JPH0854292A - Temperature sensor and lead frame thereof - Google Patents

Temperature sensor and lead frame thereof

Info

Publication number
JPH0854292A
JPH0854292A JP6229518A JP22951894A JPH0854292A JP H0854292 A JPH0854292 A JP H0854292A JP 6229518 A JP6229518 A JP 6229518A JP 22951894 A JP22951894 A JP 22951894A JP H0854292 A JPH0854292 A JP H0854292A
Authority
JP
Japan
Prior art keywords
metal plate
portions
temperature sensor
narrow metal
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6229518A
Other languages
Japanese (ja)
Other versions
JP3494709B2 (en
Inventor
Hideo Ikeda
秀夫 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ISHIZUKA DENSHI KK
Original Assignee
ISHIZUKA DENSHI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ISHIZUKA DENSHI KK filed Critical ISHIZUKA DENSHI KK
Priority to JP22951894A priority Critical patent/JP3494709B2/en
Publication of JPH0854292A publication Critical patent/JPH0854292A/en
Application granted granted Critical
Publication of JP3494709B2 publication Critical patent/JP3494709B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

PURPOSE:To provide a temperature sensor which can be arranged at a small gap without impairing heat response characteristics and has excellent mechanical strength. CONSTITUTION:Wide external lead terminals 3a', 3b' are formed at the ones of a pair of narrow-width metal plates 3a, 3b, and wide platelike holders 6a, 6b are formed at the others. A sheetlike temperature sensor has the electrode of a flat platelike thermosensitive element 7 adhered to the gap of the holders 6a, 6b by soldering, etc., and the parts of the terminals 3a', 3b' exposed and sealed at insulation sheets 9, 9'.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、温度センサとそのリー
ドフレームに関するものであり、特に、家電機器等に使
用するニッケル・カドミウム蓄電池、ニッケル水素蓄電
池等の二次電池の充電時における電池表面の温度検知を
行う為の温度センサとその温度センサに適したリードフ
レームに係るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature sensor and its lead frame, and more particularly to a surface of a battery during charging of a secondary battery such as a nickel-cadmium storage battery or a nickel-hydrogen storage battery used in home electric appliances. The present invention relates to a temperature sensor for detecting temperature and a lead frame suitable for the temperature sensor.

【0002】[0002]

【従来の技術】二次電池は、急速充電時に電池内部の化
学反応等による温度上昇や周辺温度が低かったり、或い
は周辺温度が高い時に充電すると電池寿命が短くなるこ
とがあり、このような技術的課題を解決する方法とし
て、温度センサにより充電可能な温度の上限及び下限を
検出して制御する必要がある。二次電池は、酸化及び還
元作用による化学反応によって電子を発生させて発電が
なされており、このような酸化及び還元作用による腐食
から温度センサを保護する構造が要求されるとともに、
電池は小型化の要求があり、温度センサの要求に応じる
必要性がある。
2. Description of the Related Art A secondary battery may have a short battery life when it is charged when the temperature rises due to a chemical reaction or the like inside the battery during rapid charging or when the ambient temperature is low, or when the ambient temperature is high. As a method of solving the physical problem, it is necessary to detect and control the upper limit and the lower limit of the temperature that can be charged by the temperature sensor. The secondary battery generates electricity by generating electrons by a chemical reaction due to oxidation and reduction, and a structure that protects the temperature sensor from corrosion due to such oxidation and reduction is required, and
Batteries are required to be miniaturized, and it is necessary to meet the demands of temperature sensors.

【0003】従来、このような二次電池の表面温度等を
検知する為の温度センサには、例えば、図4に示したよ
うな、本出願人が提案した実公平5−17869号公報
に記載された温度センサがある。図4(a)に於いて、
20はリードフレームであり、スプロケット用孔21a
が形成された帯状部21から直角に延びる一対のリード
22,22′が複数対突出しており、各リードは連結部
(タイバー部)23で支持され、チップ部品が挟持され
るリード24,24′が延びている。一対のリード2
4,24′の先端部分は、その幅を狭めるテーパ状部材
25,25′とチップ部品を挟持する挟持部26,2
6′が形成されている。
Conventionally, a temperature sensor for detecting the surface temperature and the like of such a secondary battery is described in, for example, Japanese Utility Model Publication No. 5-17869 proposed by the present applicant as shown in FIG. There is a temperature sensor. In FIG. 4 (a),
Reference numeral 20 denotes a lead frame, which has a sprocket hole 21a.
A plurality of pairs of leads 22 and 22 'extending at right angles from the band-shaped portion 21 in which is formed are projected, and each lead is supported by a connecting portion (tie bar portion) 23, and leads 24 and 24' for sandwiching a chip component. Is extended. A pair of leads 2
The tip portions of 4, 24 'are tapered portions 25, 25' for narrowing the width thereof, and the clamping portions 26, 2 for clamping the chip component.
6'is formed.

【0004】図4(b)には、サーミスタ等の感熱素子
からなるチップ部品27が挟持部26,26′に挟持さ
れた状態を示している。チップ部品27は、この挟持部
26,26′の間隙に半田付けされており、このチップ
部品と挟持部の周囲を覆うように絶縁被覆した構造とな
っている。この種の温度センサは、バッテリパック内に
実装されて、急速充電時の電池の表面温度又は周囲温度
を検知して充電時間を制御する為の素子として多用され
ている。
FIG. 4B shows a state in which a chip component 27 composed of a heat sensitive element such as a thermistor is sandwiched by the sandwiching portions 26, 26 '. The chip component 27 is soldered to the gap between the sandwiching portions 26, 26 ', and has a structure in which the chip component and the sandwiching portion are insulated and coated so as to cover the periphery thereof. This type of temperature sensor is mounted in a battery pack and is often used as an element for detecting the surface temperature or the ambient temperature of a battery at the time of rapid charging and controlling the charging time.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、上記の
温度センサは、バッテリパック内の空間に配置しようと
すると、リードフレームの先端の挟持部26,26′の
間隙に平板状のチップサーミスタ部品が垂直方向に挟持
されているので、絶縁被覆した状態の温度センサは、そ
の先端の感熱部が大きな形状となる欠点があるととも
に、感熱面を平坦に形成できない構造的な問題点があ
る。このような従来の温度センサは感熱部分が平坦でな
い為に、バッテリケース内の電池との接触が不十分なも
のとなる傾向にあった。従って、このような温度センサ
では、被温度検知体と感熱部との接触が不十分であり、
検出温度にバラツキが発生して正確な温度検知ができな
い欠点がある。従って、より検出精度が高く、熱応答特
性が良好な温度センサを必要とする被温度検知体に対し
ては、このような温度センサでは充分な目的を達成する
ことができない欠点がある。更に、この温度センサは、
感熱部の形状が大きくバッテリパック等に実装する場
合、バッテリパックの小型化に支障を与える結果とな
る。又、温度センサを実装する際に、感熱面が平坦でな
い為に感熱部の捻じれによって、温度センサが破壊する
おそれがあり、機械的強度が要求される。
However, when the temperature sensor is arranged in the space inside the battery pack, the flat chip thermistor component is perpendicular to the gap between the holding portions 26, 26 'at the tip of the lead frame. Since the temperature sensor is sandwiched in the direction, the temperature sensor in the state of insulating coating has a drawback that the heat sensitive portion at the tip has a large shape, and there is a structural problem that the heat sensitive surface cannot be formed flat. Such a conventional temperature sensor tends to have insufficient contact with the battery in the battery case because the heat sensitive portion is not flat. Therefore, in such a temperature sensor, the contact between the temperature-sensing body and the heat-sensitive section is insufficient,
There is a drawback that the detected temperature varies and accurate temperature detection cannot be performed. Therefore, there is a drawback that such a temperature sensor cannot achieve a sufficient purpose for a temperature-detected body which requires a temperature sensor having higher detection accuracy and good thermal response characteristics. Furthermore, this temperature sensor
If the shape of the heat-sensitive part is large and the heat-sensitive part is mounted on a battery pack or the like, it will hinder the miniaturization of the battery pack. Further, when the temperature sensor is mounted, since the heat-sensitive surface is not flat, the temperature sensor may be twisted due to the twist of the heat-sensitive portion, and mechanical strength is required.

