JPH0837261A - Semiconductor cooler - Google Patents

Abstract

PURPOSE:To cool the entire cooling surface uniformly, and to accelerate the movement of heat on the cooling surface by a method wherein the locality of cooling effect on the cooling surface is eliminated in the cooling of an integrated circuit. CONSTITUTION:A jetting nozzle 12, provided with a movable part 15 or a propeller 15, which feeds a refrigerant to the integrated circuit 2 mounted on a substrate 1, a cold plate 6 having a hole 5 on the position at a very small distance from the integrated circuit, and a compound 3 to be coated between the integrated circuit 2 and the cold plate 6, are installed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor cooling device for cooling a semiconductor circuit having a relatively large heat generation such as a large computer.

[0002]

2. Description of the Related Art Japanese Patent Application Laid-Open No. 60-160150 discloses a technique for cooling an integrated circuit such as a semiconductor with a liquid refrigerant via a heat transfer plate. In the cooling device for an integrated circuit shown in FIG. 1, heat generated in a semiconductor element 11 is transferred to a heat transfer plate 1.
0, transmitted through the deformable heat transfer body 9 and the heat transfer plate 5,
The heat of the heat transfer plate 5 is cooled by the ejection of the liquid refrigerant from the nozzle 8.

[0003]

In such a conventional structure, since the nozzle for supplying the liquid refrigerant to the cooling surface is fixed, the flow path of the refrigerant is fixed. For this reason, not only the problem that the dead water area where the movement of the refrigerant does not occur and the part that is hardly cooled occurs, but also a part with a large cooling effect and a part with a small cooling effect occur, and the temperature of the surface to be cooled is not uniform. There's a problem.

[0004] It is an object of the present invention to provide a semiconductor cooling device having improved cooling performance.

Another object of the present invention is to provide a semiconductor cooling device which prevents the formation of a dead water region in which the refrigerant does not move.

Another object of the present invention is to provide a semiconductor cooling device in which the temperature of a cooling surface is made more uniform.

[0007]

A first semiconductor cooling device of the present invention comprises a cooling container for taking in and discharging a refrigerant, a refrigerant stirring means for stirring the refrigerant jetted from the cooling container, and a cooling container for the cooling container. A heat transfer plate having holes for agitating the refrigerant by the refrigerant agitating means and discharging the refrigerant to the cooling container (hereinafter referred to as a cold plate).

In a second semiconductor cooling device of the present invention, a cooling container for taking in and discharging a refrigerant, a cooling medium stirring means for stirring the cooling medium jetted from the cooling container, and a cooling medium for discharging the cooling medium from the cooling container to the cooling medium. It includes a cold plate having holes for stirring by a stirring means and discharging to the cooling container, and a semiconductor circuit (hereinafter referred to as an integrated circuit) adhered to a surface having no holes of the cold plate with a heat conductive adhesive.

In a third semiconductor cooling device of the present invention, a jet having a movable part in which the coolant agitating means in the first semiconductor cooling device or the second semiconductor device is rotated by the coolant jetted from the cooling container. It is characterized by having a nozzle.

A fourth semiconductor cooling device of the present invention is a propeller in which the refrigerant agitating means in the first semiconductor cooling device or the second semiconductor device is rotated by the refrigerant jetted from the cooling container, and the propeller. And a connecting rod for fixing to the jet nozzle and the jet nozzle.

[0011]

An embodiment of the present invention will now be described in detail with reference to the drawings.

