JPH0875303A - Heat exchanger - Google Patents

Abstract

PURPOSE: To improve the heat exchange effect and prevent an electronic heat exchanging element from being broken down due to thermal deformation by a method wherein the cooling water is turned into a turbulent flow to lessen the differential temperature between an inlet and an outlet. CONSTITUTION: A cooling member 2 and a heat releasing member 3 are respectively attached firmly on cooling and heat releasing faces of an electronic cooling element 1 using a Peltier element. A base member 4 is attached on the heat releasing member 3 and a heat exchange medium chamber 11 is formed between the two members. The heat exchange medium chamber 11 is square, and the current of cooling water supplied along the inner walls of the heat exchange medium chamber 11 is turned in different directions by corner parts that make up a turbulent flow generator, so that the cooling water is turned into a turbulent flow and discharged from a medium outlet 13 provided in the middle of the heat exchange medium chamber 11.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to heat exchangers.

[0002]

2. Description of the Related Art Conventionally, various types of heat exchange devices are known, and as one of them, an electronic cooling device for cooling with an electronic cooling element utilizing the Peltier effect is known.

In this type of electronic cooling device, as shown in FIG. 14, a thermoelectric conversion element formed by joining different kinds of conductors or n-type and p-type semiconductors is used as an electronic cooling element C, and its joint portion A is used. , B, a heat absorption and heat dissipation phenomenon (Peltier effect) of absorbing heat at one joint surface A and radiating heat at the other joint surface B is used. The amount of heat is equal to the temperature (T) of the joint portion. It is intended to lower the temperature of the cooling body which is heat transfer-bonded to the heat absorbing surface of the electronic cooling element C in proportion to the electric current (I). When the direction of the current flowing through the electronic cooling element is reversed, the joint surface A forms the heat generating surface and the joint surface B forms the heat absorbing surface. As such an electronic cooling device, conventionally, an actual flatbed 4
Various proposals have been made as seen in, for example, Japanese Unexamined Patent Publication No. -70122 and Japanese Utility Model Laid-Open No. 1-65632.

In the case of cooling by the above-mentioned conventional electronic cooling device, the temperature of the heat radiation surface and the cooling surface is, for example, + 30 °.
Since the temperature difference reaches as high as C and -30 ° C, a large stress is generated in the joint surface between the electronic cooling element, the cooling body, and the heat radiating body due to thermal deformation of the electronic cooling element, the cooling body, and the heat radiating body. There was a problem of damage.

Therefore, as a method of solving such a problem, conventionally, a method of guiding cooling water to the heat radiation surface side of the electronic cooling element to cool it has been adopted.

[0006]

However, in such a conventional electronic cooling device, a groove is meandered in a base member provided on the heat dissipation surface side of the electronic cooling element, and cooling water is introduced into the groove. Therefore, the temperature of the cooling water is low on the inlet side of the groove and a high heat exchange rate can be maintained, but on the outlet side, the temperature of the cooling water rises due to the heat exchange, so the heat exchange efficiency is poor and the entire heat dissipation surface is uniform. There is a problem that it cannot be cooled effectively. Therefore, the part with the Peltier element, that is, the part in contact with the inlet of the cooling water is low temperature,
The part in contact with the outlet side became hot, and it was not possible to completely prevent the accidental destruction of the electronic cooling element.

Therefore, the present invention has been made in view of the above-mentioned conventional problems, and the purpose thereof is to enable effective heat dissipation or cooling, and to make the entrance side and the exit side An object of the present invention is to provide a heat exchange device having a small temperature difference and capable of obtaining high heat exchange efficiency.

