JPH08330187A - Composite electronic device - Google Patents

Abstract

PURPOSE: To provide a thin miniature composite electronic device including a plurality of capacitors having significantly different capacity employing a dielectric of different permittivity. CONSTITUTION: Dielectrics 12, 13, 14 of different permittivity are arranged in a same layer. Capacitors 3, 4, 5 are arranged such that the dielectrics 12, 13, 14 of different permittivity are interposed between the inner electrodes 9a and 9b, 10a and 10b, and 11a and 11b of different capacitors 3, 4, 5. Consequently, a plurality of capacitors 3, 4, 5 having significantly different capacity are formed in a same layer.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component using a dielectric material and having a plurality of capacitors or a plurality of capacitors and a resonator, an inductor or the like built therein.

[0002]

2. Description of the Related Art When a plurality of capacitors or the like are built in a ceramic dielectric material by using a thick film forming method such as a printing method or a sheet method, it is conventionally constituted by a single material dielectric. It is common. As a special one, JP-A-3
As described in JP-A-35515, there is a capacitor in which a dielectric having a low dielectric constant is interposed between capacitors formed in the same layer to reduce capacitive coupling between adjacent capacitors in a lateral direction. Further, Japanese Patent Publication No. 5-25399 discloses a structure in which two or more types of dielectrics having different permittivities are vertically stacked and a capacitor having a significantly different frequency is configured as one chip.

[0003]

However, when one chip (including the case where it is used as a substrate) is composed of a plurality of capacitors with a dielectric material having one dielectric constant, or Japanese Patent Laid-Open No. 3-35515. As described in (3), when a low dielectric constant material is arranged between adjacent capacitors, capacitors with various capacities having significantly different capacities cannot be built in. For this reason, a capacitor with a large capacitance is configured as a separate component, and this is soldered to a mother board or a composite electronic component is mounted on the board as a substrate. When the number of capacitors used increases, the manufacturing process becomes complicated, and the occupied space as a whole becomes large.

On the other hand, as described in Japanese Patent Publication No. 5-25399, when a dielectric material having different permittivities in the stacking direction is provided to realize a capacitor having a significantly different capacitance, the thickness becomes large. Therefore, it is difficult to meet the recent demand for thinning. In particular, when a resonator other than a capacitor is to be integrally superimposed and formed as in a device-embedded substrate such as a voltage-controlled oscillator of a mobile phone, which is built in a portable device, the thickness of the laminated body is large. Therefore, it becomes more and more difficult to meet the demand for thinning. Also,
In the case of realizing multiple capacitors that have significantly different capacitances by stacking dielectrics with different dielectric constants in the stacking direction, the area of the chip was tentatively increased to reduce the number of capacitor layers in order to achieve thinning. Then, the stacking and drying steps are repeated by using the printing method or the sheet method, the capacitance value is measured in the middle of this repeating step, and the dielectric thickness and the electrode area in the subsequent stacking step are determined according to the capacitance value in the middle. When trying to suppress a certain capacitance value before firing by adjusting the capacitance value, when the number of laminated layers is small, this capacitance adjustment becomes difficult, the capacitance value varies, and the yield deteriorates. There is a problem.

In view of the above-mentioned problems, the present invention enables miniaturization and thinning when a composite electronic component including a plurality of capacitors having greatly different capacities is formed by using dielectrics having different permittivities. The purpose is to provide a structure.

[0006]

In order to achieve this object, the composite electronic component of the present invention has dielectrics having different permittivities arranged in the same layer, and the dielectrics having different permittivities are different from each other. By arranging the capacitors so as to be interposed between the internal electrodes of the capacitors, a plurality of capacitors having significantly different capacities are formed in the same layer. In the present invention, in order to reduce the coupling between adjacent capacitors, a dielectric having a dielectric constant lower than those of these dielectrics is integrated between the dielectrics having different dielectric constants forming the capacitors and in the outer cover portion of the composite electronic component. The structure of arranging is adopted. When the stripline resonator is integrally superimposed on the laminated portion in which the plurality of capacitors are arranged, a dielectric material having a lower dielectric constant than the dielectric material between the ground electrodes is arranged around the stripline resonator. It is preferable to install it. In the present invention, when dielectrics having different dielectric constants are formed in the same layer, dielectric layers having different dielectric constants can be easily formed in the same layer by alternately printing dielectrics having different dielectric constants. Further, since the composite electronic component is integrally fired, a highly reliable component can be obtained. In addition, the present invention is not only configured as a chip-shaped composite electronic component, but a conductor and a thick film resistor are printed on the surface of a laminate forming the composite electronic component to form a substrate, and the electronic component is mounted on the substrate. The structure is also realized.

