JPH083512B2 - IC inspection system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention is an IC for inspecting an IC (integrated circuit) and selecting good ICs from defective ICs according to the inspection result. Regarding inspection system.

[Prior Art] As an example of such an IC inspection system, there is an IC inspection system capable of simultaneously inspecting a large number of programmable ROMs (EPROM, EEPROM, etc.) capable of erasing stored contents.

In this IC inspection system, a large number of socket boards each having a plurality of IC sockets are mounted, and an indicator such as a lamp is provided corresponding to each IC socket of each socket board. Of each mounted socket board
The IC inserted in the IC socket is inspected, and the result of the inspection is displayed on the corresponding display. For example, a bad IC
Only the display corresponding to the IC socket in which is attached lights up.

The operator identifies the good or bad of the IC based on the display, for example, only the defective IC is extracted from the IC socket and stored in the storage container, then the socket board with only the good IC inserted is removed, and the next Then, the socket board on which the IC to be inspected is inserted is mounted again and the inspection is started.

[Problems to be solved] As described above, it is necessary to sort defective ICs and non-defective ICs with the socket board mounted, and the inspection operation must be interrupted during this sorting operation. I can't.

However, when the inspection operation is accelerated as in recent years,
The time for inserting and removing ICs for sorting becomes longer than the time for inspection operation. As a result, the conventional IC inspection system
There was a problem that the operating rate was significantly reduced.

On the contrary, the sorting operation cannot be continuously performed, and the sorting operation is interrupted by the inspection operation. In addition, only the inspection is performed in advance, the socket boards that have been inspected are accumulated, and when it is convenient after that, the inspection work and the selection work are separately performed so that the time-consuming selection work is intensively performed. I can't. As described above, the conventional IC inspection system has a problem that the efficiency of the entire inspection / selection is poor.

[Object of the Invention] Therefore, an object of the present invention is to improve the operating rate of the system and the efficiency of the entire inspection / selection by enabling IC inspection and selection to be executed in parallel or separately. To provide the IC inspection system.

[Means for Solving Problems] In order to achieve this object, according to the present invention, an IC inspection system includes an inspection device and a sorting device to which a socket board having an IC socket can be attached and detached, respectively, and an inspection result Having a storage device for storing information, the inspection device, means for detecting the identification information unique to the socket board attached to it, and the inspection of the IC inserted in the IC socket of the socket board Means to do
Means for storing the information of the result of the inspection at the address of the storage device determined by the identification information, the sorting device, means for detecting the identification information unique to the socket board attached to it, and its identification It is configured to have a unit for reading out the inspection result information from the address of the storage device determined by the information, and a unit for displaying the read out inspection result information.

[Operation] The information of the inspection result of the IC inserted into the IC socket on the socket board attached to the inspection device is stored in the address of the storage device, which is unique to the socket board. Even if the socket board is removed from the inspection device, the information of the inspection result is stored in the storage device unless the socket board is attached to the inspection device again to perform the inspection.

Then, when the socket board is mounted on the sorting device, the information of the inspection result of the IC inserted in the IC socket, which is stored in the storage device, is read from the storage device and displayed.

Therefore, it is possible to remove the socket board that has been inspected from the inspection apparatus, immediately mount another socket board in the inspection apparatus, and start the inspection.

In addition, in parallel with the inspection operation, or irrespective of the inspection operation, the socket board with the inspected IC is attached to the sorting device, and the defective IC and the non-defective product are classified according to the information of the inspection result. You can sort with IC.

In this way, the inspection operation is not interrupted by the sorting work, and the inspection operation can be continuously executed except when the socket board is attached or detached. The system is significantly improved.

Further, since the inspection and the sorting can be performed separately, for example, the sorting work is continuously performed in parallel with the inspection, or only the inspection is performed in advance and the socket boards that have been tested are accumulated, and then the It is possible to adopt a work method in which time-consuming sorting work is intensively performed at a convenient time, and the efficiency of the whole inspection / sorting can be improved more than ever.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a conceptual system configuration diagram of an embodiment of an IC inspection system according to the present invention. As shown in this figure, this IC inspection system 10 conceptually includes an inspection device 12,
The storage device 14 and the sorting device 16 are electrically connected to each other.

