JPH0832267A - Case for electronic apparatus - Google Patents
Case for electronic apparatusInfo
- Publication number
- JPH0832267A JPH0832267A JP15867894A JP15867894A JPH0832267A JP H0832267 A JPH0832267 A JP H0832267A JP 15867894 A JP15867894 A JP 15867894A JP 15867894 A JP15867894 A JP 15867894A JP H0832267 A JPH0832267 A JP H0832267A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- cover
- case body
- frequency circuit
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、アンテナに接続する
テレビ共同受信用ブースター、コンバーター、ミキサー
などの電子機器に用いられるケースに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a case used for electronic equipment such as a booster, a converter, and a mixer for joint reception of television connected to an antenna.
【０００２】[0002]
【従来の技術】従来、電子機器用ケース（以下、ケース
と略称する）として、ケース内の高周波回路がケース外
の種々の雑音によって影響を受けないようにするととも
に、ケース外へ不用意に高周波信号を漏らさないように
するため、ケース全体を金属製材料で形成したものが知
られている。2. Description of the Related Art Conventionally, as a case for electronic equipment (hereinafter referred to as a case), a high-frequency circuit in the case is prevented from being affected by various noises outside the case, and a high-frequency wave is carelessly taken out of the case. It is known that the entire case is made of a metal material so as not to leak a signal.
【０００３】[0003]
【発明が解決しようとする課題】しかし、金属製ケース
は、錆の問題があるし、特にカバーの開閉機構を備えた
金属製ケースは、蝶番部分が錆ると、蓋を開いて内部の
電子機器を点検、調整することが困難となる。しかも、
金属製ケースは、重量があるため、取扱いが不便である
し、取付ける支柱や壁面の補強が必要な場合もある。一
方、これら金属製ケースが有する欠点を除くため、ケー
ス全体を合成樹脂製材料で形成することも考えられる
が、回路基板をシールドするため、回路基板を金属製板
材で包んでユニット化する必要があり、製造工程の増加
を招くし、回路基板のメンテナンスが困難となる。However, the metal case has a problem of rust, and in particular, the metal case provided with the opening / closing mechanism of the cover opens the lid to open the electronic case inside when the hinge part rusts. Difficult to check and adjust the equipment. Moreover,
Since the metal case is heavy, it is inconvenient to handle, and it may be necessary to reinforce the columns and wall surfaces to be attached. On the other hand, in order to eliminate the disadvantages of these metal cases, it is possible to form the entire case with a synthetic resin material, but in order to shield the circuit board, it is necessary to wrap the circuit board with a metal plate material to form a unit. Therefore, the number of manufacturing processes is increased, and maintenance of the circuit board becomes difficult.
【０００４】そこで、この発明の目的は、シールド効果
が高く、かつ軽量で錆にくく、メンテナンスが容易な電
子機器用ケースを提供することにある。Therefore, an object of the present invention is to provide a case for electronic equipment which has a high shielding effect, is lightweight, is resistant to rust, and is easy to maintain.
【０００５】[0005]
【課題を解決するための手段】前記目的を達成するため
のこの発明の構成とは、高周波回路基板及び他の回路基
板を収納する電子機器用ケースであって、前面開口の箱
状ケース本体と、このケース本体の開口面にかぶせるカ
バーとを備え、前記ケース本体及びカバーを合成樹脂製
材料で形成し、高周波回路基板の底面を覆う第１のシー
ルド板と、前記高周波回路基板の上面を覆うとともに、
前記第１のシールド板と電気的に導通可能な第２のシー
ルド板とを有することにある。[Means for Solving the Problems] The structure of the present invention for achieving the above-mentioned object is a case for electronic equipment for housing a high-frequency circuit board and another circuit board, and a box-shaped case body having a front opening. A cover that covers the opening surface of the case body, the case body and the cover are made of a synthetic resin material, and a first shield plate that covers the bottom surface of the high-frequency circuit board and an upper surface of the high-frequency circuit board. With
It has a 2nd shield plate which can electrically conduct with the said 1st shield plate.