[0008]

In order to achieve the above object, the invention as set forth in claim 1 includes a base member, one surface of which is disposed in contact with the heat exchange section, and the base member is the heat exchange section. From the center of the heat exchange medium supply chamber for guiding the heat exchange medium into the heat exchange medium supply chamber, which is formed in a portion close to A medium inlet formed at a remote position,
It has a medium outlet formed near the center of the heat exchange medium supply chamber. The invention according to claim 2 is the invention according to claim 1, wherein the heat exchange part is
An electronic heat exchange element utilizing a Peltier effect is provided, which has two heat transfer surfaces including a cooling surface and a heat dissipation surface that face each other via a semiconductor element, and the heat exchange unit includes one of the heat transfer surfaces. It is characterized by being. The invention according to claim 3 is the invention according to claim 2, characterized in that an intermediate member serving as a cooling body or a radiator is arranged between the base member and the heat exchange element. To do. According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the medium inlet is opened in a direction in which the medium is guided along an inner wall of the heat exchange medium supply chamber. It is characterized by The invention described in claim 5 is claim 1
The heat exchange device according to any one of claims 1 to 4, wherein the medium outlet has a recess having an inverted trapezoidal cross section. According to a sixth aspect of the present invention, there is provided a base member, one surface of which is disposed in contact with the heat exchange portion, the base member being formed in a portion near the heat exchange portion and having a first turbulent flow forming portion. A polygonal heat exchange medium supply chamber, a medium inlet formed at a position away from the center of the heat exchange medium supply chamber for guiding the heat exchange medium into the heat exchange medium supply chamber, and the heat exchange medium It is characterized by having a medium outlet which is formed in the vicinity of the center of the supply chamber and has a shape which serves as a second turbulent flow forming portion for making the heat exchange medium more turbulent. According to a seventh aspect of the invention, in the sixth aspect of the invention, the heat exchange section uses the Peltier effect in which two heat transfer surfaces including a cooling surface and a heat radiation surface facing each other are provided via a semiconductor element. An electronic heat exchange element is included, and the heat exchange unit is one of the heat transfer surfaces. In the invention according to claim 8, in the invention according to claim 6, the second turbulent flow forming portion is a circular hole formed at a position eccentric from the center of the heat exchange medium supply chamber. Characterize. In the invention according to claim 9, in the invention according to claim 6, the second turbulent flow forming portion is a polygonal hole formed at a position eccentric from the center of the heat exchange medium supply chamber. Is characterized by. According to a tenth aspect of the invention, in the sixth aspect of the invention, the second turbulent flow forming portion is a polygonal hole formed substantially in the center of the heat exchange medium supply chamber. To do. The invention described in claim 11 is the same as the invention described in claim 10,
The polygonal hole formed substantially in the center of the heat exchange medium supply chamber has a polygonal shape that is not point symmetrical.
According to a twelfth aspect of the present invention, in the invention according to any one of the sixth to tenth aspects, the medium outlet has a recess having an inverted trapezoidal cross section. According to a thirteenth aspect of the present invention, in the invention according to any one of the sixth to tenth aspects, the medium inlet is opened in a direction of guiding the medium along an inner wall of the heat exchange medium supply chamber. It is characterized by

[0009]

