JP3323507B2 - High-density electrical interconnect system - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to pluggable electrical interconnect systems, and more particularly, to pluggable electrical interconnect systems using a method of connecting and aligning interconnect systems and interconnect components with one another. Regarding the connect component. Although the electrical interconnect system of the present invention is particularly suited for use in connecting high density systems, it can also be used in high power systems or other systems.

2. Related Art Electrical interconnect systems (including electronic interconnect systems) are used to interconnect electrical and electronic systems and components. Generally, electrical interconnect systems include both protruding interconnect components, such as conductive pins, and receptive interconnect components, such as conductive sockets. In these types of electrical interconnect systems, electrical interconnection is achieved by inserting a raised interconnect component into a receiving interconnect component. Such insertion causes the conductive portions of the protruding and receiving interconnect components to come into contact with each other, such that electrical signals are transmitted through the interconnect components. In a typical interconnect system (eg, the grid array of FIG. 31 described below),
The plurality of individual conductive pins are arranged in a grid form,
Multiple of the individual conductive sockets (not shown in FIG. 31)
Arranged to receive individual pins, each pin and socket pair carries a different electrical signal.

Dense electrical interconnect systems are characterized by including a large number of interconnect component contacts in a small area. By doing this,
Higher density electrical interconnect systems can include shorter signal paths with less space than less dense interconnect systems. Short signal paths connected by high-density interconnect systems allow electrical signals to be transmitted at higher speeds. In general,
The higher the density of the electrical interconnect system, the better the system.

Various attempts have been made in the past to create electrical interconnect systems having reasonably high densities.
One of the proposed electrical interconnect systems is shown in FIG.
It is shown in FIG. The electrical interconnect system of FIG. 1A is known as a pillar-box interconnect system. In the system of FIG.
The protruding interconnect component is a conductive pin or pillar 10
1 and the receptive interconnect component is a conductive socket 102 in the form of a box. FIG. 1 (b) is a top view of the interconnect system of FIG. 1 (a), showing the post 101 received in the socket 102. FIG.
As can be seen from (b), the inner wall of socket 102 includes inwardly protruding portions 103 and 104 such that posts 101 in the socket fit closely together. Here, FIGS. 1 (a) and 1 (b)
Are referred to as “FIG. 1”.

Another proposed electrical interconnect system is shown in FIG. The electrical interconnect system of FIG. 2A is known as a single rod interconnect system. In the system of FIG. 2 (a), the protruding interconnect component is a conductive pin or column 201, and the receiving interconnect component is a conductive flexible rod 202.
It is. FIG. 2 (b) is a top view of the interconnect system of FIG. 2 (a), showing a column 201 placed in contact with a flexible rod 202. FIG. The flexible rod 202 is biased against the column 201 to maintain contact between the rod and the column. Here, FIGS. 2A and 2B are both referred to as “FIG. 2”.

FIG. 3 shows a third proposed electrical interconnect system.
(A). The electrical interconnect system shown in FIG. 3A is known as an edge connector system. The protruding interconnect components of the edge connector system include an insulating printed circuit board 300 and a conductive pattern 91 formed on the upper and / or lower surface of the printed circuit board. The receptive interconnect components of the edge connector system include a set of upper and lower conductive fingers 302 between which the printed circuit board 300 can be plugged.

FIG. 3 (b) is a side view of the system shown in FIG. 3 (a), showing a printed circuit board 300 inserted between the upper and lower conductive fingers 302. FIG. When the printed circuit board 300 is inserted between the conductive fingers, each conductive pattern 301 has a corresponding conductive finger so that a signal is transmitted between the conductive pattern and the conductive finger. Touch 302. Here, FIGS. 3A and 3B are both referred to as “FIG. 3”.

FIG. 4 shows the proposed fourth electrical interconnect system.
Shown in The electrical interconnect system shown in FIG. 4 is known as a pin and socket interconnect system. In the system of FIG. 4, the protruding interconnect component is a conductive push pin 401, and the receiving interconnect component is a conductive grooved socket 402. Socket 402 is typically mounted in a through hole formed in a printed circuit board. The pin 401 has a larger size than the space in the socket 402. The difference in the size of the space and spacing between pin 401 and socket 402 is such that the pin fits securely in the socket.

The interconnect system in FIGS. 1-4 is inadequate for various reasons. A major problem with the interconnect systems in FIGS. 1-4 is that these systems are not sufficiently high in density to meet the needs of existing and / or future semiconductor and computer technologies. With interconnect system densities already stalling the pace of semiconductor technology, and with space efficiency becoming increasingly important, as computer and microprocessor speeds continue to climb, electrical interconnect systems become denser, Higher pin counts will be required. The above-mentioned electrical interconnect system has a problem in that a current lacking portion and an interconnect density and the number of pins need to be considered.

In addition, the interconnect components in the system of FIGS. 1-4 generally have plating on their respective outer and inner surfaces to ensure proper electrical contact between the protruding and receiving components. Including doing.
Since plating is typically accomplished using gold or other expensive metals, the systems in FIGS. 1-4 can be very costly to produce.

Considering performance, the grid arrangement generally associated with FIGS. 1 and 2 is not dense enough to provide an adequate number of grounded contacts, and thus signal transmission problems may result. Further, the edge connector system of FIG. 3 is subject to capacitance problems and electromagnetic interference. Similarly, the pin and socket system of FIG. 4 requires a high insertion force to insert the pin 401 into the grooved socket 402 and will not fit accurately due to the lack of close tolerance.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a high density electrical interconnect system that can meet the needs of existing and considered computer and semiconductor technologies.

It is another object of the present invention to provide a less valuable and more efficient electrical interconnect system than existing high density electrical interconnect systems. Higher density and lower cost will also add better functionality and performance, and will also mean that more pins can be used.

Yet another object of the present invention is to provide an electrical interconnect system in which high densities can be achieved through the use of electrical interconnect components arranged in a nested configuration or the like.

These and other objects can be achieved by using the following electrical interconnect system. The interconnect system includes a first holding element, a first array, a second holding element, and a second array. The first array is a group of a number of electrically conductive contacts disposed on the first holding element, wherein the first group of the arrays has at least one contact of each group facing outward. And arranged to include a front surface spaced apart from the other one of the first array group by a side surface of the contact first along the line. The second array is a group of a number of electrically conductive contacts disposed on the second holding element, the second group of arrays having at least one contact of each group facing outward. And arranged to include a front surface spaced apart from the other one of the second group of arrays by a side surface of the contact firstly. Each group of contacts from the first array refers to a corresponding one of the group of contacts from the second array.

Such an object consists of a holding element and an array, wherein the array is a group of a large number of electrically conductive contacts arranged on the holding element, wherein the group of the array is such that at least one contact of each group has at least one contact. An electrical interconnect system arranged to include a front surface facing outward and spaced apart from the other one of the second group of arrays along a line initially traversed by a side surface of the contact. Can also be achieved by using

A method of making and using an electrical interconnect system having features as described above can be implemented to achieve the foregoing objectives.

It is to be understood that both the foregoing summary and the following detailed description are exemplary, explanatory and are not restrictive of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which form a part of and cooperate with the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 (a) is a perspective view showing a conventional electric interconnect system before being turned on.

FIG. 1B is a top view showing the conventional electrical interconnect system shown in FIG.

FIG. 2A is a perspective view showing another conventional electric interconnect system.

FIG. 2B is a top view showing the conventional electrical interconnect system shown in FIG. 2A.

FIG. 3A is a perspective view showing another conventional electric interconnect system.

FIG. 3B is a side view showing the conventional electrical interconnect system shown in FIG.

FIG. 4 is a perspective view showing another conventional electrical interconnect system before being turned on.

FIG. 5 (a) is a perspective view of a part of a projection-type interconnect component according to an embodiment of the present invention.

FIG. 5B is a side view of the dependent wall portion of the projection-type interconnect component shown in FIG.

FIG. 5 (c) is a side view of two of the protruding interconnect components shown in FIG. 5 (a).

FIG. 6 is a perspective view of a conductive pillar that can be used in the electrical interconnect system of the present invention.

FIG. 7 is a perspective view of another conductive pillar that can be used in the electrical interconnect system of the present invention.

FIG. 8 is a perspective view of a conductive column according to the present invention having round legs.

FIG. 9 is a perspective view of a conductive column according to the present invention having legs set to connect with round wires or cables.

FIG. 10 is a perspective view showing the protruding interconnect components located on a substrate arranged at right angles to the interface device.

FIG. 11 (a) is a perspective view showing some protruding interconnect components located on a substrate arranged at right angles to the interface device.

FIG. 11 (b) is a diagram showing a pattern in which the projections are connected to the legs of the right-angled electrical interconnect components alternately.

FIG. 12 (a) is a perspective view of a protruding electrical interconnect component according to another embodiment of the present invention.

FIG. 12 (b) is a perspective view of a projection type electrical interconnect component according to yet another embodiment of the present invention.

FIG. 13 (a) is a perspective view of a protruding electrical interconnect component according to yet another embodiment of the present invention.

FIG. 13 (b) is a perspective view of the projection type electrical interconnect component according to the embodiment shown in FIG. 5 (a) and the projection type interconnect component according to another embodiment of the present invention.

FIG. 13 (c) is a perspective view showing a part of one of the protruding electrical interconnect components shown in FIG. 13 (b), with the tip removed.

FIG. 14 is a perspective view of a conductive rod of a receiving-type interconnect component according to an embodiment of the present invention.

