JPH08327517A - Material testing machine - Google Patents

Abstract

PURPOSE: To provide a material testing machine advantageous in terms of cost and operation, allowing a high-speed access and as well ensuring high reliability in selecting a test program (test conditions and data processing method) among various modes. CONSTITUTION: A plurality of semiconductor memory modules 8 are prepared so as to deal with various dedicated programs, and a certain module 8 storing a dedicated program for the required test conditions and data processing method is selected for connection to a microprocessor 1. Then, each section of a testing machine can be controlled on the basis of the required dedicated program only by selecting the program via a program selection means 10. Also, an operation system in the memory 2 of a system can be selected and activated with the means 10, even in the condition where the memory module 8 storing the dedicated program is connected to the microprocessor 1. Furthermore, when the module 8 is connected immediately after the power supply of the system was turned on, the dedicated program stored therein is executed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for appropriately switching a dedicated program (test condition and data processing method) corresponding to various test methods in a material testing machine.

[0002]

2. Description of the Related Art In the field of material testing of general materials, there are various testing methods depending on various materials and the type of data to be collected. Therefore, it is necessary to set the test condition and the data processing method according to the test method in the material testing machine each time.

The types of test methods include simple batch test, low cycle fatigue test, high cycle fatigue test, bending test, crack growth test, static load test, elasto-plastic fracture toughness test, etc. , Young's modulus, maximum stress, stress-
Data such as strain characteristics, crack propagation velocity, K _1C value and J _1C value are collected.

The test conditions of the electric / hydraulic material testing machine are: PID control constants, waveform of load signal, amplitude,
There are average value, load detection amplifier range, etc.

Further, the test conditions of the screw rod type material testing machine include load load speed, load load direction, load detection amplifier range, recorder chart speed, maximum value and minimum value of load load signal in the case of repeated load. There are values etc.

The data processing method includes a data sampling method, a sampling data calculation method, a display method, a printer printing method, and the like.

As described above, the work of setting different test conditions and data processing methods for each test method is very troublesome. In particular, when testing frequently with one material testing machine for the purpose of quality control of various materials, it takes a lot of time to set the test conditions and data processing method,
Not only the workability is bad, but there is a possibility that a setting error will occur.

Therefore, in order to simplify the setting of the test program, conventionally, the following method has been dealt with.

(1) One of them is a method in which several kinds of test programs are stored in a floppy disk and the test programs are selected and loaded as needed. (2) The other one is C in the system of the material testing machine.
This is a method in which one or more test programs are stored in MOS-RAM (with battery backup).

[0010]

However, each of the methods (1) and (2) has the following problems.

In the case of the floppy disk system of (1),
The need for a floppy disk driver is expensive and costly. In addition, there are problems that the operation is not easy, the access time is long, and the floppy disk requires careful handling. In the case of the in-system RAM method of (2), the number of test programs is limited due to its storage capacity. Further, when selecting one from a plurality of test programs, key operation while looking at the display tends to be complicated. In addition, the volume of the display and interrupt programs is increased, the burden on the entire system program is increased, and the program execution time is extended.

Further, when the microprocessor goes out of control for some reason, all the stored test programs are destroyed, which is problematic in terms of reliability.

The present invention has been made in view of the above circumstances, and is advantageous in terms of cost and operation when switching test programs (test conditions and data processing methods) in various ways, and enables high-speed access. It is an object of the present invention to provide a material testing machine with high reliability.

[0014]

