JPH05283573A - Semiconductor cooling mechanism - Google Patents

Abstract

PURPOSE:To improve heat transfer efficiently in a refrigerant, by causing the refrigerant to collide against a heat radiating face and move in a circle around a forward directional axis so that abundance density of the refrigerant near the heat radiating face is enlarged. CONSTITUTION:In a semiconductor cooling unit, a radiating fin 8 is mounted on a bottom part of a heat-transfer plate 7 in a cooling apparatus body 6. A screw-shaped refrigerant guiding wall 9 is provided on the radiating fin 8. A refrigerant 11, such as water, is jetted out from a nozzle 10 at an upper part of the radiating fin 8. Then, the refrigerant 11 collides against the radiating fin 8, and thereby the flow of the refrigerant 11 is divided radially and uniformly at a central part of the radiating fin 8. Moreover, the flow of the refrigerant 11 is subjected to a rotating movement around a forward directional axis in collision. When the refrigerant 11, which collides against the radiating fin 8, is caused to rotate in its movement, an actual heat-transfer area is enlarged. Consequently, efficiency in heat transfer can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device cooling technique.

[0002]

BACKGROUND OF THE INVENTION Conventional impinging fluid cooling (impingem)
As a semiconductor cooling method using ent cooling, for example, in air cooling, Nikkei Electronics (1984.
3.26) As described in pp. 159 to 165, IBM Corp. adopts the collision airflow cooling method in the medium processor 381 module. On the other hand, in liquid cooling, FUJITS
U. 41.1. As described in PP12-19 (01,1990), Fujitsu has a VP2000 series CCM (C
onductive Cooling Module)
In, the collision jet method is adopted.

[0003]

However, in all of the above collision fluid cooling methods, the refrigerant is made to collide with the heat transfer plate or the heat sink to promote the heat transfer, but the heat transfer of the refrigerant is further efficient. However, there is a problem in that the flow rate of the coolant is increased and the initial temperature of the coolant needs to be further lowered as the heat generation density of the semiconductor chip increases. An object of the present invention is to improve the heat transfer efficiency of the refrigerant. The above and other objects and novel features of the present invention will be apparent from the description of the present specification and the accompanying drawings.

[0004]

The outline of a typical one of the inventions disclosed in the present application will be briefly described as follows. In order to achieve the above-mentioned object, the refrigerant that impinges on the heat dissipation surface is subjected to rotational movement about the traveling direction.

[0005]

According to the above-mentioned means, the rotational motion added to the collision motion with respect to the heat dissipation surface acts to increase the existing density (residence density) of the refrigerant that contributes to heat transfer in the vicinity of the heat dissipation surface, and thereby the refrigerant. The heat transfer efficiency can be improved.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. Example 1. One embodiment of the present invention will be described with reference to FIGS. 1 and 2. In this embodiment, a chip carrier incorporating a semiconductor chip (not shown) mounted via a solder bump 2 on a wiring substrate 1 made of, for example, a ceramic wiring substrate. Three
The semiconductor cooling device 5 is attached to the above via a filling layer 4 made of a thermal compound such as grease.
A heat radiation fin 8 is attached to the bottom of the heat transfer plate 7 of the cooling device body 6 of the semiconductor cooling device 5. This heat radiation fin 8
2, has a screw-shaped refrigerant guiding wall 9 as shown in the drawing when viewed from above, the central portion projects, and a plurality of the refrigerant guiding walls 9 are arranged obliquely downward. It has become a form. The coolant 11 such as water sprayed from the nozzle 10 located above the radiating fins 8 collides with the radiating fins 8 and is radially and evenly divided in the central portion of the radiating fins 4, and then collides with the refrigerant guiding wall 9. A rotational movement about the direction is applied. In addition, the semiconductor cooling device 5
A bellows 12 is attached to the upper end of the cooling device body 6 to absorb stress. According to the present embodiment, since the refrigerant 11 that makes the collision movement by the heat radiation fins 8 is subjected to the rotational movement, it is possible to increase the effective heat transfer area, and thereby the heat transfer efficiency can be improved.