Physically, each of these devices may be formed as an independent unit, or two or all of them may be integrated into one unit. Furthermore, a host device for controlling each of these devices may be provided.

The inspection device 12 can detachably mount 20 socket boards 18 (this is an example) on the front surface thereof. Since the attachment / detachment mechanism may be the same as that of the conventional EPROM inspection device,
The description and illustration thereof are omitted. Similarly, the sorting device 16
Also, one (or more than one) socket board 18 may be detachably attached to the front surface thereof.

FIG. 2 is a schematic plan view showing an example of the socket board 18. As shown in the figure, the socket board 18 is provided with five IC sockets 22 arranged on the front side of the substrate 20.

The board 20 is provided with an optically detectable mark 24 which is a binary code representing identification information (identification number) unique to the socket board 18. Specifically, the mark 24 is, for example, directly printed on the back surface of the substrate 20 as an optical pattern, or a sticker printed with an equivalent pattern or a sticker filled with a felt pen or the like is attached, and the mark 24 has a high reflectance. It is realized by selectively attaching a seal corresponding to a binary code or selectively forming holes penetrating through the front and back sides corresponding to a binary code.

An optical sensor for optically detecting the mark 24 of such identification information is arranged on the front surface of the inspection device 12 and the sorting device 16, but is not shown in FIG. 1 (third embodiment).
See figure).

Further, on the front surface of the sorting device 16, indicators 26 (five in this example) such as lamps and light emitting diodes are arranged in correspondence with the positions of the IC sockets 22 on the socket board 18 mounted therein. It is set up.

FIG. 3 is a functional block diagram showing a simplified functional structure of essential parts of the inspection device 12, the storage device 14 and the sorting device 16.

In this figure, the inspection device 12 will be described first.
Reference numeral 30 is a socket board corresponding portion corresponding to one socket board 18, and there are 20 in total. All the socket board corresponding parts 30 have the same structure, and five sockets 32 for connecting to the IC socket 22 and a mark of identification information.
The optical sensor 34 for detecting 24 (four in this example)
It consists of

Each socket 32 of each socket board corresponding part 30 has an inspection part 36
, And each photosensor 34 is connected to a sensor circuit 38.

Reference numeral 40 is a register for holding the storage address information of the inspection result information, and the storage address information is the sensor circuit.
Input from 38.

42 is a control unit. The control unit 42 controls the inspection unit 36, the sensor circuit 38, and the register 40.
Further, the controller 42 issues a request for writing the inspection result information to the storage device 14. Reference numeral 41 is a start switch provided in the inspection device 12 (not shown in FIG. 1), and by pressing this switch, a start signal can be given to the control unit 42.

Next, the sorting device 16 will be described. Reference numeral 44 denotes the optical sensor for detecting the mark 24 of the identification information of the socket board 18, and there are five optical sensors in this example. Each optical senna 44 is connected to a sensor circuit 46.

Reference numeral 48 is a register for holding the read address information of the inspection result information output from the sensor circuit 46. 50
Is a read request circuit that sends a read request to the storage device 14 when valid storage address information is output from the sensor circuit 46.

Reference numeral 52 is a display circuit that drives the display device 26 in accordance with the inspection result information output from the storage device 14.

The storage device 14 will be described. 54 is a memory circuit for storing information. Reference numeral 56 is a register for holding write information for the memory circuit 54, and in this case, the write information is information on the inspection result sent from the inspection device 12. Reference numeral 58 is a register for holding address information for reading / writing data from / to the memory circuit 54. The address information is transferred to the register 40 or the register 40 via the multiplexer 60.
Input from 48. Reference numeral 62 is a register for holding the information read from the memory circuit 54. 46 is the inspection device 12
And multiplexer 60 as required by the sorting circuit 16
And a control circuit for controlling the memory circuit 54.

