JPH0846347A - Jet nozzle for soldering - Google Patents

Abstract

PURPOSE:To prevent the generation of an unwetting of a work due to a blockage of jet holes by a method wherein the jet holes for solder wave jet are respectively formed in a part, in which each slant slit intersects a long slit. CONSTITUTION:A working rod 33a is elastically actuated by a fluid pressure cylinder 33 and a movable plate 23 of the same form as that of a fixed plate 22 having the form of a circular arc-shaped section is made to swing in the direction of the circular arc centering around a support axis 24 arranged in the center of the common circular arc. A multitude of projected solder waves S1 jetted from }st holes 25, in which a multitude of slant slits 25 intersect a long slit 26, are moved along the slits 25 provided in the plate 22 into a slanted form. As a result, in the case where the waves S1 come into contact to a component, such as a substrate mounting chip, of a work from the oblique direction and the waves SI come into contact to the work from just beside of the component, molten solder can be fed to all the corners, which are right under the component, of the work and the wettability of the work can be enhanced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering jet nozzle.

[0002]

2. Description of the Related Art Generally, a soldering jet nozzle used as a primary nozzle in a jet type solder bath is provided with a porous plate at an upper end opening of a nozzle body, and a large number of jets perforated in the porous plate. A large number of protruding solder waves are formed by the holes.

Japanese Patent Publication No. 62-15313 discloses that the perforated plate is reciprocated in the longitudinal direction of the nozzle body to improve the solderability.

[0004]

Conventionally, since the jet holes of the perforated plate are small circular holes having a diameter of about 3 to 5 mm, the jet holes are closed by clogging of slag such as oxide, and the closed portion. Only the solder wave does not rise, and the work (component mounting board) may become non-wetting.

The present invention has been made in view of the above circumstances, and an object thereof is to prevent non-wetting of a work due to blockage of a jet hole.

[0006]

According to a first aspect of the present invention, there is provided a soldering jet nozzle in which a large number of projecting solder waves are jetted from an upper portion of a nozzle main body which is elongated in the width direction of a work. A fixed plate integrally provided on the upper end of the nozzle body, a movable plate movably provided in a stacked state with respect to the fixed plate, and one of the fixed plate and the movable plate having a nozzle body long. A large number of slanted slits that are slanted in parallel with each other in the longitudinal direction, and are bored in the longitudinal direction of the nozzle body at a position intersecting each slant slit in the other of the fixed plate and the movable plate. And a jet hole for a solder wave jet formed at an intersection of each of the inclined slits and the long slit.

According to a second aspect of the present invention, in the soldering jet nozzle according to the first aspect, the fixed plate and the movable plate are formed in an arcuate cross-sectional shape that bulges upward, and the movable plate is provided with respect to the fixed plate. Is a structure provided so as to be rotatable around a support shaft arranged at a common arc center on both side surfaces of both ends.

According to a third aspect of the present invention, in the soldering jet nozzle according to any of the first and second aspects, the fixed plate is provided with an inclined slit, and the movable plate is provided with a long slit. Is.

The invention according to a fourth aspect is the first to the third aspects.
In the jet nozzle for soldering according to any one of
This is a configuration in which the movable plate is connected to the working portion of the fluid pressure cylinder.

The invention according to claim 5 is the same as claims 1 to 3.
In the jet nozzle for soldering according to any one of
This is a configuration in which multiple rows of long slits are provided in parallel.

[0011]

According to the first aspect of the present invention, the movable plate is reciprocally moved or swung at a right angle or a crossing angle close to a right angle with respect to the lengthwise direction of the nozzle main body, so that a large number of inclined slits and long slits A large number of protruding solder waves jetted from the intersecting jet holes are moved in a direction orthogonal to the work transfer direction or in a direction intersecting with the inclined shape.

According to a second aspect of the present invention, the movable plate having the same shape as the fixed plate having the circular arc sectional shape is rotated about a support shaft arranged at a common circular arc center, whereby an inclined slit and a long slit are formed. The protruding solder wave jetted from the jet hole intersecting the shaku slit is moved.

According to the third aspect of the present invention, the solder wave moves in an inclined shape with respect to the longitudinal direction of the nozzle body along the inclined slit of the fixing plate.

According to the fourth aspect of the present invention, by controlling the stroke and speed of the fluid pressure cylinder that reciprocates the movable plate, the deflection amount and speed of the protruding solder wave are adjusted.

According to the fifth aspect of the invention, since the elongated slits are provided in a plurality of rows, a plurality of rows of solder waves are jetted out from the plurality of rows of jet holes.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in the drawings.

FIG. 6 shows an outline of the jet type soldering apparatus. It is located below the conveyor 11 that holds and conveys the work (component mounting board) W, from the work carry-in side to the carry-out side.
A fluxer 12 for applying flux to the lower surface of the work, a preheater 13 for preheating the work, and a primary nozzle 14a and a secondary nozzle 14b for jetting molten solder onto the lower surface of the work.
A solder bath 14 provided with and a fan 15 for cooling the work are sequentially arranged.