【0006】本発明は、上述のような課題に鑑みなされ
たものであり、熱応答性を損なうことなく、小型でバッ
テリパック内の僅かな間隙に配設でき、又、機械的強度
に優れた耐久性のある温度センサを提供することを目的
とするものである。又、本発明は、温度センサに適した
リードフレームを提供することを目的とするものであ
る。
The present invention has been made in view of the above-mentioned problems, and it is small in size and can be disposed in a small gap in a battery pack without impairing thermal responsiveness, and has excellent mechanical strength. An object of the present invention is to provide a durable temperature sensor. Another object of the present invention is to provide a lead frame suitable for a temperature sensor.

【0007】[0007]

【課題を解決するための手段】上記の目的を達成する為
に、本発明の第1の温度センサは、一対の細幅金属板部
の夫々の一端から延在する部分を外部引出端子とし、該
細幅金属板部の夫々の他端に挟持部を形成し、一対の該
挟持部の側壁にチップ状の感熱素子の夫々の側面に形成
された電極部を接続し、前記外部引出端子の一部を除い
て、絶縁シートで被覆してなることを特徴とするもので
ある。本発明の第2の温度センサは、一対の細幅金属板
部の夫々の一端から延在する部分に幅広の外部引出端子
を形成し、該細幅金属板部の夫々の他方に幅広の挟持部
を夫々形成し、一対の該挟持部の側壁にチップ状の感熱
素子の夫々の側面に形成された電極部を接続し、前記外
部引出端子の一部を除いて、絶縁シートで被覆してなる
ことを特徴とするものである。本発明の温度センサの第
1のリードフレームは、帯状部と、該帯状部から直角方
向に延びる平行した一対の細長金属板状リード部と、該
細長金属板状リード部を支持するタイバー部と、該タイ
バー部から延びる一対の細幅金属板部と、該細幅金属板
部の夫々の先端部分に、該細幅金属板部の幅より広く、
且つ、チップ部品の側面に形成された電極部がその側壁
に接続される挟持部とを備えることを特徴とするもので
ある。本発明の第3の温度センサは、一対の細幅金属板
部の夫々の一端から延在する部分を外部引出端子とし、
該細幅金属板部の夫々の他端から外側に張り出す部分
に、該細幅金属板部の幅より幅広の挟持部を夫々形成
し、該挟持部の側壁にチップ状の感熱素子の夫々の電極
部を接続し、前記外部引出端子の一部を除いて、絶縁シ
ートで被覆してなることを特徴とするものである。
In order to achieve the above-mentioned object, the first temperature sensor of the present invention has a portion extending from one end of each of a pair of narrow metal plate portions as an external lead terminal, A sandwiching portion is formed at each of the other ends of the narrow metal plate portions, and an electrode portion formed on each side surface of the chip-shaped heat-sensitive element is connected to the side walls of the pair of sandwiching portions to connect the external lead terminals. It is characterized by being covered with an insulating sheet except for a part. In the second temperature sensor of the present invention, a wide external lead-out terminal is formed at a portion extending from one end of each of the pair of narrow metal plate portions, and a wide sandwich is provided at the other of the narrow metal plate portions. Parts are formed respectively, the electrode parts formed on the respective side surfaces of the chip-shaped heat-sensitive element are connected to the side walls of the pair of sandwiching parts, and a part of the external lead terminals is removed and covered with an insulating sheet. It is characterized by becoming. A first lead frame of a temperature sensor of the present invention includes a strip portion, a pair of parallel elongated metal plate lead portions extending in a direction perpendicular to the strip portion, and a tie bar portion supporting the elongated metal plate lead portion. A pair of narrow metal plate portions extending from the tie bar portion, and a tip end of each of the narrow metal plate portions is wider than the narrow metal plate portion,
In addition, the electrode part formed on the side surface of the chip component is provided with a sandwiching part connected to the side wall thereof. In a third temperature sensor of the present invention, a portion extending from one end of each of the pair of narrow metal plate portions is used as an external lead terminal,
A sandwiching portion having a width wider than the width of the narrow metal plate portion is formed at a portion protruding outward from each of the other ends of the narrow metal plate portion, and each of the chip-shaped heat sensitive elements is formed on a side wall of the sandwiching portion. The electrode parts are connected to each other, and a part of the external lead terminals is removed, and the external lead terminals are covered with an insulating sheet.

【0008】本発明の温度センサの第2のリードフレー
ムは、帯状部と、該帯状部から直角方向に延びる平行し
た一対の細長金属板状リード部と、該細長金属板状リー
ド部を支持するタイバー部と、該タイバー部から延びる
一対の細幅金属板部と、該細幅金属板部の夫々の先端部
分から外側に張り出す部分に、該細幅金属板部の幅より
広く、且つ、チップ部品の側面の電極部がその側壁に接
続される挟持部とを備えることを特徴とするものであ
る。前記温度センサに於いて、前記絶縁シートの少なく
とも一箇所に切り込みを設けたものである。前記温度セ
ンサに於いて、感熱素子を封止した前記絶縁シートの表
裏の少なくとも一部に接着剤を貼着したものである。前
記温度センサに於いて、前記絶縁シートとし、一面にポ
リイミド樹脂シートを他面にポリエステル樹脂シート又
はテフロン樹脂シートを用いたものである。前記温度セ
ンサに於いて、前記絶縁シートの少なくとも一箇所に切
込部を設けるとともに、前記切込部の一端に開口部を設
けたものである。
The second lead frame of the temperature sensor of the present invention supports the strip-shaped portion, a pair of parallel elongated metal plate-shaped lead portions extending in a direction perpendicular to the strip-shaped portion, and the elongated metal plate-shaped lead portion. The tie bar portion, the pair of narrow metal plate portions extending from the tie bar portion, and the portion protruding outward from the respective tip end portions of the narrow metal plate portion are wider than the width of the narrow metal plate portion, and It is characterized in that the electrode part on the side surface of the chip component is provided with a sandwiching part connected to the side wall thereof. In the temperature sensor, a cut is provided in at least one location of the insulating sheet. In the temperature sensor, an adhesive is attached to at least a part of the front and back of the insulating sheet in which the thermosensitive element is sealed. In the temperature sensor, as the insulating sheet, a polyimide resin sheet is used on one side and a polyester resin sheet or a Teflon resin sheet is used on the other side. In the temperature sensor, a cut portion is provided at at least one location of the insulating sheet, and an opening is provided at one end of the cut portion.

