JPH0839605A - Three-dimensional insert molding of wiring board - Google Patents

Abstract

PURPOSE:To stably hold the interval between a plurality of wiring members at the time of injection molding even when the wiring members are set to up and down positional relation. CONSTITUTION:A primary molded product 7 holding at least one wiring members 3-5 is formed and used as a spacer to incorporate the wiring members 3-5 and other wiring members 3-5 in a mold to perform the three-dimensional insert molding of a wiring board holding the interval between a plurality of the wiring members 3-5. By this constitution, even when a plurality of the wiring members 3-4 become up and down positional relation, a position is decided by using the primary molded product as the spacer to enable insert molding and, therefore, even when a large number of the wiring members 3-4 are used, there is excellent effect such that the wiring board can be certainly molded without generating a deficient product.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board three-dimensional insert molding method suitable for manufacturing a wiring board replacing a printed circuit board.

[0002]

2. Description of the Related Art In a printed circuit board, a copper foil is formed on the surface of a thin substrate material by a photo-etching method, a screen printing method, an offset method or the like, and unnecessary copper foil is removed through a masking or etching process. As a result, a complicated wiring is formed, and the wiring is formed flat due to its manufacturing characteristics.

Therefore, when wiring that crosses over three-dimensionally is required, it is necessary to separately provide an electric wire that crosses over three-dimensionally and is called a jumper wire. In addition, soldering is performed in mounting the jumper wires and parts, but at that time, the heat of the soldering may be erroneously spread to others, and the wiring of the copper foil may be damaged.

[0004]

In view of the above situation, the applicant of the present invention uses the insert molding method of embedding a three-dimensional wiring made of a conductive material in a synthetic resin.
Attempts have been made to solve this, but in the case of planar wiring, it is easy to arrange them in the mold to maintain the spacing between wiring members, but in the case of three-dimensional wiring, the spacing between the upper and lower wiring Is difficult to hold, the wiring members are misaligned,
There is a problem that defective products come into contact with each other.

The present invention solves such a problem, and even when a plurality of wiring members have a vertical positional relationship, the space between them is stably maintained during injection molding. The object is to provide a molding method.

[0006]

In order to achieve the above-mentioned object, the present invention forms a primary molded product holding at least one wiring member, and uses the primary molded product as a spacer for the wiring member and others. By incorporating the above wiring member in the mold, a three-dimensional insert molding method of the wiring board which maintains the interval between the plurality of wiring members was constructed.

In the above-described wiring board three-dimensional insert molding method, the primary molded product may have a shape capable of catching the wiring member holding it. Alternatively, it may be an insert molded product of the wiring member.

[0008]

[Operation] Since the three-dimensional insert molding method of the wiring board is configured as described above, the primary molded product is molded in advance, and in the insert molding, the primary molded product is interposed between the wiring members in the vertical relationship. Thereby, the space between the wiring members can be stably maintained in the mold.

The primary molded product can be divided into a latching mold (Claim 2) and an insert molding mold (Claim 3). The latching mold enables efficient production, and the insert molding mold can be used. If so, it is possible to reliably maintain the interval. It should be noted that even if it is a dual-purpose die that is both a latching die and an insert molding die, it does not violate the spirit of the present invention.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, some typical embodiments of the present invention will be described with reference to the drawings.

1 to 3 show an embodiment in which the outer shape is a ring shape as a representative of the hook type, and the wiring board P has an upper wiring member as shown in FIGS. 1 and 2. Ring-shaped base 1 made of synthetic resin by insert molding of 3, the middle wiring member 4, and the lower wiring member 5.
Embedded in the respective connection terminals 3a, 4
a and 5a are exposed at three places.

Each of the wiring members 3, 4, 5 is formed of a conductive metal such as copper or copper alloy in a ring shape, and the connection terminals 3a, 4a, 5a are divided into three equal parts from the center thereof.
Is projected from the outer periphery. In addition, the connection terminals 3a, 4
Reference characters a and 5a are for connecting the terminals of the components or the terminals of the power source, and the tips are formed in a small ring shape so that the terminals can be inserted and welded. Also, each wiring member 3,
The positions of the upper wiring member 3 are changed downward and the lower wiring member 5 is changed upward in the same row so that the connection terminals 3a, 4a, 5a of the wirings 4 and 5 are arranged on the same plane. See FIG. 6 for an example).

For insert molding, first, the primary molded product 7
Is molded. This is because some of the wiring members 3, 4 and 5, in this case, the recessed grooves 9 and 11 into which they are dropped so as to hold the upper wiring member 3 and the middle wiring member 4, respectively. Therefore, it is formed in an H shape in cross section. Further, a notch 10 from which the connection terminals 3a and 4a are drawn out is provided from the concave grooves 9 and 11. The primary molded product 7 does not necessarily need to be a synthetic resin as long as it is an insulating material, and may be rubber or porcelain, for example. Next, the procedure of the insert molding method will be described.