In the present invention, the heat exchange medium is supplied to the heat exchange medium supply chamber and exchanges heat with the electronic heat exchange element directly or through an intermediate member composed of a radiator or a cooling body. Then, the heat exchange medium travels along the inner wall of the heat exchange medium supply chamber, hits the first turbulence forming portion, becomes turbulent, gathers at the center of the supply chamber, and is discharged to the outside from the medium outlet. The heat exchange medium supply chamber has a polygonal shape, and a corner portion thereof forms a first turbulent flow forming portion, and the cooling medium is turbulently guided to the center of the supply chamber. By making the cooling medium turbulent, the temperature difference between the inlet side and the outlet side is small. The medium outlet has a circular or conical hole that is eccentric from the center of the heat exchange medium supply chamber to form a second turbulent flow forming portion, and makes the heat exchange medium an unsteady flow (turbulent flow). Therefore, no air column is generated at the center of the medium outlet. The medium outlet forms a second turbulent flow forming portion by forming a polygonal depression, and makes the heat exchange medium unsteady (turbulent). Therefore, no air column is generated at the center of the medium outlet. When the medium outlet is a point-symmetrical polygonal hole and is provided so as to be displaced from the center of the heat exchange medium supply chamber, the heat exchange medium does not become steady and the turbulent flow forming effect is large. At the polygonal medium outlet that is not point-symmetric, the heat exchange medium does not become steady, and the turbulent flow formation effect is large.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in the drawings. 1 is a front view of an electronic cooling element unit showing a first embodiment when the present invention is applied to an electronic cooling device, FIG. 2 is a plan view of the same, FIG. 3 is a plan view of a base member, and FIG. 2 is a sectional view taken along line IV-IV of FIG. 2, and FIG. 5 is a sectional view taken along line VV of FIG. In these drawings, in this embodiment, an electronic cooling element (electron heat exchange element) 1 utilizing the Peltier effect, a cooling body 2 as an intermediate member joined to the cooling surface and a heat radiation surface of the electronic cooling element 1, and a heat radiation Body 3
And the base member 4 joined to the surface of the radiator 3 opposite to the cooling body 2, constitute the electronic cooling element unit 10, and the electronic cooling element unit 10 is placed in the casing of the electronic cooling device, for example, as described above. Face the cooling body 2 into the casing,
The radiator 3 is arranged so as to face the outside.

As shown in FIG. 14, the electronic cooling element 1 is formed by joining different types of n-type and p-type semiconductors to each other to form a Peltier element, and a substrate such as ceramics is joined to both surfaces thereof. Since several tens of such Peltier elements are usually bonded to the substrate, if the temperature distribution is extremely uneven, thermal deformation causes large stress on these bonding surfaces.
The electronic cooling element itself, as well as the cooling body 2 and the radiator 3, may be damaged. In the present embodiment, such electronic cooling elements 1 are arranged on the same plane, for example, left and right, upper and lower two at a total of four predetermined intervals, and these electronic cooling elements 1 are electrically connected. In addition, an example in which the cooling body 2 and the radiator 3 are commonly joined to both surfaces thereof will be shown. Further, the cooling body 2, the heat radiating body 3 and the base member 4 are integrally coupled by a mounting screw (not shown). In addition, 18 is an O-ring.

The cooling body 2 is integrally formed of aluminum alloy, ceramic or the like and has a large number of fins 2a. The radiator 3 is formed in a flat plate shape by a metal, a resin or the like having a high thermal conductivity.

The base member 4 is made of metal, resin, or the like having a high thermal conductivity in a block shape, and a concave portion 11 having an appropriate depth is formed at the center of the joint surface with the heat radiating body 3. Reference numeral 11 forms a heat exchange medium supply chamber by being sealed by the radiator 3. The heat exchange medium supply chamber 11 is composed of a rectangular recess having substantially the same size as the size of the four electronic cooling elements 1 arranged, has a medium inlet 12 and a medium outlet 13, and each of the corner portions 15a to 15d is turbulent. The forming part is formed.

The medium inlet 12 is a heat exchange medium supply chamber 1
1, which guides the cooling water 14 as the heat exchange medium along the inner wall of 1, and which is one of the four corners 15 (15a to 15d) forming the turbulent flow forming portion of the heat exchange medium supply chamber 11.
A medium formed on the outer surface of the base member 4, for example, on the outer surface of the base member 4, for example, on 15d, the axis of which is formed along one (16a) of two mutually orthogonal inner wall surfaces 16a and 16d forming the corner portion. It is connected to the inlet port 23 via a passage 24. The passage 24 is formed obliquely so that the cooling water 14 as a heat exchange medium, which is guided from the medium inlet 12 into the heat exchange medium supply chamber 11, spreads over the entire depth direction of the heat exchange medium supply chamber 11. Therefore, the medium inlet 12 is an elliptical hole along the inner wall surface 16a. Although the passage 24 is formed obliquely in this embodiment, it is not always necessary to incline it when the heat exchange medium supply chamber 11 is shallow or when the diameter of the passage 24 is large.