FIG. 15 is a perspective view showing an example of a conductive rod that can be used in the electric interconnect system of the present invention.

FIG. 16 is a perspective view of a plurality of flexible rods of a receptive interconnect component each having a wire or cable interface leg.

FIG. 17 is a perspective view of an interconnect system including a plurality of flexible rods arranged to be connected by wires or cables.

FIG. 18 is a perspective view of receptive interconnect components having different length rods.

FIG. 19 is a perspective view of a portion of the protruding interconnect component received in the conductive rod of the receptive interconnect component.

FIG. 20 is a side view of a protruding interconnect component received in a receptive interconnect component.

FIG. 21 is a perspective view of a portion of a protruding interconnect component having conductive pillars that differ in overall height.

FIG. 22 is a perspective view of several protruding interconnect components having different overall heights.

FIG. 23 (a) is a perspective view of a first type of component having a low insertion force or zero insertion force in the first state.

FIG. 23B is a perspective view of a component having a low insertion force or zero insertion force in the second state.

FIG. 23 (c) is a perspective view of a first type of low or zero insertion force component using straight members.

FIG. 24 (a) is a perspective view of a second type of component having low insertion force or zero insertion force in the first state.

FIG. 24B is a perspective view of the components of FIG. 24A with a low insertion force or zero insertion force in the second state.

FIG. 24 (c) is a perspective view of a second type of low or zero insertion force component using straight members.

FIG. 25 (a) is a perspective view of a third type of component having low insertion force or zero insertion force in the first state.

FIG. 25 (b) is a perspective view of the low insertion force or zero insertion force component of FIG. 25 (a) in the second state.

FIG. 26A is a perspective view of the interconnect system including the interconnect components of FIG.

FIG. 26B is a perspective view of the interconnect system including the interconnect components of FIG.

FIG. 27A is a perspective view of the interconnect system including the interconnect components of FIG.

FIG. 27B is a perspective view of another interconnect system including the interconnect components of FIG.

FIG. 27C is a perspective view of the interconnect system including the interconnect components of FIG.

FIG. 28 (a) is a perspective view of an electrical interconnect system using a hybrid interconnect component before being numbered.

FIG. 28 (b) is a perspective view of the conductive contacts of the hybrid interconnect component before being numbered.

FIG. 29 (a) is a perspective view of a projection-type interconnect component according to the present invention.

FIG. 29 (b) is a plan view of a projection-type interconnect component according to the present invention.

FIG. 30 (a) is a perspective view of an electrical interconnect system showing an insulating electrical carrier that functions as a substrate for the system.

FIG. 30 (b) is a perspective view of another electrical interconnect system showing an insulating electrical carrier that functions as a substrate for the system.

 FIG. 31 is a plan view of a conventional grid array.

FIG. 32 is a diagram illustrating a nested arrangement of electrical interconnect components according to the present invention.

FIG. 33 (a) is a diagram showing the arrangement of the electrical interconnect components according to the present invention.

FIG. 33 (b) is a diagram showing the arrangement of the electrical interconnect components according to the present invention.

FIG. 34 shows the electrical interconnect components arranged according to the nested arrangement shown in FIG.

FIG. 35 illustrates a modified arrangement of electrical interconnect components according to the present invention.

FIG. 36 is a diagram showing electrical interconnect components arranged according to the modified arrangement shown in FIG.

FIG. 37 shows the electrical interconnect components arranged according to the modified arrangement shown in FIG.

FIG. 38 shows the electrical interconnect components arranged according to the modified arrangement shown in FIG. 35.

FIG. 39 illustrates a discontinuous arrangement of electrical interconnect components according to the modified arrangement of the present invention shown in FIG.

FIG. 40 illustrates a pattern on a printed circuit board suitable for use connected to a discontinuous arrangement of electrical interconnect components according to the present invention.

FIG. 41 (a) is a diagram illustrating the arrangement of the electrical interconnect components according to the nested arrangement of FIG. 32, modified to include a space at the center thereof.

FIG. 41 (b) is a diagram showing the arrangement of the electrical interconnect components according to the modified arrangement of FIG. 35 which has been modified to include a space at the center thereof.

FIG. 42 is a diagram showing the arrangement of electrical interconnect components according to the modified arrangement of FIG. 35 modified to include a space at the center thereof.

FIG. 43 is a diagram showing the arrangement of the electrical interconnect components according to the modified arrangement of FIG.

FIG. 44 illustrates a modified arrangement of receptive electrical interconnect components according to the present invention.

FIG. 45 is a plan view of a nested arrangement of protruding electrical interconnect components according to the configuration of FIG. 12 (a).

FIG. 46 is a plan view of the arrangement of the projection type electrical interconnect components according to the configuration of FIG.

FIG. 47 is a plan view of a nested arrangement of protruding electrical interconnect components according to the configuration shown in FIG. 13 (c).

FIG. 48 (a) is a perspective view of the arrangement of the projection type electrical interconnect components according to the configuration shown in FIG. 12 (b).

FIG. 48 (b) is a plan view of the arrangement of the projection type electrical interconnect components according to the configuration shown in FIG. 12 (b).

FIG. 48 (c) is a plan view of the arrangement of the projection type electrical interconnect components according to the configuration shown in FIG. 12 (b).

FIG. 48 (d) is a plan view of the arrangement of the projection type electrical interconnect components according to the configuration shown in FIG. 12 (b).

FIG. 49 is a side view of a conductive rod having an offset contact portion.

FIG. 50 (a) is a side view of an electrically conductive column having aligned stable portions and legs.

FIG. 50 (b) is a side view of a conductive column having offset legs.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Overview The electrical interconnect system of the present invention includes a plurality of conductive contacts arranged in groups, each group being interleaved among other groups of contacts of the electrical interconnect system, or It can be nested, forming a group arrangement of interleaved or nested contacts. Groups of contacts may be placed in an interleaved and nested arrangement such that the groups are arranged in rows and columns, and groups of adjacent rows of the arrangement are offset from adjacent columns of the arrangement. Staggered, the groups are interleaved with one another in a nested configuration such that a portion of each group overlaps in adjacent rows of the group or adjacent columns of the group. Further, the groups of contacts are arranged such that at least each group of contacts includes a front surface facing outwardly and spaced apart from one of the other groups along a line originally traversed by a side surface of the contact. Have been.

Each group of conductive contacts is configured such that a conductive portion of the protruding interconnect component is received in a corresponding receptive interconnect component, the receptive interconnect component comprising a plurality of conductive rods. Including, or alternatively, each group of conductive contacts is adapted to form a conductive portion of a receptive interconnect component configured to receive a corresponding protruding interconnect component. . When the protruding interconnect component is received in the corresponding receptive interconnect component, the conductive rod will be referred to as a conductive column.

Protruding Interconnect Component The protruding interconnect component of the present invention includes a number of electrically conductive posts secured to an electrically insulating substrate. The use of an insulating barrier is optional, although the protruding interconnect component may also include an electrically insulating barrier around which the conductive post is placed. The substrate and the barrier isolate the conductive columns from each other such that different electrical signals are transmitted over each column.

FIG. 5 (a) is a perspective view of a portion of a projection-type interconnect component 10 according to an embodiment of the present invention. The protruding interconnect component includes several conductive pillars 11. The protruding interconnect component may be used in the embodiment of FIG. 5 (a), although the use of a barrier is not required as described above.
An insulating barrier 12 may be included. The conductive pillar and the barrier (when used) are attached to the insulating substrate 13. The conductive pillars are electrically isolated from each other by the substrate 13 and the barrier 12 (when used).

FIG. 5B is a side view of the wall 12 and the insulating substrate 13. The wall 12 and the substrate 13 can be integrally formed from one unit of an insulating material. Preferably, the material of the wall and substrate is an insulating material that does not shrink when formed, such as VE, a trademark of Hoescht Celanese.
Polymer liquid crystal such as CTRA). The conductive pillar 11 is shown in FIG.
(B) Substrate through hole in substrate indicated by dotted line
Inserted into 13, or alternatively, the substrate may be formed around the pillars using an insert molding method.

As can be seen from FIG. 5 (b), the wall 12 includes an elongated portion 14 having a rectangular cross section (eg, a square), and the tip portion 15 is located at the apex of the elongated portion. FIG. 5 (b)
The dimensions of the walls shown in FIG. 1 are exemplary, so other dimensions for wall 12 may be used. For example, the transverse section of the wall 12 is more preferably 0.5 mm x 0.5 mm than 0.9 mm x 0.9 mm.

Each conductive column 11 is a contact portion, a stabilizing portion, and a leg portion including three portions. In FIG. 5A, the contact portion of each conductive pillar is shown at a position adjacent to the wall 12.
Stabilizing part (not shown in FIG. 5 (a) or FIG. 5 (b))
Is a part of each pillar fixed to the substrate 13. The legs (not shown in FIG. 5 (a) or 5 (b)) extend from the side of the substrate opposite the contact portions. The conductive pillar has a rectangular (eg, square) or triangular, semi-circular cross section, or any other cross section.

The three portions of each conductive column 11 are clearly shown in FIG. 5 (c), which is a side view of the two projecting interconnect components 10 secured to the substrate 13. In FIG. 5 (c), reference numeral 17 indicates a contact portion of each conductive column 11, reference numeral 18 indicates a stabilizing portion of each conductive column, and reference numeral 19 indicates a portion of each conductive column. Show the legs. When the protruding interconnect component 10 is received in the corresponding receptive interconnect component, electrical signals are transmitted from each leg of the conductive post 11 through the stabilizing portion and the contact portion to the receptive interconnect component. Transmitted to the element, and vice versa.

