JPH0864472A - Manufacture of chip type thick capacitor - Google Patents

Abstract

PURPOSE: To effectively reduce a defective occurrence rate by simultaneously so forming a lower layer electrode film and an auxiliary electrode film as to have an electrical continuity with an upper surface electrode film for a connecting terminal, and the upper electrode film of the upper surface of a dielectric film on the lower layer film with the auxiliary electrode film. CONSTITUTION: A pair of upper surface electrode films 12, 13 for left and right connecting terminals are formed on the upper surface of a chip piece 11. Simultaneously, a lower layer electrode film 14 and an auxiliary electrode film 20 for constituting a capacitor are so formed that the one end of the film 14 is superposed on the film 12 for the one connecting terminal of the films 12, 12 for both the terminals and the part of the film 20 is superposed on the film 12 for the other terminal. A dielectric film 15 for forming a capacitor is formed on the upper surface of the film 14, and an upper layer electrode film 15 for forming the capacitor is formed on the upper surface of the film 15 in such a manner that the one end of the film 16 is superposed on the films 20.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a so-called chip type thick film capacitor in which a capacitor is formed in a thick film on the upper surface of an insulating chip piece.

[0002]

2. Description of the Related Art Generally, as shown in FIGS. 7 and 8, a chip type thick film capacitor of this type includes a pair of left and right upper surface electrode films 2 for connection terminals on the upper surface of a chip 1 made of an insulator such as ceramic. , 3 is formed, and the lower layer electrode film 4 constituting the capacitor is formed such that one end of the lower layer electrode film 4 overlaps with one of the connection terminal upper surface electrode films 2 and 3. And a dielectric film 5 forming a capacitor on the upper surface of the lower electrode film 4, and further,
On the upper surface of the dielectric film 5, an upper electrode film 6 constituting a capacitor is arranged so that the upper electrode film 6 overlaps the other upper electrode film 3 for connecting terminals of the upper electrode films 2 for connecting terminals. It is configured to be formed in.

Reference numerals 7 and 8 denote side surface electrode films for connection terminals formed on both left and right end surfaces of the chip piece 1 so as to be electrically connected to the upper surface electrode films 2, 3 for both connection terminals. Reference numeral 9 indicates an overcoat made of glass or the like, and the outer surfaces of the upper electrode films 2 and 3 for both connection terminals and the side electrode films 7 and 8 for both connection terminals are used to improve solderability. An appropriate metal plating layer is formed.

Conventionally, when manufacturing this chip type thick film capacitor, first, a pair of left and right upper surface electrode films for connection terminals are formed on the upper surface of the chip piece 1 by screen printing using a first screen. Formed and then the chip piece 1
A lower electrode film 4 is formed on the upper surface of the substrate by screen printing using a second screen, and a dielectric film 5 is formed on the third electrode
A method is adopted in which after forming by screen printing using a screen, the upper electrode film 6 is formed by screen printing using a fourth screen.

[0005]

However, a pair of left and right upper surface electrode films 2 and 3 for connection terminals, which are finally metal-plated, are formed by screen printing, and then a lower layer electrode film for a capacitor is formed. 4 and the upper electrode film 6 are formed by screen printing, there is necessarily a relative positional deviation between them due to the different screen printing steps. When this relative positional deviation occurs in the direction in which the other connection terminal upper surface electrode film 3 and the upper layer electrode film 6 and the lower layer electrode film 4 approach each other, the other connection terminal upper surface electrode An electrical short circuit occurs between the film 3 or the upper electrode film 6 and the lower electrode film 4, resulting in a defective product.

That is, in the conventional manufacturing method, as described above, there is a problem that the defective product rate is high due to the relative displacement of the electrode films when they are formed. An object of the present invention is to provide a manufacturing method capable of reliably reducing this problem, that is, the incidence of defective products.

[0007]

In order to achieve this technical object, the present invention provides a method of forming a pair of left and right upper surface electrode films for connection terminals on the upper surface of an insulator chip piece, and then forming a capacitor terminal film. A lower layer electrode film and an auxiliary electrode film spaced apart from the lower layer electrode film as appropriate are provided, wherein the lower layer electrode film is one of the connection terminal upper surface electrode films and the auxiliary electrode film is the other. Are simultaneously formed on the upper electrode film for connecting terminals so as to be electrically connected to each other, a dielectric film for a capacitor is formed on the upper surface of the lower electrode film, and then the upper electrode for the capacitor is formed on the upper surface of the dielectric film. The film is formed so that the upper electrode film is electrically connected to the auxiliary electrode film. ”

[0008]

[Operation] As described above, of the pair of left and right upper surface electrode films for both connecting terminals, the lower electrode film for capacitors electrically conducting to the upper surface electrode film for one connecting terminal and the upper electrode for the other connecting terminal By simultaneously forming the film and the auxiliary electrode film electrically conducting to the capacitor upper electrode film,
It is possible to eliminate the relative positional deviation between them, in other words, since the interval between them can always be kept constant, when forming each electrode film,
Even if there is a relative positional deviation between them, the lower electrode film for a capacitor electrically connected to the upper electrode film for a connecting terminal is the upper electrode film for a connecting terminal and the upper electrode film for a capacitor. By electrically forming the auxiliary electrode film at the same time as the capacitor lower layer electrode film, it is possible to surely avoid electrical short-circuit with respect to the electrode film.

