JPH08335755A - Wiring board - Google Patents

Abstract

PURPOSE: To provide a pair of board to be pasted in which the problem of low connection efficiency is solved while enhancing the aligning efficiency and the inspection/confirmation efficiency of shifted connection. CONSTITUTION: A first alignment mark 4 is put on a board 1 and a second alignment mark 5 of different shape and dimensions is put on a board 2 such that they are not overlapped within the allowable dimensional range of shift. When the shift exceeds a standard value, the alignment marks 4, 5 are overlapped and thereby the shifted connection can be determined easily.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board formed by connecting a plurality of printed wiring boards.

[0002]

2. Description of the Related Art FIG. 6 shows the structure of a conventional wiring board of this type. In FIG. 6, reference numeral 21 is a transparent wiring board made of, for example, a flexible board, and 22 is connected to the wiring board 21. Is a wiring board, 26 is a terminal group or a wiring group (hereinafter referred to as a terminal group) printed on each of the wiring boards 21 and 22, and 23 and 24 are marks used for alignment when the terminal groups 26 are superposed. Is. The mark 23 is an example of a mark that is integrated with the terminal group 26, and the mark 24 is an example of a mark that is not integrated. Reference numeral 25 denotes an end surface of the wiring board 22.

Conventionally, the wiring board 2 formed in this way
When the terminal groups 26 of 1 and 22 are superposed on each other without being displaced to a predetermined position, by recognizing the wiring board 22 through the wiring board 21, the marks 23 are superposed on each other without any deviation. By aligning the terminals in the left-right direction and overlapping the terminal groups 26 without displacement in the figure, the positions in the up-down direction can be aligned in the figure. In addition, one side of the mark 24 is the end face 2
By aligning the marks 5 with each other, the positions of the marks 23 can be aligned similarly to aligning the marks 23 with each other.

[0004]

However, in the above-mentioned conventional configuration, by overlapping the alignment marks 23 and 24 of the wiring boards 21 and 22 without shifting, it is possible to prevent the terminal groups 26 from overlapping without shifting. Although it is a configuration to be checked, it is actually very difficult to superimpose it without any deviation, and the operation of superimposing without deviation leads to a reduction in the efficiency of the connection work of the terminal group 26, and a deviation has occurred. Also in this case, the size of the deviation is ambiguous, and it is difficult to compare the deviation with the standard, and the efficiency of the pass / fail judgment is reduced.

The present invention solves such a problem, and does not overlap (connect) without any deviation, but defines the size of the allowable deviation, and connects with deviation within the specified regulation range. By permitting that, a wiring board that can improve the efficiency of each terminal group connection work, and can easily compare the size of the deviation after connection with the standard and improve the efficiency of the pass / fail judgment work. It is intended to be provided.

[0006]

In order to solve the above-mentioned problems, the wiring board of the present invention is usually a hollow annular ring, and if necessary, a box-shaped or elliptical first alignment mark is attached. And a second alignment mark corresponding to the first alignment mark but having a position and shape that do not overlap at the same position on the other substrate that forms a pair. In addition, the gap between the inner line of the first alignment mark and the outline of the second alignment mark is set within the allowable dimension range of the standard value of the misalignment.

[0007]

With this configuration, the first alignment mark and the second alignment mark
By making a difference in shape and size from the alignment mark and connecting within the range where the marks do not overlap, each terminal group can be overlapped within the size range of the position difference, that is, within the standard range of deviation. Further, by changing the shape and dimensional difference of each mark, it is possible to limit the deviation according to the standard of the deviation direction and the deviation dimension unique to each product.

[0008]

EXAMPLE A wiring board according to an example of the present invention will be described below with reference to FIG.

In FIG. 1, 1 is a transparent insulating substrate on which a wiring pattern is printed, 2 is a substrate on which a wiring pattern is printed, 3 is a terminal group printed on each of the substrates 1 and 2, and 4 is a substrate. The first alignment mark printed on 1,
Reference numeral 5 denotes a second alignment mark printed on the substrate 2, which is configured to connect the wirings of the substrate 1 and the wiring of the substrate 2 by connecting the respective terminal groups 3.