Each conductive pillar 11 is made of beryllium copper, phosphor bronze, brass,
It can be formed of copper alloy, tin, gold, palladium, or any other suitable metal or conductive material. In a preferred embodiment, each conductive pillar 11 is beryllium copper, phosphor bronze,
Made of brass or copper alloy, or plated with tin, gold, palladium or nickel, or
It is formed of a material containing at least two of tin, gold, palladium and nickel. The entire surface of each pillar is plated, or just selected portions 16 (see, eg, FIG. 5 (a)), ie, when the protruding interconnect components are received in the receptive interconnect components. Corresponding portions of the conductive pillar 11 that contact the conductive rod can be plated.

The conductive pillar 11 used in the electrical interconnect system of the present invention is shown in FIG. The post 11 in FIG. 6 is a non-offset or straight post, and the surfaces A and B of the contact portion 17 and the stabilizing portion 18 are oriented closer to the interior of the projecting interconnect component for column alignment. It is so called because it faces (ie, A and B are coplanar).

Another conductive pillar that can be used in the electrical interconnect system of the present invention is shown in FIG. The conductive column 11 in FIG. 7 is called an offset column. This is because the surface A of the contact portion 17 facing inward of the protruding interconnect component is offset in the inward direction as compared to the surface B of the stabilizing portion 18 due to its column. FIG.
In the column 11, the surfaces A and B are not coplanar.

The offset pillars of FIG. 7 reach very high densities and are used when the dependent interconnect 12 of the protruding interconnect component 10 is very small or the protruding interconnect component does not include a dependent wall. In other cases, FIG.
A straight pillar is used.

Each of the different portions of each conductive column 11 performs a different function. The contact portion 17 establishes contact with the conductive rods of the receptive interconnect component when the protruding and receptive interconnect components are turned on. The stabilizing portion 18 secures the conductive pillars to the substrate 13 during handling, counting and manufacturing. Stabilization part 18
Has dimensions that allow the column to be fixed to the substrate 13 with an appropriate portion of the insulating substrate between adjacent conductive columns. The legs 19 connect to interface devices (eg, semiconductor chips, printed circuit boards, wires, or round, flat, or flexible cables) by using the electrical interconnect system as an interface. The contacts and legs may be aligned or offset with respect to the stabilizing portion to obtain the advantages described below.

The configuration of the legs 19 of each conductive column 11 depends on the type of device with which the legs interact. For example, leg 19
Will have a round configuration (FIG. 8) if connected by through holes in a printed circuit board. The legs 19 would be arranged as in FIG. 5 (c) if they were to be connected to a printed circuit board through surface mount technology (SMT). If connected by round cables or wires, the legs 19 can be configured as in FIG. Other configurations may be used depending on the device type with which the legs 19 interact.

FIG. 10 shows the configuration of the legs 19 of the conductive pillar surface-mounted on the printed circuit board 20. As shown in FIG. 10, the board 13 may be arranged at right angles to the printed circuit board 20. This can increase space efficiency and facilitate cooling of components on the control panel and / or shorten various signal paths. Although not explicitly shown in FIG. 10, the substrate 13 may be positioned at right angles with respect to the device with which the legs interact (eg, a flexible cable or a round cable), regardless of the nature of the device.
As can be seen from FIG. 10, such an arrangement requires the legs 19 to be adapted at right angles at the leg points 21. The corners of the points 21 and / or the legs 19 near the printed circuit board 20 can be sharp, as shown in FIG. 10, or one or both of the corners can be gentle or curved. .

FIG. 11 (a) illustrates the desired variety of legs 19 when several protruding electrical interconnect components 10 are mounted on a board 13 oriented at right angles to an interface device (eg, a printed circuit board 20). Show the arrangement. FIG.
According to (a), each leg 19 extends perpendicularly out of the surface of the substrate 13 and is then directed at the surface of the interface device at point 21 of that leg. The leg 19 is oriented such that the leg contacts the interface device in three separate rows (ie, FIG. 1 (a) and FIG.
11 (b), rows C, D and E).

FIG. 11 (b) is a diagram showing a state where three interconnect components are arranged in two rows, and the legs 19 of such components are arranged in three rows (C , D and E). As shown in FIG. 11B, the legs 19 of the alternately projecting interconnect components 10 are connected to the pads 22 of the interface device in a "2-1-1" and "1-2-1" pattern. are doing.
The alternating "2-1-1" and "1-2-1" patterns place the legs in three rows (C, D and E), thereby reducing signal path length, increasing speed, and If the wall is used, a right angle configuration saves space in two rows.

It should be noted that one or more rows of interconnect components (eg, two additional rows) may be located on substrate 13 rather than just two rows shown in FIG. If two additional rows of interconnect components are placed above the two rows of component 10 shown in FIG. 11 (a), for example, the legs of the additional components would be two lower rows Interface device 20 that extends exactly on the legs of the next and is then exactly the same as the legs of the two lower rows
You can turn to The alternating pattern formed by the additional legs can be exactly the same as the alternating pattern shown in FIG. 11 (b), but can be located farther away from the substrate 13 than the lower two rows of pattern.

FIG. 12 (a) shows an alternative embodiment, which reveals that the protruding component 10 can include a cruciform dependent wall 12 surrounded by a plurality of conductive pillars 11. FIG. In FIG. 12A, the legs 19 of each conductive column 13 are shown.
Is configured to be surface mounted on a printed circuit board (not shown in FIG. 12 (a)) having a board 13 placed parallel to the surface of the board. Although 12 conductive pillars are shown in FIG. 12 (a), for the vertical surface of each wall 12 more or less than 12 conductive pillars may be arranged around the wall. . 12 (a) is essentially the same as that shown in FIG. 5 (a), except for the arrangement and number of the conductive pillars and the shape of the wall. Thus, as in the embodiment of FIG. 5 (a), the protruding electrical interconnect component of FIG. 12 (a) can be used without the wall 12.

FIG. 12 (b) shows another alternative interconnect component 10 in which the wall 12 is H-shaped. In this embodiment, the two opposing ones of the columns 11 are closer than the two opposing ones of the other columns. Although four conductive pillars are shown in FIG. 12 (b), more or less than four pillars may be placed around the wall. Fig. 12 (b), except for the arrangement and number of conductive pillars and the shape of the wall
Are essentially the same as those shown in FIG. 5 (a). Therefore, the protruding interconnect components of FIG. 12 (b) can be used without barriers.

FIG. 13 (a) shows an alternative embodiment of yet another protruding component, in which the tip of the wall 12 has two inclined surfaces instead of four inclined surfaces and each conductive Has the same width as the side of the wall 12. Except for the number and width of the conductive pillars surrounding the wall 12 and the shape of the tip, the protruding electrical interconnect components are essentially the same as those shown in FIG. Thus, although two conductive pillars are shown in FIG. 13 (a), more or less than two conductive pillars may be placed around the wall 12. Further, FIG.
As in the embodiment of (a), the protruding interconnect components of FIG. 13 (a) can be used without barriers. Similarly, the width of each conductive column 12 can be larger or smaller than the width of the side wall of the support wall.

The left part of FIG. 13 (b) shows the projection type interconnect component 10 according to the embodiment of the present invention shown in FIG. 5 (a).
The right part of FIG. 13 (b) shows a projecting interconnect component 10 according to another embodiment of the present invention.

FIG. 13 (c) shows a part of the distal end portion from which a part of the right component has been removed. The interconnect component of FIG. 13 (c) contains contact portions each having a triangular cross section with several conductive pillars 11. The interconnect components of FIG. 13 (c) may include a dependent wall 12 having a substantially cross-shaped, X-shaped or H-shaped cross section, although the dependent walls may be eliminated if necessary. . FIG.
The embodiment of (c) allows close space between the pillars 11 and makes it possible to use the reduced thickness of the wall 12 as compared to the wall which can be used in other embodiments of the present invention. it can.

The protruding interconnect components shown in the figures are illustrative of the types of interconnect components that can be used in the electrical interconnect system of the present invention. Other protruding interconnect components are contemplated.

Receptive Electrical Interconnect Component The receptive electrical interconnect component of the present invention includes several electrically conductive rods secured to an insulating substrate. The receiving electrical interconnect component is configured to receive a corresponding protruding electrical interconnect component in the space between the conductive rods. The substrate insulates the conductive rods from each other such that different electrical signals are transmitted over each rod.

FIG. 14 illustrates a portion of the receptive interconnect component 30 according to an embodiment of the present invention. The receiving component 30 comprises several electrically conductive flexible rods 31 secured to an electrically insulated substrate (not shown in FIG. 14). Preferably,
The substrate material is an insulating material that does not shrink during formation (eg, a polymer liquid crystal such as VECTRA, a trademark of Hoechst Celaness). The portions of the conductive rod 31 bend away from each other and receive the protruding interconnect components in the space between the portions of the conductive rod.

Each conductive rod may be formed of the same material used to make the conductive columns 11 of the protruding electrical interconnect component. For example, each conductive rod 31 is beryllium copper,
It can be formed of phosphor bronze, brass, copper alloy, tin, gold, palladium, or any other suitable metal or conductive material.
In a preferred embodiment, each conductive rod 31 is formed of beryllium copper, phosphor bronze, brass, or a copper alloy, or plated with tin, gold, palladium, or nickel, or tin, gold, It is formed of a material containing at least two of palladium and nickel. Each rod 31
The entire surface of the conductive rod 31 is plated or corresponding to the selected portion, i.e., the conductive rod 31 that contacts the conductive column when the protruding interconnect component is received in the receptive interconnect component. To be plated can be plated.