[0007]

According to the present invention, the dielectrics having different dielectric constants are arranged in the same layer, and the dielectrics having different dielectric constants are interposed between the internal electrodes of different capacitors. Significantly different capacitors are formed within one chip. Further, since the dielectrics having the dielectric constants corresponding to the magnitude of the capacitance are formed side by side, the number of laminated layers of the entire chip can be small, and thinning can be achieved. Further, a capacitor having a large capacity is also integrated into a chip by using a conventional production line such as a printing method, not as a separate component, so that miniaturization can be achieved.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A is a perspective view showing an embodiment of a composite electronic component according to the present invention, FIG. 1B is a sectional view taken along line EE of FIG.
FIG. 2 is an exploded perspective view for explaining the material of the composite electronic component in relation to the manufacturing method as well. Reference numeral 1 denotes a laminated body manufactured by a printing method or a sheet method. As shown in FIG. 1 (B), a stripline resonator 2 is built therein, and the resonator is superposed on the resonator 2 and integrally formed. A plurality of capacitors 3, 4, 5 are formed side by side on the same layer. The dielectric 8 between the ground electrodes 6a and 6b of the resonator 2 and the strip conductors 7a and 7b, and the internal electrodes 9a and 9b, 10a and 10b, 11a and 11b of the capacitors 3, 4, and 5, respectively.
The dielectrics 12, 13, and 14 between and are composed of dielectrics having different permittivities. The dielectric 15 between the resonators 2 and between the capacitors 3, 4, and 5 and the outer cover 15 of the laminated body 1 includes the resonator 2 and the capacitors 3,
It is composed of a dielectric material having a dielectric constant lower than that of the dielectric materials 4, 12, 13, and 14.

As an example, for example, a zinc titanate ceramic having a relative permittivity of about 30 is used as the dielectric 8 of the resonator 2, and a relative permittivity of 2 is used as the dielectric 12 of the capacitor 3.
A magnesium titanate-based or zinc titanate-based ceramic of about 0 is used, a strontium titanate-based ceramic having a relative dielectric constant of about 200 is used as the dielectric 13 of the capacitor 4, and a dielectric constant of 14 is used as the dielectric 14 of the capacitor 5. Is about 100, and an alumina ceramic with a relative permittivity of about 5 is used as a low-dielectric-constant dielectric around the resonator 2 and between the capacitors 3 and 5.

Reference numeral 17 is a thick film resistor formed on the surface of the laminate 1, and 18 is a conductor. In addition, in FIG.
Reference numerals 9 to 23 are transistors, diodes, capacitors or resistors or inductors having a larger capacitance, which are mounted on the substrate by using the laminated body 1 as the substrate, and are electronic parts which vary depending on the circuit to be configured. Numerals 25 to 42 are terminal electrodes provided on the side surface of the chip made of the laminated body 1 and connected between the built-in capacitors 3 to 5 and the resonator 2 or between these and the mounted electronic components 19 to 23 and the thick film resistor 17, or It is provided for connection with an external circuit.

The manufacture of this composite electronic component will be described with reference to FIG. FIG. 2 shows one composite electronic component when a large number are taken. As shown in FIG. 2A, the dielectric paste to be the lowest low dielectric layer 15a is adjusted to have a predetermined thickness. After repeating the steps of printing a predetermined number of times and drying, a conductor paste to be the ground electrode 6a having silver or silver-palladium as a conductor is printed thereon, and as shown in FIG. 6a and the strip conductors 7a and 7b, the resonator 2
The dielectric paste forming the low-dielectric-constant dielectric layer 15b around and the dielectric paste forming the dielectric 8a in the resonator 2 are alternately printed a predetermined number of times. On top of that (C)
As shown in, the conductor paste forming the strip conductors 7a and 7b is printed. On top of that, as shown in (D),
Dielectric 8b in resonator 2 on strip conductors 7a, 7b
And the paste forming the low dielectric constant dielectric material 15c around it are alternately printed a predetermined number of times. Then, as shown in (E), a conductor paste to be the ground electrode 6b is printed thereon.

Next, as shown in (F), after the dielectric paste which becomes the dielectric 15d having a low dielectric constant between the resonator 2 and the capacitors 3 to 5 is printed a predetermined number of times so as to have a predetermined thickness, One internal electrode 9a, 1 of each capacitor 3, 4, 5
The conductor paste to be 0a and 11a is printed.

