JPH0841443A - Polishing composition and polishing method - Google Patents

Polishing composition and polishing method

Info

Publication number
JPH0841443A
JPH0841443A JP17405894A JP17405894A JPH0841443A JP H0841443 A JPH0841443 A JP H0841443A JP 17405894 A JP17405894 A JP 17405894A JP 17405894 A JP17405894 A JP 17405894A JP H0841443 A JPH0841443 A JP H0841443A
Authority
JP
Japan
Prior art keywords
polishing
polishing composition
polyoxyethylene
abrasive
buff
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17405894A
Other languages
Japanese (ja)
Inventor
Toshio Katakama
利男 片鎌
Norio Ozeki
紀夫 大関
Yukio Nishihama
幸男 西浜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okuno Chemical Industries Co Ltd
Original Assignee
Okuno Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okuno Chemical Industries Co Ltd filed Critical Okuno Chemical Industries Co Ltd
Priority to JP17405894A priority Critical patent/JPH0841443A/en
Publication of JPH0841443A publication Critical patent/JPH0841443A/en
Pending legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To provide a polishing composition which can increase the polishing speed and delay the deterioration of the polishing agent in the scratch-free mirror surface polish. CONSTITUTION:This polishing composition comprises 2-30 pts.wt. of a polishing material of 0.1-10mum average particle diameter and 1-20 pts.wt. of at least one selected from the group consisting of alkyl sulfate salts and polyoxyethylene monofatty acid esters. The substrate is polished on its surface, as the buff having the polishing composition adhered on its surface is rotated.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ステンレススチールや
非鉄金属等の被研磨物を、スクラッチのない鏡面に研磨
することができる研磨組成物及び研磨方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing composition and a polishing method capable of polishing an object to be polished such as stainless steel or non-ferrous metal to a mirror surface without scratches.

【0002】[0002]

【従来の技術とその問題点】我々の身の回りにある生活
用品、例えば、電化製品、時計、置物やインテリアなど
には、外観の見栄えを良くするために、ステンレススチ
ールや非鉄金属等が多く使用されている。そのため、外
観の見栄えや品の良さを一層向上させるため、表面の光
沢を増加させることが重要になってきており、ステンレ
ススチールや非鉄金属等の表面の光沢性を向上させるた
めに、スクラッチのない平滑面を得るための研磨方法が
検討されている。
[Prior Art and its Problems] In order to improve the appearance of everyday items such as electric appliances, watches, figurines and interiors, stainless steel and non-ferrous metals are often used. ing. Therefore, it is becoming important to increase the gloss of the surface in order to further improve the appearance and goodness of the product. In order to improve the gloss of the surface of stainless steel or non-ferrous metal, scratch-free A polishing method for obtaining a smooth surface has been studied.

【0003】例えば、特開平4−201069号には、
平均粒径2μm以下の研磨材を脂肪酸石鹸水溶液に分散
させたスラリーを用いた、スクラッチのない鏡面研磨方
法が開示されている。この方法は、スクラッチのない鏡
面研磨を行えるが、研磨速度が遅い、研磨材の劣化が早
い、という欠点があった。
For example, Japanese Patent Laid-Open No. 4-201069 discloses that
A scratch-free mirror surface polishing method using a slurry in which an abrasive having an average particle diameter of 2 μm or less is dispersed in a fatty acid soap aqueous solution is disclosed. Although this method can perform mirror-like polishing without scratches, it has drawbacks in that the polishing rate is slow and the polishing material deteriorates quickly.

【0004】[0004]

【発明が解決しようとする課題】本発明は、簡単、迅速
かつ耐久性の高い鏡面研磨用の研磨組成物及び研磨方法
を提供するものである。
DISCLOSURE OF THE INVENTION The present invention provides a polishing composition and a polishing method for mirror polishing, which is simple, quick and highly durable.

【0005】[0005]

【課題を解決するための手段】本発明者は、上記技術に
鑑み、研究を重ねた結果、平均粒径0.1〜10μmの
研磨材に、アルキル硫酸塩、ポリオキシエチレンモノ脂
肪酸エステルなどを用いた研磨組成物が、脂肪酸石鹸水
溶液を用いた研磨組成物よりも、研磨速度が速く、耐久
性に優れていることを見出した。
As a result of repeated studies in view of the above-mentioned technique, the present inventor has found that an alkylsulfate, polyoxyethylene monofatty acid ester or the like is added to an abrasive having an average particle size of 0.1 to 10 μm. It has been found that the polishing composition used has a higher polishing rate and is superior in durability than a polishing composition using a fatty acid soap aqueous solution.