Next, the connection of each of the terminal groups 3 is made by connecting the substrate 1 to each other.
When the substrate 2 and the substrate 2 are connected without displacement, the relationship between the first alignment mark 4 and the second alignment mark 5 is shown in FIG.
As described above, the dimensional differences 6 and 7 between the inside of the first alignment mark 4 and the outer shape of the second alignment mark 5 at this time correspond to the standard values of the deviations, respectively. Set it. In FIG. 1, when the first alignment mark 4 and the second alignment mark 5 overlap each other with a vertical dimension difference of 6 or more, the first alignment mark 4 and the second alignment mark are overlapped as shown in FIG. When the vertical portions of 5 overlap, and the horizontal dimension shifts by a dimension difference of 7 or more (not shown), the first alignment mark 4 and the second alignment mark 4 are overlapped.
The left and right portions of the alignment mark 5 of are overlapped.

Further, the first alignment mark 4 and the second alignment mark
When the alignment mark 5 of No. 1 is printed with a conductive substance, when the first alignment mark 4 and the second alignment mark 5 come into contact with each other, they become electrically conductive, and therefore the first alignment mark 4 By electrically and automatically inspecting the continuity between the second alignment mark 5 and the second alignment mark 5, it is possible to automatically determine whether the connection deviation between the substrate 1 and the substrate 2 is acceptable or not.

Further, the lead-out pattern of the lead-out terminals for inspecting the continuity of the first alignment mark 4 and the second alignment mark 5 is shown in FIG. 5 or an example in which the gaps in the vertical direction and the horizontal direction are different from each other as shown in FIG.
This is done by opening a part of the outer circumference of the alignment mark 4 and the deviation cannot be judged in the opened part, so that part is set as another part (in FIG. 4 and FIG. The same effect can be obtained by configuring it so that it is made in advance.

[0013]

As is apparent from the above-described embodiment, the present invention has a configuration in which a pair of substrates are provided with alignment marks having different shape or position dimensions.
Since it is only necessary to position the substrate within the range of this dimensional difference, the positioning efficiency is improved and the connection work efficiency can be improved.

Further, since the above-mentioned dimensional difference is preset to the standard value of the connection deviation, the magnitude of the deviation can be easily compared with the standard value when confirming the quality of the wiring board after connection. In addition, the inspection efficiency and inspection accuracy can be improved, and by printing the alignment marks with a conductive material, each alignment mark will come into contact and become electrically conductive if the size of the deviation exceeds the standard value. Therefore, if the continuity inspection between the respective alignment marks is automatically performed, it becomes possible to automatically determine whether or not the connection deviation is satisfied, which is an excellent effect.

[Brief description of drawings]

FIG. 1 is a plan view showing a wiring board according to an embodiment of the present invention.

FIG. 2 is an enlarged view of an alignment mark in an overlapped state of the embodiment.

FIG. 3 is an enlarged view showing an example of alignment marks in a misaligned and overlapped state of the embodiment.

FIG. 4 is an enlarged view of an alignment mark representing another embodiment of the present invention.

FIG. 5 is an enlarged view of an alignment mark showing another embodiment of the present invention.

FIG. 6 is a plan view showing a conventional wiring board.

[Explanation of symbols]

1 Insulating Substrate 2 Substrate 3 Terminal Group 4 First Alignment Mark 5 Second Alignment Mark 6 Dimensional Difference between First and Second Alignment Marks (Standard Value of Connection Misalignment) 7 First and Second Alignment mark dimension difference (standard value for connection deviation)

Claims (2)

[Claims] 1. A wiring board in which at least two substrates on which terminals or wirings are formed by printing are stacked and connected by laminating and connecting the terminals or wirings, and the boards to be laminated are overlapped. A wiring board in which alignment marks are formed at respective positions, and the pair of alignment marks are formed in different shapes and dimensions that do not overlap each other within the allowable dimension range of the bonding deviation. 2. The wiring board according to claim 1, wherein the pair of alignment marks formed on each board have conductivity.