Next, as shown in (G), dielectrics 12 having different permittivities respectively forming capacitors 3, 4 and 5,
The dielectric pastes 13 and 14 and the dielectric paste to be the low-dielectric constant dielectric 15e around the dielectric paste are printed, for example, after the paste of the dielectric 15e is printed, and then the paste of the dielectric 12 is printed. The dielectric 13 paste is printed, then the dielectric 14 paste is printed, and if necessary, these printing steps are repeated one or more times. Next, as shown in (H), a conductor paste to be the inner electrodes 9b, 10b, 11b on the other side of the capacitors 3, 4, 5 is printed.
The printing process of the conductor paste of (F) to the process of (H) are repeated as many times as the number of pairs of the internal electrodes of the capacitors 3, 4, and 5. Next, as shown in (I), a dielectric paste to be the dielectric 15f having a low dielectric constant on the upper layers of the capacitors 3, 4, and 5 is printed a predetermined number of times. Then, Figure 1
After printing the thick film resistor 17 and the conductor 18 shown in (B), each chip is cut and baked, or cut after baking and the terminal electrodes 25 to 42 are provided by baking or plating.

As shown in FIG. 2, ground electrodes 6a, 6
In b, lead-out portions a, b, c, d, e,
f, g, and h are formed, and the terminal electrodes 25, 29, 30 of FIG.
33, 34, 38, 39, 42 are connected. Further, the terminal electrodes 26 and 3 are provided on both ends of the strip conductor 7a, respectively.
7 is connected, and terminal electrodes 28 and 35 are connected to both ends of the strip conductor 7b, respectively. Further, the terminal electrodes 40, 3 are respectively provided on the lead-out portions i, j, k of the internal electrodes 9a, 10a, 11a of the capacitors 3, 4, 5 respectively.
6, 32 are connected to each other, and the other inner electrode 9b, 1
Terminal electrodes 41, 27 and 31 are connected to the lead-out portions m, n and o of 0b and 11b, respectively.

Thus, the dielectrics 12, 13, and 14 having different permittivities are arranged in the same layer, and the dielectrics 12, 13, and 14 having different permittivities are respectively the capacitors 3 and
4, 5 internal electrodes 9a and 9b, 10a and 10b, 11a
By providing the capacitor electrodes so as to be interposed between the capacitors 11b and 11b, it is possible to form a plurality of capacitors having significantly different capacitances in the same layer. In this way capacitors 3, 4, 5
If the capacitors are formed side by side, it is possible to reduce the thickness as compared with the case where capacitors having significantly different capacities are formed vertically by stacking dielectrics having different dielectric constants. In particular, when the resonator 2 is also formed integrally with the capacitors 3, 4, and 5, it has an important effect in that the thickness as a whole is not increased. In addition, since it is not necessary to reduce the number of layers in order to reduce the thickness, as in the case of vertically arranging capacitors having different capacities, the printing process is adjusted while measuring the thickness of each layer to adjust the dielectric or conductor. By printing
It is possible to manufacture a composite electronic component having a capacity value within a predetermined range and having a high yield. Further, since a large-capacity capacitor is also integrated into a chip by using a conventional manufacturing line such as a printing method, instead of being a separate component, miniaturization and simplification of the manufacturing process can be achieved. Also, the capacitor 3,
When the thicknesses of 4 and 5 are different, the shortage can be supplemented with a dielectric having a low dielectric constant according to the maximum thickness of the capacitor.

Further, by making the dielectric material 15 between the adjacent capacitors 3, 4, 5 a dielectric material having a low dielectric constant, the capacitive coupling between the capacitors 3, 4, 5 is reduced, and at the same time, the capacitors 3, 4, 5 are provided. Also, since the dielectric outside the body, that is, around the laminated body 1 is also made to have a low dielectric constant, the capacitive coupling between the terminal electrodes 25 to 42 is reduced, and the adverse effect such as signal propagation due to the capacitive coupling between the capacitors 3, 4, and 5 is adversely affected. Can be reduced, capacitor 3,
4, 5 design becomes easy. Also, each capacitor 3,
Capacitor coupling of 4 and 5 can be reduced, so each capacitor 3,
4, 5 can be arranged close to each other, which contributes to downsizing.

