JPH0868607A - Contact-type line sensor of unevenness information on surface - Google Patents

Abstract

PURPOSE: To obtain a contact-type sensor by which the flaw, of a product, which is hard to optically detect such as a flaw in a same color, a black flaw, etc., can be detected automatically without generating a blind spot by a method wherein a comb tooth-shaped probe which has been bent in the middle is brought into contact with an object, to be inspected, so as to be scanned and the strain, of the probe, which is generated by the unevenness of a surface is detected by a piezoelectric element. CONSTITUTION: As a comb tooth-shaped line probe, a line probe which has been bent in the middle is used so as not to generate a blind spot when it comes into contact with a product. A silicon thin film 9 which has been doped with phosphorus and continuity patterns 10, 11 are formed on the root part of the line probe by a vapor growth method, a piezoelectric element is formed, and a line sensor 50 is formed. The line sensor 50 is fixed by a holding utensil 51 in such a way that the contact angle 37 of the center line of the tip of the sensor with the face of the product becomes, e.g. 80 deg. or higher. Then, products 53c, 53b, 53a are conveyed by a conveyor 54, they are brought into contact with the line sensor 50, a signal from the tip of the probe is amplified ADD-converted and image-processed and the flaw of the products is detected automatically.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the surface irregularities of products such as black bodies and various products of the same color which cannot be inspected by a conventional optical image processing apparatus and whose contrast of reflected light is extremely low. The present invention relates to a contact-type line sensor for measuring surface roughness, pattern recognition, scratches, and other inspections, which can perform measurement with excellent reliability, quantitativeness, and other characteristics.

[0002]

2. Description of the Related Art In general, inspection of surface flaws is related to the reliability of products, and is therefore always carried out at the time of manufacturing various products and parts, and is also a major item for product and parts inspection.

With the miniaturization, high functionality and integration of electric parts and products such as printed circuit boards and precision small motors, the presence of foreign matter and scratches on the surface is not limited to appearance defects, but also short circuits, disconnections, rotation defects, etc. Strict and accurate inspection is required because it may cause product deterioration and product performance. For general electronic, precision, mechanical products, etc., flaws that can be detected by visual inspection, especially those with a depth of more than 5 μm and a size of more than 30 μm, are fatal problems that affect the performance. Become. On the other hand, high-speed inspection is an important factor because the efficiency of inspection influences the cost.

However, the parts to be inspected for flaws,
In many products, such as bright surfaces and black bodies, foreign matter and flaws have the same color as the background, or almost no contrast can be obtained, and the conventional optical flaw inspection device should be used for these. Was extremely difficult. Therefore, it is unavoidable that in these inspections, a person holds the sample in his hand and moves it at various angles with respect to the light while visually inspecting it from all angles, or even with a slight contrast. In most cases, the inspection is performed under a microscope using the human eye that can be judged, and sometimes the inspection is performed by touching with a hand or the like.

In addition to the above, as a conventional technique, there is an attempt to improve and cope with an optical image processing apparatus, but since a large number of light sources and a television camera are used as this means, the apparatus is expensive and large. However, it was industrially impossible. Other methods include color image processing and image processing using an image using infrared rays and ultraviolet rays, but this method is inferior in performance to visual inspection. Also, in highly accurate surface roughness and film thickness measurement, one probe with a diamond indenter is brought into contact with the product, and the product is moved to convert the surface unevenness information into pressure or strain on the probe, There is one that converts this distortion into an electric signal and uses it. In this method, only the information of the contacted part can be obtained, and it takes a lot of measurement time to inspect the surface,
It was impossible to analyze automatically.

Further, there are a scanning tunnel microscope and an atomic force microscope as a contact type analyzer for obtaining surface information of surface irregularities. However, these methods have a drawback in that the observable range is small and that it is smaller than the object of visual inspection. In addition, there is a method in which a surface distribution sensor formed by integrating and forming a large number of unit piezoelectric sensors such as piezoelectric rubber capable of converting a pressure change into an electric signal is used. However, since this inspection means can inspect only the size of the area distribution sensor at a time, it is difficult to deal with continuous line inspection.

In the plastic precision disc inspection, a metal strain gauge is mounted on a razor-shaped blade of about 5 cm x 20 cm, and the tip of the blade is fully contacted with the product at a contact angle of about 20 degrees or less. There is a method in which the product is rotated in this state, the flaws on the disk surface are converted into the distortion of the blade, and further detected by an electric signal. However, this method cannot be used for electrical, mechanical, and precision products because it cannot be inspected without the use of a coolant and a lubricant, in addition to the drawback that the condition and location of flaws cannot be specified.