【0006】即ち、本発明は、平均粒径が0.1〜10
μmの研磨材を2〜30重量部、アルキル硫酸塩及びポ
リオキシエチレンモノ脂肪酸エステルからなる群から選
ばれる少なくとも一種を1〜20重量部含む研磨組成物
を提供するものである。
That is, the present invention has an average particle size of 0.1 to 10
It is intended to provide a polishing composition containing 2 to 30 parts by weight of an abrasive having a thickness of μm, and 1 to 20 parts by weight of at least one selected from the group consisting of alkyl sulfates and polyoxyethylene monofatty acid esters.

【0007】また、本発明は、上記研磨組成物を付着さ
せたバフを回転させながら、被研磨物の表面を研磨する
研磨方法を提供するものである。
The present invention also provides a polishing method for polishing the surface of an object to be polished while rotating the buff to which the polishing composition is attached.

【0008】本発明において用いられる研磨材は、酸化
クロム、酸化アルミニウム、酸化鉄、けい石粉末、非晶
質シリカ、けい藻土、炭化けい素、酸化ジルコニウム、
酸化セリウムなどの微粒研磨材が使用できる。
The abrasive used in the present invention is chromium oxide, aluminum oxide, iron oxide, silica powder, amorphous silica, diatomaceous earth, silicon carbide, zirconium oxide,
Fine-grained abrasives such as cerium oxide can be used.

【0009】好ましい研磨材としては、酸化アルミニウ
ム、酸化クロムの微粉品が例示される。
Examples of preferable abrasives include fine powders of aluminum oxide and chromium oxide.

【0010】特に、界面活性剤と研磨材の好ましい組合
わせとしては、ステアリル硫酸ナトリウムと酸化アルミ
ニウム、ポリオキシエチレンモノステアリル酸エステル
と酸化アルミニウムが例示される。
Particularly preferable combinations of the surfactant and the abrasive include sodium stearyl sulfate and aluminum oxide, and polyoxyethylene monostearyl ester and aluminum oxide.

【0011】研磨材の粒度は、0.1〜10μmで、好
ましくは、0.5〜3μmである。0.1〜10μmで
は、被研磨物にスクラッチは入らず、研磨効果が優れて
いる。
The particle size of the abrasive is 0.1 to 10 μm, preferably 0.5 to 3 μm. When the thickness is 0.1 to 10 μm, scratches do not enter the object to be polished, and the polishing effect is excellent.

【0012】研磨組成物中の研磨材の含有量は、2〜3
0重量部で、好ましくは、3〜10重量部である。
The content of the abrasive in the polishing composition is 2-3.
It is 0 part by weight, preferably 3 to 10 parts by weight.

【0013】本発明の研磨組成物は、アルキル硫酸塩及
びポリオキシエチレンモノ脂肪酸エステルの他に非研磨
材成分を含んでいてもよく、それら非研磨材成分として
は、ポリオキシエチレンモノアルキルエーテル、ポリオ
キシエチレンソルビタンモノ脂肪酸エステル、ポリオキ
シエチレン牛脂アミノエーテル、ロート油、アルキルフ
ェニールエーテルモノスルフォン酸塩、アルキルフェニ
ルエーテルジスルフォン酸塩、アルキルジフェニルエー
テルジスルフォン酸塩、多価アルコールなどが挙げられ
る。
The polishing composition of the present invention may contain a non-abrasive component in addition to the alkyl sulfate and the polyoxyethylene monofatty acid ester, and these non-abrasive components include polyoxyethylene monoalkyl ether, Examples thereof include polyoxyethylene sorbitan monofatty acid ester, polyoxyethylene beef tallow amino ether, funnel oil, alkylphenyl ether monosulfonate, alkylphenyl ether disulphonate, alkyldiphenyl ether disulphonate and polyhydric alcohol.