An example of the conductive rod 31 used in the electrical interconnect system of the present invention is shown in FIG. Referring to FIG. 15, each conductive rod 31 of the present invention includes three parts, a contact part 32, a stabilizing part 33, and a leg 34.

The contact portion 32 of each conductive rod 31 contacts the conductive column of the corresponding protruding receiving component when the protruding receiving component is received within the corresponding receiving interconnect component. . The contact portion 32 of each conductive rod includes an interface portion 35 and a retracted portion 36. The interface part 35 is
The portion of the conductive portion 32 that contacts the conductive column when the protruding and receiving interconnect components are turned on. The retraction portion 36 includes a sloped surface that, when the tip of the dependent wall of the projecting interconnect component contacts,
(Or, when the wall is not used, contacting one or more pillars of the protruding interconnect component), during which time the conductive rod begins to separate.

The stabilizing portion 33 is firmly fixed to a substrate holding the conductive rod 31 (for example, the substrate 37 in FIG. 17). The stabilizing portion 33 of each conductive rod prevents the rod from becoming entangled or displaced during handling, turning, and production. The stabilizing portion 33 is dimensioned to allow a suitable portion of the insulating substrate to be present between adjacent conductive rods and to lock the rods within the substrate.

The legs 34 are very similar to the legs 19 of the conductive post 11 described with respect to the protruding interconnect component 10.
Like leg 19, leg 34 connects to an interface device (eg, a semiconductor chip, printed circuit board, wire, or round, flat, or flexible cable) by using an electrical interconnect system as an interface. .

Like leg 19, the configuration of leg 34 depends on the type of device interacting. Possible configuration of leg 34 is leg 19 on top
Is the same as the possible configuration described above. For example, FIG.
And FIG. 17 shows the configuration of the legs 34 used in interfacing with a round cable or wire 35, and in particular, FIG. Element 30 is shown having a conductive rod 31 secured to an insulative substrate 37 and having legs 34 of each rod arranged for connection by a round wire or cable 35.

Like leg 19, leg 34 may be bent at right angles in situations where the substrate of the receptive interconnect component is positioned at right angles with respect to the interface device interacting with leg 34. The contacts and legs of each conductive rod can be aligned or offset with respect to the stabilizing portion to provide the advantages described below.

FIG. 18 illustrates another embodiment of the receptive interconnect component 30. As in the embodiment of FIG. 14, the receptive interconnect component 30 includes several electrically conductive flexible rods. However, in the embodiment of FIG. 18, the contact portion 32a for two rods is longer than the contact portion 32b for the other two rods.

It should be noted that the configuration of the receiving component depends on the configuration of the protruding interconnect component or vice versa. For example, if the protruding interconnect component includes a cruciform shaped wall surrounded by conductive columns, the receiving component is configured to receive that type of protruding interconnect component. Should be.

Engagement of Interconnect Components FIG. 19 shows the protruding interconnect component 10 received within the conductive rod of the receptive interconnect component 30. When a protruding interconnect component is received in this manner within a receptive interconnect component, such interconnect components are said to be numbered or plugged together. The protruding and receptive interconnect components, when turned, allow the contact portion 32 of the conductive rod to be turned.
Bends and expands to receive the protruding interconnect components in the space between the contact portions of the conductive rod.

The numbered position shown in FIG. 19 is reached by the protrusion interconnect component 10 and the receptive interconnect component 30 moving toward each other in the direction of arrow Y shown in FIG. In the turned position, the contact portion of each conductive rod exerts a standard force on the corresponding one of the conductive columns in a direction in the plane XZ. In FIG. 19, arrow Y is perpendicular to plane XZ.

The process of turning the protruding interconnect component 10 to the corresponding receptive interconnect component 30 is illustrated in FIG.
14, FIG. 15, FIG. 19 and FIG. 20 will be described later. FIG. 20 shows exemplary dimensions for the interconnect components. Other dimensions may be used. FIGS. 5 (a) and 14 show the state of the corresponding receptive interconnect component 30 prior to being referred to as the protruding interconnect component 10. FIG. As can be seen from FIG. 14, the contact portion of the rod of the receptive interconnect component
32 clustered together before calling them projective interconnect components. By such a grouping, a contact can be involved between two or more rods.

Next, the protruding and receptive interconnect components are
They are moved towards each other in the direction of arrow Y shown at 19. After all, the retracting part 36 of each conductive rod 31 (FIG. 15)
Comes into contact with the tip of the wall 12 (when used). While there is further relative movement of the interconnect components towards each other, the beveled configuration of the tips begins to disperse the contact portions 32 of the conductive rods. Due to the inclined upper surface of the conductive column 11 of the projecting component, the contact portion 32
Expansion occurs with additional relative movement between interconnect components. Such an extension would result in the conductive rod 31 being in the fully engaged position (FIGS. 19 and 20).
Exerts a standard force on the eleventh, thereby ensuring a reliable electrical contact between the rod and the pillar. In FIG. 20, the solid line is used to show the state of the conductive rod at the aligned position, while the dotted line shows the conductive rod before the alignment. It should be noted that the initial expansion of the contact portion 32 is caused by one or more pillars 11 of the protruding interconnect component, rather than by the cliff tip, when the cliff is not used.

The insertion force required to turn the protruding interconnect component 10 into the receiving interconnect component 30 is:
It is highest in that it corresponds to the early stage of expansion of the conductive rod 31. The next insertion force is lower because it is related to the action of the frictional force rather than the expanding force. The insertion force required to number the protruding interconnect component within the receptive interconnect component can be reduced by using a protruding interconnect component having conductive posts of varying height. (And one or more interconnects may be completed and provided before one or more other interconnects). An example of such a protruding interconnect component is shown in FIG.

As seen in FIG. 21, the conductive columns 11 are set such that one pair of opposing columns has a first overall height and the other pair of opposing columns has a second overall height. it can. In essence, the configuration of FIG. 21 raises initial insertion force peaks at different times so that the required insertion force is gradually spread over a longer period of time as the dialing stroke is performed. Can be divided into different components.

FIG. 22 shows another way in which the required insertion force can be extended over time as the clock (and the programmed engagement is provided). Figure
Referring to 22, the protruding interconnect components 10 in different rows can be started with different rows of interconnect components at different times as they are referred to.
Has different overall heights. For example, the rows may be alternatively raised and lowered instead of the overall height, or the overall height of the row may be gradually increased with each row. Similarly, components in a given row may have different overall heights. Furthermore, the figure
The embodiments of FIGS. 21 and 22 can be combined so that different rows of interconnect components reach different embodiments in overall height, and the conductive columns of interconnect components in each different row. Also differ in overall height. Similarly, the conductive rod 31 or the contact portion 32 of each receptive interconnect component can be varied in length as in FIG. 18 to reduce insertion force, i.e., maintain an appropriate standard force to supply Considered programmed engagement can be provided.

Expansion of the conductive rod 31 between the locking engagements wipes off the rocks and wipes off the surface of the pillar 11, the wall 12 (if used) and other contaminants on the rod 31. Perform a cleaning function to leave. Such a cleaning action provides a more reliable electrical interconnection between the energized conductive elements and the formation of a larger contact area.

The insertion force can be essentially completely eliminated using a zero insertion force-receiving interconnect component. FIG. 23 (a), 23
(B) and 23 (c) (collectively FIG. 23) show a first type of zero insertion force component 50, FIGS.
(B) and 24 (c) (collectively FIG. 24) show a second type of zero insertion force component 60. The zero insertion force component and the very low insertion force component are particularly important, the latter being described below. This is because, as the number of contacts increases, the insertion force required for the mating engagement is desirably reduced or eliminated.

23 (a) and 23 (b), the zero insertion force interconnect component 50 includes a plurality (eg, four) conductive rods 51 carried by an insulating substrate 52. The interconnect component 50 also includes a movable substrate 53 and a dumpling member 54 secured to the movable substrate. The movable substrate can be manipulated manually or by machine. Similarly, the dumpling member may be replaced by a straight member without a sphere, as shown in FIG.

FIG. 23A shows the initial state of the interconnect component 50. Prior to the mating engagement of interconnect component 50 and the protruding interconnect component, movable substrate 53 is
Moved upward as shown in FIG.
Expands to a greater distance than the protruding component that the conductive rod 51 is numbered. Conductive rod 51 before turning engagement
By extension, the insertion force normally associated with insertion of the protruding interconnect component is essentially eliminated. Dumpling member 54 retracts to its initial position in response to the insertion of the protruding interconnect component, i.e., under the control of another machine device, such as a cam, thereby causing the rod of the receiving interconnect component to move. release.

The component 50 in FIG. 23 can be modified such that the member 54 does not completely expand the conductive rod 51 before receiving the protruding interconnect component. This improvement provides a system that requires only a very low insertion force before the locking engagement in which the rod 51 is only partially expanded, while at the same time exerting the ability to clean. You. This cleaning ability cleans the contact surfaces and ensures good contacts.

With reference to FIGS. 24 (a) and 24 (b), the zero insertion force interconnect component 60 includes a plurality (eg, four) conductive rods 61 carried by an insulating substrate 62. The interconnect component 60 also includes the movable substrate 63 and a dumpling member 64 secured to the movable substrate. The movable substrate can be manipulated manually or by machine. Similarly, the dumpling member may be replaced by a straight member without a sphere, as shown in FIG.

