba
11 (Grid Grid).

However, in the case of a conventional ZIF type IC socket, PGA (Pin Grid Array)
y) There is an IC corresponding to the format, but BGA (Ba
There was no corresponding IC in the (II Grid Array) format.

[0005] Therefore, an object of the present invention is to provide an IC socket that can support not only PGA but also other types of mounting methods such as BGA.

[0006]

SUMMARY OF THE INVENTION An IC socket according to the present invention is resiliently expanded to a first state in contact with a plurality of terminals in an IC socket used for connection of an IC having a plurality of terminals. A plurality of socket contacts capable of being in a second state, a housing holding the plurality of socket contacts aligned and held, and a plurality of preload pins aligned corresponding to the plurality of socket contacts; A slider movable between first and second positions, wherein the plurality of preload pins are spaced apart from the plurality of socket contacts when the slider is at the first position, and the plurality of preload pins are spaced apart from the plurality of socket contacts. 1 and engages the plurality of socket contacts when in the second position to bring them into the second state. And a be intended, the plurality of sockets
Each of the contacts has an elliptical cylindrical shape in the first state.
It is characterized by the following.

[0007] A lever is further rotatably supported by the housing. By rotating the lever, the slider is pressed by a part of the lever to move to the second position. Configuration is preferred.

It is preferable that the levers are provided on both sides of the housing.

[0009]

[0010]

1 and 2 show an IC socket according to an embodiment of the present invention. This IC socket comprises a plurality of socket contacts 1 formed by bending a conductive metal, an insulating housing 2 holding the socket contacts 1, and a pair of levers 3 rotatably supported on both sides of the housing 2, respectively. 2, the slider 5 which moves relative to the housing 2 in FIG. 2 by rotating the levers 3 and 4, and the levers 3 and 4 in FIG.
Shaft bars 6 and 7 which are the centers of rotation of the shafts.

As is clear from FIG. 1, the socket contacts 1 are arranged in a grid at substantially equal intervals in the vertical and horizontal directions. Referring to FIG. 3 as well, this socket contact 1 has a substantially C-shaped contact portion having a spring elasticity in a circumferential direction at an upper portion. In the illustrated embodiment, the contact portion has an elliptical cylindrical or cylindrical shape in the first state, which is a natural state, but can also assume a second state in which it is elastically expanded. Also, following this contact section, FIG.
In FIG. 4, the lower portion is fixedly held in the housing 2 by press fitting or the like.

The slider 5 slides between a relatively lower first position and a relatively upper second position. The slider 5 is provided with a plurality of preload pins 51 similarly arranged corresponding to the socket contacts 1. The preload pin 51 has a substantially semicircular tip. The distal end of the preload pin 51 is located on substantially the same axis as the central axis of the contact portion of the socket contact 1 as shown in FIGS. The slider 5 has connector grooves 52 each having a width larger than the cross section of the lower portion for holding the lower portion of the socket contact 1 so as to be movable in the vertical direction.

As shown in FIG. 2, the levers 3 and 4 have a center end of the IC socket in contact with a lower side of the slider 5, and an outer end of the IC socket has an IC socket. Extends to both sides. 2 and 3, the levers 3 and 4 are pivoted about the shaft bars 6 and 7 as described later, and the preload pin 51 of the slider 5 moves into and out of the contact portion of the socket contact 1.

When the upper surface of the slider 5 is pressed downward, the slider 5 goes down to the first position, and the levers 3, 4 go up. When the outer ends of the levers 3 and 4 are pressed downward, the slider 5 rises and reaches the second position. Such a configuration in which the slide 5 can be moved up and down only by an operation of pushing down is advantageous when the IC is automatically mounted on the IC socket.

Next, with reference to FIGS. 3 and 4, the operation of the IC socket for inserting and removing an IC will be described.
In FIGS. 3 and 4, a spherical B
Although the example in which the GA (solder ball) 81 is attached is shown, the same applies to the case where PGA is attached as a terminal.

First, in the state shown in FIG. 3, the slider 5 is in the upper position, that is, in the second position. In this case, the preload pin 51 of the slider 5 is inserted inside the substantially C-shaped contact portion of the socket contact 1. The diameter is increased in the circumferential direction. Here, since the inner diameter of the contact portion of the socket contact 1 when the diameter is enlarged is larger than the outer diameter of the solder ball of the BGA 81, the IC 8 can be inserted into the contact portion of the socket contact 1 by ZIF. Also, at this time, a distance B
GA81 is located, socket contact 1
Is in a non-contact state with the BGA 81.