The medium outlet 21 is the heat exchange medium supply chamber 1
1 is a conical recess formed in the center of the bottom surface of the base 1 and has a passage 2 formed at the bottom thereof within the thickness of the base member 4.
6, one end of which is connected, and the other end of the passage 26 communicates with a medium outlet port 27 formed on the outer surface of the base member 4.

In such a structure, the cooling water 14 supplied from the medium inlet 12 to the heat exchange medium supply chamber 11 has the inner wall surface 1 parallel to the medium inlet 12 of the heat exchange medium supply chamber 11.
6a, 90 ° when you reach the corner 15a
The direction is changed to proceed along the inner wall surface 16b, and when it hits the corner 15b, the direction is changed by 90 ° and the inner wall surface 16c is changed.
Follow along and further hit the corner 15c, 90 °
The direction is changed to proceed along the inner wall surface 16d. Here, when the cooling water 14 hits the corner portions 15a to 15d and is redirected, the flow is disturbed, so that it becomes a turbulent turbulent flow, that is, a swirling flow as shown in FIG. Collected in the center of the medium supply chamber 11, the medium outlet 13-the passage 26-
It is discharged to the outside through the medium outlet 27. Therefore, the flow of the cooling water 14 is smooth, and the heat exchange medium supply chamber 11
The radiator 3 can be satisfactorily cooled without staying inside, and the cooling effect can be improved. Particularly in the present invention, since the cooling water 14 is turbulently formed by the turbulent flow forming portion formed in the heat exchange medium supply chamber 11, that is, the corner portions 15a to 15d, the temperature difference between the inlet side and the outlet side is small. , High heat exchange rate can be obtained. Therefore, no large stress is generated on the joint surface of the Peltier element due to thermal deformation, and the electronic cooling element 1 itself and further the cooling body 2,
It is possible to reliably prevent damage to the radiator 3. Also,
The medium outlet 13 is formed of a recess and facilitates the discharge of the cooling water 14.

FIG. 6 is a plan view showing a second embodiment of the present invention. In this embodiment, the base member 4 is directly bonded and fixed to one surface of the electronic cooling element 1, that is, the heat radiation surface, and the heat radiator is omitted. Note that 1A is a Peltier element, and 1B is a Peltier substrate made of ceramics, and these constitute the electronic cooling element 1. Other configurations are the same as those in the above embodiment.

Even in such a structure, the cooling water 14 supplied into the heat exchange medium supply chamber 11 becomes a turbulent turbulent flow, so that the heat radiating surface of the electronic cooling element 1 is effectively cooled as in the above embodiment. be able to. Further, in the present embodiment, the cooling water 14 is in direct contact with the one Peltier substrate 1B of the electronic cooling element 1, so that the cooling efficiency can be improved.

FIG. 7 is a front view of an electronic cooling element unit showing a third embodiment of the present invention, FIG. 8 is a plan view with the cooling body of the unit removed, FIG. 9 is a plan view of a base member, and FIG. 8 is a sectional view taken along line IX-IX of FIG. 8, and FIG. 11 is a sectional view taken along line XX of FIG. In the figure, the same components as those in FIGS. 1 to 6 are designated by the same reference numerals. In these drawings, in this embodiment, the thermoelectric cooling elements 1 are arranged in 6 rows in the same plane.
A total of 18 rows, three rows in total, are arranged at a predetermined interval, and these electronic cooling elements 1 are electrically connected, and at the same time, the cooling body 2 and the heat radiating body 3 are jointed together to form a base member 4.
The heat exchange medium supply chambers 11 and 11 are formed at the center of the joint surface with the heat radiator 3 and each of which has two recesses on the left and right, which have an appropriate depth. Each heat exchange medium supply chamber 11 has the same size and is composed of a rectangular recess having substantially the same size as the size in which three thermoelectric cooling elements 1 are arranged in rows and columns, and each of them has a medium inlet 12 and a medium outlet 13. Have The corner portions 15a to 15d of each heat exchange medium supply chamber 11 form a first turbulent flow forming portion.