The zero insertion force interconnect component of FIG. 24 is provided with an opening in a fixed substrate 62 to allow a movable substrate 63 to allow movement of a dumpling member 64 therein. This is essentially the same as the components shown in FIG. 23, except that it is located below a fixed substrate 62.

FIG. 24A shows the initial state of the interconnect component 60. Prior to the mating engagement of the interconnect components 60 and the protruding interconnect components, the movable substrate 63 is
Moved upward as shown in FIG.
Expands to a greater distance than the protruding component that turns the conductive rod 61. Conductive rod 61 before turn engagement
By extension, the insertion force normally associated with insertion of the protruding interconnect component is essentially eliminated. Dumpling member 64 retracts to its initial position in response to insertion of the protruding interconnect component, i.e., under the control of another machine device, such as a cam, thereby causing the rod of the receptive interconnect component to move. release.

The component 60 in FIG. 24 can be modified so that the member 64 does not completely expand the conductive rod 61 before receiving the protruding interconnect component. With this modification, only a very low insertion force is required before the buckling engagement, in which the rod 61 is only partially expanded. On the other hand, at the same time, a system is provided which exerts its cleaning ability. This cleaning ability cleans the contact surfaces and ensures good contacts.

FIGS. 25 (a) and 25 (b) (collectively FIG. 25) show a third type of zero insertion force interconnect system 70 or very low insertion force interconnect system 70. FIG. In the system of FIG. 25, the raised interconnect component 10 includes several (eg, three) conductive posts 11 secured to an insulating substrate 13 and the receiving component 30 includes Some (eg 3) conductive rods fixed to 37
Including 31. 25 (a) and 25 (b), left-handed pillar 11
Are from the protruding interconnect components other than the protruding interconnect components cooperating with the remaining pillars of FIGS. 25 (a) and 25 (b). Similarly, FIGS. 25 (a) and 25
The rod 31 to the left in (b) is shown in FIGS. 25 (a) and 25 (b).
From the receptive interconnect components other than the receptive interconnect components cooperating with the remaining rod.

FIG. 25 (a) shows an interconnect system between the steps being numbered, and FIG. 25 (b) shows the interconnect system in the numbered state. Through the use of the system of FIG. 25, the lock engagement is performed as follows. First, substrate 13
And the substrate 37 are moved toward each other on the X plane until the state shown in FIG. Next, as shown in FIG. 25 (b), the substrate 13 and the substrate 37 are brought into contact with the contact portion of the column 11 and the contact portion 31 of the rod body in the X plane as shown in FIG. , Parallel to each other (by a cam or other mechanical device). The insertion force is essentially not required to reach the condition shown in FIG. 25 (b), since the column 11 and rod 31 do not contact each other until after the state of FIG. 25 (b).

FIG. 26 (a) shows the corresponding receptive interconnect components
FIG. 26 shows the protruding interconnect component 10 of FIG. 12 (a) prior to the mating engagement with 30; FIG. 26 (b) shows the protrusion-type interconnect component after mating engagement with the corresponding receiving interconnect component 30. FIG.
1A shows a projection-type interconnect component 10. Figure 26
The receptive interconnect components of (a) and 26 (b) are:
For example, it includes twelve conductive rods 31 which are aligned and engaged with the pillars 11 of the corresponding projecting interconnect components 10.

FIGS. 27 (a), 27 (b) and 27 (c) show the numbered engagement of at least one protruding interconnect component 10 of FIG. 13 (a) into a corresponding receiving interconnect component 30. Is shown. 27 (a), 27 (b) and 27 (c) are two conductive rods for referring to the two conductive pillars of the protruding interconnect component.
Including 31. FIG. 27 (a) shows an interconnect system in which the protruding interconnect components are arranged in a diamond-shaped or offset configuration. FIG. 27 (b) shows an interconnect system in which protruding interconnect components are located side by side. FIG. 27 (c) shows the interconnect system at the numbered position. The lead-in portions 36a and 36b of the conductive rod 3 in FIG. 27 (c) are different height conductive rods for the gap and the arrangement having even higher density.

Hybrid Electrical Interconnect Component So far, a protruding electrical interconnect component 10 having a plurality of pillars 11 has been discussed. Receptive electrical interconnect components 30 having a plurality of conductive rods 31 were also discussed. FIG. 28 (a) shows a pair of hybrid electrical interconnect components 75. Each of the hybrid electrical interconnect components 75 includes a plurality of conductive pillars.
11 and a plurality of conductive rods 31. Due to the upper hybrid electrical interconnect component 75 in FIG. 28 (a), the conductive columns 11 are closer and closer together than the conductive rods 31. Due to the hybrid electrical interconnect component 75 at the bottom of FIG. 28 (a), the conductive rods 31 are closer and closer together than the conductive columns 11. If necessary, the hybrid electrical interconnect component 75
As with the protruding electrical interconnect component 10 and the receiving electrical interconnect component 30, it may include a barrier (not shown in FIG. 28).

FIG. 28 (b) shows the various parts that make up the conductive pillar 11 and the conductive rod 31 used in the hybrid electrical interconnect component 75. For example, FIG. 28 (b) shows that the conductive rod 31 of the hybrid electrical interconnect component 75 includes a contact portion 32 having an interface portion 35 and a retracted portion 36, and a stabilizing portion 33, respectively. Show what you can do. Although the legs are applicable to hybrid electrical interconnect component 75, the legs for conductive column 11 and conductive rod 31 are not shown in FIGS. 28 (a) and 28 (b).

FIGS. 29 (a) and 29 (b) show a variation on the above-described protruding electrical interconnect component 10. FIG. FIGS. 29 (a) and 29
In (b), the opposing pillars 11 are the same width, but the pillars 11 next to each other around the peripherals of the interconnect component are of different widths. In addition, conductive pillars
11 has contact portions 17 that are offset towards each other as compared to the stabilizing portion 18 of the column. As with the other protruding interconnect components, FIGS.
The components shown in (b) may have insulating barriers (these are not shown). The component can then be configured for reception within a corresponding receptive electrical interconnect component.

Insulating Substrate As described above, the conductive pillars of the protruding interconnect components are fixed to the insulating substrate 13. Similarly,
The conductive rod of the receiving component is fixed to the insulating substrate 37.

FIGS. 30 (a) and 30 (b) (collectively referred to as FIG. 30) illustrate an insulating electrical carrier and a receiving interconnect component 30 acting as a substrate 13 for a protruding interconnect component 10. FIG. And an insulating electric carrier acting as the substrate 37 of FIG. The carrier 13 in FIG.
Are arranged such that a right angle connection is made using the legs of the protruding interconnect component 10. Similar to the carrier in FIG. 30A, the carrier 37 in FIG.
Are arranged for straight connections rather than at right angles. The carrier in FIG. 30 (a) or FIG. 30 (b) can be a right angle or straight carrier.

For example, when used for surface mounting on a printed circuit board, the legs and / or rods of each surface mounted column are:
A part of the substrate can be extended by about 0.3 mm to extend beyond the most extended part. This can compensate for mismatches on the printed circuit board and create a more flexible compliant electrical interconnect system.

The connector of FIG. 30 is oriented such that the opportunity for rearward turn engagement is eliminated. Importantly, there are other options that can distinguish between two connectors having the same number of contacts.

Interconnect Arrangement The present invention provides a distinction over prior art electrical interconnect systems because the interconnect components of the present invention can be arranged in a nested configuration at a much higher density than a typical grid array or edge connector arrangement. It has advantages that can be. Such an arrangement is not achieved by existing prior art electrical interconnect systems.

A prior art grid array is shown in FIG. In a typical prior art grid array, several rows of pillar interconnect components 101 are disposed on a holding surface. All of the columns 101 of the grid array in a given row or column are separated from each other by a distance X.
In the grid array of FIG. 31, the minimum distance X is about 1.25
mm. This could result in a density of about 62 contacts per square centimeter (400 contacts per square inch).

The present invention can provide higher densities. Instead of using grids or rows of individual pillars to connect to each individual socket, the electrical interconnect system of the present invention allows groups to receive each other for each group into each receptive interconnect component. The plurality of conductive pillars are arranged in a group with interleaving between them. Like the conductive pillars, the conductive rods are also arranged in groups, with the groups being interleaved with each other to receive each protruding interconnect component. Thus, while the prior art interconnect system works by interconnecting individual pins with individual sockets, the present invention allows individual receptive interconnect components to operate in the most efficient manner possible. And increasing the density and flexibility by interconnecting individual protruding interconnect components, including groups of columns.

FIG. 32 shows a group arrangement of holes or passages 81 according to the present invention. According to the arrangement of FIG. 32, groups of holes or passages 81 are formed in the insulated substrate 13. Conductive pillars 11 (eg, FIG. 5) are fitted into each passage to form an array of protruding interconnect components, or alternatively, conductive rods 31 (eg, FIG. 14) are received. Each of the passages is mated to form an array of mold interconnect components.

Here, reference numeral 82 indicates the group of contacts forming the interconnect component, or is generally used to indicate the interconnect component including the group of contacts. Thus, each interconnect component 82 referred to herein may be a projecting interconnect component 10 including a plurality of conductive pillars 11 or, alternatively, a receiving interconnect including a plurality of conductive rods 31. It may be a mold interconnect component 30 or, alternatively, a hybrid interconnect component including a plurality of conductive pillars 11 and a plurality of conductive rods 31 (see, for example, FIG. 28).

