JPH08339876A - Ic socket - Google Patents

Abstract

PURPOSE: To provide sure electric connection so as to be stabilized, by constituting a socket for an IC package having a bending lead so that two-point contact can be made in a vertical part of the lead. CONSTITUTION: When an IC package is inserted from an upper side relating to a socket main unit, an R-shaped part of a lead and a tapered part 1a of the first contact piece 1 are press bent in an outside direction of the socket main unit. Then a pressing part 1b of the first contact piece comes into contact with an engaging part 2b of the second contact piece 2, to bent also the second contact piece 2 in the outside direction of the socket main unit. When the IC package is moved further downward, the R-shaped part of the lead comes into contact with a tapered part 2a of the second contact piece, to bend the second contact piece 2 further to the outside. The IC package main unit comes into contact with a mounting part of the socket main unit, to bring the lead electrically surely into contact with the contact pieces 1, 2 of a contact pin, also to fix the IC package to the socket main unit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket for mounting an IC package having J-bend type leads and connecting the leads with an external circuit.

[0002]

2. Description of the Related Art An IC having a conventional J-bend type lead
As an IC socket for a package, for example, as shown in FIG. 4, a first contact portion 1c provided on the first contact piece 1 and a second contact portion provided on the second contact piece 2 of a bifurcated contact pin. By sandwiching the R-shaped portions 8a and 8b of the leads from the upper side and the lower side by the 2c, the IC package is
At the same time when the lead 8 and the contact pin are fixed to the socket, the contact pin comes into contact with the lead 8 at two points, so that the lead 8 and the contact pin are surely electrically connected.

In the IC socket shown in FIG. 5, two contact portions 1c and 2c are provided on one contact piece of a contact pin, and the lead 8 is sandwiched between the two contact portions 1c and 2c from the side. At the same time that the IC package is fixed to the socket body 6, the lead 8 and the contact pin are surely electrically connected by contacting the lead 8 at two points.

[0004]

However, in the case of the IC socket shown in FIG. 4, since the first contact portion 1c of the contact pin is in contact with the R-shaped portion 8b of the lead obliquely from above, the socket body 6 When taking out the IC package from the R pin of the lead to the first contact portion 1c of the contact pin
The shaped portion 8b is easily caught and difficult to take out, and the lead 8 may be damaged.

In addition, due to a dimensional error in the manufacture of the IC package, the R-shaped portion 8 of the lead depends on the IC package.
a. The position of 8b may vary, the contact position between the contact pin and the lead 8 may change, and the contact pressure between the contact pin and the lead 8 may change for each IC package. When the contact pressure between the contact pin and the lead changes, the electric resistance of the contact portion also changes. Therefore, in the case of the IC socket shown in FIG. 4, when an IC package mounting test or the like is performed, variations in electrical resistance affect the test results, which may cause inconvenience.

In the case of the IC socket shown in FIG. 5, the two contact portions, the first contact portion 1c and the second contact portion 2c, are brought into contact with the lead 8 only by the one spring portion 9 of the contact pin. First contact portion 1c and second contact portion 2c for 8
Their contact pressures are different, or one of the first contact portion 1c and the second contact portion 2c has the lead 8
There is a case in which the contact resistance does not come into contact with the IC package, and in conducting a mounting test of the IC package or the like, inconvenience may occur due to variations in contact resistance or defective connection.

Further, the contact pin is bifurcated like the IC socket shown in FIG. 4 to provide two contact pieces 1 and 2, and contact portions 1c and 2c provided on the two contact pieces 1 and 2, respectively. In both cases, when the contact is attempted to contact the vertical portion A of the lead 8 shown in FIG. 6 from the side, the dimension of the vertical portion A of the lead 8 is short. A cam for the lead 8 to push and bend the second contact piece 2 of the contact pin toward the outer side of the socket 1 main body 6 when the IC package is inserted into the socket main body 6 from the above direction. Since it becomes impossible to provide the tapered portion 2b as a surface and the state becomes substantially horizontal, there is a problem that the B portion of the lead 8 shown in FIG. 6 is placed on the second contact piece 2.

