JPH0832940B2 - Shield plate for thin film forming equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to spattering, CVD, or PVD.
When a thin film is formed by a method such as the one described above, the present invention relates to a shroud plate which prevents the scattered target material from adhering to the inner wall of the vacuum container or the parts in the vacuum.

[Prior Art] As a thin film forming apparatus, a sputtering device, a chemical vapor deposition device, a physical vapor deposition device, etc. are generally known. The most typical sputtering device among them is shown in FIG.

In FIG. 1, 1 is a vacuum container, 2 is a target, 3
Is a substrate (object to be processed) and 4 is a shear plate. Ar ⁺ is made to collide with the target 2 and the scattered target material thus ejected is deposited on the substrate 3 to form a thin film.

At the time of this sputtering, in order to prevent the scattered target material from adhering to the inner wall of the vacuum container 1, a shied plate 4 is generally provided.

Conventionally, the shiny plate 4 is made of stainless steel, and before the target material that is scattered and adheres is peeled off and dropped, the shied plate 4 is made of nitric acid and hydrofluoric acid as a main corrosive mixed acid. The hard plate was washed and the adhering target material was eluted in mixed acid, completely removed, and reused.

[Problems to be solved by the invention]

However, the sushi plate made of the above-mentioned stainless steel plate has poor adhesion with the target material and is easily peeled off, so it needs to be washed frequently, which causes a decrease in the operating rate. When cleaning and reusing the hard plate, there is a problem that stainless steel has insufficient corrosion resistance to a mixed acid mainly composed of nitric acid and hydrofluoric acid and has a short life.

If the target material adhered to the shroud is dropped on the surface of the target without frequent cleaning, the surface of the target will be contaminated and a sputtering thin film of the desired composition can be formed. Because it will not be possible.

Further, in frequent cleaning, the spattering operation must be stopped during the cleaning period, so the operating rate is reduced, and thus the productivity is also reduced. For this reason, it has been desired to develop a shiny board made of a material that does not easily peel off even when the scattered target material adheres to and deposits on the shiny board.

[Means for solving problems]

Therefore, the present inventors have found that the adhesiveness with the scattered target material is good, the peeling is difficult, the period of use without cleaning is long, and the corrosion resistance to a cleaning solution mainly containing nitric acid and hydrofluoric acid is excellent. As a result of conducting research to develop a tassel board, weight% (hereinafter,% means weight%)
And Cr: 25 to 75%, and, if necessary, Fe: 0.1 to 25%, and / or one or more of Ti, Zr, Nb, Mo, W and Cu: 0.1
〜5%, balance: Ni or high chrome nickel alloy made of unavoidable impurities, the shingled plate has good adhesion to the scattered target material, is hard to peel off, and is not washed. It has been found that the usable period of time is long and the corrosion resistance to the cleaning solution mainly containing nitric acid and hydrofluoric acid is excellent.

The present invention has been made based on such findings, and the reasons why the components are limited as described above will be described below.

(A) Cr The Cr component improves the adhesion of the target material and corrosion resistance, but if the content is less than 25%, the adhesion of the target material is insufficient and nitric acid and hydrofluoric acid are the main constituents. Corrosion resistance to the above solution cannot be obtained sufficiently. on the other hand
If the content exceeds 75%, processing is difficult. Therefore Cr
The content was set to 25-75%.

(B) Fe Fe component refines the structure and improves toughness, but if its content is less than 0.1%, it has no effect on the refinement of the structure, while if it exceeds 25%, the σ phase precipitates and becomes brittle. It is not preferable because Therefore, the Fe content is 0.1-25%
I decided.

(C) Ti, Zr, Nb, Nb, Mo, W and Cu These components further improve the corrosion resistance and workability, but if the content is less than 0.1%, the corrosion resistance and workability are not improved, On the other hand, if the content exceeds 5%, no further effect can be obtained. Therefore, the content of the above components was set to 0.1 to 5%.

〔Example〕

Next, the present invention will be specifically described based on Examples.

A high-chromium nickel alloy ingot having the composition shown in Table 1 was prepared by a normal melting method, and then this was hot-rolled normally and then cold-rolled to obtain a high-chrome nickel plate having a thickness of 3 mm. A nickel alloy plate was prepared. The thickness: 3 mm high chromium nickel alloy plate as the substrate, by sputtering with sialon, alumina and silicon nitride as the target, by sputtering to form a thin film on the substrate surface, the result of testing how many batches lead to peeling The results are shown in Table 1.

 The sputtering conditions for one batch are as follows.

Discharge power: 200W, Gas conditions: Ar gas, 1.0 × 10 ^-3 Torr, Sputtering time: 3 hours, Furthermore, the above thickness: 3 mm high chrome nickel alloy plate containing humidity: 60 ° C. HF: 3%, HNO ₃ : 17% A corrosion resistance test was conducted by immersing in an aqueous solution for 365 days and measuring the amount of reduction in the plate thickness. The results are also shown in Table 1.

It should be noted that, in this embodiment, although the sputtering plate of the sputtering device is described, it is not limited to the above sputtering device, and the polishing plate for the thin film forming apparatus of the present invention is a chemical vapor deposition device or a physical vapor deposition device. It can also be used as a shield or a shield for a vapor deposition apparatus such as an apparatus.

〔The invention's effect〕

As shown in Table 1 above, the application of the shroud plate made of the high chromium nickel alloy having the above-mentioned composition to the thin film forming apparatus provides good adhesion to the scattered target material. Since it is difficult to peel off, it can be used many times without cleaning, and since it has excellent corrosion resistance, it has less corrosion due to cleaning and can be repeatedly used for a long time.

[Brief description of drawings]

 FIG. 1 is a schematic sectional view of a sputtering device.

Claims (4)

[Claims] 1. A thin plate for a thin film forming apparatus, comprising a high chromium nickel alloy having a composition of Cr: 25 to 75% by weight, balance: Ni and inevitable impurities. 2. A thin film forming apparatus characterized by comprising a chromium nickel alloy having a composition of Cr: 25 to 75% by weight, Fe: 0.1 to 25% by weight, the balance: Ni and inevitable impurities. Hard board. 3. Cr: 25 to 75% by weight, one or more of Ti, Zr, Nb, Mo, W, and Cu:
A thin plate for a thin film forming apparatus, characterized by being composed of a high chromium nickel alloy having a composition of 0.1 to 5% by weight and the balance: Ni and inevitable impurities. 4. Cr: 25 to 75% by weight, Fe: 0.1 to 25% by weight, one or more of Ti, Zr, Nb, Mo, W, and Cu:
A thin plate for a thin film forming apparatus, characterized by being composed of a high chromium nickel alloy having a composition of 0.1 to 5% by weight and the balance: Ni and inevitable impurities.