Since the dielectric 15 having a lower dielectric constant than the dielectric 8 between the ground electrodes 6a and 6b is arranged around the stripline resonator 2, the resonator 2 and the capacitors 3, 4, 5 are provided.
It is also possible to reduce the capacitive coupling between and, and prevent adverse effects such as interference between the resonator 2 and the capacitors 3, 4, and 5. The laminated body 1 as described above can also be manufactured by a sheet method. However, according to the printing method as shown in the above embodiment, dielectric pastes having different dielectric constants are printed, and dielectric pastes having different dielectric constants are printed. Since it can be realized only by alternately printing in the areas that have not been formed, manufacturing becomes easy. Further, according to the present invention, since the composite electronic component is integrally fired, a highly reliable one can be obtained. Further, although a structure for realizing dielectrics having different permittivities can be realized by a method such as bonding, a highly reliable composite electronic component can be realized by integrally firing the whole. Further, the conductor 18 and the thick film resistor 17 are printed on the surface of the laminated body 1 so that it can be used as a substrate, and the electronic components 19 to 23 are mounted on the substrate 1, so that the overall size of the hybrid integrated circuit is small. Parts can be configured.

FIG. 3A is a perspective view showing another embodiment of the composite electronic component according to the present invention, and FIG. 3B is its FF sectional view.
FIG. 4 is an exploded perspective view for explaining the material of the composite electronic component in relation to the manufacturing method. The composite electronic component of this embodiment includes dielectrics 50, 51 and internal electrodes 5 having different dielectric constants.
Capacitor 5 consisting of 2a and 52b, 53a and 53b
4, 55 are formed on the same layer, a low dielectric constant dielectric material 15 is arranged between these capacitors 54, 55 and outside, and further, they are stacked on different layers from these capacitors 54, 55 and have different dielectric constants. Dielectric 56 and internal electrode 5
A capacitor 58 composed of 7a and 57b is provided, and the dielectric 15 having a low dielectric constant is provided between the capacitor 58 and the capacitors 54 and 55 and outside the capacitor 58.

In this composite electronic component, as shown in FIG. 4A, one of the internal electrodes 52a of one of the capacitors 54 and 55 is printed after the dielectric paste, which is the lower dielectric 15f having a low dielectric constant, is printed a predetermined number of times. , 53a is printed. Next, as shown in FIG.
4 and 55, the dielectric pastes to be the dielectrics 50 and 51 having different dielectric constants, and the dielectric 1 having a low dielectric constant around them.
The dielectric paste of 5 g, for example, the paste of the dielectric 15 g is printed, then the paste of the dielectric 50 of the capacitor 54 is printed, and then the dielectric 5 of the capacitor 55 is printed.
Print 1 paste and repeat these steps one or more times if necessary. Next, as shown in FIG.
The conductor paste to be the inner electrodes 52b and 53b on the other side of Nos. 4 and 55 is printed. The internal electrode printing step (A) to the step (C) are repeated as many times as the number of logarithms of the internal electrodes 52a and 52b and 53a and 53b of the capacitors 54 and 55.

Next, as shown in FIG.
The low dielectric constant dielectric layer 15h, which is the upper layer of the layers 4 and 55, is printed a predetermined number of times. After that, one internal electrode 5 of the capacitor 58
The conductor paste to be 7a is printed. Next, as shown in (E), a dielectric paste serving as the dielectric 56 that forms the capacitor 58 and a dielectric paste serving as the dielectric 15i having a low dielectric constant around the dielectric paste are, for example, the paste of the dielectric 15i. After printing, the dielectric 56 paste is printed, and if necessary, these steps are repeated one or more times. Next, as shown in (F), a conductor paste to be the other internal electrode 57b of the capacitor 58 is printed. The internal electrode printing step (D) to the step (F) are repeated as many times as the number of logarithms of the internal electrodes 57a and 57b of the capacitor 58.

Next, as shown in FIG.
The dielectric paste to be the upper dielectric layer 15j having a low dielectric constant is printed a predetermined number of times. Subsequent processing is as described above. Internal electrodes 52a, 52b, 53a, 53 shown in FIG.
b, 57a, 57b, and lead-out parts p, r, q, s,
t and u are connected to the terminal electrodes 61, 62, 63, 64, 65, 66 on the side surface of the laminated body 1A shown in FIG. 3A, respectively.

In the present invention, different capacitors are built in dielectrics having different dielectric constants, and one of them has the same dielectric constant.
In some cases, two or more different capacitors are provided side by side or side by side (in the stacking direction). Other than the above embodiments, various modifications and additions such as a capacitor integrally superposed with an inductor can be made.

