JPH08328485A - Image display device manufacturing method and image display device manufactured by the method - Google Patents

Abstract

PURPOSE: To obtain a large screen in which image quality is not degraded in combined boundary parts by forming element forming ingredients while providing margin parts on respective plural small substrates to be combined and thereafter be combining small substrates after removing margin parts by cuttings to make combined parts of small substrates not become edge parts of small substrates at the time of forming element forming ingredients. CONSTITUTION: In an image display device manufacturing method in which element forming ingredients are formed on plural small substrates 1a to 1d and the rear plate of an image display device is formed by combining respective small substrates 1a to 1d, element forming ingredients are formed by making marging parts 201 on respective substrates 1a to 1d. Then, the margin parts 201 are removed by cuttings and small substrate 1a to 1d are mated each other by smoothing cut surface formed by cuttings and fixing substrates common to all small substrates 1a to 1d are stuck to element forming ingredient forming surfaces of respective small substrates 1a to 1d and the surfaces opposite to the surfaces. Moreover, the surface roughnesses of mated surfaces of small substrates 1a to 1d are made to be <=10μm.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image forming apparatus having an image forming element substrate composed of a plurality of small substrates and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, as a technique for realizing a flat display device, a simple matrix display device (LED), a thin film transistor liquid crystal display device (TFT / LCD), a plasma display (PDP), a low speed electron beam fluorescent display tube ( VFD) and multi-electron source flat CRT.

Below, as an example of the above-mentioned display technology, P
The DP surface discharge display device will be described.

In the PDP, a gas mainly containing neon is enclosed in a space hermetically sealed by a front glass, a rear glass and a partition, and a voltage is applied between the anode and the cathode electrodes with respect to the enclosed gas. The neon emission generated at that time is applied to a display.

Recently, attempts have been made to increase the screen size of the PDP. Therefore, as a substrate manufacturing method that can cope with large screens without the need for equipment for large substrates, combine a plurality of small substrates for one of a pair of facing glass substrates forming a gas filled space. There has been proposed a method of manufacturing a substrate by such a method.

[0006]

However, when, for example, a photolithography method is used as a process for forming an element on a small substrate, the resist is swelled at the substrate end portion compared to the substrate center portion, and thus the substrate end portion is formed. It was difficult to form the device in.

Further, when the screen printing method is used as another process, if a printed pattern exists at the edge of the substrate, the ink may travel along the edge of the substrate, causing bleeding. However, it was difficult to perform good printing.

Therefore, when a small substrate formed by using the above-described image forming element forming process is combined to cope with a large screen, it is difficult to arrange pixels continuously at the combined boundary portion. There is a problem that the image quality is degraded.

The present invention discloses the results of earnest research in view of the problems of the above-mentioned conventional techniques, and it is possible to increase the screen size by combining small substrates without degrading image quality. An object of the present invention is to provide an image display device manufacturing method that can be realized and an image display device manufactured by using the same.

[0010]

In order to achieve the above-mentioned object, the present invention provides element formation elements on a plurality of small substrates,
In the method of manufacturing an image display device, wherein a rear plate of an image display device is formed by combining the small substrates, the rear plate has a margin portion on each of the small substrates to form the element forming element. A step, a step of removing the blank portion by cutting, a step of smoothing a cutting surface formed by the cutting, a cutting surface of each of the small substrates are combined, and an element forming element forming surface of each of the small substrates. It is characterized in that it is formed by sequentially performing a step of adhering a common fixed substrate to all the small substrates on the opposite surface.

Further, in the smoothing step, the surface roughness of the surface where the small substrates are brought into contact with each other is set to 10 μm or less.

Further, the smoothing method is a mechanical polishing method. Further, the smoothing method is a chemical polishing method. The device is a surface conduction electron-emitting device.

The number of the small substrates is four.

[0014]

In the present invention configured as described above, a plurality of small substrates to be combined are each provided with a blank space to form an element forming element, and thereafter, the blank space is removed by cutting, whereby The combination boundary portion of the substrates does not become an end portion of the small substrate at the time of forming the element forming element, and the image quality does not deteriorate at the combination boundary portion. In addition, since the cut surface formed by cutting is smoothed, small pieces of glass due to cutting that cause defects in the image forming element are not generated when the small substrates are combined.

[0015]

Embodiments In the present invention, after the element forming elements are formed on a plurality of small substrates having margins in advance, the margins of the plurality of small substrates are removed to form end portions on the small substrates. It is possible to form an element forming element at
Further, by aligning the ends of the substrates on which the element forming elements are formed, it is possible to provide the element forming elements also on the combined boundary portion of the small substrates.

When the above-mentioned method is used, the following problems occur when removing the blank portion of the small substrate.