If the electrical interconnect component 82 is a protruding interconnect component, the interconnect component 82
Are the corresponding receptive interconnect components (eg, the receptive interconnect components shown in FIG. 14)
Placed for acceptance within. Further, the conductive contacts of each interconnect component may be interleaved or nested within other contacts of the interconnect component, such that the contacts of each interconnect component may be interleaved.
Be placed. In other words, the conductive contacts of the array should be of each group 82 to reach the highest density possible while providing adequate clearance for the rod engagement of the receptive interconnect components used. Some are arranged so that they overlap columns and rows of adjacent groups of contacts. The contact or electrical interconnect component 82 of FIG. 32, whether in contact with or not in contact with the conductive contact, when such component is a protruding interconnect component or a hybrid interconnect component , Each group may have a dependent wall 12 located in a central portion of its interconnect components. On the other hand, it should be noted that one or more interconnect components (eg, all) may not have a barrier. When the electrical interconnect component is a receptive interconnect component, such component does not include a barrier.

As shown in FIG. 32, each group of contacts 82 forming an interconnect component may be arranged in a cross shape. However, other shapes (FIGS. 12 (a), 12 (b), 13)
(A), 13 (c), 25, 28, or 29 resulting shapes or other shapes that can be easily nested are used. The grouping of the contacts into a cruciform (as in FIG. 32) can be attributed to balancing the stresses in the rods such that the conductive rods of each receptive or hybrid interconnect component are overstressed. Not receive. In addition, the use of cross-shaped groups provides alignment effects not found in prior art systems such as the grid array of FIG. For example, the cross-shaped interconnect components shown in FIG. 32 are aligned with the rods of the corresponding receptive interconnect components, respectively, when the electrical interconnect components 82 are projecting, and the entire arrangement of FIG. In the same way.

Nesting groups (eg, cross-shaped groups) of holes or contacts (ie, protruding, receiving, or hybrid interconnect components)
It creates an adequate gap between the contacts to match the corresponding interconnect component and minimizes the space between the contacts. Prior art systems known to the inventor do not utilize space in this manner. Further, as described above, when electrical interconnect component 82 is a protruding interconnect component or a hybrid interconnect component, each electrical interconnect component 82
It is optional to include a wall between the contacts. In the absence of a barrier, each group of pillars 11 for each protruding interconnect component or hybrid interconnect component will have a corresponding interconnect during the numbering engagement by the upper sloped surface of the pillar. The corresponding conductive rod of the component can be expanded.

Although the nested configuration of FIG. 32 eliminates the need for insulating walls between the contacts, such insulating walls can be used if desired. Similarly, although the nested configuration of FIG. 32 may be an arrangement for the pillars 11 of the protruding interconnect components in an electrical interconnect system, the nested configuration of FIG. 32 is a receptive interconnect component of the system. The arrangement for the rod body 31 may be used. For example, for both protruding and receptive interconnect components in a given electrical interconnect system, the contacts of such components would be one of each group of contacts cooperating with the electrical interconnect component. Portions may be arranged to overlap adjacent groups columns and rows of contacts cooperating with other electrical interconnect components. In other words, both protruding and receiving components in a given electrical interconnect system can be arranged in a nested configuration. This is also true for electrical interconnect systems that include hybrid electrical interconnect components. Further, by arranging the contacts in groups (eg, cross-shaped groups 82 in FIG. 32), the legs of the interconnect components for each group are interconnected with interface devices (eg,
It can be arranged to extend the layout and trace routing of a printed circuit board.

The density of the interconnect arrangement of FIG. 32 is such that, when the electrical interconnect components 82 are projecting interconnect components or hybrid interconnect components, each of which includes It depends on the configuration of the space and the size of the used walls. According to each example of FIGS. 33 (a) and 33 (b), the cross-section of each dependent wall 12 is 0.5 mm × 0.5 mm, 0.9 mm × 0.9 mm, or some other dimension. As an example, the interconnect components of FIG. 33 (a) each include a 0.5 mm × 0.5 mm wall and are offset columns as shown in FIG. 7, and FIG. 33 (b)
Interconnect components may each include a 0.9 mm × 0.9 mm wall and the non-offset post shown in FIG. Preferably, as shown in FIGS. 33 (a) and 33 (b), the distance between adjacent contacts in one electrical interconnect component and the adjacent contacts from different electrical interconnect components The distance between and both are 0.
2 mm or more.

An arrangement in which each wall is 0.5 mm × 0.5 mm is shown in FIG.
Higher densities can be reached when the cliffs are not used.

For the arrangement of FIG. 32, when a 0.9 mm × 0.9 mm wall is used, the centerline-to-centerline distance X between the rows of electrical interconnect components may be 1.5 mm, and between the rows of electrical interconnect components. The centerline-to-centerline distance Y may be 1.25 mm, and the overall density in this arrangement is about 105 contacts per square centimeter (680 contacts per square inch). When a 0.5 mm x 0.5 mm wall is used, the centerline-to-centerline distance X between the rows of electrical interconnect components may be 1.0 mm, and the centerline-to-centerline distance between rows of electrical interconnect components. Y may be 1.5 mm, and the overall density in this configuration is about 128 contacts per square centimeter (828 contacts per square inch). When a small wall is used or when a wall is not used, the centerline-centerline distance X between the rows of electrical interconnect components is
The centerline-to-centerline distance Y between rows of electrical interconnect components may be 1.25 mm, and the overall density in this arrangement is about 159 contacts per square centimeter (1,028 per square inch). Is obtained.

In the nested arrangement shown in FIG. 32, the electrical interconnect components 82, whether projecting, receiving or hybrid, are arranged in a matrix on the insulating substrate 13 (see FIG. 32).
The dashed lines at 32 indicate rows and columns, respectively), the electrical interconnect components of adjacent rows of the arrangement are shifted as the electrical interconnect components are shifted from adjacent columns of the arrangement, and the electrical interconnect components are shifted. Are interleaved between each other in a nested configuration such that a portion of each electrical interconnect component overlaps in adjacent rows of electrical interconnect components or adjacent columns of electrical interconnect components. You.
The protruding, receiving and / or hybrid components in a given electrical interconnect system can all be arranged according to the nested arrangement shown in FIG.

While FIG. 32 shows an arrangement having 20 rows and 17 columns, an arrangement having other numbers of rows and columns is also envisioned. For example, an arrangement having about 17 more columns and 2, 3, 4, or more rows may be used. Arrangements having two, three and four rows etc. are particularly suitable for use as edge connectors for PCBs and other boards.

The nested configuration of FIG. 32 can be modified to provide higher densities. An example of one considered improvement is shown in FIG.
, Which essentially rotates the arrangement of FIG. 32, and so that there is less space between components,
Derived from placing interconnect components.
In the arrangement of FIG. 35, the electrical interconnect component 8
2. The protruding, receiving or hybrid type is arranged in a matrix on the insulating substrate 13 and at least one contact of each electrical interconnect component 82 (eg, FIG. 35).
11) includes a front surface 83 facing outwardly and spaced along a line originally traversed by the side surfaces 84 of the other contacts in its arrangement. Similarly, in the arrangement of FIG. 35, the adjacent interconnect component is a line drawn from the center of the interconnect component to the component through the center of the contact to the center of any interconnect component immediately adjacent to the component. Are also offset so that they do not cross. It is noted that, like the nested arrangement shown in FIG. 32, the arrangement in FIG. 35 uses a cross-shaped group of contacts for electrical interconnect components, although other forms are possible. Should. Further, similar to the arrangement of FIG. 32, the arrangement of FIG. 35 may be modified to include more or fewer rows and columns than those shown (eg, two, three, or four rows and eight columns). it can. Similarly, the electrical interconnect components in any given electrical interconnect system (eg, both protruding and receiving interconnect components in a pluggable system) may be arranged according to the arrangement shown in FIG.

FIG. 36 shows part of the arrangement according to FIG. 35 using barriers having a cross section of 0.5 mm × 0.5 mm. As can be seen from FIG. 37, the protruding electrical interconnect components 82 from FIG. 36, when received in the respective receptive interconnect components 30, when the conductive contacts or rods of the receptive interconnect components 30 The bodies 31 are separated by a distance of, for example, 0.2 mm.

FIG. 38 is an illustration of a protruding electrical interconnect component 10 arranged according to the arrangement of FIG. 35 and received in a corresponding receptive interconnect component 30. In FIG. 38, the barrier 12 for the protruding interconnect component 10 is 0.9 mmx
It can have a 0.9 mm cross section. The distance between each conductive contact or rod 31 and the contact it faces is, for example,
0.4 mm.

When 0.9mm x 0.9mm wall is used for the arrangement of Figure 35,
The distance d between similar surfaces of the contacts may be 2.19 mm, and the overall density for placement is about
It should be noted that 71 contacts (460 contacts per square inch) are obtained. When a 0.5 mm x 0.5 mm wall is used, the distance d may be 1.60 mm, and the overall density for placement is about 139 contacts per square centimeter (900 contacts per square inch). When the cliffs are not used, the distance d may be 1.5 mm, and the overall density for placement is about 179 contacts per square centimeter (1,156 contacts per square inch).

In the arrangements of FIGS. 32 and 35, rows and columns in each arrangement are continuous. In other words, there is no break or interruption in the rows or columns of electrical interconnect components between the electrical interconnect components in each row and column apart from the normal space. Such continuous rows and columns are particularly useful in semiconductor chip connection technology, where the bonding is directly under the chip as well as around the peripherals of the semiconductor chip. This is also valuable for high pin count interconnects.