According to the present invention, there is provided a microprocessor for controlling each part of a testing machine according to a read program, and an in-system memory having a basic program for a test condition and a data processing method and connected to the microprocessor. , A semiconductor memory module that has a dedicated program for test conditions and data processing method and is connectable / disconnectable to a microprocessor, and a state in which the microprocessor executes the basic program of the in-system memory and a dedicated semiconductor memory module A program selection unit that switches between a state in which a program is executed and a determination unit that detects that the semiconductor module is connected to the microprocessor are provided. Half above Body If the memory module is detected to have been connected to the microprocessor, characterized in that it is configured to execute the dedicated program said semiconductor memory module has.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION In FIG. 1 showing a block diagram of a main part of a material testing machine according to an embodiment of the present invention, 1 is a microprocessor (CP) in a microcomputer.
U), 2 is a ROM storing a system program and a basic program (test conditions and data processing method)
(Read-only memory) 3 is a RAM (random access memory) for storing the obtained data, and ROM 2
The RAM 3 is connected to the microprocessor 1 via an address bus, a data bus, and a control bus. The ROM 2 and the RAM 3 correspond to the in-system memory referred to in the configuration of the invention. Reference numeral 4 is an interface for exchanging signals between the tester main body and the microprocessor 1, 5 is a display such as a CRT or a liquid crystal display device, 6 is a keyboard, and 7 is a recorder such as a printer or plotter. Reference numeral 8 denotes a semiconductor memory module which stores a dedicated program (test conditions and data processing method) and which can be connected to and separated from the microprocessor 1 and can be freely replaced.

A plurality of semiconductor memory modules 8 storing special programs (test conditions and data processing methods) corresponding to various test methods are prepared, each of which is a ROM or a CMO with a backup battery.
The S-RAM is built in a compact package, and a label is attached to the package to show what the stored dedicated program (test conditions and data processing method) is.

The semiconductor memory module 8 has an address bus, a data bus, a control bus, and a connection detection signal line 9 for outputting a "L" level connection detection signal CA when the semiconductor memory module 8 is connected to the microprocessor 1. It is configured to be connected to the microprocessor 1 via the. The connection detection signal line 9 is connected to the DC power supply V _CC via the pull-up resistor R1.

Reference numeral 10 is a program selection means for switching between a state in which the microprocessor 1 executes the basic program in the ROM 2 and a state in which the dedicated program in the semiconductor memory module 8 is executed. This is an internal selection for selecting the basic program inside the system. It comprises a key 10a and an external selection key 10b for selecting a dedicated program outside the system. One ends of these keys 10a and 10b are connected to a DC power supply V _CC via pull-up resistors R2 and R3,
The other end is grounded. The program selection key 10 corresponds to the program selection means in the configuration of the invention.

PL1 is an internal selection display lamp that lights up when the internal selection key 10a is turned on, and PL2 is an external selection display lamp that lights up when the external selection key 10b is turned on. Light emitting diodes are used for the display lamps PL1 and PL2.

FIG. 2 shows a specific structure of the semiconductor memory module 8, where V _CC is +5 V power supply, GND is 0 V power supply, and A
_{0 to} A _n are address buses, D _{0 to} D _n are data buses, C
E is a chip enable terminal, and OE is an output enable terminal (lead terminal) when the semiconductor memory module 8 is a ROM. The semiconductor memory module 8 is R
In the case of AM, the output enable terminal OE becomes the read / write terminal R / W.

As shown in FIG. 3, the internal selection display lamp PL1 is attached to the internal selection key 10a, and the external selection display lamp PL2 is attached to the external selection key 10b.

Next, the operation of this embodiment will be described with reference to the flowchart of FIG.

Step S1 upon power-on of the system
To start the operation from.

In step S1, all states are initialized, and in step S2 it is determined whether the connection detection signal CA is at "L" level.

When the semiconductor memory module 8 is not connected to the microprocessor 1, the CA terminal is connected to the DC power supply V _CC via the pull-up resistor R1.
It becomes "H" level. When the semiconductor memory module 8 is connected, the CA terminal is connected to the GND terminal, so that the CA terminal becomes "L" level.

When the determination in step S2 is NO, the process proceeds to step S3, the L1 terminal is set to "L" level to turn on the internal selection display lamp PL1, and the flag F is set to "IN" (= "0" in step S4). "), The basic program stored in the ROM 2 which is the in-system memory is executed in step S5.

That is, the material test is performed by setting the registers corresponding to the respective parts of the tester main body and controlling the respective parts of the tester main body according to the test conditions and the data processing method by the basic program. The test data obtained by this is stored in the RAM 3.

The transition from step S2 to step S5 means that the basic program used immediately before the end of the previous operation is continuously used when the semiconductor memory module 8 is not connected when the power is turned on.