Further, in the case of the contact type, depending on the contact angle between the probe and the product and the size of the unevenness on the product surface, there is a blind spot where the probe cannot contact. Since the range becomes very large as the contact angle of the probe becomes low, there is a problem that surface flaws cannot be detected faithfully.

[0009]

As described above, in these flaw inspection steps to which the conventional image processing inspecting apparatus using optical information cannot be applied, the inspection is conducted only by the visual inspection of human hands, and the visual inspection is a fatigue phenomenon. Therefore, it was impossible to inspect for more than 2 hours, and a large number of personnel were assigned compared to the production process. However, due to the recent lack of manpower, it is not possible to assign sufficient personnel to these inspection processes, which causes the defect inspection process of products to decrease the production speed. Therefore, there has been a strong demand for the development of a method for automatically performing a flaw inspection of a product or the like to which a flaw inspection apparatus cannot be applied by image processing using optical information. In other words, the problems in automatic inspection of flaws that are strongly demanded by companies nowadays are to cope with products where it is difficult to detect flaws optically, the ability to reliably detect flaws of the size to be detected, and the continuous operation. Inspection, grasp and judgment of surface information, in the case of contact type, support for scratch marks and friction heat due to contact and non-lubrication inspection, low cost, high accuracy, high sensitivity, high reliability, simple machine Structure, etc.
It was necessary to meet all of these.

The present invention is capable of detecting surface irregularity information even for products of the same color, black body, etc., which are very difficult to detect by image processing using optical information, and tend to be of a contact type. It is an object of the present invention to provide a contact type line sensor of surface unevenness information that can be measured with a very small blind spot in measurement and without requiring the use of an expensive system such as a large computer.

[0011]

The present invention has been made in order to achieve the above-mentioned object, and it has a rigidity in the lateral direction by selecting a desired value of the ratio of width and thickness and at the same time, An elastic comb-shaped probe with a piezoresistive element that transforms the strain caused by the unevenness of the surface of the inspection object into a resistance change at the base, and the detection flaw signals for each of the comb-shaped probes are input. An image processing device that determines the presence or absence of flaws and recognizes the shape of flaws, and incorporates flaw signals from the comb-teeth probe into surface information, and also performs drive control and movement monitoring of the table on which the object is placed. And a comb-like probe which is formed at an equal pitch. Further, the comb-like probe has an intermediate pitch of 2
It is characterized in that the probe is bent in three steps, or or, and a projection having a tip curvature radius of 10 μm to 10 mm is formed at the tip of the probe.

[0012]

The function of detecting flaws is to fix the line sensor and move the product in one direction, or fix the product and move the sensor in one direction to detect surface information and flaws, size,
Get depth and location information. In particular, the method of fixing the sensor and moving the product can also be applied to a belt conveyor or the like, which satisfies the continuity of inspection. The comb-teeth-shaped line probe has comb teeth formed in a line shape, that is, each probe as it is, or is bent as it is in two or more steps as it is, and further, a projection or a convex portion is formed at this tip portion. An arbitrary contact angle can be obtained between the probe and the surface of the object to be measured. Further, since the interval between the probe and the adjacent probe, that is, the size of the pitch is 10 μm to 10 mm, desired flaws can be inspected.

[0013]

The line sensor according to the present invention will be described in detail below with reference to the accompanying drawings by way of examples. The line sensor according to the first embodiment is similar to that shown in FIG.
It is used as shown in. That is, the gate-shaped support base 52
A sensor holder that can adjust the tilt and vertical position of the sensor
51 is fixed, and the line sensor 50 is attached so as to be parallel to the product surface and have an appropriate contact angle. Products 53 on the belt conveyor 54 or table are 53c, 53b,
Since the product 53b is sequentially sent, the product 53b is brought into contact with the line sensor to inspect the entire surface of the product.