The primary nozzle 14a and the secondary nozzle 14b
Is supplied with the molten solder S accommodated in the bath by a pump (not shown) provided in the solder bath 14, and the primary nozzle 14a according to the present invention is raised by a large number of projecting solder waves S1 jetted from above. Soldering is performed to every corner of the densely mounted components, and the secondary nozzle 14b is finished by the flat solder wave S2 jetted from above. Various examples of the primary nozzle 14a are shown below.

FIG. 1 shows a first embodiment according to the present invention. As shown in FIGS. 1 (A) and 1 (B), a nozzle body 21 is formed to be long in the width direction of a work, and FIG. As shown in (D), a fixed plate 22 is integrally provided on the upper end of the nozzle body 21, and a movable plate 23 is movably provided on the fixed plate 22 in a stacked state.

As shown in FIG. 1C, the fixing plate 22 is
Both of the movable plate 23 and the movable plate 23 are formed in an arcuate cross-sectional shape that bulges upward. Is rotatably provided.

The movable plate 23 has a wider angle than the fixed plate 22,
Both sides 23b of the movable plate 23 on the work loading and unloading sides.
Project from the fixing plate 22 and serve as guide fins for returning the jet solder into the solder bath.

As shown in FIG. 1A, the fixing plate 22 is
A large number of inclined slits 25 are formed in parallel with each other in a slanting direction with respect to the longitudinal direction of the nozzle main body 21, and the movable plate 23 has a long length of the nozzle main body 21 at a position intersecting each inclined slit 25 over substantially the entire length. Long slits 26 are formed in the direction, and jet holes 27 for solder wave jets are formed at intersections of the inclined slits 25 and the long slits 26, respectively.

As shown in FIG. 1D, a projecting piece 31 is integrally provided on the end face plate 23a at one end of the movable plate 23.
A tip end portion of an operating rod 33a of a fluid pressure cylinder 33 such as an air cylinder is connected to a long hole 32 provided in 31 by a pin 34.

Next, the operation of this embodiment will be described.

The working rod 33a is expanded and contracted by the fluid pressure cylinder 33 to move the movable plate 23 having the same shape with respect to the fixed plate 22 having an arc cross section in the arc direction around the support shaft 24 arranged at the common arc center. By swinging the slanted slits 25 to a plurality of slanted slits 25 and elongated slits 26, the jet holes 27 intersect each other as shown in FIG.
As shown in (B), a large number of projecting solder waves S1 jetted are slanted along the slant slits 25 of the fixing plate 22.

For this reason, when the projecting solder wave S1 obliquely contacts a component such as a board-mounted chip of a work, and when the solder wave S1 contacts directly from the component, the molten solder is applied to every corner of the shadow of the component. Can be supplied, and the wettability of a work such as a high-density mounting substrate can be improved.

As described above, the inclined slit 25 and the long slit
Since the movable jet hole 27 is formed at the intersection with the combination with 26, there is no possibility that the jet hole 27 will be blocked by clogging of slag such as oxides, etc., preventing non-wetting of the work due to blockage of the jet hole 27 it can.

Fluid pressure cylinder for moving the movable plate 23 back and forth
Since the reciprocating stroke and speed of 33 can be easily adjusted by the switching timing of the direction control valve in the fluid pressure circuit and the flow rate control valve, the swing amount and speed of the protruding solder wave S1 are adjusted according to the condition of the work.

Next, FIG. 2 shows a second embodiment according to the present invention. As shown in FIG.
The long slits (rows) 26 are provided in parallel.
Since the other structure is the same as that of the first embodiment, the same reference numerals are given to the same portions and the description thereof will be omitted.

Since the elongated slits 26 are provided in a plurality of rows, the jet holes 27 are provided in a plurality of rows as shown in FIG. 2 (B).
A plurality of rows of solder waves S1 are ejected from the nozzles to ensure reliable soldering.

Next, FIG. 3 shows a third embodiment according to the present invention. As shown in FIG. 3 (A), a long slit 26 is formed in the center of the fixed plate 22 over substantially the entire length, and a movable plate is formed. A large number of inclined slits 25 are formed in 23. Other structure is first
Since this is the same as the embodiment, the same parts are designated by the same reference numerals and the description thereof is omitted.

3B, the movable plate 23 is swung in a circular arc direction around the support shaft 24 so that a large number of inclined slits 25 and long slits 26 intersect each other. A large number of projecting solder waves S1 jetted from the jet holes 27 are moved along the long slits 26 of the fixing plate 22 in the direction orthogonal to the work transfer direction.

Next, FIG. 4 shows a fourth embodiment according to the present invention. As shown in FIG.
The long slits (rows) 26 are provided in parallel.
Since the other structure is the same as that of the third embodiment, the same parts are designated by the same reference numerals and the description thereof will be omitted.

Since the elongated slits 26 are provided in plural rows, the jet holes 27 in plural rows are formed as shown in FIG. 4 (B).
A plurality of rows of solder waves S1 are ejected from the nozzles to ensure reliable soldering.