If the determination in step S2 is YES, the process proceeds to step S6, the L2 terminal is set to "L" level to turn on the external selection display lamp PL2, and the step S7 is performed.
After setting "EXT" (= "1") to the flag F with,
In step S8, the dedicated program (test conditions and data processing method) is read from the semiconductor memory module 8,
It is loaded into RAM3 and RA is executed in step S9.
According to the test conditions and data processing method by the dedicated program stored in M3, the material test is performed by setting the registers corresponding to the respective parts of the tester body and controlling the respective parts of the tester body. Also in this case, the obtained test data is stored in the RAM 3.

From the semiconductor memory module 8 to RA
After the loading of M3 is completed, the semiconductor memory module 8 may be separated from the microprocessor 1 or may remain connected.

In step S10, it is determined whether or not the operation of the tester main body is stopped. If the operation is continuing, the process returns to step S10 to wait for the stop of the test operation.

When the operation of the tester main body is stopped, the process proceeds to step S10, and it is determined whether the internal selection key 10a is turned on or not by the S1 terminal being at "L" level.

When it is turned on, the routine proceeds to step S12, where it is determined whether or not "EXT" is set in the flag F. If NO, that is, the execution of the basic program in the ROM 2 is continued, and step S
Return to 5.

The fact that the flag F is set to "EXT" and the internal selection key 10a is turned on means that the basic program of the ROM 2 is used from the state of using the dedicated program loaded in the RAM 3 in step S8. It means switching to the state.

That is, the process proceeds to step S13, the L2 terminal is set to "H" level to turn off the external selection display lamp PL2, the internal selection display lamp PL1 is turned on in step S14, and the flag F is set to "IN" in step S15. ”
After switching to, the basic program of the ROM 2 is executed in step S16, and the process returns to step S10.

If the internal selection key 10a is OFF in the determination of step S11, the process proceeds to step S17,
It is determined whether or not the external selection key 10b is turned on. When it is OFF, the process returns to step S10,
When it is ON, the process proceeds to step S18, and the flag F is set to "I".
It is determined whether N "is set. If NO, that is, the execution of the dedicated program loaded in the RAM 3 is continued, and step S9 is executed.
Return to

The flag F is set to "IN", and
If the external selection key 10b is turned on, it means R
This means that the state of using the basic program of the OM2 is switched to the state of using the dedicated program stored in the semiconductor memory module 8.

In this case, the process proceeds to step S10 to determine whether the connection detection signal CA is at "L" level.
When the semiconductor memory module 8 is not connected, the basic program cannot be switched to the dedicated program. Therefore, the process returns to step S10 and steps S10 → S11 → are continued until the semiconductor memory module 8 is connected.
The steps S17 → S18 → S19 → S10 are repeated.

When a new semiconductor memory module 8 is already connected by replacement or when a new semiconductor memory module 8 is newly connected, the process proceeds to step S20, where the L1 terminal is set to the "H" level and the internal selection display lamp PL.
1 is turned off, and in step S21, the external selection display lamp PL
Turn on 2.

Next, in step S22, the flag F
Is switched to “EXT”, the dedicated program is read from the semiconductor memory module 8 in step S23, loaded into the RAM3, and the RAM3 is loaded in step S24.
After running the test with the dedicated program stored in
It returns to step S10.

After the loading of the semiconductor memory module 8 into the RAM 3 is completed, the semiconductor memory module 8 may be separated from the microprocessor 1 or may remain connected.

In the above series of operations, in order to switch the used program from the basic program to the dedicated program, (a) the operation of the tester main body is stopped,
(B) The external selection key 10b is turned on,
(C) The case where the semiconductor memory module 8 is connected to the microprocessor 1 and the CA terminal is at the “L” level is satisfied.

On the other hand, there are two ways to switch the used program from the dedicated program to the basic program: (a) the operation of the tester main body is stopped, and (b) the internal selection key 10a is turned on. This is a case where all the conditions are met, and the fact that the CA terminal is at the "L" level is not necessarily a condition.