【0009】[0009]

【作用】本発明の第1の温度センサは、一対の細幅金属
板部の夫々の一方を外部引出端子とし、該細幅金属板部
の夫々の他方を挟持部とし、一対の該挟持部の側壁にチ
ップ状の感熱素子の夫々の側面に形成された電極部を接
続したものであり、感熱素子の感熱面が平坦なものとな
る。本発明の第2又は第3の温度センサは、細幅金属板
部の先端部分に幅の広い挟持部を設け、その挟持部の側
壁に感熱素子の電極面を電気的に接続することによっ
て、感熱素子の感熱面の面積を大きく設定できるととも
に、挟持部が広い面積を有するので熱の吸収がよく、感
熱素子への熱の伝達を良好なものとし、熱応答特性を良
好なものとする。又、感熱素子は平板状であって、その
平面部が感熱面であり、その側壁に電極が形成されてお
り、その電極に挟持部の側壁が電気的に接続されている
ので、感熱部は偏平状となる為に、被検知体との密着度
が良好なものとなり、正確に温度検知がなし得る。
In the first temperature sensor of the present invention, one of the pair of narrow metal plate portions is used as the external lead-out terminal, and the other of the narrow metal plate portions is used as the holding portion, and the pair of holding portions are provided. The electrode portions formed on the respective side surfaces of the chip-shaped heat-sensitive element are connected to the side walls of the heat-sensitive element, and the heat-sensitive surface of the heat-sensitive element becomes flat. In the second or third temperature sensor of the present invention, a wide sandwiching portion is provided at the tip of the narrow metal plate portion, and the electrode surface of the heat-sensitive element is electrically connected to the side wall of the sandwiching portion. The area of the heat-sensitive surface of the heat-sensitive element can be set large, and since the sandwiching portion has a large area, the heat absorption is good, the heat transfer to the heat-sensitive element is good, and the heat response characteristics are good. Further, the heat-sensitive element has a flat plate shape, a flat surface portion thereof is a heat-sensitive surface, an electrode is formed on the side wall thereof, and the side wall of the sandwiching portion is electrically connected to the electrode. Due to the flat shape, the degree of adhesion with the object to be detected becomes good, and the temperature can be accurately detected.

【0010】又、温度センサの金属部分をリードフレー
ムによる一体成形で製作することができる為に、形状或
いは寸法精度のバラツキを小さくすることができるとと
もに、リードフレームの状態で絶縁シートの貼着まで組
み立てることができるので、組立部品数や組立工数が低
減できるとともに、自動化が容易である。又、本発明の
第1と第2の温度センサは、薄いシート状とすること
で、バッテリパック等のケース内部に温度センサを配置
する為の特別な空間を設ける必要がない。更に、本発明
の第2の温度センサでは、感熱部分の一対の挟持部に至
る部分の細幅金属板部の隙間を広くすることで、半田等
によって挟持部が電気的な短絡を防止している。前記温
度センサは、絶縁シートとして、耐熱樹脂シートとして
ポリイミド樹脂シートを用い、且つ、機械強度を高める
為に、ポリエチレン樹脂シート又はテフロン樹脂シート
を用い、耐熱性を高めるとともに引裂強度を高めた温度
センサものである。
Further, since the metal portion of the temperature sensor can be integrally formed by the lead frame, variations in shape or dimensional accuracy can be reduced, and the lead sheet can be attached to the insulating sheet. Since they can be assembled, the number of assembly parts and the number of assembly steps can be reduced, and automation is easy. Further, since the first and second temperature sensors of the present invention are formed in a thin sheet shape, it is not necessary to provide a special space for disposing the temperature sensor inside a case such as a battery pack. Further, in the second temperature sensor of the present invention, by widening the gap between the narrow metal plate portions in the portion reaching the pair of sandwiching portions of the heat-sensitive portion, the sandwiching portion can be prevented from an electrical short circuit by soldering or the like. There is. The temperature sensor uses a polyimide resin sheet as a heat-resistant resin sheet as an insulating sheet, and uses a polyethylene resin sheet or a Teflon resin sheet to increase mechanical strength, and a temperature sensor having increased heat resistance and tear strength. It is a thing.

【0011】[0011]

【実施例】以下、本発明の温度センサとそのリードフレ
ームの実施例について図面を参照して説明する。図1
(a)は、本発明に係る温度センサの一実施例のリード
フレームを示す平面図であり、図1(b)は温度センサ
の斜視図であり、図1(c)は図1(b)のX−X線に
沿った断面図である。図1(d)は他の実施例の断面図
である。先ず、温度センサに使用されるリードフレーム
について、図1(a)に基づいて説明する。Aはステン
レス,コバール,ニッケル又はニッケル合金等の帯状の
金属板を化学エッチング或いはプレス等によって形成さ
れたリードフレームである。スプロケット孔1が一定間
隔で形成された帯状部2には、帯状部2に対し直角方向
に極細幅部を介して外部引出端子3a′,3b′が延在
し、更に、外部引出端子3a′,3b′の幅より細い細
長金属板状リード部3a,3bが連なっている。このよ
うに、平行な細長金属板状リード部3a,3bを一組と
する複数組が帯状部2に設けられている。
Embodiments of the temperature sensor and its lead frame of the present invention will be described below with reference to the drawings. FIG.
1A is a plan view showing a lead frame of an embodiment of the temperature sensor according to the present invention, FIG. 1B is a perspective view of the temperature sensor, and FIG. 1C is FIG. 1B. It is sectional drawing which followed the XX line of FIG. FIG. 1D is a sectional view of another embodiment. First, a lead frame used for the temperature sensor will be described with reference to FIG. A is a lead frame formed by chemically etching or pressing a strip-shaped metal plate of stainless steel, kovar, nickel or nickel alloy. External lead-out terminals 3a ', 3b' extend at right angles to the belt-like portion 2 through a very narrow portion in the belt-like portion 2 in which the sprocket holes 1 are formed at regular intervals, and further, the external lead-out terminal 3a '. , 3b ', the elongated metal plate-shaped lead portions 3a, 3b are connected. As described above, the strip-shaped portion 2 is provided with a plurality of sets each including the parallel elongated metal plate-shaped lead portions 3a and 3b.

【0012】細長金属板状リード部3a,3bの延在部
には、細幅金属板部5a,5bが延在しており、この一
対の細長金属板状リード部3a,3bと細幅金属板部5
a,5bの中間部には、これらを固定保持する為のタイ
バー部4が形成されている。細幅金属板部5a,5bの
先端部には、外側に突出した幅が広い平板状の挟持部6
a,6bが形成されている。挟持部6a,6bの先端は
夫々テーパ部8a,8bが形成されている。このテーパ
部8a,8bは感熱素子を半田で接着する際に、挟持部
6a,6bが半田による架橋(半田ブリッジ)が生じて
短絡するのを防止するものであり、挟持部6a,6bの
間隙が広い場合は、必ずしもテーパ部8a,8bを形成
する必要はない。又、半田ブリッジが生じて短絡するの
を防止するだけでなく、テーパ部8a,8bと感熱素子
の電極面とで形成される鋭角部を半田の溜場として用い
ることができるので、外観形状を良好なものとすること
ができるとともに、感熱素子を挟持部6a,6bに強固
に接着することができるので機械的強度を高めることが
できる。
Narrow metal plate portions 5a and 5b extend in the extending portions of the elongated metal plate-shaped lead portions 3a and 3b, and the pair of elongated metal plate-shaped lead portions 3a and 3b and the narrow metal sheet. Board 5
A tie bar portion 4 for fixing and holding these is formed in the intermediate portion between a and 5b. At the tips of the narrow metal plate portions 5a and 5b, a flat plate-shaped holding portion 6 that protrudes outward and has a wide width is provided.
a and 6b are formed. Tapered portions 8a and 8b are formed at the tips of the sandwiching portions 6a and 6b, respectively. The taper portions 8a and 8b prevent short-circuiting due to bridging (solder bridge) due to solder between the sandwiching portions 6a and 6b when the heat-sensitive element is bonded by solder, and the gaps between the sandwiching portions 6a and 6b. When the width is large, it is not always necessary to form the tapered portions 8a and 8b. Further, not only can a solder bridge be prevented from causing a short circuit, but also an acute angle portion formed by the tapered portions 8a and 8b and the electrode surface of the heat sensitive element can be used as a reservoir for the solder, so that the appearance shape can be improved. In addition to being good, the thermosensitive element can be firmly adhered to the sandwiching portions 6a and 6b, so that the mechanical strength can be increased.