As shown in FIG. 3, first, the upper wiring member 3 and the middle wiring member 4 are held in the recessed grooves 9 and 11 of the primary molded product 7 and are then placed in an injection molding die.
At that time, the lower wiring member 5 is housed at the same time, and injection molding is performed in a state where the wiring members 3, 4, 5 are combined so as to be in predetermined positions. Then, depending on the shape of the mold, the primary molded product 7 and the wiring members 3, 4,
5 and the connection terminals 3a, 4a, 5a are embedded in a secondary molding portion 8 formed in a ring shape, and at the same time, the connection terminals 3a, 4a, 5a are inserted into the parts for welding the terminals of the parts. The hole 12 for is formed.

FIGS. 5 to 6 show an embodiment in the production of a ring-shaped wiring board P which is also an insert molding die. As shown in FIGS. 4 and 5, the wiring board P has the same shape. In addition, although the upper wiring member 3, the middle wiring member 4, and the lower wiring member 5 are embedded in the base 1, unlike the above embodiment, the upper wiring member 3 and the lower wiring member 5 are respectively provided. Insert molding is performed on the primary molded products 7, 7. Further, the middle wiring member 4 is formed in a ring shape that is slightly larger.

In the insert molding, the primary molded product 7 has the connecting terminals 3 so that the middle wiring member 4 is hooked.
Since the projecting piece 13 is formed at the base end of each of a and 5a and the connecting terminals 3a and 5a are projected from the tip of the projecting base piece 13, in the secondary molding, as shown in FIG. With the wiring member 4 sandwiched in between, the primary moldings 7, 7 of the upper wiring member 3 and the lower wiring member 5 are incorporated into a mold, and the secondary molding portion 8 is formed as in the above-described embodiment. .

7 to 11 show a case where a large number of wiring members are three-dimensionally incorporated like a jungle gym unlike the above embodiment, and the wiring structure has an upper step and a step. It is divided into a section and a lower section. The wiring board P as a finished product is shown in FIG.
The molding method is different from that shown in FIGS. In addition, in FIG. 11, 21 is a socket for taking in a power supply.

The embodiment shown in FIG. 7 and FIG. 8 is a hook type case as in the first embodiment (FIGS. 1 to 3).
The upper wiring member 23 and the lower wiring member 2
Primary molded product 7 that holds both when 5 exists
With respect to the above, it is formed to have an H-shaped cross section having concave grooves 9 and 11 on both upper and lower surfaces.

In the case of FIG. 9 and FIG. 10, the insert molding die corresponding to the second embodiment (FIGS. 4 and 6) is used, and the upper wiring member 23 and the lower wiring member 25 are also provided. In the case of having the above, the primary molded product 7 is insert-molded with respect to the wiring member 25 which is the lower side.

FIG. 12 shows two wiring members 30, 32.
FIG. 3 is a cross-sectional view of a ring-shaped wiring board that crosses three-dimensionally. In this insert molding method, one wiring member 30 is provided with a bent bridge 34 that straddles the other wiring member 32, and it is held by a pin. In the same figure, 36 and 36 are through holes for the pin.

[0021]

As described above, according to the present invention, even when a plurality of wiring members have a vertical positional relationship, the primary molded product can be used as a spacer to fix the position and perform insert molding. Even if there are many wiring members, there is an excellent effect that the wiring board can be surely molded so as to prevent defective products.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a wiring board according to the present invention as viewed in the direction of arrows AA in FIG.

FIG. 2 is a plan view in which a wiring board is partially cut away.

FIG. 3 is a partial perspective view showing an assembled state of the same wiring board during injection molding.

FIG. 4 is a cross-sectional view showing a wiring board of another embodiment as viewed in the direction of arrows BB in FIG.

FIG. 5 is a plan view in which a wiring board is partially cut away.

FIG. 6 is a partial perspective view showing an assembled state of the same wiring board during injection molding.

FIG. 7 is a perspective view showing an assembled state at the time of injection molding in a wiring board according to still another embodiment.

8 is a cross-sectional view taken along the line CC of FIG.

FIG. 9 is a partially cutaway perspective view showing an assembled state at the time of injection molding in a wiring board according to still another embodiment.

10 is a cross-sectional view taken along the line DD of FIG.

11 is a perspective view showing a wiring board molded in the embodiments of FIGS. 7 and 9. FIG.

FIG. 12 is a partial cross-sectional view of a wiring board showing a three-dimensional insert molding method of the wiring board according to another invention.

[Explanation of symbols]

 P Wiring board 3,4,5,23,25 Wiring member 7 Primary molding 8 Secondary molding

Claims (3)

[Claims] 1. A gap between a plurality of wiring members is formed by forming a primary molded product holding at least one wiring member and incorporating the wiring molded member and another wiring member into a mold by using the primary molded product as a spacer. A method for forming a three-dimensional insert of a wiring board, which is characterized in that: 2. The primary molded article is shaped so that a wiring member holding it can be hooked.
The method for three-dimensional insert molding of the wiring board described. 3. The primary molded product is an insert molded product of a wiring member holding the primary molded product.
The method for three-dimensional insert molding of the wiring board described.