It should be noted that the base portion of the lead 8 near the IC package body 7 may not be electrically contacted due to burrs during molding of the IC package body 7, so that the portion B of the lead 8 may not be contacted. It is desirable to avoid the connection with the contact pin.

According to the present invention, in an IC socket having a contact pin in which a contact portion is provided on each of two bifurcated contact pieces to make two-point contact, an IC package having a J-bend type lead is placed above. When inserted into the socket body, the lead does not cause troubles such as the lead resting on the second contact portion of the contact pin. Moreover, both contact portions are connected to the lead from the side of the IC package. You can make sure contact, J
It is an object to provide an IC socket for an IC package having a bend type lead.

[0010]

SUMMARY OF THE INVENTION According to the present invention, a contact pin having elasticity is bifurcated to provide two contact pieces, and a first contact piece has a taper portion whose free end portion is inclined inward from above. Is provided to form a first contact portion in the lower portion thereof, the second contact piece is provided with a taper portion inclined from the upper side to the inner side at the free end portion thereof, and is engaged with the first contact piece at the upper portion of the taper portion. The above problem is solved by providing the engaging portion and forming the second contact portion on the lower portion.

[0011]

Operation: An IC having a J-bend type lead with the above structure
When the package is inserted into the socket body from above, the lead first contacts the taper portion provided on the first contact piece of the contact pin. When the IC package is moved further downward, the first contact piece bends toward the outside of the socket body and comes into contact with the engaging portion on the upper portion of the taper portion provided on the second contact piece, and the second contact piece also contacts the socket. Bend to the outside of the body.

When the IC package moves further down,
The lead comes into contact with the second contact portion below the tapered portion of the second contact piece that is already bent outward of the socket body, and further bends the second contact piece outward, so that the IC package body becomes the socket body. It is placed on the socket body by contacting the placing portion provided on the. The first contact portion of the first contact piece and the second contact portion of the second contact piece press the lead from the outside, so that the lead and the contact pin are electrically contacted with each other and the IC package is mounted on the socket body. Fix it.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side view of a contact pin having elasticity according to the present invention. In the figure, 1 is a first contact piece having a tapered portion 1a, a pressing portion 1b bent at the lower end thereof, and a first contact portion 1c having a convex shape, and 2 is a tapered portion 2a having a shorter dimension than the tapered portion 1a. An engaging portion 2b extending from the tapered portion 2a, and a convex second contact portion 2c formed on the bent portion by bending the lower portion of the tapered portion 2a. The second contact piece 3 has a connecting portion 3 extending downward for connecting to an external circuit, 4 a hole for inserting a hook-shaped jig when press-fitting a contact pin into the socket body, 5 a socket body Is a cutout portion for engaging with the positioning portion of.

FIG. 2 is a sectional view showing a state where the contact pin shown in FIG. 1 is attached to the socket body, and FIG. 3 is a partial enlarged view showing a process of attaching the IC package to the IC socket shown in FIG. . In the figure, reference numeral 6 denotes a socket body having a mounting portion 6a, an elongated hole 6b for press-fitting the contact pin shown in FIG. 1, and a convex portion 6c which engages with the cutout portion 5 of the contact pin. There is. Reference numeral 7 is an IC package body, and 8 is a J-bend type lead.

Next, a process of mounting the IC package having the J-bend type lead on the socket body will be described with reference to FIG. First, the above IC is oriented in the direction shown in FIG.
When the package 7 is inserted into the socket body 6 from above, the R-shaped portion 8a of the lead 8 and the taper portion 1a of the first contact piece come into contact with each other, and the first contact piece 1 as shown by the arrow in FIG. The tapered portion 1a of 1 is pushed and bent toward the outside of the socket body 6. Then, as shown in FIG. 3C, the pressing portion 1b of the first contact piece comes into contact with the engaging portion 2b of the second contact piece, and the second contact piece 2 is also bent outward of the socket body 6. .