【0014】本発明研磨組成物中のアルキル硫酸塩は、
一般式R−O−SO2 −OMで表わされ、Rとしては、
カプリリル、カプリル、ラウリル、ミリスチル、セチ
ル、ステアリル、オレイルなどの炭素数が8〜18の飽
和又は不飽和のアルキル基、好ましくは、炭素数が12
〜18のアルキル基、Mとしては、ナトリウム、カリウ
ム等のアルカリ金属、及びエタノールアミン等の有機ア
ミンなどが挙げられる。
The alkyl sulfate in the polishing composition of the present invention is
Represented by the general formula R-O-SO 2 -OM, as the R,
A saturated or unsaturated alkyl group having 8 to 18 carbon atoms such as caprylyl, capryl, lauryl, myristyl, cetyl, stearyl, oleyl, etc., preferably 12 carbon atoms.
Examples of the alkyl group of -18 and M include alkali metals such as sodium and potassium, and organic amines such as ethanolamine.

【0015】ポリオキシエチレンモノアルキルエーテル
としては、例えば、カプリリルアルコール、カプリルア
ルコール、ラウリルアルコール、ミリスチルアルコー
ル、セチルアルコール、ステアリルアルコール、オレイ
ルアルコールなどの炭素数8〜18の飽和、不飽和アル
コールのポリオキシエチレンとのエーテルなどが挙げら
れる。
Examples of the polyoxyethylene monoalkyl ether include saturated and unsaturated alcohols having 8 to 18 carbon atoms such as caprylyl alcohol, capryl alcohol, lauryl alcohol, myristyl alcohol, cetyl alcohol, stearyl alcohol and oleyl alcohol. Examples thereof include ethers with oxyethylene.

【0016】ポリオキシエチレンモノ脂肪酸エステルと
しては、ポリオキシエチレンとカプリル酸、カプリン
酸、ラウリン酸、ミリスチン酸、パルミチン酸、ステア
リン酸、オレイン酸などの炭素数8〜18の飽和、不飽
和脂肪酸エステルなどが挙げられる。
As the polyoxyethylene monofatty acid ester, polyoxyethylene and caprylic acid, capric acid, lauric acid, myristic acid, palmitic acid, stearic acid, oleic acid, and other saturated or unsaturated fatty acid esters having 8 to 18 carbon atoms. And so on.

【0017】本発明の研磨剤組成物中、最も好ましい非
研磨材成分としては、アルキル硫酸塩及びポリオキシエ
チレンモノ脂肪酸エステルであり、これらを用いた場合
は、脂肪酸石鹸水溶液よりも、特に研磨速度が優れ、研
磨剤の処理量も優れている。
In the abrasive composition of the present invention, the most preferred non-abrasive components are alkyl sulfates and polyoxyethylene monofatty acid esters. When these are used, the polishing rate is particularly higher than that of the fatty acid soap aqueous solution. And the throughput of the polishing agent is also excellent.

【0018】尚、上記以外の非研磨材成分として、ナフ
タレンスルフォン酸ホルマリン縮合物のナトリウム塩や
ポリカルボン酸型高分子分散剤などの添加により、研磨
材の分散効果を上げることにより、研磨剤のハンドリン
グ性が向上する。
As a non-abrasive component other than those mentioned above, the sodium salt of a formalin condensate of naphthalene sulfonic acid, a polycarboxylic acid type polymer dispersant, or the like is added to improve the dispersing effect of the abrasive, and Handleability is improved.

【0019】研磨組成物中のアルキル硫酸塩及びポリオ
キシエチレンモノ脂肪酸エステルからなる群から選ばれ
る少なくとも一種の含有量は、1〜20重量部で、好ま
しくは3〜10重量部である。
The content of at least one selected from the group consisting of alkylsulfates and polyoxyethylene monofatty acid esters in the polishing composition is 1 to 20 parts by weight, preferably 3 to 10 parts by weight.

【0020】1〜20重量部では、界面潤滑効果が上が
り、鏡面光沢が優れ、研磨組成物の粘度が低くなり、研
磨剤が研磨品に殆ど付着せず、研磨終了後に研磨剤の持
ち出しがなく、実用上使用し易い。
When the amount is 1 to 20 parts by weight, the interfacial lubrication effect is improved, the specular gloss is excellent, the viscosity of the polishing composition is low, the polishing agent hardly adheres to the polishing product, and the polishing agent is not taken out after polishing. , Practically easy to use.

【0021】次に本発明の研磨方法について述べる。Next, the polishing method of the present invention will be described.

【0022】本発明の研磨組成物は、水に分散させてス
ラリーとして使用する。
The polishing composition of the present invention is dispersed in water and used as a slurry.