Example 2. Another embodiment of the present invention will be described with reference to FIG. In the embodiment shown in FIG. 3, a spiral wall portion 13 is provided on the inner wall surface of the tube of the nozzle 10 so that the refrigerant 11 is preliminarily subjected to rotational motion before the refrigerant 11 is jetted to the chip carrier 3. Example 3. Another embodiment of the present invention is shown in FIG.
This will be described with reference to (b). In the embodiment shown in FIG. 4, the refrigerant is ejected from a nozzle having an ejection port capable of ejecting the refrigerant from different directions.
That is, an injection port 14 composed of a collision flow injection port and a rotary flow injection port is provided in the lower part of the nozzle 10 so that rotary motion is applied when the refrigerant is injected from the nozzle 10.

Example 4. The embodiment shown in FIG.
An agitator 16 having a propeller 15 is provided in the vicinity of 0 in the vicinity of the end portion thereof so that the refrigerant 11 is forcibly subjected to rotational motion. Although the invention made by the present inventor has been specifically described based on the embodiments, the invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say. For example, in Example 4 or the like, a heat dissipation fin may be added. Further, the cooling device main body in the example of FIGS. 1 to 5 may be an open system, or a gas cooling system may be used instead of the liquid cooling system. In addition, in the above description, it is more effective to reduce the heat transfer loss by making the cross-sectional shape of the side surface of the cooling device main body circular to prevent the generation of local vortices. In the above description, the case where the invention made by the present inventor is mainly applied to the chip carrier type semiconductor device which is the field of application which is the background has been described, but the present invention is not limited to this, and to other semiconductor devices, etc. Can also be applied to.

[0009]

The effects obtained by the representative ones of the inventions disclosed in this application will be briefly described as follows. According to the present application, the refrigerant collides with the heat transfer surface while being accompanied by the rotational movement around the traveling direction, which is an effect that the heat transfer efficiency can be improved.

[Brief description of drawings]

FIG. 1 is a schematic sectional view of an essential part showing an embodiment of the present invention.

FIG. 2 is a top view showing an embodiment of the present invention.

FIG. 3 is a schematic sectional view of an essential part showing an embodiment of the present invention.

FIG. 4 is a schematic sectional view of an essential part showing an embodiment of the present invention.

FIG. 5 is a schematic sectional view of an essential part showing an embodiment of the present invention.

[Explanation of symbols]

 1 ... Wiring board 2 ... Solder bump 3 ... Chip carrier 4 ... Filling layer 5 ... Semiconductor cooling device 6 ... Semiconductor cooling device main body 7 ... Heat transfer plate 8 ... Heat dissipation Fin 9 ... Refrigerant guide wall 10 ... Nozzle 11 ... Refrigerant 12 ... Bellows 13 ... Helical wall 14 ... Injection port 15 ... Propeller 16 ... Stirrer

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kanji Otsuka 2326 Imai, Ome-shi, Tokyo Hitachi, Ltd. Device Development Center

Claims (4)

[Claims] 1. When cooling a device by colliding a surface of the semiconductor device requiring heat dissipation (hereinafter referred to as a heat dissipation surface) with a cooling medium, the cooling motion is applied to the cooling medium around the collision direction. A method for cooling a semiconductor device, comprising: 2. The method for cooling a semiconductor device according to claim 1, wherein a cooling device having a screw-shaped coolant guiding wall is opposed to the heat dissipation surface, and the cooling device applies a rotational motion to the coolant. 3. The semiconductor device according to claim 1, wherein the refrigerant is jetted from a nozzle having a plurality of spiral wall portions on the inner wall surface, and the refrigerant is rotationally moved inside the nozzle to collide with a heat dissipation surface of the semiconductor device. Cooling method. 4. The method of cooling a semiconductor device according to claim 1, wherein the cooling medium is jetted from a nozzle having an injection port capable of jetting the cooling medium from a plurality of different directions.