【0013】次に、実施例の温度センサを図1(b)の
斜視図及び図1(c)の断面図に基づいて説明する。図
1(b)に於いて、幅の広い平板状の挟持部6a,6b
から幅の細い細長金属板状リード部3a,3bに連な
り、外部引出端子3a′,3b′へと連なっており、平
板状の挟持部6a,6bの側壁に、サーミスタ等の感熱
素子7の側面に形成された電極部が接触して半田で接続
されている。ポリイミド樹脂等の絶縁シート9,9′
は、少なくともその片面に接着剤が塗布されて、細長金
属板状リード部3a,3bと感熱素子7と挟持部6a,
6bと外部引出端子3a′,3b′の一部を除いて挟む
ように貼着されて感熱素子7を封止している。平板状の
挟持部6a,6bの幅Wを広く形成することにより、そ
の面に絶縁シート9,9′が強固に接着されるので、機
械強度を高めることが可能である。又、感熱素子7は、
平板状のチップ部品であるので、図1(c)に示すよう
に、挟持部6a,6bの側面に接着された感熱素子7
は、僅かに突出するのみであり、絶縁シート9,9′の
面が略平坦なものとすることができるので、温度センサ
が装着される部分が僅かな間隙でよい。又、図1(d)
に示すように、挟持部6a,6bの片面、即ち、被温度
検知体に接する感熱素子7の面が面一となっている。感
熱素子7は挟持部6a,6bの側壁に半田15a,15
bで固着して配置されており、感熱素子7の主な感熱面
を被検知体に充分接触することより温度検出を正確に行
うことができる。
Next, the temperature sensor of the embodiment will be described with reference to the perspective view of FIG. 1 (b) and the sectional view of FIG. 1 (c). In FIG. 1 (b), wide flat plate-shaped holding portions 6a, 6b
To the thin elongated metal plate leads 3a and 3b and to the external lead-out terminals 3a 'and 3b'. The side surfaces of the thermosensitive element 7 such as a thermistor are attached to the side walls of the plate-like holding portions 6a and 6b. The electrode portions formed on are contacted and connected by solder. Insulation sheet 9,9 'such as polyimide resin
Is coated with an adhesive agent on at least one side thereof, so that the elongated metal plate-shaped lead portions 3a and 3b, the heat-sensitive element 7 and the holding portion 6a,
6b and external lead-out terminals 3a ', 3b' except for a part thereof are attached so as to sandwich the thermosensitive element 7. By forming the width W of the flat plate-shaped holding portions 6a and 6b wide, the insulating sheets 9 and 9'are firmly adhered to the surfaces, so that the mechanical strength can be increased. Further, the heat sensitive element 7 is
Since it is a flat plate-shaped chip component, as shown in FIG. 1C, the heat sensitive element 7 adhered to the side surfaces of the sandwiching portions 6a and 6b.
Has a slight gap, and since the surfaces of the insulating sheets 9 and 9'can be made substantially flat, a small gap is sufficient for the portion where the temperature sensor is mounted. Also, FIG. 1 (d)
As shown in FIG. 7, one surface of the sandwiching portions 6a and 6b, that is, the surface of the thermosensitive element 7 that is in contact with the temperature detection target is flush with each other. The heat-sensitive element 7 has solder 15a, 15 on the side walls of the sandwiching portions 6a, 6b.
The temperature is accurately detected by sufficiently fixing the main heat-sensitive surface of the heat-sensitive element 7 to the object to be detected.

【0014】尚、この実施例の温度センサの組立方法に
ついて簡単に説明すると、リードフレーム2のスプロケ
ット用孔1に自動送り装置の爪が係合して送られ、部品
自動挿入機からチップ部品である感熱素子7が挟持部6
a,6bの間隙にテーパ部8a,8b側から挿入され
て、感熱素子7はリードフレームの弾力性によって挟持
部6a,6bに挟持固定された後に、感熱素子チップ部
品が挟持されたリードフレームが半田槽に送られ、感熱
素子7と挟持部6a,6bが半田付けされて固定され
る。その後、タイバー部4が切断されて除去される。続
いて、感熱素子7が半田付けされたリードフレームA
は、絶縁シート被覆工程に進み、外部引出端子3a′,
3b′の一部を残してリードフレームAの両面から絶縁
シート8,8′で挟むように圧接貼着して感熱素子7を
被覆する。更に、切断工程において外部引出端子3
a′,3b′の端部付近で切断し、絶縁シートも個々に
切断して各温度センサを分離形成する。
The method of assembling the temperature sensor of this embodiment will be briefly described. The claw of the automatic feeding device engages with the sprocket hole 1 of the lead frame 2 and is fed. A certain heat-sensitive element 7 has a holding part 6
The thermosensitive element 7 is inserted into the gap between a and 6b from the side of the taper portions 8a and 8b, and is clamped and fixed to the clamping portions 6a and 6b by the elasticity of the lead frame. The heat sensitive element 7 and the sandwiching portions 6a and 6b are soldered and fixed to the solder bath. After that, the tie bar portion 4 is cut and removed. Then, the lead frame A to which the heat sensitive element 7 is soldered
Goes to the insulating sheet covering step, and the external lead terminals 3a ′,
The heat sensitive element 7 is covered by pressure bonding so as to sandwich the insulating sheets 8 and 8'on both sides of the lead frame A while leaving a part of 3b '. Furthermore, in the cutting process, the external lead terminal 3
The temperature sensors are separated from each other by cutting in the vicinity of the ends of a'and 3b 'and cutting the insulating sheet individually.

【0015】無論、チップ状の感熱素子の挿入は、自動
部品挿入機によって挟持部6a,6bの間隙に、挟持部
6a,6bの面に対して垂直方向から挿入するようにし
てもよい。その際、挟持部6a,6bを少し開いた状態
で挿入するとよい。又、タイバー部4が挟持部6a,6
bから離れた位置に設けられている場合は、絶縁シート
で感熱素子を被覆した後に、タイバー部4を切除しても
よい。このように、リードフレームを用いて、温度セン
サを組み立てることができるので、自動化に有利であ
り、組立精度を高めることができるとともに、組立部品
数や組立工数を低減することができる。又、サーミスタ
等の感熱素子7の厚みは、リードフレームAの板の厚み
方向に突出した形状とならないように、リードフレーム
の厚みと同程度とするのが理想的である。しかし、実施
例では平板状のチップ部品の厚みをリードフレームAの
板の厚みより厚いものを用い多少突出した形状となって
いる。更に、感熱素子7は薄膜サーミスタ等であっても
よく、その構造寸法、特性等が充分満足できる温度セン
サであれはよく、実施例に限定するものではない。
Needless to say, the chip-shaped heat-sensitive element may be inserted into the gap between the holding portions 6a and 6b from the direction perpendicular to the surfaces of the holding portions 6a and 6b by an automatic component inserting machine. At that time, it is preferable to insert the holding portions 6a and 6b in a state in which they are slightly opened. In addition, the tie bar portion 4 holds the holding portions 6a, 6a.
When it is provided at a position away from b, the tie bar portion 4 may be cut off after covering the heat sensitive element with the insulating sheet. As described above, since the temperature sensor can be assembled using the lead frame, it is advantageous for automation, the assembling accuracy can be improved, and the number of assembling parts and the number of assembling steps can be reduced. Further, the thickness of the thermosensitive element 7 such as a thermistor is ideally set to be approximately the same as the thickness of the lead frame so as not to project in the thickness direction of the plate of the lead frame A. However, in the embodiment, the thickness of the flat chip component is thicker than the thickness of the plate of the lead frame A, and the shape is slightly projected. Further, the heat sensitive element 7 may be a thin film thermistor or the like, and may be a temperature sensor whose structural dimensions, characteristics, etc. are sufficiently satisfied, and is not limited to the embodiment.