【０００６】また、前記カバーが、前記ケース本体の高
周波回路基板側を覆う下カバーと、前記他の回路基板側
を覆う上カバーとから成り、前記下カバーが前記ケース
本体の所定箇所を支点にして開閉可能に取付けられてい
ることにある。Further, the cover comprises a lower cover for covering the high-frequency circuit board side of the case body and an upper cover for covering the other circuit board side, and the lower cover uses a predetermined portion of the case body as a fulcrum. It is installed so that it can be opened and closed.
【０００７】[0007]
【作用】ケース本体及びカバーは、合成樹脂製材料で形
成されているため、錆の発生もないし、軽量であるため
取扱いが容易で取付ける支柱や壁面を補強する必要もな
い。しかも、高周波回路基板の底面を覆う第１のシール
ド板及び高周波回路基板の上面を覆う第２のシールド板
を有するため、外来ノイズの影響を受け難いし、高周波
がケース外へ漏れるおそれもない。また、各シールド板
は、高周波回路基板とは別体であるため、高周波回路基
板をユニット化する必要がなく、製造工程を短縮するこ
とができるし、高周波回路基板のメンテナンスも容易で
ある。Since the case body and the cover are made of a synthetic resin material, rust does not occur, and since the case body and the cover are lightweight, they are easy to handle and there is no need to reinforce the columns or wall to be attached. Moreover, since it has the first shield plate that covers the bottom surface of the high-frequency circuit board and the second shield plate that covers the upper surface of the high-frequency circuit board, it is unlikely to be affected by external noise, and high frequencies do not leak to the outside of the case. Further, since each shield plate is separate from the high frequency circuit board, there is no need to unitize the high frequency circuit board, the manufacturing process can be shortened, and the maintenance of the high frequency circuit board is easy.
【０００８】また、前記カバーを前記ケース本体の高周
波回路基板側を覆う下カバーと、他の回路基板側を覆う
上カバーとによって構成し、前記下カバーを前記ケース
本体の所定箇所を支点にして開閉可能に取付けることに
より、調整作業の必要な高周波回路基板側のみを開閉可
能とすることができるため、メンテナンスが容易とな
る。Further, the cover is composed of a lower cover for covering the high frequency circuit board side of the case body and an upper cover for covering the other circuit board side, and the lower cover is a fulcrum at a predetermined portion of the case body. By mounting such that it can be opened and closed, it is possible to open and close only the side of the high-frequency circuit board that requires adjustment work, which facilitates maintenance.
【０００９】[0009]
【実施例】以下、この発明の一実施例を図面に基づいて
説明する。図１は、この発明にかかるケースに高周波回
路基板及び電源回路基板を収納し、集合住宅用のブース
ターを組み立てるところを示す説明図、図２はシールド
板の取付け説明図である。ケース１は、ケース本体２
と、このケース本体２にかぶせるカバー４とを備え、ケ
ース本体２の背面側内部奥方に第１のシールド板３を設
け、さらに高周波回路基板５の上面に設ける第２のシー
ルド板６を備えて構成される。このケース１は図１の右
上方向を上側に、また左下方向を下側にして周知のアン
テナ取付用の支柱や、配電ボックス奥の板壁面などに取
付けられるものである。ケース本体２は、長方形の背面
板部２１の長手方向各側縁に側板部２２を、上方及び下
方の各側縁に天板部２３ａ、底板部２３ｂをそれぞれ立
設した前面開口の箱状に合成樹脂製材料で射出成型さ
れ、その内部は仕切板２ａによって高周波回路基板５を
収容する空間と、電源や調整済の素子を配置した電源回
路基板９を収容する空間とに仕切られている。なお、こ
の仕切板２ａは必ずしも設けなくてもよい。また、背面
板部２１の周縁にはカバー４の開口端縁を当接するつば
部２４が形成され、底板部２３ｂには高周波回路基板５
に取付けられたＦ型接栓５１を突出するための複数の接
栓突出孔２５が形成されている。２６は下カバー４２を
固定するためのネジ孔、２７はブースターを壁面に取付
けるためのネジ挿通用の切欠き部、８はＡＣコードであ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory view showing a case where a high frequency circuit board and a power supply circuit board are housed in a case according to the present invention, and a booster for an apartment house is assembled, and FIG. 2 is an explanatory view of attaching a shield plate. Case 1 is case body 2
And a cover 4 that covers the case body 2, a first shield plate 3 provided inside the back side of the case body 2, and a second shield plate 6 provided on the upper surface of the high-frequency circuit board 5. Composed. The case 1 is attached to a well-known antenna mounting column, a wall surface inside the power distribution box, or the like with the upper right direction in FIG. 1 being the upper side and the lower left direction being the lower side. The case main body 2 has a box-like shape with a front opening in which side plates 22 are provided on the respective side edges in the longitudinal direction of a rectangular back plate 21 and top plates 23a and bottom plates 23b are provided on the upper and lower side edges, respectively. It is injection-molded with a synthetic resin material, and its interior is partitioned by a partition plate 2a into a space for housing the high-frequency circuit board 5 and a space for housing a power supply circuit board 9 on which a power source and adjusted elements are arranged. The partition plate 2a does not necessarily have to be provided. Further, a brim portion 24 that abuts the opening edge of the cover 4 is formed on the peripheral edge of the back plate portion 21, and the high frequency circuit board 5 is formed on the bottom plate portion 23b.