Next, FIG. 5 shows a fifth embodiment according to the present invention. The portions of the fixed plate 22 and the movable plate 23 which face each other are formed in a flat plate shape and slidably contacted with each other. Figure 5
As shown in (A), a long slit 26 is formed in the center of the fixed plate 22 over substantially the entire length, and a large number of inclined slits 25 are formed in the movable plate 23. Since the other structure is the same as that of the third embodiment, the same parts are designated by the same reference numerals and the description thereof will be omitted.

Then, the movable plate 23 is moved by the fluid pressure cylinder 33.
By reciprocating at right angles to the long direction of the nozzle body 21, a large number of projecting solder waves jetted from the jet holes 27 intersecting the large number of inclined slits 25 and the long slits 26, and the work transfer direction. Move in the orthogonal direction.

The invention described in claims 1 to 3 is not limited to the fluid pressure cylinder 33 as a drive unit for acting the movable plate 23, and other mechanical actuators such as a rotary actuator or a crank mechanism, for example. This also includes the case where the movable plate 32 is operated by.

[0038]

According to the first aspect of the present invention, a movable jet hole is formed at the intersection of a combination of an inclined slit and a long slit provided on one or the other of the fixed plate and the movable plate. Therefore, there is no possibility that the jet holes will be clogged due to clogging of slag such as oxide, and it is possible to prevent non-wetting of the work due to the clogging of the jet holes. Moreover, the wettability of a work such as a high-density mounting substrate can be improved by moving the jet holes in a direction intersecting the work transfer direction and swinging the protruding solder waves with respect to the work.

According to the second aspect of the present invention, since the movable plate having the same shape as the fixed plate having the circular arc sectional shape rotates about a support shaft arranged at a common circular arc center, the movable plate has the same shape as the fixed plate. The movable plate can be easily attached only by the spindle.

According to the invention described in claim 3, since the solder wave moves obliquely along the inclined slit of the fixing plate,
When the solder wave comes into contact with the board-mounted component of the workpiece obliquely, and when the solder wave comes into contact with the component from directly beside, the molten solder can be supplied to every corner of the shadow of the component.

According to the fourth aspect of the invention, the reciprocating stroke and speed of the fluid pressure cylinder can be easily adjusted by the switching timing of the directional control valve in the fluid pressure circuit and the flow rate control valve. At the same time, it is possible to easily change the movable state such as the deflection amount and speed of the protruding solder wave.

According to the fifth aspect of the invention, since the long slits are provided in a plurality of rows, the work can be reliably soldered by the plurality of rows of solder waves ejected from the plurality of rows of jet holes.

[Brief description of drawings]

1A is a plan view showing a first embodiment of a soldering jet nozzle according to the present invention, FIG. 1B is an explanatory view showing a jetting state of a solder wave, and FIG. 1C is a sectional view thereof. (D) is a side view thereof.

2A is a plan view showing a second embodiment of a soldering jet nozzle according to the present invention, and FIG. 2B is a sectional view thereof.

3A is a plan view showing a third embodiment of a soldering jet nozzle according to the present invention, and FIG. 3B is a sectional view thereof.

4A is a plan view showing a fourth embodiment of a soldering jet nozzle according to the present invention, and FIG. 4B is a sectional view thereof.

5A is a plan view showing a fifth embodiment of a soldering jet nozzle according to the present invention, and FIG. 5B is a side view thereof.

FIG. 6 is a schematic view showing a jet type soldering device.

[Explanation of symbols]

 W Work S1 Projected solder wave 21 Nozzle body 22 Fixed plate 23 Movable plate 24 Spindle 25 Tilt slit 26 Long slit 27 Jet hole 33 Fluid pressure cylinder

Claims (5)

[Claims] 1. A soldering jet nozzle in which a large number of projecting solder waves are jetted from an upper portion of a nozzle body which is elongated in the width direction of a work, and is integrally provided at an upper end portion of the nozzle body. Fixed plate, a movable plate movably provided in a stacked state with respect to the fixed plate, and one of the fixed plate and the movable plate formed in a slanting manner with respect to the longitudinal direction of the nozzle body and in parallel with each other. A plurality of inclined slits, long slits formed on the other side of the fixed plate and the movable plate in the longitudinal direction of the nozzle body at positions intersecting with the respective inclined slits, and the respective inclined slits. A soldering jet nozzle, comprising: a jet hole for a solder wave jet, which is formed at each intersection with a long slit. 2. The fixed plate and the movable plate are formed in an arcuate cross-sectional shape that bulges upward, and the movable plate is rotated with respect to the fixed plate about a support shaft arranged at a common arc center on both end side surfaces thereof. The jet nozzle for soldering according to claim 1, wherein the jet nozzle for soldering is provided so as to be movable. 3. The jet nozzle for soldering according to claim 1, wherein the fixed plate is provided with an inclined slit and the movable plate is provided with a long slit. 4. The soldering jet nozzle according to claim 1, wherein an operating portion of a fluid pressure cylinder is connected to the movable plate. 5. The jet nozzle for soldering according to claim 1, wherein a plurality of long slits are provided in parallel.