[0009]

Therefore, according to the present invention, there is an effect that the incidence of defective products due to the relative displacement of each electrode film can be greatly reduced.

[0010]

Embodiments of the present invention will be described below with reference to the drawings of FIGS. 1 and 2 show a chip type thick film capacitor manufactured by the method of the present invention. This chip type thick film capacitor has a pair of left and right connecting terminals on the upper surface of a chip piece 11 made of an insulator such as ceramics. And the lower electrode film 14 and the auxiliary electrode film 20 constituting the capacitor are formed on the lower electrode film 1
4 has one end of the connection terminal upper surface electrode film 12 and the connection terminal upper surface electrode film 12 connected to the auxiliary electrode film 20.
Is formed so as to partially overlap the upper surface electrode film 13 for the other connection terminal, and a dielectric film 15 constituting a capacitor is formed on the upper surface of the lower layer electrode film 14. Further, the dielectric film 15 is formed. The upper electrode film 1 that constitutes the capacitor on the upper surface of the
6, one end of the upper layer electrode film 16 has both the auxiliary electrode films 2
It is formed so as to overlap zero.

Reference numerals 17 and 18 denote the chip pieces 1 described above.
Reference numeral 19 denotes a side electrode film for connection terminals formed so as to be electrically connected to the upper surface electrode films 12 and 13 for both connection terminals on each of the left and right end surfaces in 1, and reference numeral 19 denotes an overcoat such as glass, Upper surface electrode films 12, 1 for both connection terminals
On the outer surface of the side electrode films 17 for both 3 and both connection terminals, an appropriate metal plating layer for improving solderability is formed.

In manufacturing the chip type thick film capacitor having this structure, first, as shown in FIG.
1 on the upper surface of the upper and lower electrode film 1 for connecting terminals
2, 13 are formed by screen printing using the first screen 21, and then, on the upper surface of the chip piece 11,
As shown in FIG. 4, the lower electrode film 14 and the auxiliary electrode film 20 are formed by screen printing using the second screen 22.

Further, on the upper surface of the lower electrode film 14, as shown in FIG.
As shown in, the dielectric film 15 is formed by screen printing using the third screen 23. Then, on the upper surface of the dielectric film 15, as shown in FIG.
6 is formed by screen printing using the fourth screen 24. Then, side electrode films 17 and 18 for connecting terminals are formed on both left and right end surfaces of the chip piece 11, and an overcoat 19 is further applied. Then, the upper electrode films 12 and 13 for both connecting terminals and both connecting terminals are formed. Side electrode film 17, 18
The metal is plated on the outer surface of the to make a finished product.

As described above, one of the pair of left and right upper surface electrode films 12 for connecting terminals is the upper surface electrode film 1 for connecting terminal.
Capacitor lower electrode film 1 electrically conducting to 2
4 and the auxiliary electrode film 20 electrically connected to the other upper electrode film 13 for connection terminals and the upper electrode film 16 for capacitors are simultaneously formed by screen printing using the second screen 22, It is possible to eliminate the relative positional deviation in the above, in other words, since the interval dimension T between them can be always kept constant, when forming various electrode films, the relative positions between them are Even if there is a deviation, the capacitor lower electrode film 14 electrically connected to the one connection terminal upper electrode film 12 is different from the other connection terminal upper electrode film 13 and the capacitor upper electrode film 16. By forming the auxiliary electrode film 20 at the same time as the lower electrode film 14 for a capacitor, it is possible to surely avoid the electrical short circuit. .

[Brief description of drawings]

FIG. 1 is a vertical sectional front view of a chip type thick film capacitor according to an embodiment of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a vertical cross-sectional front view showing a state in which an upper surface electrode film for a connection terminal is formed on the upper surface of a chip piece.

FIG. 4 is a vertical cross-sectional front view showing a state in which a lower electrode film for a capacitor and an auxiliary electrode film are formed on the upper surface of a chip piece.

FIG. 5 is a vertical sectional front view showing a state in which a dielectric film is formed on the upper surface of the lower electrode film for a capacitor.

FIG. 6 is a vertical sectional front view showing a state in which a capacitor upper layer electrode film is formed on the upper surface of the dielectric film.

FIG. 7 is a vertical sectional front view of a conventional chip type thick film capacitor.

FIG. 8 is a plan view of FIG.

[Explanation of symbols]

 11 Chip Pieces 12, 13 Upper Electrode Film for Connection Terminal 14 Lower Electrode Film for Capacitor 15 Dielectric Film 16 Upper Electrode Film for Capacitor 17, 18 Side Electrode Film for Connection Terminal 19 Overcoat 20 Auxiliary Electrode Film

Claims (1)

[Claims] 1. A pair of left and right upper surface electrode films for connection terminals are formed on the upper surface of an insulating chip piece, and then a lower layer electrode film for a capacitor and an auxiliary electrode film which is appropriately spaced from the lower layer electrode film. And the lower electrode film are simultaneously formed so as to be electrically connected to the upper electrode film for one connecting terminal of the upper electrode films for both connecting terminals, and the auxiliary electrode film is electrically connected to the upper electrode film for the other connecting terminal, respectively. Then, after forming a dielectric film for a capacitor on the upper surface of the lower electrode film, an upper electrode film for a capacitor is formed on the upper surface of the dielectric film, and the upper electrode film electrically connects to the auxiliary electrode film. A method of manufacturing a chip-type thick film capacitor, which is characterized in that