A plurality of contact plug projecting holes 25 for projecting the F-type connector 51 attached to is formed. 26 is a screw hole for fixing the lower cover 42, 27 is a notch for inserting a screw for mounting the booster on the wall surface, and 8 is an AC cord.
【００１０】第１のシールド板３は、高周波回路基板５
の底面形状に対応した形状の基板部３１の相対向する１
組の側縁に側板部３２を、他の１つの側縁に側板部３３
を、残る側縁に複数の舌片３４をそれぞれ立設した一面
開口の箱状に、アルミ、銅、鉄板などの導電性の良い材
料を用いてプレス加工することにより形成されている。
各舌片３４は、第１のシールド板３に高周波回路基板５
を取付けたときに、各舌片間にＦ型接栓５１が位置する
間隔で形成されている。また、基板部３１及び側板部３
３には、高周波回路基板５を取付けるための取付片３ｂ
が形成されている。第１のシールド板３は、取付ネジ３
５をケース本体２の背面板部２１上のネジ孔２８にネジ
止めすることにより取付けられる。そして、Ｆ型接栓５
１を備えた接栓取付部材５３が組付け固定された高周波
回路基板５を用意し、Ｆ型接栓５１の先端がケース本体
２の接栓突出孔２５から突出する状態にして第１のシー
ルド板３の取付片３ｂ上にあるネジ孔３ａに取付ネジ５
ａを用いて取付けると、第１のシールド板３と高周波回
路基板５のアースとが導通し、高周波回路基板５の裏面
側がシールドされる。なお、高周波回路基板５の上には
第２のシールド板６が取付けられる。The first shield plate 3 is a high frequency circuit board 5.
1 of the substrate portion 31 having a shape corresponding to the bottom surface shape of the
The side plate portion 32 is provided on the side edge of the set, and the side plate portion 33 is provided on the other one side edge.
Is formed into a box shape with one surface opening in which a plurality of tongue pieces 34 are respectively erected on the remaining side edges by using a material having good conductivity such as aluminum, copper or iron plate.
Each tongue piece 34 includes a high-frequency circuit board 5 on the first shield plate 3.
When attached, the F-shaped connector 51 is formed between the tongues at an interval. Further, the board portion 31 and the side plate portion 3
3, a mounting piece 3b for mounting the high-frequency circuit board 5
Are formed. The first shield plate 3 has a mounting screw 3
5 is attached to the screw hole 28 on the back plate 21 of the case body 2 by screwing. And F type plug 5
The high-frequency circuit board 5 to which the connector mounting member 53 including 1 is assembled and fixed is prepared, and the tip of the F-type connector 51 is projected from the connector protruding hole 25 of the case main body 2 to form the first shield. The mounting screw 5 is attached to the screw hole 3a on the mounting piece 3b of the plate 3.
When attached using a, the first shield plate 3 and the ground of the high-frequency circuit board 5 are electrically connected, and the back side of the high-frequency circuit board 5 is shielded. A second shield plate 6 is attached on the high frequency circuit board 5.