The flow chart of FIG. 4 shows only a basic basic flow. Actually, the contents of the test conditions in the dedicated program read from the semiconductor memory module 8 are checked, and if the test is performed, When there is an abnormality in the condition, ROM2 is used instead of the test condition.
It performs error handling by setting the default value (standard value) of the basic program stored in.

In the flowchart of FIG. 4, when the dedicated program is selected, the dedicated program of the semiconductor memory module 8 is once written in the RAM 3 which is the in-system memory, and the dedicated program in the RAM 3 is accessed. The present invention is not limited to this, and the semiconductor memory module 8 may be directly accessed without writing the dedicated program in the RAM 3.

In the above embodiment, the number of semiconductor memory modules 8 connected to the microprocessor 1 is one, but instead of this, a plurality of semiconductor memory modules 6 may be connected to the microprocessor 1 simultaneously. It may be configured and any one of them may be selected. In this case, the internal selection key 10a, the external selection key 10b, the internal selection display lamp PL1, and the external selection display lamp PL2 are individually provided for each semiconductor memory module 8.

[0047]

According to the present invention, the following effects are exhibited.

A required semiconductor memory module is selected from a plurality of semiconductor memory modules having a dedicated program corresponding to various test conditions and data processing methods, connected to the microprocessor, and the dedicated program is selected by the program selecting means. It is possible to control each part of the testing machine based on the required dedicated program, and especially when the semiconductor memory module is installed in advance only when the system is powered on. Since the dedicated program in the memory module is selected and executed, the operability at the start of the test can be simplified.

That is, the dedicated program (test condition and data processing method) can be switched in various ways by a very simple operation of selecting and connecting the semiconductor memory module. Since the number of semiconductor memory modules is arbitrary, there is no restriction on the number of types of dedicated programs, which is advantageous as compared with the in-system RAM method of the conventional example (2).

Even if the microprocessor runs out of control and the basic program on the system memory is destroyed, the dedicated program (test conditions and data processing method) itself is stored in the semiconductor memory module. It is possible to improve reliability by avoiding the destruction of all programs (basic program and various dedicated programs) like.

The access to the semiconductor memory module is much faster than the loading from the floppy disk in the conventional example (1), and the conventional example (2).
The workability can be improved as compared with the test program selection work by frequent key operation (in-system RAM system).

In terms of cost, a floppy disk driver is not required for the conventional example (1), and
This is advantageous over the conventional example (2) in that the volume of the display or interrupt program is small, the load on the system program is light and the program execution time is short.

Further, since the semiconductor memory module is packaged, its handling is easier than that of a floppy disk.

As described above, according to the present invention, when the dedicated program (test condition and data processing method) is variously switched, it is advantageous in terms of cost and operation, high speed access is possible, and high reliability is achieved. There is an effect that can be obtained.

[Brief description of drawings]

FIG. 1 is a diagram showing a block diagram of a main part of this embodiment.

FIG. 2 is a diagram showing a configuration of a semiconductor memory module.

FIG. 3 is a diagram showing configurations of an internal selection key and an external selection key.

FIG. 4 is a diagram showing a flowchart for explaining the operation.

[Explanation of symbols]

 1 ... Microprocessor 2 ... ROM (memory in system) 8 ... Semiconductor memory module 10 ... Program selection means 10a ... Internal selection key 10b ... External selection Key

Claims (1)

[Claims] 1. A microprocessor for controlling each part of a testing machine according to a read program, a system memory having a basic program for a test condition and a data processing method and connected to the microprocessor, and a test condition and a data processing method. And a semiconductor memory module that has a dedicated program and is connectable / separable to and replaceable with the microprocessor, and switches between a state in which the microprocessor executes the basic program of the in-system memory and a state in which the semiconductor memory module executes the dedicated program. The semiconductor memory module is provided with a program selecting means and a determining means for detecting that the semiconductor module is connected to the microprocessor, and the semiconductor memory module is the first test after the system is powered on. The material testing machine configured to execute a dedicated program included in the semiconductor memory module when it is detected that the semiconductor memory module is connected to the microprocessor.