Next, the BGA 81 is connected to the socket contact 1
With the IC8 set by inserting it inside the contact part of
The upper surface of the slider 5 is pushed downward by the arrow as shown in FIG. 3 to move the slider 5 to the first position. Then, the preload pin 51 comes off from the contact portion of the socket contact 1, and
The diameter of the contact portion is reduced in the circumferential direction by its own spring elasticity, and the contact portion is in the state shown in FIG.

Here, the minimum length of the natural state of the circumferential spring at the contact portion of the socket contact 1 is BGA81.
Is smaller than the outer diameter of the BGA in FIG.
81 and the contact portion of the socket contact 1 are electrically connected.

That is, referring to FIG. 5 and FIG. 6, the shortest inner diameter of the contact portion of the socket contact 1 in the natural state, ie, the first state, is d1, the outer diameter of the BGA 81 is d2, and the preload pin 81 If the outer diameter is d3, d3 ≧ d2> d
It is 1. With such a relationship, when the slider 5 and the levers 3 and 4 are operated to bring the contact portion of the socket contact 1 into contact or non-contact with the BGA 81, the insertion and removal force of the insertion and removal of the IC connector is reduced. Peak can be reduced.

Then, as shown in FIG. 5, when the contact portion of the socket contact 1 is in a natural state, that is, in the first state, the contact portion is in contact with the outer periphery of the BGA 81 by pressing.
Also, as shown in FIG. 6, in the state where the contact portion of the socket contact 1 is expanded outward by the preload pin 81, that is, in the second state, the contact portion and the outer periphery of the BGA 81 are separated from each other to be in a non-contact state. .

In order to remove the IC 8, the levers 3 and 4 on the left and right are pushed downward as shown by arrows in FIG. As a result, the slider 5 is lifted up to the initial state, that is, the state shown in FIG. 3, and the IC 8 can be removed in this state. Here, when operating the levers 3 and 4 at the time of removing the IC 8 again, the levers 3 and 4 can be operated by leverage boost, so that the operating force can be reduced.

In the IC connector configured as described above, the terminal of the IC 8 is inserted and removed inside the contact portion of the socket contact 1 while the contact portion of the socket contact 1 is pushed and spread by the preload pin 51 of the slider 5. , IC
Even if the number of terminals increases, that is, even if the IC has multiple poles, the peak of the insertion / extraction force can be suppressed. Further, at the time of removal, the lever lever is boosted, and the operating force can be further reduced. Further, the IC 8 is set in the ZIF, and the slider 5 and the levers 3 and 4 are operated only in the vertical direction so that the I
Since C can be fitted and detached, it is possible to easily cope with automatic mounting.

[0023]

As described above, according to the present invention,
It is possible to provide an IC socket that can support not only PGA but also other types of mounting methods such as BGA.

[Brief description of the drawings]

FIG. 1 is a plan view of an IC socket according to an embodiment of the present invention.

FIG. 2 is a front view of the IC socket of FIG. 1;

FIG. 3 is a sectional view of the IC socket of FIG. 1 when an IC is mounted.

FIG. 4 is a cross-sectional view of the IC socket of FIG. 1 at the time of contact between a contact portion of a socket contact and a terminal of the IC.

FIG. 5 is an explanatory diagram showing a relationship between a contact portion of a socket contact and an IC terminal in the IC socket of FIG. 1;

FIG. 6 is an explanatory diagram showing a relationship between a contact portion of a socket contact, an IC terminal, and a preload pin of a slider in the IC socket of FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Socket contact 2 Housing 3 and 4 Lever 5 Slider 51 Preload pin 8 IC

Continuation of the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H01R 24/00-24/18 H01R 33/76 H01R 13/629

Claims (3)

(57) [Claims] 1. An IC socket used for connection of an IC having a plurality of terminals, wherein the plurality of sockets can assume a first state in contact with the plurality of terminals and a second state resiliently expanded. A contact, a housing holding the plurality of socket contacts in alignment, and a plurality of preload pins aligned with the plurality of socket contacts for movement between first and second positions relative to the housing; A possible slider, wherein the plurality of preload pins are spaced apart from the plurality of socket contacts when the slider is in the first position, allowing them to be in the first state; when in a second position is intended to make them engaged with the plurality of socket contacts to said second state, said plurality
Each of the socket contacts is an elliptical cylinder in the first state.
An IC socket characterized in that it has a shape . 2. A lever which is rotatably supported by the housing and is rotatably supported. By rotating the lever, the slider is pressed by a part of the lever to move to the second position. The IC socket according to claim 1, wherein: 3. The IC socket according to claim 1, wherein the lever is provided on both sides of the housing.