【００１１】カバー４は、図１に示すように、回路基板
ごとにメンテナンスを行なうことができるように電源回
路基板９側を覆う上カバー４１及び高周波回路基板５側
を覆う下カバー４２から構成される。下カバー４２は、
長方形の前板部４２ａの相対向する１組の側縁に側板部
４２ｂを形成した断面コ字状に、合成樹脂製材料で射出
成型されている。そして、ケース本体２にかぶせたとき
に、各側板部４２ｂの内面がケース本体２の側板部２２
の外面に密着するとともに、側板部４２ｂの端縁がケー
ス本体２のつば部２４上に密着し、防水が図られてい
る。４２ｄは、ケース本体２のネジ孔２６にねじ込んで
下カバー４２をケース本体２に固定するための取付ネジ
である。なお、この下カバー４２は、ケース本体２の側
板部２２に形成された合成樹脂製の蝶番部２ｂを支点と
して取付ネジ４２ｄの側が前方へ開放するように取付け
られる。上カバー４１は、長方形の天板部４１ｃの側縁
の内、相対向する１組の側縁に側板部４１ｂを、前縁に
前板部４１ａをそれぞれ形成した背面及び下面が開口の
箱状に、合成樹脂製材料で射出成型されている。そし
て、ケース本体２にかぶせたときに、各側板部４１ｂ及
び天板部４１ｃの内面が側板部２２及び天板部２３ａの
外面に密着するとともに、側板部４１ｂの端縁がケース
本体２のつば部２４上に密着し、防水が図られている。
上カバー４１の開口した下面の周縁４１ｄは、下カバー
４２の溝が形成されたつば部４２ｃ上に密着し、上カバ
ーと下カバーとの境界から雨水が侵入しないようになっ
ている。As shown in FIG. 1, the cover 4 is composed of an upper cover 41 that covers the power circuit board 9 side and a lower cover 42 that covers the high frequency circuit board 5 side so that maintenance can be performed for each circuit board. It The lower cover 42 is
The rectangular front plate portion 42a is injection-molded with a synthetic resin material into a U-shaped cross section in which side plate portions 42b are formed on a pair of opposite side edges. Then, when the case body 2 is covered, the inner surface of each side plate portion 42b has a side plate portion 22 of the case body 2
The outer edge of the side plate portion 42b is in close contact with the outer peripheral surface of the case body 2, and the edge portion of the side plate portion 42b is in close contact with the outer peripheral surface of the case body 2 for waterproofing. Reference numeral 42d denotes a mounting screw for screwing into the screw hole 26 of the case body 2 to fix the lower cover 42 to the case body 2. The lower cover 42 is attached so that the hinge 42b made of synthetic resin formed on the side plate portion 22 of the case body 2 serves as a fulcrum so that the side of the attachment screw 42d opens forward. The upper cover 41 has a box-like shape in which a back plate and a bottom surface are open, in which side plates 41b are formed on one pair of side edges facing each other and side plates 41a are formed on the front edges of the side edges of the rectangular top plate 41c. Is injection-molded with synthetic resin material. Then, when the case body 2 is covered, the inner surfaces of the side plate portions 41b and the top plate portion 41c closely contact the outer surfaces of the side plate portion 22 and the top plate portion 23a, and the end edges of the side plate portion 41b are joined to the brim of the case body 2. It is in close contact with the portion 24 and is waterproof.
A peripheral edge 41d of the opened lower surface of the upper cover 41 is in close contact with the flange portion 42c of the lower cover 42 in which the groove is formed, so that rainwater does not enter from the boundary between the upper cover and the lower cover.