【0016】次に、本発明の温度センサとそのリードフ
レームの他の実施例について説明する。図2(a)はリ
ードフレームの平面図であり、図2(b)はその要部の
平面図である。図2(a)に於いて、リードフレームB
はスプロケット用孔1が等間隔で配列された帯状部2か
ら直角方向に平行に一対の細長金属板状リード部3a,
3bが多数対突出しており、その延在部に細幅金属板部
5a,5bが形成され、タイバー部4で固定保持されて
いる。細幅金属板部5a,5bの先端部は外方に僅かに
張り出して延在する部分に、幅の広い挟持部6a,6b
が形成されている。挟持部6a,6bに至る部分に空隙
14が形成される。挟持部6a,6bには、テーパ部8
a,8bと8c,8dが形成されている。挟持部6a,
6bに至る部分に、広い空隙14を形成することによ
り、チップ部品等の感熱素子7の電極10a,10b間
の距離が狭いチップ部品を用いる場合であっても半田ブ
リッジを防止する構造とするリードフレームである。即
ち、感熱素子7の側面に形成された電極10a,10b
の長さに比べ、電極10a,10bが接触する部分の挟
持部6a,6bの側壁の長さが短く設定されており、半
田付け時に、挟持部6a,6b間に形成されがちな半田
ブリッジによる短絡を防止することができる。
Next, another embodiment of the temperature sensor of the present invention and its lead frame will be described. FIG. 2A is a plan view of the lead frame, and FIG. 2B is a plan view of the main part thereof. In FIG. 2A, the lead frame B
Is a pair of elongated metal plate-shaped lead portions 3a, which are parallel to each other at right angles from a strip-shaped portion 2 in which sprocket holes 1 are arranged at equal intervals.
A large number of pairs of 3b are projected, and thin metal plate portions 5a and 5b are formed on the extending portions thereof, and are fixedly held by the tie bar portion 4. The narrow metal plate portions 5a and 5b have tip portions that are slightly overhanging outward, and have wide sandwiching portions 6a and 6b.
Are formed. A void 14 is formed in a portion reaching the sandwiching portions 6a and 6b. A taper portion 8 is provided on the sandwiching portions 6a and 6b.
a, 8b and 8c, 8d are formed. Clamping part 6a,
By forming a wide void 14 in a portion reaching 6b, a lead having a structure that prevents solder bridging even when a chip component having a small distance between the electrodes 10a and 10b of the heat sensitive element 7 such as a chip component is used. It is a frame. That is, the electrodes 10a, 10b formed on the side surface of the heat sensitive element 7
The lengths of the side walls of the sandwiching portions 6a and 6b at the portions in contact with the electrodes 10a and 10b are set to be shorter than the length of the electrodes, and the solder bridge is apt to be formed between the sandwiching portions 6a and 6b during soldering. A short circuit can be prevented.

【0017】図2(b)は、温度センサの感熱部の拡大
図であり、11は絶縁シート(点線で示す)の平面形状
を示しており、点線で示した部分13は絶縁シート11
の表面に設けられた接着部を示し、この接着部13は温
度センサを被温度検知体に装着する場合の位置決め用で
ある。又、絶縁シート11には凹状の切込部12,1
2′が設けられている。このように切込部12,12′
を設けることによって、感熱部の捻じれ等により挟持部
6a,6bに加わる応力を軽減する構造としている。こ
の切込部は、凹状の切込部12,12′に限定すること
なく、細幅金属板部5a,5b間の絶縁シート11に切
り込みを設けることによって、感熱部の捻じれ等により
挟持部6a,6bに加わる応力を軽減する構造としてい
る。又、接着部13は図2(b)に示す部分に限定する
ことなく、温度センサの感熱部を被温度検知体の検知部
分に固定できればどの部分であてもよく、更に、表裏何
れの部分であってもよく、これらは、図1の実施例にも
適応できることは明らかである。又、凹状の切欠部1
2,12′を形成する位置は、実施例に限定することな
く、実装する対象によって異なる場合があり、捻じれの
発生する部分を考慮して設定すればよい。更に、この実
施例に於いても図1の実施例の組み立て方法が適応でき
るとともに、組み立て寸法精度がよく、且つ、組み立て
部品数、組み立て工数を低減することができる。
FIG. 2 (b) is an enlarged view of the heat-sensitive portion of the temperature sensor, in which 11 is a plan view of the insulating sheet (shown by the dotted line), and portion 13 shown by the dotted line is the insulating sheet 11.
The adhesive part 13 is provided on the surface of the adhesive, and the adhesive part 13 is for positioning when the temperature sensor is attached to the temperature detection target. Further, the insulating sheet 11 has concave cutouts 12, 1
2'is provided. In this way, the notches 12, 12 '
Is provided to reduce the stress applied to the sandwiching portions 6a and 6b due to the twist of the heat sensitive portion or the like. The cut portion is not limited to the recessed cut portions 12 and 12 ', but the cut portion is provided in the insulating sheet 11 between the narrow metal plate portions 5a and 5b, so that the heat-sensitive portion is twisted or the like so as to sandwich the cut portion. The structure is such that the stress applied to 6a and 6b is reduced. Further, the adhesive portion 13 is not limited to the portion shown in FIG. 2 (b), and may be any portion as long as the heat-sensitive portion of the temperature sensor can be fixed to the detection portion of the temperature detection target. Obviously, these are also applicable to the embodiment of FIG. Also, the concave notch 1
The positions at which 2, 12 'are formed are not limited to the embodiment, and may be different depending on the object to be mounted, and may be set in consideration of the portion where twist occurs. Further, in this embodiment, the assembling method of the embodiment of FIG. 1 can be applied, the assembling dimensional accuracy is good, and the number of assembling parts and the assembling man-hour can be reduced.

【0018】上記実施例では、感熱素子7が固着された
細長金属板状リード部3a,3bを絶縁シート9,9′
で被覆したものである。この絶縁シート9,9′は、両
面ともポリイミド樹脂を使用したものでもよい。しか
し、耐熱性が高く、且つ、機械強度が高い絶縁シートと
する為には、被温度検知体の感熱面との接触部分にポリ
イミド樹脂シートを用い、他方にポリエステル樹脂シー
ト又はテフロン樹脂シートを用いる。この樹脂シートの
組み合わせは、ポリエステル樹脂シートやテフロン樹脂
シートがポリイミド樹脂シートに比べて伸縮性に優れて
いることを利用するものであり、リードフレームを張り
合わせた場合に、リードフレームの厚み方向の段差形状
に対しても良い密着性を保ちながら貼着することができ
る。又、被検知側の絶縁シートには、図1(d)で説明
すれば、絶縁シート9は耐熱性のポリイミド樹脂シート
とし、リードフレームによる厚み方向の段差を有する側
の絶縁シート9′にはポリエステル樹脂シート又はテフ
ロン樹脂シートとするとよい。
In the above embodiment, the elongated metal plate lead portions 3a and 3b to which the heat sensitive element 7 is fixed are connected to the insulating sheets 9 and 9 '.
Is coated with. The insulating sheets 9 and 9'may be made of polyimide resin on both sides. However, in order to obtain an insulating sheet having high heat resistance and high mechanical strength, a polyimide resin sheet is used for the contact portion with the heat-sensitive surface of the temperature sensing object, and a polyester resin sheet or Teflon resin sheet is used for the other. . This combination of resin sheets takes advantage of the fact that polyester resin sheets and Teflon resin sheets are more stretchable than polyimide resin sheets. It can be attached while maintaining good adhesion to the shape. 1 (d), the insulating sheet 9 on the side to be detected is a heat-resistant polyimide resin sheet, and the insulating sheet 9'on the side having a step in the thickness direction due to the lead frame is It is preferable to use a polyester resin sheet or a Teflon resin sheet.