【0023】水の量としては、当業者が容易に決定でき
る。
The amount of water can be easily determined by those skilled in the art.

【0024】上記研磨組成物を用いて、鏡面研磨を行な
うに際して、研磨方法は、バフを用いた縦研磨及び平面
研磨で行なうことができる。
When mirror polishing is performed using the above polishing composition, the polishing method can be vertical polishing using a buff or flat polishing.

【0025】また、使用するバフとしては、フェルトバ
フ、ネルバフ、スポンジバフ、羊毛バフなどが挙げられ
る。
Examples of the buff used include felt buff, ner buff, sponge buff, wool buff and the like.

【0026】バフ周速度は、50〜500m/分で研磨
でき、この周速度では、研磨効率が良く、スクラッチは
入らず、優れた鏡面研磨ができる。
Buffing can be performed at a peripheral speed of 50 to 500 m / min. At this peripheral speed, polishing efficiency is good, scratches do not occur, and excellent mirror surface polishing can be performed.

【0027】本発明の研磨方法によって研磨される被研
磨物としては、ステンレススチールや非鉄金属例えば、
アルミニウム、銅合金、チタン、ニッケルめっき品、ク
ロムめっき品などが挙げられる。
The object to be polished by the polishing method of the present invention includes stainless steel and non-ferrous metals such as
Examples include aluminum, copper alloys, titanium, nickel-plated products, and chrome-plated products.

【0028】上記研磨方法では、鏡面研磨を行なうに際
し、研磨組成物は連続供給することにより、スクラッチ
のない、鏡面研磨ができる。
In the above-mentioned polishing method, the mirror-polishing can be carried out without scratch by continuously supplying the polishing composition during the mirror-polishing.

【0029】[0029]

【実施例】【Example】

実施例1〜3及び比較例1〜2 研磨テストピースとしてアルミニウム板材(JIS A
−5052) 20×20cmを油脂性固形バフ研磨剤
ライム 434(奥野製薬工業(株)製)を用い、綿バ
イアスバフにて、表面粗さ 0.2μm Rmax に仕上げた物
を用いて、研磨回転数300r.p.m.、研磨圧6,
000Paにて、研磨剤使用量100gの条件下にフェ
ルトバフ(φ180cm)を用いてバフ研磨を行った。研
磨組成物として表1に示すものを各々100g使用し
た。
Examples 1 to 3 and Comparative Examples 1 to 2 Aluminum plate materials (JIS A
-5052) 20 × 20 cm oily solid buffing agent
Using Lime 434 (manufactured by Okuno Chemical Industries Co., Ltd.), a cotton bias buff having a surface roughness of 0.2 μm Rmax was used, and the polishing speed was 300 r.p.m. p. m. , Polishing pressure 6,
Buffing was performed at 000 Pa using a felt buff (φ180 cm) under the condition that the amount of abrasive used was 100 g. As the polishing composition, 100 g of each of those shown in Table 1 was used.

【0030】[0030]

【表1】 研磨組成物 実施例 比較例 成 分 1 2 3 1 2 アルキル硫酸ナトリウム* 10 ポリオキシエチレン脂肪酸エステル** 10 ポリオキシエチレン脂肪酸エステル*** 10 脂肪酸石鹸**** 10 脂肪酸石鹸***** 10 焼成アルミナ(中心粒径1μm) 20 20 20 20 20 水 70 70 70 70 70 100 100 100 100 100 * ステアリル硫酸ナトリウム ** ポリオキシエチレンモノステアリン酸エステル *** ポリオキシエチレンモノミリスチン酸エステル **** ステアリン酸65%、パルミチン酸30%、ミリスチン酸5%のナトリ ウム塩 ***** ステアリン酸65%、パルミチン酸30%、ミリスチン酸5%のカリウ ム塩 一枚のテストピースの鏡面研磨に要する時間及び100
gの研磨組成物で研磨可能なテストピースの枚数を表2
に示す。
TABLE 1 Polishing Composition Examples Comparative Example Ingredient 1 2 3 1 2 sodium alkyl sulfate * 10 Polyoxyethylene fatty acid esters ** 10 polyoxyethylene fatty acid ester *** 10 fatty acid soap **** 10 fatty acid soap * **** 10 Calcined alumina (center particle size 1 μm) 20 20 20 20 20 Water 70 70 70 70 70 100 100 100 100 100 * Sodium stearyl sulfate ** Polyoxyethylene monostearate *** Polyoxyethylene monomyristin Acid ester **** Sodium stearate 65%, palmitic acid 30%, myristic acid 5% sodium salt ***** Stearic acid 65%, palmitic acid 30%, myristic acid 5% potassium salt Time required for mirror polishing of test piece and 100
Table 2 shows the number of test pieces that can be polished with the polishing composition of g.
Shown in