[0023]

According to the first aspect of the present invention, since the dielectrics having different permittivities are arranged in the same layer in the laminated body to form the respective capacitors, a plurality of capacitors having significantly different capacitances can be formed in the same layer. . If capacitors with greatly different capacities are formed side by side by changing the dielectric constants in this way, it is possible to reduce the thickness compared to the case where capacitors with significantly different capacities are formed vertically by stacking dielectrics with different dielectric constants. Can be achieved. In addition, because it is not necessary to reduce the number of layers in order to reduce the thickness, as in the case where capacitors with different capacities are arranged vertically, the printing process is adjusted while measuring the capacitance value to print the dielectric or conductor. By doing so, it is possible to manufacture a composite electronic component having a capacitance value within a predetermined range and having a high yield. Further, since a large-capacity capacitor is also integrated into a chip by using a conventional manufacturing line such as a printing method, instead of being a separate component, miniaturization and simplification of the manufacturing process can be achieved.

According to the second aspect of the present invention, since the dielectric between the adjacent capacitors is a dielectric having a low dielectric constant, the capacitive coupling between the capacitors can be reduced, and the dielectric outside the capacitors, that is, around the laminated body, can be reduced. The low dielectric constant also reduces capacitive coupling between the capacitor terminal electrodes,
The adverse effects such as signal propagation due to capacitive coupling between capacitors can be reduced, and the capacitors can be easily designed. Further, since the capacitive coupling of each capacitor can be reduced, the capacitors can be arranged close to each other, which contributes to downsizing.

According to the present invention, since the stripline resonator is also formed integrally with the capacitor, the thickness as a whole is not increased, and the stripline resonator is applied to a voltage controlled oscillator or the like mounted on a mobile phone, a mobile wireless communication device or the like. When the component of the invention is used, it has an important effect of facilitating mounting. Further, since the dielectric having a lower dielectric constant than the dielectric between the ground electrodes is arranged around the portion of the dielectric between the ground electrodes through which the strip conductor of the stripline resonator penetrates,
The coupling between the resonator and the capacitor can also be reduced, and interference between the resonator and the capacitor and mutual adverse effects of the characteristics can be prevented.

According to the fourth aspect, the dielectric pastes having different permittivities can be realized by merely printing them alternately on the areas where the dielectric pastes having different permittivity are not printed, which facilitates the manufacturing.

According to the fifth aspect, since the composite electronic component is integrally fired, a highly reliable composite electronic component can be obtained.

According to the sixth aspect of the present invention, since the conductor and the thick film resistor are printed on the surface of the laminated body so that it can be used as a substrate, and the electronic components are mounted on the substrate, the overall size of the hybrid integrated circuit component is small. Can be configured.

[Brief description of drawings]

1A is a perspective view showing an embodiment of a composite electronic component according to the present invention, and FIG. 1B is a sectional view taken along line EE of FIG.

FIG. 2 is an exploded perspective view showing the configuration of the present embodiment.

3A is a perspective view showing another embodiment of the composite electronic component according to the present invention, and FIG. 3B is a sectional view taken along line FF of FIG.

FIG. 4 is an exploded perspective view showing the configuration of the embodiment shown in FIG.

[Explanation of symbols]

1, 1A: laminated body, 2: resonator, 3 to 5, 54, 55,
58: capacitor, 6a, 6b: ground electrode, 7a,
7b: strip conductor, 8, 12, 13, 14, 50,
51, 56: Dielectrics, 9a, 9b, 10a, 10b, 1
1a, 11b, 52a, 52b, 53a, 53b, 57
a, 57b: internal electrodes, 25-42, 61-66: terminal electrodes

Claims (6)

[Claims] Claims: 1. By arranging dielectrics having different dielectric constants in the same layer and arranging the capacitors so that the dielectrics having different dielectric constants are interposed between the internal electrodes of the respective capacitors, A composite electronic component characterized by forming multiple capacitors with significantly different capacities. 2. The dielectric material having a dielectric constant lower than those of the dielectric materials is integrally formed between the dielectric materials having different dielectric constants respectively forming the plurality of capacitors and in the outer cover portion of the composite electronic component. A composite electronic component characterized by being provided. 3. The stripline resonator according to claim 1 or 2, wherein a stripline resonator is integrally superposed on a laminated portion in which the plurality of capacitors are arranged, and a ground electrode of the resonator is provided around the resonator. A composite electronic component comprising a dielectric having a dielectric constant lower than that of the dielectric. 4. The method according to any one of claims 1 to 3,
A composite electronic component, wherein dielectric layers having different dielectric constants are formed in the same layer by alternately printing dielectrics having different dielectric constants in the same layer. 5. The method according to any one of claims 1 to 4,
A composite electronic component, wherein the composite electronic component is obtained by integral firing. 6. The method according to any one of claims 1 to 5,
A composite electronic component, wherein a conductor and a thick film resistor are printed on a surface of a laminate constituting the composite electronic component to form a substrate, and the electronic component is mounted on the substrate.