The medium inlet 12 is an elliptical hole along a partition wall 30 that partitions the left and right heat exchange medium supply chambers 11, 11.

The medium outlet 13 is the heat exchange medium supply chamber 1
A second turbulent flow forming portion is formed by forming an inverted trapezoidal recess formed in the center of the bottom surface of No. 1, and a passage 26 formed in the wall thickness of the base member 4 on one slope thereof. Has one end open and the other end communicates with a medium outlet 27 formed on the outer surface of the base member 4.

In such a structure, the cooling water 14 supplied from the medium inlet 12 to the heat exchange medium supply chamber 11 advances along the partition wall 30 and the corner portions 15a, 15b, 15 are formed.
By sequentially hitting c and 15d to change direction,
Since the flow is disturbed, it becomes a swirl turbulent flow as shown in FIG. 9 and gathers in the center of the heat exchange medium supply chamber 11, and the medium outlet 13
-It is discharged to the outside from the medium outlet 27 through the passage 26.

Here, as shown in FIG. 3 and FIG.
In the first embodiment in which the medium outlet 13 is formed by the conical recess, when the cooling water 14 flows along the slope of the medium outlet 13, it becomes a steady flow, and therefore flows into the center portion of the medium outlet 13 as shown in FIG. There is a problem that the air column 32 is formed as shown in FIG. 3, and this serves as a heat insulating layer, which lowers the cooling effect of the central portion of the radiator 3, but in the present embodiment, the generation of such an air column 32 is effective. Can be prevented. This is because, if the medium outlet 13 is formed in an inverted trapezoidal shape, even if the cooling water 14 flows into the medium outlet 13 along its slope, even if it is a steady flow, the direction is changed by the corner portion, It is considered that the unsteady flows, that is, the turbulent flows caused by the collisions with each other, are spread to the entire inside of the medium outlet 13, so that there is no room for generation of air columns. As a result, the temperature difference between the inlet side and the outlet side is smaller, a high heat exchange rate can be obtained, and the cooling effect can be improved. Therefore, a large stress is not generated on the joint surface of the Peltier element due to thermal deformation, and it is possible to reliably prevent damage to the electronic cooling element 1 itself, the cooling body 2, the radiator 3, and the like.

The medium outlet 13 may have various shapes. Depending on the shape, the medium outlet 13 may be formed eccentrically from the center of the heat exchange medium supply chamber 11 in order to enhance the turbulent flow function. It is possible. The shape may be a regular polygon such as a regular triangle, a regular quadrangle or a regular pentagon, or may be a rectangle or an irregular polygon. In this case, as the holes for forming the turbulent flow, the rectangular or irregular polygon is more likely to form the turbulent flow than the regular polygonal holes. In the case of a regular polygon, if the center is formed eccentrically from the center of the heat exchange medium supply chamber 11, it is not point-symmetrical with respect to the center, so that it becomes a substantially irregular polygon and the turbulent flow function is increased. be able to. Also, in the case of a circular hole or a conical hole, if they are provided eccentrically, it is possible to function similarly as a turbulent flow forming portion.

FIG. 12 is a sectional view showing a fourth embodiment of the present invention. This embodiment shows a case of applying to a heat exchanger not using an electronic heat exchange element, in which the base member 4 having the heat exchange medium supply chamber 11 and the heat transfer member 41 having the heat exchange chamber 40 are joined to each other to perform heat exchange. Cooling water 1 supplied to the medium supply chamber 11
4 and the medium (water, air, etc.) 42 supplied to the heat exchange chamber 40
It is designed to exchange heat with and. The base member 4 is formed similarly to the base member 4 shown in the third embodiment. The heat exchange chamber 40 of the heat transfer member 41 has substantially the same size as the heat exchange medium supply chamber 11, and the medium introduction port 43 and the medium extraction port 44 are formed on the opposite side surfaces thereof. Even in such a configuration, as in the third embodiment, the temperature difference between the inlet side and the outlet side is smaller and a high heat exchange rate can be obtained.

