JPH087641Y2 - 半導体素子の放熱構造 - Google Patents

半導体素子の放熱構造

Info

Publication number
JPH087641Y2
JPH087641Y2 JP1989097650U JP9765089U JPH087641Y2 JP H087641 Y2 JPH087641 Y2 JP H087641Y2 JP 1989097650 U JP1989097650 U JP 1989097650U JP 9765089 U JP9765089 U JP 9765089U JP H087641 Y2 JPH087641 Y2 JP H087641Y2
Authority
JP
Japan
Prior art keywords
heat dissipation
heat
plate
substrate
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989097650U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0336148U (en, 2012
Inventor
幹夫 白井
利夫 橋本
正和 山添
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Priority to JP1989097650U priority Critical patent/JPH087641Y2/ja
Publication of JPH0336148U publication Critical patent/JPH0336148U/ja
Application granted granted Critical
Publication of JPH087641Y2 publication Critical patent/JPH087641Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1989097650U 1989-08-22 1989-08-22 半導体素子の放熱構造 Expired - Lifetime JPH087641Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989097650U JPH087641Y2 (ja) 1989-08-22 1989-08-22 半導体素子の放熱構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989097650U JPH087641Y2 (ja) 1989-08-22 1989-08-22 半導体素子の放熱構造

Publications (2)

Publication Number Publication Date
JPH0336148U JPH0336148U (en, 2012) 1991-04-09
JPH087641Y2 true JPH087641Y2 (ja) 1996-03-04

Family

ID=31646785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989097650U Expired - Lifetime JPH087641Y2 (ja) 1989-08-22 1989-08-22 半導体素子の放熱構造

Country Status (1)

Country Link
JP (1) JPH087641Y2 (en, 2012)

Also Published As

Publication number Publication date
JPH0336148U (en, 2012) 1991-04-09

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