As shown in FIG. 2, the comb-teeth-shaped line probe on which the element is to be formed has an elastic body having a thickness 1 of 15 to 15.
Using phosphor bronze foil of 50 μm, the pitch 2 of each probe is 30 to 200 μm, the width 3 of each probe is about 20 to 150 μm,
The length 4 was 1 to 10 mm, and the total width 5 composed of 10 to 500 probes was 2 mm to 10 cm and formed by etching or the like. The line probe is formed so that the ratio of the width 3 of each probe to the thickness 1 of the probe is approximately 2 or more, and has rigidity in the lateral direction to prevent the probe from kinking or pushing sideways. This eliminates interference between the probes due to unevenness. In addition to this, as the elastic body which is a material of the line probe, nickel alloy or the like capable of forming the above-mentioned line probe by etching, electroforming, photolithography, precision processing or the like, silicon (Si), polyimide resin, etc. , Epoxy resin, etc. are used.

As shown in FIGS. 3 and 4, an insulating film such as a silicon nitride film 7 and a polyimide film 8 having a thickness of about 1 μm each is formed on this line probe. The gap length 23 obtained by forming the n-type semiconductor thin films 9 and 13 of phosphorus-doped silicon and the conductive patterns 10, 11 and 14 by vapor phase epitaxy and photolithography is 30 μm or more.
A piezoresistive element having a thickness of 200 μm is formed, an insulating protective film is further formed, and a polyimide or silicon nitride film 12 and a silicon oxide film, titanium nitride, or both protective films 15 as a wear protective film are formed.
Each thickness was formed to about 1 μm to form a line sensor. The probe 6 is bonded to the ground electrode 19 of the substrate and also serves as a ground for noise reduction. When the material of the elastic body is not a conductive substance, it is similarly formed after forming the insulating film after performing a pretreatment such as chromium vapor deposition. Continuity pattern 1
0, 11, and 14 are bonded and bonded to respective terminals of the printed board. The concavo-convex signal of each probe is a conduction pattern.
The change in resistance of the piezoresistive element arranged between 10 and 11 and 14, that is, at the base of the probe due to strain is taken out as a resistance change between terminals. The temperature of each probe of the line sensor is corrected by signals from the conductive patterns 10 and 14 formed of the silicon semiconductor 13 and aluminum.

This line sensor has a contact angle with the product
Fix it to the holder at 45 degrees and move the black rubber magnet product and the solder-plated lead frame product on the table or belt conveyor at a speed of 1 cm / sec to 5 cm / sec to make sure the surface of the product is not damaged. The result of measurement is shown as Sample No.1.

In the product inspection, as shown in the block diagram of FIG. 5 showing the configuration of the inspection device, the signal 25 from each probe of the line sensor is switched by the switching circuit 26 and amplified by the amplifier circuit 27. It is converted into digital data by the analog-digital conversion circuit 28. The control device 30 displays a table, etc. each time conversion of signals from all terminals of the line sensor placed at a certain line position is completed.
31 is moved by the same pitch as each probe, and conversion of data at the next line position is started. Or table etc.
When 31 etc. are moved continuously and moved by the pitch of each probe, the conversion of the next line position is started. As a result of repeating this in sequence, the set of converted digital data is
The surface data includes surface flaws. A flaw is detected by extracting flaw information or the like from this data by a general image processing device 29. As a device after the line sensor, a device used in an ordinary general-purpose image processing method can be used, and a special large computer is not required and a microcomputer is used.

Next, a second embodiment will be described. FIG. 6 shows the configuration of the line sensor of the second embodiment, (a) is a side view,
(b) The figure is a plan view. As shown in the figure, the comb-shaped line probe on which an element is to be formed is applied to the above-described first embodiment.
Based on the line probe of, the middle of the probe is 3 in order to eliminate the blind spot when contacting the product.
As shown in 3, 34, and 35, those folded in three stages were used. On this line probe, an insulating film such as a silicon nitride film 7 and a polyimide film 8 is formed with a thickness of about 1 μm, and phosphorus-doped silicon is deposited on the insulating layer and at the root of each probe by vapor phase epitaxy. Thin films 9 and 13 and conduction pattern 1
A piezoresistive element obtained by forming 0, 11, and 14 is formed, and a polyimide or silicon nitride film 12, a silicon oxide or titanium nitride film, or a protective film 15 of both is formed as a protective film to form a line. Made with a sensor. This line sensor is fixed to a holder so that the contact angle 37 formed by the center line of the sensor tip 33 and the product surface is 80 degrees or more, and the black rubber magnet product on the table or belt conveyor and the solder-plated lead frame. The product was moved at a speed of 1 cm / sec to 5 cm / sec, and the results of measuring the flaws on the surface of the product are shown as sample No.2. The same device as in Example 1 was used as the device after the sensor.

