JP2837354B2 - 3D insert molding method for wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a three-dimensional insert molding method for a wiring board suitable for manufacturing a wiring board instead of a printed circuit board.

[0002]

2. Description of the Related Art In a printed circuit board, a copper foil is formed on the surface of a thin substrate material by a photo-etching method, a screen printing method, an offset method, or the like, and an unnecessary copper foil is removed through a masking or etching process. Thereby, a complicated wiring is formed, and the formation of the wiring becomes planar due to the property of its manufacture.

[0003] Therefore, when wiring that crosses three-dimensionally is required, it is necessary to separately provide an electric wire that crosses three-dimensionally called a jumper wire. In addition, soldering is performed in the mounting of the jumper wire and the components. At this time, the heat of the soldering is erroneously transmitted to other parts, and the wiring of the copper foil may be damaged.

[0004]

SUMMARY OF THE INVENTION In view of the above circumstances, the applicant of the present invention has disclosed a method of forming a plating heat of a conductive material.
Attempts have been made to solve this problem by insert molding methods that embed three-dimensional wiring of metal pieces that can withstand in synthetic resin.However, in the case of planar wiring, it is arranged in a mold to reduce the distance between wiring members. Although it is easy to hold, in the case of three-dimensional wiring, there is a problem that it is difficult to maintain a space between upper and lower wirings, a wiring member is displaced, and a defective product that comes into contact is generated.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem. Even when a plurality of wiring members have a vertical positional relationship, a three-dimensional insert for a wiring board in which the distance therebetween is stably maintained during injection molding. It was intended to provide a molding method.

[0006]

In order to achieve the above object, the present invention provides a method of forming a plurality of wiring members as metal pieces.
Build, forming a primary molded product for holding the at least one wiring members among them, by incorporating the wire members and other wiring members for its primary molded article as a spacer in a mold, the spacing of the plurality of wiring members The three-dimensional insert molding method of the holding wiring board was constructed.

[0007] In the above-mentioned three-dimensional insert molding method for a wiring board, the primary molded product may be shaped so that the wiring member holding the primary molded product can be hooked. Alternatively, an insert molded product of a wiring member may be used.

[0008]

Since the three-dimensional insert molding method for a wiring board is configured as described above, a primary molded product is molded in advance, and in insert molding, the primary molded product is interposed between wiring members in a vertical relationship. The distance between the wiring members can be stably held in the mold.

[0009] The primary molded product can be divided into a latching die (claim 2) and an insert molding die (claim 3). With the latching type, the production becomes efficient and the insert molding die is used. If so, the spacing is ensured. It should be noted that the use of both the latch mold and the insert mold is not contrary to the spirit of the present invention.

[0010]

Next, some typical embodiments of the present invention will be described with reference to the drawings.

FIGS. 1 to 3 show an embodiment in which the outer shape is a ring shape as a representative of a hanging type. The wiring board P has an upper wiring member as shown in FIGS. 3, a middle wiring member 4, and a lower wiring member 5 are formed by insert molding into a ring-shaped base made of synthetic resin .
There is embedded in each of the connecting terminals 3a, 4
a and 5a are exposed at three places.

Each of the wiring members 3, 4, and 5 is formed in a ring shape from a conductive metal such as copper or a copper alloy, and includes three connection terminals 3a, 4a, and 5a equally divided from the center.
Are protruded from the outer periphery. The connection terminals 3a, 4
Reference numerals a and 5a connect a terminal of a component or a terminal of a power supply, and the tip is formed in a small ring shape so that the terminal can be inserted and welded. In addition, each wiring member 3,
The positions of the connection terminals 3a, 4a, and 5a are changed to the same row by steps so that the upper wiring member 3 is lower and the lower wiring member 5 is upper so that the connection terminals 3a, 4a, and 5a are arranged on the same plane. See FIG. 6 for an example).

In the insert molding, first, the primary molded product 7
Is molded. This is because grooves 9 and 11 which drop some of the wiring members 3, 4 and 5, in this case, are dropped on both upper and lower surfaces so as to hold the upper wiring member 3 and the middle wiring member 4. Provided, and is therefore H-shaped in cross section. Further, a notch 10 from which the connection terminals 3a and 4a are drawn out from the concave grooves 9 and 11 is provided. The primary molded article 7 does not necessarily need to be a synthetic resin as long as it is an insulating material, and may be, for example, rubber or porcelain. Next, the procedure of the insert molding method will be described.

As shown in FIG. 3, first, in a state where the upper wiring member 3 and the middle wiring member 4 are held in the concave grooves 9 and 11 of the primary molded product 7, they are put into an injection mold.
At this time, injection molding is performed in a state where the lower wiring members 5 are put together and the wiring members 3, 4, and 5 are combined so as to be at predetermined positions. Then, depending on the shape of the mold, the primary molded product 7 and each of the wiring members 3, 4,
5 and a secondary molded part 8 in which the entirety of the connection terminals 3a, 4a, 5a are embedded are formed in a ring shape, and at the same time, the connection terminals 3a, 4a, 5a are inserted into the parts for welding the terminals of the parts. Hole 12 is formed.