FIG. 13 is a sectional view showing a fifth embodiment of the present invention. Similar to the fourth embodiment, this embodiment is applied to a heat exchanger that does not use an electronic heat exchange element, and a heat transfer member 45 having a large number of fins 45a is joined and fixed to the cooling surface of the base member 4, The medium 42 is guided into the heat transfer member 45 by the fan 47. Other configurations are the same as those in the above embodiment. Even in such a configuration,
Similar to the fourth embodiment, the temperature difference between the inlet side and the outlet side is smaller and a high heat exchange rate can be obtained.

In each of the above embodiments, the case where the cooling water is used as the heat exchange medium has been described, but the present invention is not limited to this, and a gas such as CFC can be used. Is. Further, in the first and second embodiments, the electronic cooling element can be used as an electronic heat exchange element by switching the direction of the current flowing through the electronic cooling element 1. In addition, the present invention can be variously modified and changed, and it goes without saying that the heat exchange medium supply chamber 11 may have a polygonal shape other than a square. Furthermore, FIG.
Although the case where the heat exchange medium supply chamber 11 is formed on the side of the base member 4 is shown in the embodiment shown in, the heat exchange medium supply chamber 11 may be provided on the side of the radiator 3.

[0028]

As described above, according to the heat exchanging device of the present invention, the heat exchanging device is provided with the base member whose one surface is in contact with the heat exchanging portion, and the base member is a portion close to the heat exchanging portion. And a polygonal heat exchange medium supply chamber having a first turbulent flow forming portion, and a position away from the center of the heat exchange medium supply chamber for guiding the heat exchange medium into the heat exchange medium supply chamber. Since it has a formed medium inlet and a medium outlet formed near the center of the heat exchange medium supply chamber, the cooling medium supplied from the medium inlet can be removed even if the area of the heat exchange medium supply chamber is large. The first turbulent flow forming section can make the flow turbulent and guide it smoothly and surely to the medium outlet. Also,
In the present invention, since the cooling water is turbulent, the temperature difference between the inlet side and the outlet side is small and a high heat exchange rate can be obtained. Therefore, a large stress does not occur on the joint surface of the Peltier element due to thermal deformation, and it is possible to reliably prevent damage to the electronic cooling element itself and also to the intermediate members such as the cooling body and the radiator. Further, the structure is simple and the base member can be easily manufactured. Further, in the present invention, since the medium outlet is formed as an eccentric circular or conical hole or a polygonal depression to form the second turbulent flow forming portion, the turbulent flow forming effect is large and an air column is generated in the central portion. Can be prevented, and the temperature difference between the inlet side and the outlet side can be further reduced. Further, when the medium outlet has a polygonal shape, depending on the shape, if the medium outlet is provided so as to be displaced from the center of the heat exchange medium supply chamber, the turbulent flow forming effect can be enhanced.

[Brief description of drawings]

FIG. 1 is a first example in which the present invention is applied to an electronic cooling device.
It is a front view of the electronic cooling element unit which shows an Example.

FIG. 2 is a plan view of the unit.

FIG. 3 is a plan view of a base member.

4 is a sectional view taken along line IV-IV of FIG.

5 is a sectional view taken along line VV of FIG.

FIG. 6 is a sectional view showing a second embodiment of the present invention.

FIG. 7 is a front view of an electronic cooling element unit showing a third embodiment of the present invention.

FIG. 8 is a plan view of the same unit with a cooling body removed.