When the scribe groove is provided and the small substrate is split along the scribe groove, or when the margin is removed by a method such as dicing, a small piece of glass with a size of several tens of μm remains on the cut side. However, when the cut surfaces of the small substrates are butted against each other, there is a risk that the small pieces of glass remaining on the cut side may be removed and adhered to the image forming element.
Small pieces of glass shield the element and cause defects in the imaging element. The present invention is characterized in that the cut surfaces are smoothed before the cut surfaces of the small substrates are butted against each other to prevent small pieces of glass from remaining on the cut sides.

That is, by processing the surface roughness of the cut surface to 10 μm or less, it is possible to prevent the small pieces of glass from remaining on the cut side. Thereby, the element defect due to the shielding of the element of the glass piece could be prevented.

Generally, as a method of cutting a blank portion of a small substrate, a method of breaking the substrate after scratching a glass surface with scribe grooves to form a scribe groove, a method of cutting the substrate using a dicing saw, or the like is used. Although a known method can be applied, the smoothing means of the present invention can be suitably applied to any of these cutting methods.

As means for smoothing, a mechanical polishing method using abrasive grains and a polishing machine, and a chemical polishing method utilizing chemical erosion are known.

Abrasive grains used in the mechanical polishing method are selected from materials such as silicon carbide, fused alumina, hard sand, boron carbide, garnet diamond, etc. having an appropriate grain size and hardness. Is used in the form of powder or suspended in an appropriate liquid (free abrasive grains) or fixed with an appropriate binder (fixed abrasive grains). Then, using a polishing machine, the lapping machine rotates in the in-plane direction while the abrasive grains are supplied onto the lapping machine, which is the reference point for polishing.
The work surface is machined by vibrating. As the lapping machine at this time, there are a cast iron plate, a gun metal plate, a hard glass, etc., and they are selected depending on the finished surface accuracy and the like.

The chemical polishing method is a method of chemically eroding the glass surface, and a mixed acid mainly containing hydrofluoric acid is used.

The surface conduction electron-emitting device used in the image display device will be described below with reference to the drawings.

6A and 6B are views showing the basic structure of the surface conduction electron-emitting device, wherein FIG. 6A is a top view and FIG. 6B is a side view.

As shown in FIG. 6, the surface conduction electron-emitting device has a structure in which device electrodes 42 and 43 made of a metal film face each other on a substrate 41 made of an insulating layer and face each other with a predetermined interval. A thin film 44 made of fine particles is arranged across the device electrodes 42 and 43, and an electron emitting portion 45 made of conductive fine particles is provided in the thin film 44.

The fine particles described herein refer to a film in which a plurality of fine particles are adjacent to each other or overlap each other (including an island shape).

Further, the surface conduction electron-emitting device, which is constructed by previously disassembling the conductive fine particles, can be constructed by partially changing the basic manufacturing method. In the embodiments described below, the surface conduction electron-emitting device described above is used as an optimum image forming device.

The method for manufacturing the image display device of the present invention will be described below with reference to examples. (First Embodiment) FIG. 1 is an overall view showing an embodiment of the structure of an element forming element base according to the present invention.

In this embodiment, as shown in FIG. 1, a small glass plate (400 mm × 40 mm) which becomes the element forming element base 1a.
(0 mm), the margin portion 201 provided over two sides, the upper wiring 10, and the lower wiring 9 are mainly configured.

FIG. 2 shows the element forming element substrate 1 shown in FIG.
It is an enlarged view of the vicinity of the image forming element in a.

After cleaning the element forming element substrate 1a, FIG.
As shown in, the lower wiring 9 made of Al having a thickness of 5 μm, the insulating layer 30 made of a glass material having a thickness of 10 μm, and the thickness of 20 μm
The upper wiring 10 and the upper electrode 31 made of Al of m and the thin film 23 made of PdO element fine particles were sequentially formed into an image forming element by a thin film photolithography etching method.

FIG. 3 is a diagram showing the positions of the margins of the small boards to be combined when the screen is enlarged.

With respect to the element forming element substrates 1b to 1d, image forming elements were prepared by the same method as described above. The blank space 201 of each element forming element base is arranged at the position shown in FIG. 3 in the base.

Next, the blank portion 201 was cut out from each of the element forming element substrates 1a to 1d.

Upon cutting the blank portion 201, a resist having a thickness of 7 μm was formed on the element formation surface side to protect the element. Then, the blank portion 201 was cut by known dicing. At this time, use resin bond as the blade #
1000 was used, and the feed rate was 5 mm / min. After that, when the cut surface was observed with an optical microscope, small pieces of glass of 20 to 30 μm remained.

After cutting the margin 201, the cut surface was smoothed.

FIG. 4 is a diagram showing a smoothing method for the element forming element substrate in the present invention.

As shown in FIG. 4, the element forming element substrate 1a
After being fixed by a base fixing means (not shown), the cut surface was brought into contact with the lapping machine 101.

Next, the lapping machine 101 was vibrated in the in-plane direction while supplying molten alumina as abrasive grains onto the lapping machine 101. At this time, # 400 and # 1500 were sequentially used as abrasive grains.