Next, a third embodiment will be described. 7A and 7B are configuration diagrams of the third embodiment, where FIG. 7A is a side view and FIG. 7B is a plan view. As shown in the figure, a comb-shaped line probe on which an element is to be formed is provided with a thickness of 300 to 1000 as an elastic body.
Use carbon steel plate of μm, pitch 500 to 4000μ
m, the width of each probe is about 300 to 3000 μm, the length is 3 to 20 cm, and the total width is 20 to 100.
The one used was 30 mm to 40 cm. Further, a probe having a protrusion 40 having a height of about 3 mm and a depth of about 2 mm was formed at the tip of each probe to reduce the blind spot in detecting flaws in the product. An insulating film such as a silicon nitride film 7 or a polyimide film 8 is formed on the line probe, and further, a width of about 100 to 3000 μm and a gap length of the resistive element of about 100 are formed on the line probe and at the root of each probe. Or mounting a piezoresistive element having a size of 10000 μm, and forming an insulating film 12 of polyimide and silicon nitride and a protective film 15 of silicon oxide or titanium nitride as a protective film, as in the first embodiment. And made a line sensor. Fix this line sensor to the holder so that the contact angle of the center line of the protrusion with the product surface is 100 to 110 degrees, and attach the black rubber magnet product and solder-plated lead frame product on the table or belt conveyor to the product. 3 cm / sec to 20 cm /
Sample No. 3 shows the result of measuring the flaws on the surface of the product by moving it at a speed of 2 seconds. The same information processing device as that of the first embodiment was used after the sensor.

In Example 4, a comb-teeth-shaped line probe on which an element is to be formed is used, which is based on that of Example 3 described above, and in which the probe middle portion is bent in two steps. An insulating film is formed on this line probe in the same manner, and a piezoresistive element is mounted or formed on this and at the base of each probe, and as a protective film.
A polyimide and silicon nitride film 12 or a silicon oxide and titanium nitride film protective film 15 was formed to form a line sensor. The line sensor is fixed to the holder so that the contact angle formed by the center line of the protrusion of the line sensor and the product surface is 90 degrees, and the black rubber magnet product on the table or belt conveyor and the solder-plated lead frame. Product
Sample No. 4 shows the result of measuring the flaws on the surface of the product which was moved at a speed of 3 cm / sec to 20 cm / sec. The same information processing device as that of the first embodiment was used after the sensor.

As Comparative Example 1, the image processing using optical information, which is a conventional method, is applied to the products of the above-mentioned first, second, third, and fourth embodiments. The results are shown in Sample No. 5 and the results using a contact type surface roughness meter are shown in Sample No. 6 for comparison.

Especially, it is difficult to inspect by image processing using optical information, and it is necessary to detect flaws having a depth of more than 5 μm. The sensitivity, speed, and other characteristics are shown in Table 1 below. Similarly, the flaw depth is 100 μm.
The results for the rubber magnets required to detect the larger ones are shown in Table 2. In the table, ◎ means good
A circle indicates an allowable range, a triangle indicates that only a part can be handled, and a circle indicates that it is impossible at all. The numbers in the table indicate that larger flaws can be detected.

[0023]

[Table 1]

[0024]

[Table 2]

As is clear from Tables 1 and 2, even if the flaws of the product, which are required to be detected by visual inspection but cannot be detected by the conventional flaw inspection method, are detected by the line sensor according to the present invention. By using, it is possible to sufficiently detect the position, shape, size, depth, etc. on the surface. The position and size of the flaw can be detected because the probe is comb-shaped and a pitch suitable for the flaw to be detected can be selected.

In this method, the pitch of the probe is determined by visual inspection in accordance with the size of the target flaw. Generally, the size is about 30 μm to 4 mm. Similarly, the total width of the line probe is determined corresponding to the width of the portion to be inspected or the product, and is generally about 2 mm to 40 cm. As the product becomes larger, the lower limit of the allowable flaw size also becomes larger. Examples 1 and 2 are examples corresponding to products whose products are relatively small and whose flaw size is relatively small, and which require inspection, and Examples 3 and 4 are relatively large products. This is an example corresponding to a product for which it is required to detect relatively large flaws.