【0031】[0031]

【表2】 * テストピースの鏡面光沢を行うのに要する研磨時間 ** テストピースの鏡面光沢を行ない得る研磨枚数 尚、実施例1〜3及び比較例1〜2について、個々所要
研磨時間後の鏡面光沢は目視および計器測定による表面
粗さ(0.06〜0.07μm Rmax )については、優位差は認
められない。
[Table 2] * Polishing time required to perform specular gloss of the test piece ** Number of polishes capable of performing specular gloss of the test piece Incidentally, in Examples 1 to 3 and Comparative Examples 1 and 2, the specular gloss after each required polishing time was visually observed. Regarding the surface roughness (0.06 to 0.07 μm Rmax) measured by a measuring instrument, no significant difference is observed.

【0032】表2に示されるように、本願の研磨組成物
は、全体として研磨時間と研磨枚数のバランスが石鹸を
用いた従来の研磨組成物よりも優れている。
As shown in Table 2, the polishing composition of the present invention as a whole has a better balance between the polishing time and the number of polishing sheets than the conventional polishing composition using soap.

【0033】実施例4及び5 研磨テストピースとして、ステンレス板材(JIS S
US 304BA)20×20cmを用い、油脂性固形バ
フ研磨剤 青棒 31(奥野製薬工業(株)製)を用
い、オープン綿バフにて表面粗さ 0.1μm Rmax に仕上
げた物を用いて、研磨回転数400r.p.m.、研磨
圧8,000Paの条件下に、スポンジバフ(φ180
cm)を用いてバフ研磨を行った。
Examples 4 and 5 As a polishing test piece, a stainless plate material (JIS S
US 304BA) 20 × 20 cm, using an oily solid buff abrasive blue stick 31 (manufactured by Okuno Chemical Industries Co., Ltd.), and polishing with an open cotton buff to a surface roughness of 0.1 μm Rmax. Rotation speed 400r. p. m. Under a polishing pressure of 8,000 Pa, sponge buff (φ180
cm) was used for buffing.

【0034】研磨組成物として、下記の表3に示すもの
を、各々100g用いた。
As the polishing composition, 100 g of each of those shown in Table 3 below was used.

【0035】[0035]

【表3】 * ラウリル硫酸ナトリウム ** ポリオキシエチレンモノラウリン酸エステル 尚、実施例4及び5は、太陽光の下で、スクラッチのな
い鏡面光沢を有する。また、計器測定による表面粗さは
共に、0.06μm Rmax であった。
[Table 3] * Sodium lauryl sulfate ** Polyoxyethylene monolaurate It should be noted that Examples 4 and 5 have specular gloss without scratches under sunlight. In addition, the surface roughness measured by a meter was both 0.06 μm Rmax.

【0036】[0036]

【発明の効果】本発明の研磨組成物及び研磨方法は、従
来に比べ、研磨速度が速く、しかも、研磨剤の劣化を遅
くすることができる。
EFFECT OF THE INVENTION The polishing composition and the polishing method of the present invention have a higher polishing rate than conventional ones and can slow the deterioration of the polishing agent.

【0037】[0037]

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成6年8月10日[Submission date] August 10, 1994

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0003[Name of item to be corrected] 0003

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0003】 例えば、特開平4−201069号に
は、平均粒径2μm以下の研磨材を脂肪酸石鹸水溶液に
分散させたスラリーを用いた、スクラッチのない鏡面研
磨方法が開示されている。この方法は、スクラッチのな
い鏡面研磨を行えるが、研磨速度が遅い、研磨の劣化
が早い、という欠点があった。
For example, Japanese Patent Application Laid-Open No. 4-201069 discloses a scratch-free mirror-polishing method using a slurry in which an abrasive having an average particle diameter of 2 μm or less is dispersed in a fatty acid soap aqueous solution. Although this method can perform mirror-like polishing without scratches, it has drawbacks such as a low polishing rate and a rapid deterioration of the polishing agent .