【００１２】このように、ケース本体及びカバーが合成
樹脂製材料で形成されているため、錆の発生もないし、
蝶番部も合成樹脂製であるため、下カバーが開閉不可能
となることもない。しかも、ブースターの全重量の大半
を占めるケース本体及びカバーが合成樹脂製材料で形成
されているため、金属製ケースに比べてかなりの軽量化
を図ることができ、支柱や配電ボックス奥の板壁面への
取付作業が容易となる。また、第１のシールド板３及び
第２のシールド板６によって高周波回路基板の全体がシ
ールドされるため、ノイズ対策も万全となる。その一
方、ケース本体の背面内側に設ける第１のシールド板３
によってケースの強度が向上するし、高周波回路基板５
はユニット化されていないため、素子の調整や修理など
が容易である。さらに、下カバーを容易に開閉すること
ができるため、高周波回路基板５の調整作業が容易であ
るとともに、そのときでも上カバーは開かないため、電
源回路に誤って手などが触れるおそれもない。As described above, since the case body and the cover are made of the synthetic resin material, no rust is generated,
Since the hinge part is also made of synthetic resin, the lower cover will not be opened or closed. Moreover, since the case body and cover, which occupy most of the total weight of the booster, are made of synthetic resin material, the weight can be considerably reduced compared to the metal case, and the wall surface of the pillar or the power distribution box is deep. To be easily installed. Further, since the entire high-frequency circuit board is shielded by the first shield plate 3 and the second shield plate 6, noise countermeasures are also perfect. On the other hand, the first shield plate 3 provided inside the back surface of the case body
The strength of the case is improved by the high frequency circuit board 5
Since it is not unitized, it is easy to adjust and repair the element. Furthermore, since the lower cover can be easily opened and closed, adjustment work of the high-frequency circuit board 5 is easy, and the upper cover is not opened even at that time, so that there is no risk of accidentally touching the power circuit with a hand or the like.
【００１３】Ｆ型接栓５１は、高周波回路基板５上に取
付けられた金属製の接栓取付部材５３の取付板５３ａの
面上に取付けられ、Ｆ型接栓に同軸ケーブルに取付けら
れた接栓を締着する際に、ストレスが基板の一点に集中
して基板が破損しないようになっている。５３ｂは取付
板５３ａと一体形成された支持板で、接栓取付部材の剛
性を確保している。また、テストポイント用Ｆ型接栓
（以下、ＴＰ用Ｆ型接栓と略する）５２は、取付板５３
ａと一体形成された台座５３ｃに取付けられ、ＴＰ用Ｆ
型接栓に同軸ケーブルに取付けられた接栓を着脱したと
きに、高周波回路基板５にかかるストレスが分散される
ようになっている。第２のシールド板６は、アルミ、
銅、鉄板などの導電性の良い材料で形成され、取付ネジ
挿通孔６５を介して取付ネジ７を接栓取付部材５３のネ
ジ孔５３ｄにねじ込むことにより取付けられる。この第
２のシールド板６は、端部に形成された接触片６１が第
１のシールド板３と接触することにより導通が図られ、
高周波回路基板５の上面側をシールドする働きをする。
６２はＴＰ用Ｆ型接栓５２を突出させるための突出孔、
６３，６４はそれぞれ高周波回路基板５のレベル調整つ
まみ及びゲイン切替スイッチを突出させるための突出孔
であり、各突出孔付近の第２のシールド板６の表面には
電子部品を正しく操作するための表示が印刷されてい
る。なお、下カバー４２の裏面に第２のシールド板６を
取付け、下カバー４２をケース本体２にかぶせると、第
２のシールド板６と第１のシールド板３とが電気的接続
されるよう構成することもできる。The F-type connector 51 is mounted on the surface of the mounting plate 53a of the metallic connector mounting member 53 mounted on the high-frequency circuit board 5, and the F-type connector is connected to the coaxial cable. When tightening the stopper, stress is concentrated on one point of the substrate so that the substrate is not damaged. Reference numeral 53b is a support plate integrally formed with the mounting plate 53a to ensure the rigidity of the plug mounting member. The F-type plug for test point (hereinafter, abbreviated as F-type plug for TP) 52 is a mounting plate 53.
It is attached to a pedestal 53c integrally formed with a
The stress applied to the high-frequency circuit board 5 is dispersed when the connector attached to the coaxial cable is attached to or detached from the mold connector. The second shield plate 6 is made of aluminum,
It is made of a material having good conductivity such as copper or iron plate, and is attached by screwing the attachment screw 7 into the screw hole 53d of the plug attachment member 53 through the attachment screw insertion hole 65. The second shield plate 6 is made conductive by the contact piece 61 formed at the end contacting the first shield plate 3,
It functions to shield the upper surface side of the high-frequency circuit board 5.