【0019】更に、図3は本発明に係る温度センサの他
の実施例の要部を示す図であり、この実施例では図1及
び図2の実施例に適応できるものである。図3に於い
て、絶縁シート9,9′は、細長金属板状リード部3
a,3bが突出する側の絶縁シートに切込部16を形成
する。この切込部16の先端に円形の開口部17が設け
る。切込部16に連続する円形の開口部17を形成する
ことによって、絶縁シートの引裂強度を向上させること
ができる。即ち、細長金属板状リード部3a,3bによ
って絶縁シート9,9′が引っ張られたとしても、この
切込部16とその先端の開口部17によって吸収して絶
縁シート9,9′が簡単に裂けるのを防止することがで
きる。ポリイミド樹脂シートとポリエステル樹脂シート
又はテフロン樹脂シートによって機械強度を高めるとと
もに、この切込部16とその先端の開口部17を設ける
ことによって、一層機械的強度を高めることができる。
Further, FIG. 3 is a diagram showing a main part of another embodiment of the temperature sensor according to the present invention, and this embodiment can be applied to the embodiments of FIGS. 1 and 2. In FIG. 3, the insulating sheets 9 and 9'are the elongated metal plate-shaped lead portions 3
The notch 16 is formed in the insulating sheet on the side where a and 3b project. A circular opening 17 is provided at the tip of the cut portion 16. The tear strength of the insulating sheet can be improved by forming the continuous circular opening 17 in the cut portion 16. That is, even if the insulating sheets 9 and 9'are pulled by the elongated metal plate-shaped lead portions 3a and 3b, the insulating sheets 9 and 9'are easily absorbed by the cut portion 16 and the opening 17 at the tip thereof. It can prevent tearing. The mechanical strength can be further enhanced by providing the notch 16 and the opening 17 at the tip thereof while the mechanical strength is enhanced by the polyimide resin sheet and the polyester resin sheet or the Teflon resin sheet.

【0020】上述のように、本発明の温度センサは、そ
の形状がシート状であって、感熱面を平坦なものとする
ことが可能である。感熱素子の厚みがリードフレームの
厚み(約150μm)より厚い場合であっても、図1
(c),(d)に示すように、感熱素子が僅かに突出す
るもののシート状とすることができる。又、本発明の温
度センサは、感熱素子が細い金属性のリードに固定支持
され、且つ、絶縁シートで被覆されており、感熱部は弾
力性を有し、絶縁シートで被覆することで化学反応等に
よる腐食から保護することができ、而も、二枚の絶縁シ
ートを圧接貼着させることによって機械的強度を高める
ことができる。絶縁シートの特性は、耐熱性を有すると
ともに、耐酸性を有するものがよく、実装される被温度
検知体の特性に耐え得るものであればよい。
As described above, the temperature sensor of the present invention can have a sheet-like shape and a flat heat-sensitive surface. Even when the thickness of the heat sensitive element is thicker than the thickness of the lead frame (about 150 μm),
As shown in (c) and (d), the heat-sensitive element may be formed in a sheet shape although it slightly protrudes. Further, in the temperature sensor of the present invention, the heat-sensitive element is fixedly supported by the thin metal lead and is covered with the insulating sheet, and the heat-sensitive portion has elasticity, and by covering with the insulating sheet, the chemical reaction It can be protected from corrosion due to, for example, the mechanical strength can be enhanced by pressing two insulating sheets together. The insulating sheet preferably has heat resistance and acid resistance, as long as it can withstand the characteristics of the temperature-sensing body to be mounted.

【0021】又、図1の実施例では、絶縁シートで被覆
する形状であるが、図2,3の実施例で示したように、
部分的に切込部を設けたものであってもよい。これらの
形状は、被温度検知体に合わせて最も適した形状の温度
センサを選択すればよい。無論、感熱素子は、薄膜サー
ミスタ或いは半導体素子等であってもよいことは明らか
である。更に、リードフレームのタイバー部は、実施例
のように上方に設ける方が挟持部に弾力性を与えるのに
有利であるが、リードフレームの厚みの関係で必ずし
も、上方である必要はない。タイバー部を下方に設けた
場合は、タイバー部とリード部を同時に切断して、細幅
金属板部(リード部)の残りの部分を外部出力端子とす
ることも可能である。又、挟持部のテーパ部は実施例の
ように直線的である必要もない。
In the embodiment shown in FIG. 1, the shape covered with an insulating sheet is as shown in the embodiment shown in FIGS.
It is also possible to provide a cut portion partially. With respect to these shapes, a temperature sensor having the most suitable shape may be selected according to the object to be detected. Obviously, the heat sensitive element may be a thin film thermistor, a semiconductor element, or the like. Further, it is advantageous to provide the tie bar portion of the lead frame above as in the embodiment so as to give elasticity to the holding portion, but it is not always necessary to be above due to the thickness of the lead frame. When the tie bar portion is provided below, the tie bar portion and the lead portion can be cut at the same time, and the remaining portion of the narrow metal plate portion (lead portion) can be used as the external output terminal. Further, the taper portion of the sandwiching portion does not need to be linear as in the embodiment.

【0022】[0022]

【発明の効果】上述のように、本発明に係る温度センサ
とそのリードフレームは、帯状部から直角方向に延びる
平行な一対の細幅金属板状リード部と、一対の細幅金属
板状リード部の上部に形成されたタイバー部と、タイバ
ー部から更に延びる細幅金属板部と、その先端部分に形
成された一対の細幅金属板部よりも外側に突出する幅広
の挟持部とから構成されたリードフレームを使用して組
立られたものであり、リードフレームの板厚みと略同じ
厚みが理想的であるが、それより多少厚いものでもよ
く、平板状でその側面に電極を有するチップ部品を挟持
部に挟持して半田等によって接合し、挟持部と細幅金属
板状リード部の一部を絶縁シートで貼着して絶縁被覆
し、最終的に絶縁シート及びリードフレームの細幅金属
板状リード部を夫々切断して個々の温度センサを形成す
る。従って、従来の単品毎の形成加工に比べて著しく作
業性が向上するばかりでなく、リードフレームの加工精
度が高いので、寸法のバラツキによる不良品の発生率を
減少させることができる。
As described above, the temperature sensor and the lead frame thereof according to the present invention include a pair of parallel narrow metal plate lead portions extending in a right angle direction from the strip portion and a pair of narrow metal plate lead leads. A tie bar portion formed on the upper part of the tie bar portion, a narrow metal plate portion further extending from the tie bar portion, and a wide sandwiching portion protruding to the outside of the pair of narrow metal plate portions formed at the tip portion thereof. Is ideally designed to have a thickness approximately the same as the thickness of the lead frame, but it may be a little thicker than that, and is a flat plate-shaped chip component with electrodes on its side surface. Sandwiching them between the sandwiching parts and joining them with solder, etc., and sandwiching the sandwiching parts and a part of the narrow metal plate-shaped lead part with an insulating sheet for insulation coating, and finally, for the insulating sheet and the narrow metal of the lead frame. Cut the plate-shaped leads individually And to form individual temperature sensors. Therefore, not only the workability is remarkably improved as compared with the conventional forming processing for each individual product, but also the processing accuracy of the lead frame is high, so that the occurrence rate of defective products due to dimensional variation can be reduced.