Referring to FIG. 1, a first embodiment of the present invention is a substrate 1, an integrated circuit 2 mounted on the substrate 1, a substrate frame 3 fixed to the outer peripheral edge of the substrate 1, and an integrated circuit 2. Compound 4 having a high thermal conductivity applied to the upper surface located on the side opposite to the substrate 1, the outer peripheral edge portion of which is in contact with the substrate frame 3 and is thermally connected to the plurality of integrated circuits 2 through the compound 4 A heat transfer plate (hereinafter referred to as a cold plate) 6 provided with a hole 5 corresponding to the size of the circuit on the surface opposite to the heat connection surface with the integrated circuit 2, an inlet 8 for taking in the refrigerant 7, and an inlet 8 A suction chamber 10 for sucking the coolant 7, a discharge nozzle 13 for discharging the coolant from the hole 5, a discharge chamber 11 for discharging the coolant discharged by the discharge nozzle 13 and an outlet for discharging the coolant from the discharge chamber 11. Cooling container 1 including 9 and
4 and a feature of the first embodiment of the present invention;
A plurality of ejection nozzles 12 having a movable portion 15 having a shape bent from the bottom of the hole 0 toward the hole 5 and capable of rotating about a rotation axis perpendicular to the bottom surface of the hole 5 are provided.

The flow direction of the refrigerant is indicated by an arrow.

The movable portion 15 rotates in the direction shown by the arrow by the jetting force of the refrigerant 7 given from the suction chamber 10 and jetted by the jetting nozzle 12. In this rotation, the refrigerant 7 flowing just below from the suction chamber 10 is applied to the side wall of the movable portion 15, and from that point, the refrigerant 7 moves in the horizontal direction and is applied to the other side wall of the movable portion 15. Already, the refrigerant 7 is ejected from the side wall to which the refrigerant 7 is applied to the front or the side, thereby realizing the rotation in the circular direction.

The refrigerant in the hole 5 is agitated by the rotating operation of the movable portion 15.

In the first embodiment of the present invention, the movable portion 15 is used.
By rotating the refrigerant 7 to change the spouting location of the refrigerant 7 in the hole 5 to move the refrigerant 7, the occurrence of a dead water area is prevented,
The temperature of the cooling surface can be made uniform. in this way,
The first embodiment of the present invention increases the momentum of the refrigerant 7,
The cooling performance can be improved by increasing the heat transport amount.

Next, a second embodiment of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 2, a second embodiment of the present invention is characterized in that a jet nozzle 212 for jetting the refrigerant 7 from the absorption chamber 10 to the hole 5, and a frame is provided outside the jet nozzle 212. A connecting rod 216 having a character-shaped or X-shaped frame fixed at one end at the intersection thereof;
Is provided with a propeller 215 fixed to the other end of the.

The refrigerant 7 is ejected from the absorption chamber 10 by a nozzle 212
And is stirred by the propeller 215 via the The rotation of the propeller prevents the generation of dead water by stirring the refrigerant 7,
The temperature of the cooling surface can be made uniform. in this way,
The second embodiment of the present invention can improve the cooling performance by increasing the momentum of the refrigerant 7 and increasing the heat transport amount.

[0020]

According to the present invention, the dead water area can be reduced by stirring the refrigerant, and the temperature of the cooling surface can be made uniform. Further, the momentum of the refrigerant increases due to the stirring of the refrigerant, and the heat transport amount increases. These factors improve the cooling performance of the present invention.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram showing a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Integrated circuit 3 Substrate frame 4 Compound 5 Hole 6 Cold plate 7 Refrigerant 8 Inlet 9 Outlet 10 Suction chamber 11 Discharge chamber 12, 212 Jet nozzle 13 Discharge nozzle 14 Cooling vessel 15 Cooling unit 15 Movable part 215 Propeller 216 Connecting rod

Claims (3)

[Claims] 1. A cooling container for taking in and discharging a refrigerant, a refrigerant agitating means for agitating the refrigerant ejected from the cooling container, and a refrigerant agitating means for agitating the refrigerant from the cooling container to the cooling container. A semiconductor cooling device, comprising: a heat transfer plate having holes for discharging. 2. The semiconductor cooling device according to claim 1, wherein the cooling medium agitating means includes a spray nozzle having a movable portion that rotates by the cooling medium sprayed from the cooling container. 3. The refrigerant agitating means comprises a propeller rotating by the refrigerant jetted from the cooling container, and a connecting rod for fixing the propeller shaft and jet nozzle. Item 2. The semiconductor cooling device according to item 1.