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 平均粒径が0.1〜10μmの研磨材を
2〜30重量部、アルキル硫酸塩及びポリオキシエチレ
ンモノ脂肪酸エステルからなる群から選ばれる少なくと
も一種を1〜20重量部含む研磨組成物。
1. Polishing containing 2 to 30 parts by weight of an abrasive having an average particle diameter of 0.1 to 10 μm, and 1 to 20 parts by weight of at least one selected from the group consisting of alkyl sulfates and polyoxyethylene monofatty acid esters. Composition.
【請求項2】 請求項1に記載の研磨組成物を付着させ
たバフを回転させながら、被研磨物の表面を研磨する研
磨方法。
2. A polishing method for polishing a surface of an object to be polished while rotating a buff having the polishing composition according to claim 1 attached thereto.
JP17405894A 1994-07-26 1994-07-26 Polishing composition and polishing method Pending JPH0841443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17405894A JPH0841443A (en) 1994-07-26 1994-07-26 Polishing composition and polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17405894A JPH0841443A (en) 1994-07-26 1994-07-26 Polishing composition and polishing method

Publications (1)

Publication Number Publication Date
JPH0841443A true JPH0841443A (en) 1996-02-13

Family

ID=15971888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17405894A Pending JPH0841443A (en) 1994-07-26 1994-07-26 Polishing composition and polishing method

Country Status (1)

Country Link
JP (1) JPH0841443A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998021289A1 (en) * 1996-11-14 1998-05-22 Kao Corporation Abrasive composition for the base of magnetic recording medium and process for producing the base by using the same
WO1999043761A1 (en) * 1998-02-24 1999-09-02 Showa Denko K.K. Abrasive composition for polishing semiconductor device and process for producing semiconductor device with the same
US6383239B1 (en) 1999-03-15 2002-05-07 Tokyo Magnetic Printing Co., Ltd. Free abrasive slurry composition and a grinding method using the same
JP2003025209A (en) * 2001-07-23 2003-01-29 Nisshin Steel Co Ltd Polishing method for stainless steel
FR2835517A1 (en) * 2002-02-04 2003-08-08 Jean Luc Renaud Ozone generator used for treatment of air includes unit for circulating a gas through the space between an ultraviolet tube and a tubular casing whose inner walls are reflective and made of ozone-resistant material
US20070169420A1 (en) * 2003-10-17 2007-07-26 Saint-Gobain Abrasives, Inc. Antiloading compositions and methods of selecting same
JP2009263534A (en) * 2008-04-25 2009-11-12 Yushiro Chem Ind Co Ltd Abrasive grain dispersion medium, slurry composition, method of polishing of brittle material, and preparation method of sapphire substrate

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998021289A1 (en) * 1996-11-14 1998-05-22 Kao Corporation Abrasive composition for the base of magnetic recording medium and process for producing the base by using the same
WO1999043761A1 (en) * 1998-02-24 1999-09-02 Showa Denko K.K. Abrasive composition for polishing semiconductor device and process for producing semiconductor device with the same
US6410444B1 (en) 1998-02-24 2002-06-25 Showa Denko K.K. Composition for polishing a semiconductor device and process for manufacturing a semiconductor device using the same
US6436835B1 (en) 1998-02-24 2002-08-20 Showa Denko K.K. Composition for polishing a semiconductor device and process for manufacturing a semiconductor device using the same
US6383239B1 (en) 1999-03-15 2002-05-07 Tokyo Magnetic Printing Co., Ltd. Free abrasive slurry composition and a grinding method using the same
JP2003025209A (en) * 2001-07-23 2003-01-29 Nisshin Steel Co Ltd Polishing method for stainless steel
FR2835517A1 (en) * 2002-02-04 2003-08-08 Jean Luc Renaud Ozone generator used for treatment of air includes unit for circulating a gas through the space between an ultraviolet tube and a tubular casing whose inner walls are reflective and made of ozone-resistant material
US20070169420A1 (en) * 2003-10-17 2007-07-26 Saint-Gobain Abrasives, Inc. Antiloading compositions and methods of selecting same
JP2009263534A (en) * 2008-04-25 2009-11-12 Yushiro Chem Ind Co Ltd Abrasive grain dispersion medium, slurry composition, method of polishing of brittle material, and preparation method of sapphire substrate

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