Next, the inspection operation and the selection operation in this IC inspection system 10 will be described.

First, the inspection operation will be described. When the socket board 18 with the IC inserted therein is mounted on the front surface of the inspection device 12 and the start switch 41 is pressed, the control unit 42 starts the inspection operation.

The first socket board corresponding portion 30 is selected by the control portion 42, and the IC inserted in the IC socket 22 of the corresponding socket board 18 is inspected by the inspection portion 36. Also, the optical sensor of the selected socket board corresponding part 30
The output signal of 34 (that is, the detection signal of the identification information of the corresponding socket board 18) is selected by the sensor circuit 38, and the identification information itself (or an addition of an appropriate binary number) is used as address information from the sensor circuit 38. Is output.

When the inspection of the ICs attached to the socket board 18 corresponding to the first socket board corresponding portion 30 is completed, 5-bit inspection result information indicating the quality of the five ICs attached to the socket board 18 is displayed. It is output from the inspection unit 36. A load signal is sent from the control unit 42 to the register 40, and the address information output from the sensor circuit 38 is set in the register 40. Next, the control unit 42 issues a write request signal to the storage device 14.

In response to this write request signal, the control circuit 64 of the memory device 14 sets the information of the inspection result in the register 56, switches the multiplexer 60 to the inspection device 12 side, and changes the address information held in the register 40. The register 58 is set. Then, the control circuit 64 operates the memory circuit 54 in the write mode to store the information of the inspection result of the IC inserted in the first socket board 18 in the unique address of the socket board 18.

When the control circuit 64 receives requests from both the inspection device 12 and the sorting device 16 at the same time, the control circuit 64 preferentially receives the request from the inspection device 12.

In this way, when the writing of the inspection result information related to the first socket board 18 is completed, the control unit 42 selects the second socket board corresponding unit 30 and performs the same control, and the corresponding second IC attached to socket board 18
The information of the inspection result of (1) is stored in the storage device (14).

Similarly, when the operation relating to the socket board 18 corresponding to the last socket board corresponding circuit 30 is completed, the inspection unit 42 stops the inspection operation, and the completion thereof is indicated by an indicator or the like provided in the inspection device 12 (shown in the figure. Notify the worker).

If the operator confirms the completion display, the socket board installed immediately without performing IC sorting work.
It is possible to remove the 18 and mount the socket board 18 on which an IC to be inspected newly is inserted in the inspecting device 12 to start the inspection. As described above, the inspection operation is interrupted only for the time to replace the socket board, so that the operation rate of the IC inspection system 10 is significantly improved as compared with the conventional system.

In parallel with such inspection operation, or separated,
IC can be selected. This sorting operation will be described.

When the tested socket board 18 is mounted on the front surface of the sorting device 16, the mark 24 of the identification information is detected by the optical sensor 44, and the detection signal corresponding to the identification information is input to the sensor circuit 46. As a result, the identification information itself (or the sum of appropriate binary numbers) is output from the sensor circuit 46 as address information. If the address information is valid information, the read request circuit 50 sends a load signal to the register 48, and the address information is set in the register 48. Immediately after that, the storage device
A read request signal for 14 is sent from the read request circuit 50.

In response to the read request, the control circuit of the storage device 14
The multiplexer 64 switches the multiplexer 60 to the register 48 side and sends a load signal to the register 58 to set the address information held in the register 48 in the register 58. Next, the control circuit 64 operates the memory circuit 54 in the read mode and gives a load signal to the register 62 to set the read information in the register 62.

In this way, the information of the inspection result corresponding to the socket board 18 mounted on the sorting device 16 is read from the storage device 14, and the display circuit 52 displays the information according to the information.
26 is driven. For example, the display corresponding to the defective IC
Only 26 can fire.

Since the worker can distinguish the defective product from the good product and the IC from the display, the defective product and the good product can be distinguished from each other, pulled out from the IC socket 22, and separately stored in a container or the like.