When the IC package is further moved downward, as shown in FIG. 3D, the R-shaped portion 8a of the lead 8 is formed.
Contacts the tapered portion 2a of the second contact piece that is already bent outward of the socket body 6, and further bends the second contact piece 2 slightly outward of the socket body 6. Then, as shown in FIG. 3 (e), the IC package body 7 contacts the mounting portion 6a of the socket body, and the first contact portion 1c of the first contact piece 1 and the second contact portion 2c of the second contact piece 2c.
Both contact the vertical portion of the lead 8 and the portion A shown in FIG. 6 and pinch the lead 8 from both sides, so that the lead 8 and the contact piece 1.2 of the contact pin are electrically and reliably contacted. At the same time, the IC package is fixed to the socket body 6.

To attach the contact pin shown in FIG. 1 to the socket body 6, first, the contact pin shown in FIG. 1 is inserted into the elongated hole 6b provided in the socket body 6 from above with a weak force. A portion of the bottom of the socket body 6 adjacent to the elongated hole is slightly lightened in advance.
Therefore, by inserting a hook-shaped jig into the hole 4 of the contact pin from the slightly lightened portion and pulling the hook-shaped jig downward with a strong force, the contact pin becomes a long hole. Simultaneously with being press-fitted into the socket 6b, the notch 5 of the contact pin and the protrusion 6c of the socket body are engaged with each other to fix the contact pin to the socket body 6.

[0018]

As described above, since the IC package socket having the J-bend type lead of the present invention can make two-point contact in the vertical portion of the lead, the R-shaped portion of the lead makes contact. Since the contact position between the contact pin and the lead is smaller than that in the conventional IC socket, the contact pressure between the contact pin and the lead does not vary, and the electrical connection is reliable and stable.

When molding the IC package body, the resin that has become a burr may adhere to the base portion of the lead near the IC package body.
In the case of the socket, since there is no contact with the contact pin at the base portion of the lead close to the IC package body, there is no fear of contact failure due to the resin.

[Brief description of drawings]

FIG. 1 is a side view showing an example of a contact pin according to the present invention.

FIG. 2 is a cross-sectional view of essential parts showing a state where the contact pin shown in FIG. 1 is mounted on a socket body.

FIG. 3 is a partial cross-sectional view showing a process of mounting an IC package having a J-bend type lead on the IC socket shown in FIG. 2, (a) before mounting, (b), (c), (d) (E) shows the state of being completely attached while being attached.

FIG. 4 is a sectional view showing an example of a conventional IC package socket having a J-bend type lead.

FIG. 5 is a cross-sectional view showing another example of a conventional IC package socket having a J-bend type lead.

FIG. 6 is a cross-sectional view of a conventional IC package having a J-bend type lead.

[Explanation of symbols]

 1 1st contact piece 1a Tapered part 1c 1st contact part 2 2nd contact piece 2a Tapered part 2b Engagement part 2c 2nd contact part 3 Connection part 4 Hole 5 Notch part 6 Socket main body 7 IC package main body 8 J bend type Reed

[Procedure amendment]

[Submission date] April 26, 1996

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Claims

[Correction method] Change

[Correction content]

[Claims]

Claims (1)

[Claims] 1. An IC mounted with an elastic contact pin formed by bifurcating upward to form a first contact piece and a second contact piece for contacting a J-bend type lead of an IC package. In the socket, the first contact piece is provided with a taper portion inclined from the upper side to the inner side at a free end thereof, and a convex first contact portion is formed at a lower portion thereof, and the second contact piece is provided with the free portion. The end portion is provided with a taper portion that is inclined from the upper side to the inner side, and the upper portion of the taper portion is provided with an engagement portion that engages with the first contact piece, while the lower portion is formed with a convex second contact portion. An IC package socket having a J-bend type lead.