【0023】又、平板状の温度センサであるので、特別
な空間を設けることなく、僅かの隙間に実装できるとと
もに、感熱部を被検知体に実装した際、被検知体に感熱
部が密着し、且つ、感熱面が広いので、正確な温度検出
ができる利点がある。又、幅広の挟持部とすることによ
り、挟持部で吸収された熱がその側面を通して感熱素子
に伝導し易く、熱の応答特性を良好をものとするととも
に、正確な温度検知が可能である。更に、これらの温度
センサは、リードフレームで組み立てを行えば、特別な
治具等を使用することなく、感熱素子を正確に位置決め
して接合固定できる。そして、最後に帯状部及び絶縁シ
ートを切断すれば多数の温度センサを連続的に製造する
ことができ、従来のように単品加工に比べて作業性が著
しく向上する。而も、これらの一連の組み立て作業は、
リードフレームの状態で行って、最後に細幅金属板状リ
ード部を切断して切り離すので、組立工程を自動化し易
い利点がある。
Further, since it is a flat plate-shaped temperature sensor, it can be mounted in a small gap without providing a special space, and when the heat-sensitive part is mounted on the object to be detected, the heat-sensitive part comes into close contact with the object to be detected. Moreover, since the heat-sensitive surface is wide, there is an advantage that the temperature can be accurately detected. Further, by using the wide sandwiching portion, the heat absorbed by the sandwiching portion is easily conducted to the heat sensitive element through the side surface thereof, the heat response characteristic is improved, and accurate temperature detection is possible. Furthermore, if these temperature sensors are assembled with a lead frame, the thermosensitive element can be accurately positioned and joined and fixed without using a special jig or the like. Finally, by cutting the strip-shaped portion and the insulating sheet, a large number of temperature sensors can be continuously manufactured, and the workability is remarkably improved as compared with the conventional single-piece processing. In addition, these series of assembly work,
Since it is performed in the state of the lead frame, and finally, the narrow metal plate-shaped lead portion is cut and separated, there is an advantage that the assembly process can be easily automated.

【0024】又、感熱素子の側面に形成された電極面が
幅広の挟持部の側面に半田等により接合される。この部
分は半田槽に投入されるので、挟持部同志が半田ブリッ
ジによって短絡を防止するように、細幅金属板部の間隔
より広い間隔が設けられて挟持部が形成されており、半
田付着が低減され、組み立て作業性が良好である。又、
絶縁シートに切込部を適当に形成することによって、被
温度検知体に装着された際に捻じれが生じたとしても異
常な応力を与えることがないので、機械的強度や耐久性
を向上させることができる利点がある。又、絶縁シート
に接着部を設けることによって、被温度検知体の実装位
置に温度センサを貼り付けることで簡単に位置決めがで
きる利点がある。又、絶縁シートに、ポリイミド樹脂シ
ートのような耐熱性絶縁シートと引っ張り強度の高いテ
フロンやポリエステル等の樹脂シートを張り合わせて、
絶縁シートの引き裂かれによる損傷を防止することがで
きる。又、絶縁シートに切欠部とその先端に円形の開口
部を設けることによって、ポリイミド樹脂シートのよう
な耐熱性絶縁シートで張り合わせたとしても、機械強度
を高めることができる利点がある。
Further, the electrode surface formed on the side surface of the heat sensitive element is joined to the side surface of the wide sandwiching portion by soldering or the like. Since this part is put into the solder bath, the sandwiching part is formed with a gap wider than that of the narrow metal plate part so that the sandwiching parts can prevent a short circuit by the solder bridge, and the solder adhesion is prevented. It is reduced and the assembly workability is good. or,
By properly forming the cut portion in the insulating sheet, abnormal stress is not given even if twisting occurs when it is attached to the temperature sensing object, so mechanical strength and durability are improved. There is an advantage that can be. Further, by providing the adhesive portion on the insulating sheet, there is an advantage that the temperature sensor can be easily positioned by attaching the temperature sensor to the mounting position of the temperature sensing object. Also, a heat-resistant insulating sheet such as a polyimide resin sheet and a resin sheet such as Teflon or polyester having high tensile strength are attached to the insulating sheet,
It is possible to prevent damage due to tearing of the insulating sheet. Further, by providing a cutout portion and a circular opening portion at the tip of the insulating sheet, there is an advantage that the mechanical strength can be increased even if the insulating sheet is laminated with a heat resistant insulating sheet such as a polyimide resin sheet.

【図面の簡単な説明】[Brief description of drawings]

【図1】(a)は本発明に係る温度センサのリードフレ
ームの一実施例を示す平面図、(b)は本発明に係る温
度センサの一実施例を示す斜視図、(c)はX−X線に
沿った断面図、(d)は他の実施例の断面図である。
1A is a plan view showing an embodiment of a lead frame of a temperature sensor according to the present invention, FIG. 1B is a perspective view showing an embodiment of a temperature sensor according to the present invention, and FIG. -A sectional view taken along the line X, and (d) is a sectional view of another embodiment.

【図2】(a)は本発明に係る温度センサのリードフレ
ームの一実施例を示す平面図、(b)は本発明に係る温
度センサの要部を示す平面図である。
FIG. 2A is a plan view showing an embodiment of a lead frame of a temperature sensor according to the present invention, and FIG. 2B is a plan view showing a main part of the temperature sensor according to the present invention.

【図3】本発明に係る温度センサの他の実施例の要部を
示す平面図である。
FIG. 3 is a plan view showing a main part of another embodiment of the temperature sensor according to the present invention.

【図4】(a)は従来の温度センサのリードフレームの
一例を示す平面図、(b)はその要部を示す平面図であ
る。
FIG. 4A is a plan view showing an example of a lead frame of a conventional temperature sensor, and FIG. 4B is a plan view showing a main part thereof.

【符号の説明】[Explanation of symbols]

A,B リードフレーム 1 スプロケット用孔 2 帯状部 3a,3b 細長金属板状リード部 3a′,3b′ 外部引出端子 4 タイバー部 5a,5b 細幅金属板部 6a,6b 挟持部 7 感熱素子 8a〜8d テーパ部 9,9′ 薄膜シート 10a,10b 電極 12,12′ 切欠部 13 接着部 14 空隙 15a,15b 半田 16 切込部 17 開口部 A, B lead frame 1 sprocket hole 2 strips 3a, 3b elongated metal plate-shaped leads 3a ', 3b' external lead-out terminals 4 tie bar parts 5a, 5b narrow metal plate 6a, 6b sandwiching part 7 thermal element 8a- 8d Tapered part 9,9 'Thin film sheet 10a, 10b Electrode 12, 12' Notch part 13 Adhesive part 14 Void 15a, 15b Solder 16 Notch part 17 Opening part

Claims (9)