Such a sorting operation can be continuously performed in parallel with the inspection operation without being interrupted by the inspection operation.

Further, since the information of the inspection result of the IC inserted in the socket board 18 is stored in the address unique to the socket board 18, the inspection result information is the same.
Are stored until they are attached to the inspection device 12. Therefore, the socket boards 18 that have been inspected are integrated with the ICs attached, and regardless of the inspection, the socket boards 18 are attached to the sorting device 16 at a convenient time to determine whether the ICs are good or bad.
IC selection work can be performed.

Although one embodiment has been described above, the present invention is not limited to this.

For example, a plurality of sorting devices may be provided, or a plurality of socket boards may be simultaneously attached to the sorting device so that the inspection result information of each can be displayed.
By doing so, the sorting work can be simultaneously performed by a plurality of workers, and the efficiency of the sorting work can be further improved. It should be noted that since such modifications can be easily realized by those skilled in the art from the above description, specific examples thereof will not be presented.

Further, the number of IC sockets provided on the socket board, the method of displaying the identification information, the means for detecting the identification information, the means for displaying the inspection result information, and the like may be appropriately changed.

In addition to this, the present invention can be variously modified and implemented within the scope of the invention.

[Effects of the Invention] As described above, according to the present invention, an IC inspection system has an inspection device and a sorting device to which a socket board having an IC socket can be attached and detached respectively, and a memory for storing information of inspection results. The inspection device has a device, a means for detecting identification information unique to the socket board attached to the device, a means for inspecting the IC inserted in the IC socket of the socket board, and the inspection Means for storing the resulting information at an address of the storage device determined by the identification information, and the selection device is determined by the means for detecting the identification information unique to the socket board attached to the selection device and the identification information. It is configured to have means for reading out information on the inspection result from the address of the storage device and means for displaying the information on the read-out inspection result. From without testing operation by selection operation is interrupted, and it is possible to perform separately a screening inspection.

Therefore, according to the present invention, it is possible to realize an IC inspection system having a high system operation rate and high efficiency of the entire inspection and selection.

[Brief description of drawings]

FIG. 1 is a conceptual system configuration diagram showing an embodiment of an IC inspection system according to the present invention, FIG. 2 is a schematic plan view showing an example of a socket board, and FIG. 3 shows an inspection device, a storage device and a sorting device. It is a functional block diagram which simplifies and shows the functional composition of an important section. 12 ... Inspection device, 14 ... Storage device, 16 ... Sorting device, 18 ... Socket board, 22 ... IC socket, 24 ... Identification information mark,
26 ... Display unit, 34 ... Optical sensor, 36 ... Inspection unit, 38 ... Sensor circuit, 42 ... Control unit, 44 ... Optical sensor, 46 ... Sensor circuit, 50 ...
Read request circuit, 52 ... Display circuit.

Claims (3)

[Claims] 1. An inspection device and a selection device to which a socket board having an IC socket can be attached and detached, respectively, and a storage device for storing information of inspection results, wherein the inspection device is mounted on the socket board. To detect the identification information unique to the socket board and its socket board
It has means for inspecting the IC inserted in the IC socket, and means for storing information on the result of the inspection at the address of the storage device determined by the identification information, and the sorting device is attached to it. Means for detecting identification information unique to the socket board, means for reading out information on the inspection result from the address of the storage device determined by the identification information, and means for displaying information on the read-out inspection result IC inspection system characterized by having. 2. The inspection device is capable of mounting a plurality of socket boards, and the information on the inspection results of the ICs inserted in the IC sockets of the mounted socket boards is unique to each socket board. The IC inspection system according to claim 1, wherein the IC inspection system is configured to be stored at addresses of a storage device determined by information. 3. The identification information unique to the socket board is optically detectable and is displayed on the socket board, and the identification information is optically read by a means for detecting the identification information. The IC inspection system according to item 1 or item 2 in the range.