Thereafter, this step is performed by the element forming element base 1
The same was done for the other cut surfaces of a.

After the smoothing was completed, the resist was removed from the element forming element substrate 1a. By the series of steps described above, a good electron-emitting device could be formed in the vicinity of the cut side that is the end of the device forming element substrate.

5A and 5B are views showing an embodiment of the image display device of the present invention. FIG. 5A is a side view and FIG. 5B is a top view.

After carrying out the above-mentioned steps, as shown in FIG. 5, the element forming element bases 1a to 1d were fixed on the supporting base 11 with the adhesive 12 in such a manner that their cut surfaces were aligned. At this time, the face plate 8 on which the phosphor, which is the light emitting body 2, is formed on the image forming element side is disposed above the image forming element 3 via the frame member 6, and the face plate 8, the frame member 6, and the element forming element are formed. Frit glass was applied to each of the joints of the element bases 1a to 1d and sealed. Further, drive processing circuits 5a to 5d are provided on the element forming element bases 1a to 1d, respectively.

When the display of the image was confirmed using the image display device prepared in the above-mentioned process, good display was confirmed.

(Second Embodiment) In the first embodiment, the mechanical polishing method is used as the smoothing method for the element forming element substrate, but in the second embodiment, the chemical polishing method is used. I will describe.

A resist having a thickness of 7 μm was formed on the element forming surface side of the element forming element base for protecting the element, and the margin portion was cut out as in the first embodiment. After that, the cut surface of the element-forming element substrate was smoothed by a chemical polishing method.

At this time, as the polishing liquid, hydrofluoric acid 20%, sulfuric acid 3%, acetic acid 0.5%, sodium dodecylbenzene sulfonate 0.2% was used.

After smoothing was completed, the resist was removed from the element-forming element substrate using a solvent.

When the display of the image was confirmed using the image display device produced in the above-mentioned process, good display was confirmed.

[0050]

As described above, according to the present invention, when the rear plate of the image display device is manufactured, the plurality of small substrates to be combined are provided with the blank portions and the element forming elements, and then the blank portions are formed. By combining after removing by cutting, the combination boundary part of the small substrate does not become the end part of the small substrate when the element forming element is formed, and the image quality does not deteriorate at the combination boundary part. An image forming apparatus for a screen can be provided.

Further, since the cut surface formed by cutting is smoothed, it is possible to prevent the generation of small pieces of glass due to cutting when combining small substrates.
It is possible to prevent the occurrence of defects in the image forming element due to the generated small pieces of glass being removed and adhering to the image forming element.

[Brief description of drawings]

FIG. 1 is an overall view showing an example of a structure of an element forming element base according to the present invention.

FIG. 2 is an enlarged view of the vicinity of an image forming element in the element forming element substrate shown in FIG.

FIG. 3 is a diagram showing a position of a blank portion of a small substrate to be combined in a large screen.

FIG. 4 is a diagram showing a smoothing method of the element forming element base according to the present invention.

5A and 5B are diagrams showing an embodiment of the image display device of the present invention, in which FIG. 5A is a side view and FIG. 5B is a top view.

6A and 6B are diagrams showing a basic configuration of a surface conduction electron-emitting device, in which FIG. 6A is a top view and FIG. 6B is a side view.

[Explanation of symbols]

 1a to 1d Element forming element base 2 Light emitter 3 Image forming element 4 Base connecting part 5a to 5d Drive drive processing circuit 6 Frame member 7 Frame member connecting part 8 Face plate 9 Lower wiring 10 Upper wiring 11 Supporting substrate 12 Adhesive 23 Thin film 30 Insulating Layer 31 Upper Electrode 41 Substrate 42, 43 Element Electrode 44 Thin Film 45 Electron Emitting Section 101 Lapping Machine 201 Blank Area

Claims (7)

[Claims] 1. A method of manufacturing an image display device, comprising forming element forming elements on a plurality of small substrates and combining the small substrates to form a rear plate of the image display device, wherein the rear plate comprises: A step of forming the element forming element by providing a blank portion on each small substrate; a step of removing the blank portion by cutting; a step of smoothing a cut surface formed by the cutting; And a step of adhering a fixed substrate common to all the small substrates to the surface opposite to the element forming element formation surface of each of the small substrates, and forming the image by sequentially performing Manufacturing method of display device. 2. The image display device manufacturing method according to claim 1, wherein in the smoothing step, the surface roughness of the surface where the small substrates are brought into contact with each other is 10 μm or less. Manufacturing method. 3. The method of manufacturing an image display device according to claim 1, wherein the smoothing method is a mechanical polishing method. 4. The method of manufacturing an image display device according to claim 1, wherein the smoothing method is a chemical polishing method. 5. The method of manufacturing an image display device according to claim 1, wherein the element is a surface conduction electron-emitting device. 6. The method of manufacturing an image display device according to claim 1, wherein the number of the small substrates is four. 7. An image display device manufactured by using the method for manufacturing an image display device according to claim 1. Description: