JPH08330481A - Heat sink device - Google Patents

Abstract

PURPOSE: To materialize high cooling efficiency with small size and space saving, in a heat sink device used for an electronic device. CONSTITUTION: The motor of a cooling fan device 2 is fixed to one side face of a heat sink base 1 by fixing method such as mounting, screwing, press-fitting, etc., and a plurality of fins la projected from the heat sink base 1 are arranged to surround the fan 2b fixed to the rotary shaft of the motor 2a, and these fins la perform the role of the fan casing of the fan 2b, and the motor 2 is arranged between the heat sink base 1 and the fan 2b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink device used for cooling a heating element such as a power transistor.

[0002]

2. Description of the Related Art Conventionally, heat sinks have been used to radiate heat generated by heating elements such as power transistors, power ICs, cement resistors, etc., and to prevent an excessive rise in temperature of these elements.

FIG. 4 is a perspective view of a heat sink to which a heat generating element is attached. In the figure, 11 is a heat generating element such as a power transistor, and 12 is formed of a material having good thermal conductivity such as aluminum. And a plurality of fins 12
a is a heat sink integrally formed.

By the way, it is known that when the heating element such as the power transistor described above is continuously energized and the overall temperature reaches an equilibrium state, the temperature of the heating element follows the following equation.

(T−t) ∝Q / (k * A) where T: heating element temperature t: ambient temperature Q: total heating value of heating element attached to heat sink k: heat dissipation efficiency A: heat sink surface area In order to further lower the temperature of the heat generating element by the heat sink, means such as increasing the surface area of the heat sink or using a cooling fan together to increase the heat radiation efficiency is used.

[0006]

However, in the former method which does not use a cooling fan, heat is mainly radiated by natural convection, and the heat radiation efficiency is poor. In order to obtain a sufficient cooling capacity, the surface area of the heat sink is large and the space is large. It is a problem.

When the cooling fan is used together as in the latter case, the cooling fan 13 is connected to the main body 1 as shown in FIG.
No. 4 is attached to the outer box and some are placed inside the device main body 14 as shown in FIG. 6 so that the heat generating element and the cooling fan are arranged close to each other. Depending on the mounting position, the distance from the heat sink 12 is increased, and the wind from the fan diffuses and
In some cases, the amount of air blown to 2 decreases and the cooling effect deteriorates. Further, in the case where the cooling fan and the heat sink are arranged close to each other inside the device body 14, the amount of air blown to the heat sink is sufficient, but since the cooling fan 13 occupies the space inside the device body 14. However, there is a problem that it becomes a very restriction in mounting other parts.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above-mentioned various problems, to improve the cooling capability of the heat sink and to save space.

[0009]

In order to solve the above-mentioned problems, a heat sink device of the present invention comprises a heat sink base, drive means provided on the heat sink base, and
A fan rotated by the driving means and a plurality of fins provided upright on the heat sink base are provided, and the driving means is arranged between the heat sink base and the fan.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is a heat sink base, a drive means provided on the heat sink base, a fan rotated by the drive means, and an upright position on the heat sink base. A plurality of fins, the driving means is disposed between the heat sink base and the fan, and can increase the length of the heat sink when the size of the heat sink base is the same. Since the heat sink area can be increased, the cooling capacity can be improved without increasing the size of the heat sink device, and space can be saved when mounting inside the equipment. When the efficiency is the same, the heat sink device can be made smaller and thinner.

Embodiments of the present invention will be described below with reference to the drawings. (Embodiment 1) FIGS. 1 to 3 show a first embodiment of a heat sink device of the present invention. In the figure, 1 is a heat sink base, and one side of the heat sink base 1 is mounted with a motor 2a of a cooling fan device 2
It is fixed by a fixing method such as press fitting, and the heating element 3 can be attached to the other side surface. Further, the plurality of fins 1a protruding from the heat sink base is a fan 2 fixed to the rotation shaft of the motor 2a.
It is arranged so as to surround b, and this fin 1a also serves as a fan casing of the fan 2b.

In the heat sink device of this embodiment constructed as described above, the heat generated from the heating element 3 is diffused by heat conduction to the entire heat sink base 1 including the fins 1a. The wind induced by the fan 2b takes heat while flowing along the outer wall of the fin 1a as shown by the arrow in FIGS. 1 and 2, and flows out of the heat sink base. Further, the heat of the motor 2a is also diffused to the entire heat sink substrate 1 by heat conduction and is taken away by the wind of the fan 2b.

By the way, in this embodiment, since the heat sink and the cooling fan device are integrally formed, the wind of the fan 2b can be directly and effectively applied to the fin 1a, and the efficiency of heat radiation from the fin 1a can be improved. Can be dramatically increased.

Therefore, when the cooling capacities of the heat sinks are the same, the shape of the heat sink can be made smaller and thinner.

Further, since the fan casing of the fan 2b is composed of the fins 1a, the size as a whole does not change so much even though the heat sink base 1 and the cooling fan device are integrated.

Therefore, even if the heat sink device is arranged inside the main body of the apparatus, no restriction is imposed on other components in mounting, and a large space saving can be realized in combination with the miniaturization of the heat sink described above. The device can be made smaller and thinner.

Of course, the type of fan used may be any of axial flow, centrifugal flow, oblique flow, cross flow, and the like.

[0018]

As apparent from the above description,
The heat sink device of the present invention comprises a drive means provided on the heat sink base, a fan rotated by the drive means, and a plurality of fins erected on the heat sink base, and the drive means is provided between the heat sink base and the fan. Since it is installed in the
It has an excellent effect that it can be made thin and a large space can be saved.

[Brief description of drawings]

FIG. 1 is a front view of a heat sink device according to an embodiment of the present invention.

FIG. 2 is a sectional view of a heat sink device according to the same embodiment.

FIG. 3 is a rear view of the heat sink device according to the same embodiment.

FIG. 4 is a perspective view of a conventional heat sink.

FIG. 5 is a diagram showing a state in which a cooling fan is mounted on an outer box of the device;

FIG. 6 is a diagram showing a state in which a cooling fan is arranged inside a device so as to face a heat sink.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat sink base 1a Fin 2 Cooling fan 2a Motor 2b fan 3 Heat generating element

Claims (1)

[Claims] 1. A heat sink base, a drive means provided on the heat sink base, a fan rotated by the drive means, and a plurality of fins provided upright on the heat sink base, the drive means comprising: A heat sink device arranged between a heat sink substrate and the fan.