【特許請求の範囲】[Claims] 【請求項1】 一対の細幅金属板部の夫々の一端から延
在する部分を外部引出端子とし、該細幅金属板部の夫々
の他端に挟持部を形成し、一対の該挟持部の側壁にチッ
プ状の感熱素子の夫々の側面に形成された電極部を接続
し、前記外部引出端子の一部を除いて、絶縁シートで被
覆してなることを特徴とする温度センサ。
1. A pair of narrow metal plate portions, each of which extends from one end of the pair of narrow metal plate portions, is used as an external lead terminal, and a sandwiching portion is formed at each of the other ends of the narrow metal plate portions. A temperature sensor characterized in that an electrode portion formed on each side surface of a chip-shaped heat-sensitive element is connected to the side wall of the above, and a part of the external lead terminal is removed and covered with an insulating sheet.
【請求項2】 一対の細幅金属板部の夫々の一端から延
在する部分に幅広の外部引出端子を形成し、該細幅金属
板部の夫々の他端に幅広の挟持部を夫々形成し、一対の
該挟持部の側壁にチップ状の感熱素子の夫々の側面に形
成された電極部を接続し、前記外部引出端子の一部を除
いて、絶縁シートで被覆してなることを特徴とする温度
センサ。
2. A wide outer lead-out terminal is formed at a portion extending from one end of each of the pair of narrow metal plate portions, and a wide sandwiching portion is formed at each other end of the narrow metal plate portions. An electrode portion formed on each side surface of the chip-shaped heat-sensitive element is connected to the side walls of the pair of sandwiching portions, and a part of the external lead terminal is removed, and an insulating sheet is coated. And a temperature sensor.
【請求項3】 帯状部と、該帯状部から直角方向に延び
る平行した一対の細長金属板状リード部と、該細長金属
板状リード部を支持するタイバー部と、該タイバー部か
ら延びる一対の細幅金属板部と、該細幅金属板部の夫々
の先端部分に、該細幅金属板部の幅より広く、且つ、チ
ップ部品の側面に形成された電極部がその側壁に接続さ
れる挟持部とを備えることを特徴とするリードフレー
ム。
3. A strip-shaped portion, a pair of parallel elongated metal plate-shaped lead portions extending in a direction perpendicular to the strip-shaped portion, a tie bar portion supporting the elongated metal plate-shaped lead portion, and a pair of extended tie bar portions. A narrow metal plate portion and an electrode portion, which is wider than the narrow metal plate portion and is formed on a side surface of the chip component, is connected to a side wall of each of the tip portions of the narrow metal plate portion. A lead frame comprising a holding portion.
【請求項4】 一対の細幅金属板部の夫々の一端から延
在する部分を外部引出端子とし、該細幅金属板部の夫々
の他端から外側に張り出す部分に、該細幅金属板部の幅
より幅広の挟持部を夫々形成し、該挟持部の側壁にチッ
プ状の感熱素子の夫々の電極部を接続し、前記外部引出
端子の一部を除いて、絶縁シートで被覆してなることを
特徴とする温度センサ。
4. A portion of the pair of narrow metal plate portions extending from one end of each of the narrow metal plate portions is used as an external lead-out terminal, and a portion of the narrow metal plate portion protruding outward from the other end of the narrow metal plate portion is formed. A sandwiching portion that is wider than the width of the plate portion is formed, and each electrode portion of the chip-shaped heat-sensitive element is connected to the side wall of the sandwiching portion, and a part of the external lead terminal is removed and covered with an insulating sheet. A temperature sensor characterized by the following.
【請求項5】 帯状部と、該帯状部から直角方向に延び
る平行した一対の細長金属板状リード部と、該細長金属
板状リード部を支持するタイバー部と、該タイバー部か
ら延びる一対の細幅金属板部と、該細幅金属板部の夫々
の先端部分から外側に張り出す部分に、該細幅金属板部
の幅より広く、且つ、チップ部品の側面の電極部がその
側壁に接続される挟持部とを備えることを特徴とするリ
ードフレーム。
5. A strip-shaped portion, a pair of parallel elongated metal plate-shaped lead portions extending in a direction perpendicular to the strip-shaped portion, a tie bar portion supporting the elongated metal plate-shaped lead portion, and a pair of tie bar portions extending from the tie bar portion. The narrow metal plate portion and the portions protruding outward from the respective tip end portions of the narrow metal plate portion are wider than the narrow metal plate portion, and the electrode portions on the side surfaces of the chip component are provided on the side walls thereof. A lead frame comprising: a sandwiching part to be connected.
【請求項6】 前記絶縁シートの少なくとも一箇所に切
り込みを設けたことを特徴とする請求項1,2又は4に
記載の温度センサ。
6. The temperature sensor according to claim 1, wherein a cut is provided in at least one location of the insulating sheet.
【請求項7】 感熱素子を封止した前記絶縁シートの表
裏の少なくとも一部に接着剤を貼着したことを特徴とす
る請求項1,2又は4に記載の温度センサ。
7. The temperature sensor according to claim 1, wherein an adhesive is attached to at least a part of the front and back of the insulating sheet encapsulating the thermosensitive element.
【請求項8】 前記絶縁シートとし、一面にポリイミド
樹脂シートを他面にポリエステル樹脂シート又はテフロ
ン樹脂シートを用いることを特徴とする請求項1,2,
4,6又は7に記載の温度センサ。
8. The insulating sheet, wherein a polyimide resin sheet is used on one side and a polyester resin sheet or a Teflon resin sheet is used on the other side.
The temperature sensor according to 4, 6, or 7.
【請求項9】 前記絶縁シートの少なくとも一箇所に切
込部を設けるとともに、前記切込部の一端に開口部を設
けることを特徴とする請求項1,2,4,6,7又は8
に記載の温度センサ。
9. A cut portion is provided at at least one location of the insulating sheet, and an opening portion is provided at one end of the cut portion, 1, 2, 4, 6, 7 or 8.
The temperature sensor described in.
JP22951894A 1994-06-07 1994-09-26 Temperature sensor and its lead frame Expired - Lifetime JP3494709B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22951894A JP3494709B2 (en) 1994-06-07 1994-09-26 Temperature sensor and its lead frame

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP12498294 1994-06-07
JP6-124982 1994-06-07
JP22951894A JP3494709B2 (en) 1994-06-07 1994-09-26 Temperature sensor and its lead frame

Publications (2)

Publication Number Publication Date
JPH0854292A true JPH0854292A (en) 1996-02-27
JP3494709B2 JP3494709B2 (en) 2004-02-09

Family

ID=26461536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22951894A Expired - Lifetime JP3494709B2 (en) 1994-06-07 1994-09-26 Temperature sensor and its lead frame

Country Status (1)

Country Link
JP (1) JP3494709B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006112983A (en) * 2004-10-18 2006-04-27 Hitachi Ltd Controller
JP2010093258A (en) * 2008-10-09 2010-04-22 Joinset Co Ltd Ceramic chip assembly
JP2019219201A (en) * 2018-06-18 2019-12-26 矢崎総業株式会社 Sensor body and manufacturing method for sensor body
KR20200074126A (en) 2017-10-30 2020-06-24 세미텍 가부시키가이샤 Temperature sensors and devices with temperature sensors
CN115465332A (en) * 2022-10-27 2022-12-13 北京交通大学 Motor train unit train control method and system, electronic equipment and storage medium
WO2023153130A1 (en) * 2022-02-14 2023-08-17 矢崎総業株式会社 Temperature sensor and method for manufacturing temperature sensor

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006112983A (en) * 2004-10-18 2006-04-27 Hitachi Ltd Controller
JP2010093258A (en) * 2008-10-09 2010-04-22 Joinset Co Ltd Ceramic chip assembly
KR20200074126A (en) 2017-10-30 2020-06-24 세미텍 가부시키가이샤 Temperature sensors and devices with temperature sensors
US11644368B2 (en) 2017-10-30 2023-05-09 Semitec Corporation Temperature sensor and device including temperature sensor
JP2019219201A (en) * 2018-06-18 2019-12-26 矢崎総業株式会社 Sensor body and manufacturing method for sensor body
US11340119B2 (en) 2018-06-18 2022-05-24 Yazaki Corporation Sensor body and method of manufacturing sensor body
WO2023153130A1 (en) * 2022-02-14 2023-08-17 矢崎総業株式会社 Temperature sensor and method for manufacturing temperature sensor
CN115465332A (en) * 2022-10-27 2022-12-13 北京交通大学 Motor train unit train control method and system, electronic equipment and storage medium

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