Instead of being arranged in continuous rows and columns, electrical interconnect components 92 (whether such components are of the protruding, receptive or hybrid type)
May be arranged in groups or groups of four or more components separated by channels 85 as shown in FIG. This type of arrangement utilizes channels 65 to route the traces, so that printed circuit boards and other interface surface traces can be easily routed to vias etc. on the interface surface. I do. To facilitate such routing, the channel between groups of electrical interconnect components 82 is wider than the space between electrical interconnect components 82 within each group or population. The use of channel 85 is applicable to all of the interconnect arrangements disclosed herein, including the arrangements of FIGS.

Channels 85 between groups or groups of electrical interconnect components correspond to spaces where vias, pads, through holes and / or traces may be located. FIG. 40 is an example of a pattern on a printed circuit board suitable for use in connecting a discontinuous arrangement of electrical interconnect components as shown in FIG. Example dimensions for the pattern are 17.33mm
And 17.69 mm, giving a density of about 46 contacts per square centimeter (300 contacts per square inch). Figure 4
As can be seen from FIG. 0, the pattern of the printed circuit board includes traces 86, vias 87, and pads 88, for example, where the pads are arranged in a pattern that corresponds to the pattern of electrical interconnect components. The pattern of the printed circuit board shown in FIG. 40 is the same in the route traces, vias and areas of the printed circuit board corresponding to the channels 45 between the electrical interconnect components. Figure 40
The exemplary dimensions for the pattern shown in FIG. 7 are 0.15 mm due to the width of trace 86, 0.15 mm separates trace 86 from other conductive components on the board surface, and vias 87 For 0.6mm diameter. Although FIG. 40 illustrates an exemplary pattern of a circuit board or other substrate according to the present invention on which electrical interconnect components may be mounted, other patterns according to the present invention are envisioned.

In addition to the continuous arrangement of FIGS. 32 and 35 and the consolidated or discontinuous arrangement of FIG. 39, all of the arrangements of the present invention can be modified to include a space 89 in its central portion, including wire bonding, tabs ( It facilitates connection with semiconductor chip carriers produced using bonding techniques such as TAB). FIGS. 41 (a) and 41 (b) are examples of embodiments in which the arrangement formed on the insulating substrate 13 of FIGS. 32 and 35 is modified to include a space 89. FIG.

FIG. 41 (a) shows an example of the arrangement of the electrical interconnect component 82 from FIG. 32 modified to include a space 89 in its central portion. In FIG. 41 (a), each of the sides of the array is about 25 mm long, so 252 contacts can be provided using only an area of 625 square mm.

FIG. 41 (b) shows an example of the arrangement of the electrical interconnect component 82 from FIG. 35 modified to include a space 89 in its central part. In FIG. 41 (b), each of the sides of the array is approximately 23 mm long, so 336 contacts can be provided using only an area of 529 square mm.

FIG. 42 is another view of the arrangement shown in FIG. 41 (b), each having a contact portion 17 offset with respect to a corresponding stabilizing portion 18 in the embodiment of the offset column shown in FIG. 11 is shown. Like FIG. 41, FIG.
And (b) show that each arrangement according to the invention can be modified to include a space 89 in its central part. Figure
Due to the arrangement of 41 (a), 41 (b) and 42, the electrical interconnect components 82 shown are protruding interconnect components, each including the dependent wall 12. However,
In accordance with the present invention, such components may be protrusion-less interconnect components, receptive interconnect components, or hybrid interconnect components.

Figures 43 to 47 show various appearances associated with the arrangement according to the invention. FIG. 43 shows, for example, the sequential arrangement of the protruding electrical interconnect components 82, each of which is shown in FIG.
3 shows the column 11 with the contact portion 17 offset with respect to the corresponding stabilizing portion 18 in the embodiment of the offset column indicated by. FIG. 44 illustrates the electrical interconnect component 82.
Indicate that it may be a receptive electrical interconnect component from a socket that can be mounted on a PCB or other interface surface using the SMT method, which places the protruding interconnect component into the socket from above. To be plugged in. FIG. 45 shows that the nested arrangement of electrical interconnect components 82 can be configured like the protruding electrical interconnect components shown in FIG. 12 (a). Figure 46
Is a nested protruding electrical interconnect component such as the electrical interconnect component shown in FIG.
Shown is an arrangement of about 130 contacts per square centimeter for 82 (837 contacts per square inch), each including two contacts or posts 11 or optionally a four-sided insulating barrier 12. FIG. 47 shows an arrangement for an electrical interconnect component 82, such as the protruding electrical interconnect component shown partially in FIG. 13 (c).

FIGS. 48 (a) through 48 (d) show an arrangement for an electrical interconnect component 82, such as the H-shaped electrical interconnect component shown in FIG. 12 (b). H
The dimensions for the placement of the shaped interconnect components are shown in FIGS. 48 (c) and 48 (d). The arrangement of FIG. 48 (c) can provide a density of about 111 contacts per square centimeter (716 contacts per square inch). On the other hand, FIG.
Can provide a density of about 99 contacts per square centimeter (636 contacts per square inch).

The aforementioned conductive column 11 or conductive rod 31 can be used in the above arrangement. Separate contacts, stabilizers and legs of the conductive pillar and rod serve to maximize interconnect placement efficiency. For example, as shown in FIG.
Contact portion 17 can be offset in the direction of the interior of the protruding interconnect component due to its post. By offsetting the contact portions in this manner, a smaller wall may be used, or the wall may be completely eliminated. Accordingly, the density of the electrical interconnect arrangement described above will be increased, for example, by using the offset post shown in FIG.

When an offset post (eg, as in FIG. 7) is used, the contact portions of the corresponding conductive rods can also be offset. However, as shown in FIG. 49, the contact portion 31 of the conductive rod 32 reduces the amount of stress exerted on the conductive rod and minimizes the space used.
It is totally offset from the wall. Higher electrical interconnect densities can be achieved through the use of the offset post 11 of FIG. 7 connected to the conductive rod 31 of FIG.

Like the contact portion, the conductive pillar 11 or the leg of the conductive rod 31 can be aligned or offset from its corresponding stabilizing portion. FIG. 50 (a) shows a conductive column 11 having legs 19 aligned about the central axis of the stabilizing portion, and FIG. 50 (b) shows the legs 19 offset from the stabilizing portion. 2 shows a conductive column having: Figures 50 (a) and 50
The alignment and offset shown in (b) are the same, and can be applied to the conductive rod 31 respectively.

The arrangement of FIG. 50 (a) is used for the north and south contacts when the substrate 13 is positioned at right angles to the device with which the legs 19 interact. On the other hand, the configuration of FIG. 50 (b) can be used when a straight or right angled interconnect is made between the leg and the interface device, and over the interface device for making a connection to the leg. There is almost no spatial domain. The legs of the column are aligned or offset at their corresponding stabilizing portions to fit within the leg interface pattern normally associated with the rod, or the legs of the rod are stabilized at their corresponding stabilization. It should be noted that the sections are aligned or offset to fit within the leg interface pattern normally associated with the post. This provides flexibility in trace routing.

Pillar 11 including separate contacts, stabilizing portions and legs and / or
Alternatively, the use of the rod 31 results in other advantages, as well as the configuration of those parts other than those described above. For example, the contact portion of the pillar or rod as in FIG. 8 can be made easier because the pillar or rod can be the same size as the stabilizing portion, or the contact portion can be smaller (ie, smaller). , The density of the interconnect system can be increased more than the stabilization part as shown in FIG.

In the case where the contact portion is made narrower than its corresponding stabilizing portion, the holes or passages to which the columns or rods are fixed can be set to have different widths or diameters at different levels. For example, the width or diameter near the hole from which the contact portion protrudes can be smaller than the width or diameter on the other side of the substrate from which the legs protrude. In this type of configuration, the post or rod is first inserted in the contact portion and inserted into the hole, and then applied to the portion of the hole where the shoulder of the stabilizing portion has a smaller width or diameter. It is pushed further into the hole until it touches. In this method, by setting the configuration of the holes, excessive insertion (that is, insertion of the column or rod to the extent that the stabilizing portion extends through the holes) or extrusion for high turning force can be performed. Projection can be prevented.

Like the contact portions, the legs of each column or rod may be the same size as the stabilizing portions of the columns or rods, or the legs may be smaller (ie, narrower) than the stabilizing portions. Therefore, it is possible to connect to a high-density interface device and / or to achieve flexibility in circuit design and routing. In the case where the legs are narrower than their corresponding stabilizing portions, the holes or passages to which the columns or rods are fixed can be set to have different widths or diameters at different levels. For example, the width or diameter near the portion of the hole from which the legs protrude can be smaller than the width or diameter on the side of the substrate from which the other legs protrude. In this type of configuration, the pillar or rod is inserted into the hole with the legs first entering, and then the shoulder of the stabilizing portion has a narrower width or diameter. It is pushed further into the hole until it touches the part. In this method, by setting the configuration of the holes, excessive insertion (that is, insertion of the column or rod to the extent that the stabilizing portion extends through the holes) or extrusion for high turning force can be performed. Projection can be prevented.

When the contact portion of the column or rod is offset from the stabilizing portion (eg, as shown in FIG. 7), the column or rod is inserted into the corresponding hole with the legs first entering. It should be noted that it must be inserted into Similarly, when the legs of the column or rod are offset from the stabilizing portion, the column or rod must be inserted into the corresponding holes with the contact portion entering first.