FIG. 9 is a plan view of a base member.

10 is a cross-sectional view taken along line XX of FIG.

11 is a sectional view taken along line XI-XI of FIG.

FIG. 12 is a sectional view showing a fourth embodiment of the present invention.

FIG. 13 is a sectional view showing a fifth embodiment of the present invention.

FIG. 14 is a diagram for explaining the Peltier effect.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electron cooling element (electron heat exchange element), 1A ... Peltier element, 1B ... Peltier substrate, 2 ... Cooling body, 3 ... Radiating body,
4 ... Base member, 10 ... Electronic cooling element unit, 11 ...
Heat exchange medium supply chamber, 12 ... Medium inlet, 13 ... Medium outlet,
14 ... Cooling water, 15a-15d ... Turbulent flow forming part.

Claims (13)

[Claims] 1. A polygonal shape having a first turbulent flow forming portion, the base member having one surface disposed in contact with the heat exchange portion, the base member being formed in a portion close to the heat exchange portion. A heat exchange medium supply chamber, a medium inlet formed at a position away from the center of the heat exchange medium supply chamber for guiding the heat exchange medium into the heat exchange medium supply chamber, and near the center of the heat exchange medium supply chamber And a medium outlet formed in the heat exchanger. 2. The heat exchanging device according to claim 1, wherein the heat exchanging section has two heat transfer surfaces, which are a cooling surface and a heat radiating surface facing each other, with a semiconductor element interposed therebetween. A heat exchange device comprising an exchange element, wherein the heat exchange part is one of the heat transfer surfaces. 3. The heat exchange device according to claim 2, wherein an intermediate member serving as a cooling body or a heat radiating body is arranged between the base member and the heat exchange element. apparatus. 4. The heat exchange device according to claim 1, wherein the medium inlet is opened in a direction in which the medium is guided along an inner wall of the heat exchange medium supply chamber. A heat exchange device characterized by the above. 5. The heat exchange device according to claim 1, wherein the medium outlet has a recess having an inverted trapezoidal cross section. 6. A polygonal shape, comprising: a base member having one surface disposed in contact with the heat exchange section, the base member being formed in a portion adjacent to the heat exchange section and having a first turbulent flow forming section. Heat exchange medium supply chamber, a medium inlet formed at a position away from the center of the heat exchange medium supply chamber for guiding the heat exchange medium into the heat exchange medium supply chamber, and the center of the heat exchange medium supply chamber A heat exchange device having a medium outlet which is formed in the vicinity and has a shape which becomes a second turbulent flow forming portion for making the heat exchange medium more turbulent. 7. The heat exchanging device according to claim 6, wherein the heat exchanging portion has two heat transfer surfaces, which are a cooling surface and a heat radiating surface facing each other, with a Peltier effect therebetween. A heat exchange device comprising an exchange element, wherein the heat exchange part is one of the heat transfer surfaces. 8. The heat exchange device according to claim 6, wherein the second turbulent flow forming portion is a circular hole formed at a position eccentric from the center of the heat exchange medium supply chamber. Heat exchange equipment. 9. The heat exchange device according to claim 6, wherein the second turbulent flow forming portion is a polygonal hole formed at a position eccentric from the center of the heat exchange medium supply chamber. Heat exchange device. 10. The heat exchange device according to claim 6,
The heat exchanging device, wherein the second turbulent flow forming portion is a polygonal hole formed substantially in the center of the heat exchange medium supply chamber. 11. The heat exchange device according to claim 10, wherein the polygonal hole formed substantially in the center of the heat exchange medium supply chamber has a polygonal shape that is not point symmetrical. 12. The heat exchange device according to claim 6, wherein the medium outlet has a recess having an inverted trapezoidal cross section. 13. The heat exchange device according to claim 6, wherein the medium inlet is opened in a direction in which the medium is guided along an inner wall of the heat exchange medium supply chamber. A heat exchange device characterized by the above.