FIGS. 5 and 6 show an embodiment in the manufacture of a ring-shaped wiring board P as an insert mold. As shown in FIGS. 4 and 5, the wiring board P has the same structure. In addition, the upper wiring member 3, the middle wiring member 4, and the lower wiring member 5 are embedded in the base.
The lower wiring member 5 and the lower wiring member 5 are respectively insert-molded into the primary molded products 7. Further, the middle wiring member 4 is formed in a ring shape which is slightly larger.

The primary molded product 7 is connected to the connection terminal 3 so that the middle wiring member 4 is engaged in the insert molding.
A protruding piece 13 is formed at the base end of each of the a and 5a, and the connection terminals 3a and 5a protrude from the front end of the protruding base piece 13, so that in the secondary molding, as shown in FIG. With the wiring member 4 interposed therebetween, the primary molded products 7, 7 of the upper wiring member 3 and the lower wiring member 5 are assembled in a mold, and a secondary molded portion 8 is formed in the same manner as in the above embodiment. .

FIGS. 7 to 11 show a case where a large number of wiring members are three-dimensionally assembled like a jungle gym, which is different from the above-described embodiment. Section and the lower section. FIG. 11 shows a wiring board P as a finished product.
9 and FIG. 10 are different from each other in the molding method. In FIG. 11, reference numeral 21 denotes a socket for receiving a power supply.

The embodiment shown in FIGS. 7 and 8 is a case of a hook type like the first embodiment (FIGS. 1 to 3).
Upper wiring member 23 and lower wiring member 2
Primary molded article 7 that holds both when 5 is present
Is formed in an H-shaped section having concave grooves 9 and 11 on both upper and lower surfaces.

FIGS. 9 and 10 show an insert molding die corresponding to the second embodiment (FIGS. 4 and 6), in which an upper wiring member 23 and a lower wiring member 25 are formed. , The primary molded product 7 is insert-molded for the lower wiring member 25.

FIG. 12 shows two wiring members 30, 32.
In the insert molding method, a bent bridge 34 that straddles the other wiring member 32 is provided on one of the wiring members 30, and is held down by a pin. In the figure, reference numerals 36 and 36 denote through holes of the pins.

[0021]

As described above, according to the present invention, even when a plurality of wiring members are in a vertical positional relationship, the position can be determined and insert-molded using the primary molded product as a spacer. Even if the number of the wiring members is large, there is an excellent effect that the wiring board can be surely formed so that no defective product is generated.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a wiring board according to the present invention as viewed in the direction of arrows AA in FIG.

FIG. 2 is a partially cutaway plan view of a wiring board.

FIG. 3 is a partial perspective view showing an assembled state of the wiring board during injection molding.

FIG. 4 is a cross-sectional view showing a wiring board according to another embodiment taken along line BB of FIG. 5;

FIG. 5 is a partially cutaway plan view of a wiring board.

FIG. 6 is a partial perspective view showing an assembled state of the wiring board during injection molding.

FIG. 7 is a perspective view showing an assembled state at the time of injection molding in a wiring board of still another embodiment.

FIG. 8 is a sectional view taken along line CC of FIG. 7;

FIG. 9 is a partially cutaway perspective view showing an assembled state at the time of injection molding in a wiring board of still another embodiment.

FIG. 10 is a sectional view taken along line DD in FIG. 9;

FIG. 11 is a perspective view showing a wiring board formed in the embodiment of FIGS. 7 and 9;

FIG. 12 is a partial cross-sectional view of a wiring board showing a method for three-dimensional insert molding of the wiring board according to a different invention.

[Explanation of symbols]

 P Wiring board 3, 4, 5, 23, 25 Wiring member 7 Primary molded product 8 Secondary molded part

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁶ , DB name) B29C 45/00-45/84 H05K 3/00 H05K 3/46

Claims (3)

(57) [Claims] A plurality of wiring members are formed as metal pieces.
Ri, by incorporating to form a primary molded product for holding the at least one wiring member of which the wiring members and other wiring members for its primary molded article as a spacer in a mold, the spacing of the plurality of wiring members A three-dimensional insert molding method for a wiring board, characterized by holding. 2. The method according to claim 1, wherein the primary molded product has a shape capable of hooking a wiring member holding the primary molded product.
The three-dimensional insert molding method of the wiring board according to the description. 3. The molded product of claim 1, wherein the primary molded product is an insert molded product of a wiring member holding the primary molded product.
The three-dimensional insert molding method of the wiring board according to the description.