The reason why a flaw having a depth of 5 μm can also be measured is that a piezoresistive element is used as a strain detecting element. In the contact type, there is a blind spot range that cannot be measured depending on the value of the contact angle 37. The following phenomena occur in a probe without protrusions and bends. If there is a convex portion in the traveling direction, and the probe tip is at the bottom portion and the probe middle portion contacts the leading edge of the convex portion, the blind spot range cannot be detected from the contact point of the tip to the leading edge of the convex portion. Also, when proceeding from the convex portion to the concave portion, the probe is in an idle state until the probe tip leaves the convex portion trailing edge and contacts the concave portion,
During this period, the blind spot is reached. The former blind spot range is almost nonexistent when the probe contact angle is 70 degrees or more, but becomes larger as the angle becomes smaller, especially 20 degrees or less, which cannot be ignored. The latter blind spot range is almost non-existent when the contact angle is 20 degrees or less, but becomes large as the angle increases, especially when it is 80 degrees or more. When the contact angle is near 45 degrees, the dead angle range is the smallest, but it does not exist.

Although the first embodiment is based on this method of use, in this case, the defect of the blind spot is that the flaws to be detected are detected to be approximately the same as the front and rear and are larger than they should be. Since it is possible to grasp the action and the shape of a flaw almost clearly, it can be effectively used for flaw detection and the like. Further, since the structure is simple, there is an advantage that the sensor can be easily formed.

The probe is formed with a projection or has a two-step bent structure, and the contact angle 37 formed by the projection or the tip center line and the product surface is 70 to 110 degrees, and the angle formed by the probe center line and the product surface. When 38 is set to about 20 to 10 degrees, the above-mentioned blind spot range can be almost completely eliminated by the synergistic effect. Example 3 is based on this method. Excellent in accurate detection of flaws and pattern recognition. However, in this case, since the angle 38 formed between the probe center line and the product surface is small, a large sensor such as that of the third embodiment can take a large work area, but a small sensor cannot physically take a large work area. Interference will occur. In this case, the work area can be increased by further bending the probe upward and increasing the angle 39 with the product surface. Example 2 and Example 4 are based on this method.

That is, in the case of a rod-shaped probe, the contact angle cannot be made to be close to 45 degrees, so that it can be practically used in the detection, and by forming a convex portion at the tip or by making the structure of the probe into two or three steps. The range of the blind spot is set to almost zero, and accurate shape and pattern recognition of flaws can be dealt with. Further, unlike the optical method, it is possible to surely obtain the surface unevenness information, so that the obtained information can be rapidly processed into surface information at a speed of, for example, 1 cm / sec to 20 cm / sec. . This is sufficient for the average production rate of the line of 1 to 10 cm / sec.

The contact pressure of the probe can be made extremely small by making the ratio of the contact portion and the heat radiating portion large by making the probe comb-shaped, and the contact pressure of the probe can be made extremely small. It is possible to almost eliminate the occurrence of scratches and to prevent the generation of scratch marks. Generally, in such contact of a probe, if the contact load per probe is 1 g weight, it is said that a scratch mark will always occur, but in the case of this method, the load per probe is Since the weight can be limited to 0.04 g at the maximum, the formation of scratch marks on the product can be almost eliminated by the inspection. As described above, it is apparent that the line sensor according to the present invention can sufficiently measure even flaws on the surface of a product which are almost undetectable by image processing using optical information.

On the other hand, the products shown in Table 1 have a specular gloss with a light reflectance of nearly 100%, and even if there is a flaw in a very small portion of this product, the flaw is crushed by the halation phenomenon, Since no flaw can be detected, sample No. 6 of the comparative example
As shown in, almost no measurement is possible. Further, since the products in Table 2 are black rubber products and there is almost no reflected light of light, almost no surface information such as flaws can be obtained. Therefore, measurement cannot be performed at all as shown in Comparative sample No. 6.

If a surface roughness meter is used, as shown in Comparative Example 7 in Tables 1 and 2, extremely high-resolution inspection can be performed only in the line direction, but surface information cannot be grasped.

[0034]

The first feature of the present invention is that the contact type line sensor according to the present invention can be applied to products of the same color, black body, etc., which are difficult to detect by image processing using optical information. Means that the surface unevenness information can be effectively detected, and therefore, even in the flaw inspection of such a product, the measurement can be performed very effectively. A second feature of the present invention is that a comb-teeth line probe with an equal pitch is used, and by setting the size of this pitch to the same level as the size of a flaw to be detected by visual inspection, most of the It is possible to detect flaws required for visual inspection. Also, by taking a comb-tooth structure and appropriately setting the length of the probe, it is possible to almost eliminate scratch marks and friction heat due to contact, so that it can be applied even to products that do not like contact. .