The legs of each pillar or rod can be arranged in many different configurations. For example, the leg may have its central axis aligned with the central axis of the stabilizing portion, as in FIG. 50 (a). Alternatively, the legs may be such that the sides of the legs are coplanar with the sides of the stabilizing portion, as shown in FIG. 50 (b).
It can be offset from the stabilizing part.

Similarly, the legs of each column or rod can be secured to different portions of the stabilizing portion. For example, the legs can be attached to the center, corner, or sides of the stabilizing portion to gain flexibility in trace routing and circuit design and increase interface device density.

Further variability of the legs of each pillar or rod is contemplated. Within a given protruding or receptive interconnect component, the legs of that component can be configured to face each other or away from each other, or one particular leg faces one another while the other leg faces another. The legs can be configured to be separated from each other. Similarly, the legs of a given interconnect component are arranged such that each leg faces a leg directly to its left, or each leg faces a leg directly to its right. obtain.

Similarly, a second molding operation can be used to join the legs of one or more interconnect components together. In this type of configuration, the insulating yoke or substrate is formed around the leg at the point where the leg connects to the interface device,
It can help with alignment and protect the legs during shipping.

Further, portions of the legs of the pillar and / or rod may be selectively covered with an insulating material to prevent short circuiting and to allow for closer placement of the legs with respect to each other (eg, each other). Arrangement of the legs facing). This type of selective insulation is particularly applicable to right angle connections as shown in FIG. Referring to FIG. 11 (b), such selective insulation of the legs can be used to allow for closer placement of all of the legs within each component. Instead, such selective insulation of the legs allows for a closer arrangement in each component that shares the same row of legs (eg, rows C, D and E in FIG. 11 (b)) with one another. Can be used to Although selective insulation of the legs helps prevent shorting when these types of closer arrangements are made, such closer arrangements can be made without selective insulation.

As can be seen from the foregoing description, the use of columns and rods including separate contacts, stabilizing portions and legs formed from a single piece maximizes the efficiency of the interconnect arrangement of the present invention. In addition, the optional construction of conductive pillars and rods may allow for flexibility in circuit design and signal routing not possible through the use of existing interconnect systems.

Manufacture The conductive pillars and conductive rods of the electrical interconnect component may be manufactured by a method stamped from strips or drawn wires, and the contacts and interface portions may be suitable as described above for the columns and rods. It is designed to ensure that you are facing the right direction. Both steps are
Enables selective plating and automated insertion. The right angle leg embodiment protrudes from the center of the stabilizing portion, thereby allowing one pin punch having a different tail length to provide contacts for all sides and levels of the electrical interconnect system of the present invention. . However, due to the maximum density, the legs can be moved from the center of the stabilizing portion to allow maximum density while avoiding interference between adjacent legs.

The stamped contacts can be loose or on the strip, as the asymmetric shape leads to a constant orientation in automated assembly equipment. The strip may be between a stable area at the tip or may be part of a band lier that holds the individual contacts. Different length tail lengths on the right angle embodiment assist in orientation and vibrating ball delivery during automated assembly.

The present invention is compatible with both sewing and gang insertion and assembly equipment. The insulated connector body and package are designed to facilitate automation with automated robotic insertion into a printed circuit board or wire termination into the connector. As an option of forming an insulating substrate and inserting contacts into the substrate, the insulating substrate can be formed around the contacts in an insert molding process. Completed parts are compatible with the PCB assembly process.

Conclusion The present invention provides an electrical interconnect system at a lower cost and more efficient, faster, and at a higher density than existing high density electrical interconnect systems. Thus, the present invention can keep up with the fast pace of progress currently taking place in semiconductor and computer technology.

It will be apparent to those skilled in the art that various modifications and variations can be made in the disclosed electrical interconnect system without departing from the scope and spirit of the invention. Other embodiments of the disclosed invention will be apparent to one skilled in the art from consideration of the specification and practice. The specification and examples are illustrative and are intended to be considered with the true scope and spirit of the invention, which is indicated by the following claims.

Continuation of the front page (56) References JP-A-5-62736 (JP, A) JP-A-8-510354 (JP, A) US Patent 4,997,376 (US, A) (58) Fields investigated (Int. ⁷ , DB name) H01R 24/00-24/18

Claims (23)

(57) [Claims] 1. An electrical interconnect system, comprising: a first holding member (37); a first conductive contact group (30) fixed on the first holding member (37);
A holding member (13); and a second conductive contact group (10) fixed on the second holding member (13), wherein each contact piece (31) of the first contact group is A contact section (32) extending from a surface of one holding member (37), wherein a plurality of the contact sections (32) are arranged on the surface of the first holding member.
Arranged as a first array of groups, each of said contact sections (32) comprising one contact surface;
An opposing surface opposite the one contact surface; and at least one side joining the contact surface and the opposing surface, wherein each contact of the second conductive contact group is 2 having a contact section (17) extending from the holding member, wherein a plurality of said contact sections (17) are arranged as a second array of a group of multi-contact sections (17); each of said contact sections (17) Is one contact surface,
An opposing surface opposite the one contact surface, and at least one side joining the contact surface and the opposing surface, wherein each group of the first array of contact sections (32) comprises:
The second array of contact sections (17) is configured to receive a corresponding one of the second array of contact section (17) groups, wherein each group of the second array of contact sections (17) is a contact of the first array. When received in a corresponding one of the groups of sections (32), each contact surface of each contact section of the first array corresponds to a contact surface of the contact section (17) of the second array.
Contact sections of each group of the first array (17)
At least a portion of said opposing surface (83) is crossed by at least a portion of said side surface (84) of a contact section (17) from another group of said first array and said opposing surface An electrical interconnect system, wherein the electrical interconnect system is disposed outwardly away from the group along a straight line perpendicular to and separated from each other by air. 2. Each group of the second array is a component of the protruding interconnect component (10) and each group of the first array is a receptive interconnect component (30).
2. The electrical interconnect system according to claim 1, wherein the electrical interconnect system comprises: 3. The system of claim 2, wherein each of the protruding interconnect components further includes a barrier that is electrically insulated from one another and about which contacts for the interconnect components are located. Electric interconnect system. 4. The electrical interconnect system of claim 1, wherein at least one of the arrays has a density of at least about 77 contacts per square centimeter (500 contacts per square inch). 5. The electrical interconnect system of claim 1, wherein at least one of the arrays has a density of at least about 93 contacts per square centimeter (at least 600 contacts per square inch). 6. The electrical interconnect system of claim 1, wherein at least one of the arrays has a density of at least about 155 contacts per square centimeter (at least 1000 contacts per square inch). 7. The electrical interconnect system of claim 1, wherein the opposing surfaces are separated from each other only by air. 8. The electrical interconnect system according to claim 1, wherein the opposing surfaces are in contact only with air. 9. The contact section of each group of the second array such that the opposing surface of the contact section opposes the opposing surface of the other contact section of the group in which opposing surfaces within the group are separated from one another primarily by air. The electrical interconnect system according to claim 1, wherein at least one of (17) is arranged. 10. The contact section of each group of the second array such that the opposing surface of the contact section opposes the opposing surface of the other contact section of the group in which opposing surfaces within the group are separated from each other only by air. The electrical interconnect system according to claim 1, wherein at least one of (17) is arranged. 11. Each of the contact sections (17) of the contacts of the second array extends at least one perpendicular to the surface of the second holding element (13) before and after engagement of the first and second arrays. And each of the contact sections (32) of the first array of contacts is inclined prior to engagement of the first and second arrays and after engagement of the first and second arrays. The electrical interconnect system according to claim 1, having at least one straightening portion. 12. The electrical interconnect system of claim 1, wherein opposing surfaces of said first array are electrically insulated from each other primarily by air. 13. The electrical interconnect system of claim 12, wherein each group of the second array is a component of a protruding interconnect component. 14. The invention as defined in claim 13 wherein each protruding interconnect component further comprises a barrier wall electrically insulated from one another and around which contacts for the interconnect component are located. Electric interconnect system. 15. The electrical interconnect system of claim 12, wherein each group of the first array is a component of a receptive interconnect component. 16. The electrical interconnect system of claim 12, wherein the opposing surfaces are electrically insulated from each other only by air. 17. Each group of the second array such that the opposing surface of the contact section opposes the opposing surface of the other contact section of the group in which opposing surfaces in the group are electrically isolated from one another primarily by air. 13. The electrical interconnect system according to claim 12, wherein at least one of said contact sections (17) is arranged. 18. Each group of the second array such that opposing surfaces of the contact sections oppose opposing surfaces of other contact sections of the group, the opposing surfaces in the group being electrically isolated from each other only by air. 13. The electrical interconnect system according to claim 12, wherein at least one of said contact sections (17) is arranged. 19. Each of the contact sections (17) of the second array of contacts has at least one portion extending vertically before and after engagement of the first and second arrays.
And each of the contact sections (32) of the contacts of the first array are tilted horizontally before engagement of the first and second arrays and vertically after engagement of the first and second arrays. 13. The electrical interconnect system of claim 12, comprising at least one portion that extends straight. 20. The electrical interconnect system of claim 1, wherein the fluid electrical insulator occupies a majority of the total space located between the facing surfaces. 21. The electrical interconnect system according to claim 20, wherein the fluid electrical insulator is a gas. 22. The electrical interconnect system according to claim 20, wherein the fluid electrical insulator is air. 23. The method according to claim 20, wherein the fluid electrical insulator completely occupies the entire space located between the facing surfaces.
20. The electrical interconnect system of claim 20.