A third feature of the present invention is that the line probe is bent in two or three stages in the middle, or a protrusion having a tip curvature radius adapted to the size of the flaw to be detected at the probe tip, that is, about 1 of the flaw. By forming a projection having a radius of curvature of 10 μm to 10 mm of about ⅓ or the same size, it is possible to extremely reduce the range of the blind spot in the measurement that is likely to occur in the contact type. The fourth feature of the present invention is that the reason why it cannot be detected or measured by the image processing method using optical information is that it is used under the condition of little or little optical information. It is not due to the information processing device and the computer that are operating. For this reason, if the line probe according to the present invention is used as a signal detection source, sufficient analysis and measurement can be performed by these general-purpose information processing devices, so that a microcomputer can be used as a computer without requiring an expensive system. That's enough.

[Brief description of drawings]

FIG. 1 is a perspective view showing a schematic configuration of a flaw inspection device.

FIG. 2 is a line probe configuration diagram of the first embodiment.

FIG. 3 is a cross-sectional configuration diagram of the line sensor according to the first embodiment.

FIG. 4 is a plane configuration diagram of the line sensor according to the first embodiment.

FIG. 5 is a block diagram showing the configuration of the inspection apparatus according to the first embodiment.

6A and 6B are configuration diagrams of a line sensor according to a second embodiment, in which FIG. 6A is a side view and FIG. 6B is a plan view.

FIG. 7 is a line probe configuration diagram of a third embodiment,
(a) Figure is a side view, (b) Figure is a plan view

[Explanation of symbols]

1 Thickness of probe 2 Pitch 3 Width of probe 4 Length of probe 5 Total width of line probe 6 Line probe 7 Silicon nitride film 8, 12 Polyimide film 9, 13 Silicon semiconductor thin film 10, 11, 14 Conductive pattern 15 Oxidation Silicon protective film 16, 17, 18 Substrate electrode pattern 19 Substrate earth 20 Mold resin 21 Wire bonding 23 Piezoresistive element gap length 24 Printed circuit board base material 25 Line sensor 26 Switching circuit 27 Amplifier circuit 28 Analog-digital conversion circuit 29 Image Defect extraction by processing 30 Controller 31 Drive device such as table 32 Output signal 33 First stage of line probe 34 Second stage of line probe 35 Third stage of line probe 36 Product 37 Contact angle between tip and product surface 38 Angle between the probe center line and the product surface 39 Bending angle for a large work area 40 Protrusion at the tip of the probe 50 Sensor 51 line sensor holder 52 gatepost-shaped fixture support base 53 product 54 conveyors, etc.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Mitsuru Denda 1729 2 Nagachi, Okaya City, Nagano Prefecture (72) Inventor Akio Koike 3-25-53, Shinmeicho, Okaya City, Nagano Prefecture (72) Inventor Masayoshi Misawa Nagano Prefecture 449, Nakatsubo, Teira, Ina City (72) Inventor, Yonekubo, 4691, Kataoka, Shiojiri City, Nagano Prefecture (72) Inventor, Keigo Oguchi 1-934, Nomizo Nishi, Matsumoto City, Nagano Prefecture (72) Inventor Shigeru Kawabe 3155-4 Nagachi, Okaya-shi, Nagano (72) Inventor Yasuko Kurokawachi 3155-3 Nagachi, Okaya-shi, Nagano

Claims (3)

[Claims] 1. A piezoresistive element for selecting a desired ratio of width and thickness to provide lateral rigidity and for converting strain caused by unevenness of the surface of the object to be tested into resistance change. An elastic comb-shaped probe arranged at the base, and an image processing device for recognizing the shape of a flaw by determining the presence or absence of a flaw by inputting the flaw signal detected by each of the comb-shaped tips, Contact of surface irregularity information characterized by being configured by incorporating a flaw signal from a comb-like probe into surface information, and comprising a microcomputer for drive control and movement monitoring of a table on which an object is placed. Line sensor. 2. The contact type line sensor for surface unevenness information according to claim 1, wherein the comb-teeth shaped probes are formed at an equal pitch. 3. The comb-shaped probe is bent in two or three stages in the middle, and / or the tip has a radius of curvature at the tip.
The contact type line sensor according to claim 1, wherein the contact type line sensor is formed by forming protrusions of 10 μm to 10 mm.