62 is a projecting hole for projecting the F-type connector 52 for TP,
Reference numerals 63 and 64 denote projecting holes for projecting the level adjusting knob and the gain changeover switch of the high-frequency circuit board 5, respectively. The surface of the second shield plate 6 near each projecting hole serves to operate electronic parts properly. The display is printed. When the second shield plate 6 is attached to the back surface of the lower cover 42 and the lower cover 42 is placed on the case body 2, the second shield plate 6 and the first shield plate 3 are electrically connected. You can also do it.
【００１４】なお、第１のシールド板３の形状は、図２
に示す一面開口の箱状の他、平板形状でもよい。また、
ケース本体２のつば部２４上にゴム、塩化ビニルなどで
形成されたパッキン材を取付け、防水対策に万全を期す
こともできる。さらに、この実施例のケースをミキサ
ー、コンバーターなど、他の電子機器用として用いるこ
とができるのは勿論のことである。The shape of the first shield plate 3 is shown in FIG.
In addition to the box shape with the one-sided opening shown in FIG. Also,
A packing material made of rubber, vinyl chloride, or the like may be attached on the brim portion 24 of the case body 2 to ensure complete waterproofing. Further, it goes without saying that the case of this embodiment can be used for other electronic devices such as a mixer and a converter.
【００１５】[0015]
【発明の効果】この発明によれば、ケース本体及びカバ
ーが合成樹脂製材料で形成され、錆の発生もないため、
屋外での耐久性が向上する。しかも、金属製ケースに比
べてかなりの軽量となるため、取扱いが容易で、取付け
る支柱や壁面を補強する必要もない。その一方、高周波
回路基板の底面側及び上面側をシールド板によってシー
ルドすることができるため、高周波回路基板が外来ノイ
ズの影響を受けたり、ケース外へ高周波が漏れることも
ない。また、第１のシールド板をケース本体に設けるこ
とによりケースの強度も向上する。さらに、各シールド
板は高周波回路基板とは別体であるため、高周波回路基
板をユニット化する必要がなく、製造工程を短縮するこ
とができるし、高周波回路基板のメンテナンスも容易と
なる。According to the present invention, since the case body and the cover are made of synthetic resin material and rust is not generated,
Improves outdoor durability. Moreover, since it is considerably lighter than the metal case, it is easy to handle, and it is not necessary to reinforce the columns and wall surfaces to be attached. On the other hand, since the bottom surface side and the upper surface side of the high frequency circuit board can be shielded by the shield plate, the high frequency circuit board is not affected by external noise and the high frequency wave does not leak to the outside of the case. Also, the strength of the case is improved by providing the first shield plate on the case body. Furthermore, since each shield plate is separate from the high-frequency circuit board, it is not necessary to unitize the high-frequency circuit board, the manufacturing process can be shortened, and the high-frequency circuit board can be easily maintained.
【図１】この発明にかかるケースを組み立てるところを
示す説明図である。FIG. 1 is an explanatory view showing a case where a case according to the present invention is assembled.
【図２】シールド板の取付けを示す説明図である。FIG. 2 is an explanatory diagram showing attachment of a shield plate.
１・・ケース、２・・ケース本体、２ａ・・仕切板、２
ｂ・・蝶番部、２１・・背面板部、２２・・側板部、２
３ａ・・天板部、２３ｂ・・底板部、２４，４２ｃ・・
つば部、２５・・接栓突出孔、２６，２８，３ａ，５３
ｄ・・ネジ孔、２７・・切欠き部、３・・第１のシール
ド板、３ｂ・・取付片、３１・・基板部、３２，３３・
・側板部、３４・・舌片、３５，４２ｄ，５ａ，７・・
取付ネジ、４・・カバー、４１・・上カバー、４１ａ，
４２ａ・・前板部、４１ｂ，４２ｂ・・側板部、，４１
ｃ・・天板部、４１ｄ・・周縁、４２・・下カバー、５
・・高周波回路基板、５１・・Ｆ型接栓、５２・・ＴＰ
用Ｆ型接栓、５３・・接栓取付部材、５３ａ・・取付
板、５３ｂ・・支持板、５３ｃ・・台座、６・・第２の
シールド板、６１・・接触片、６２，６３，６４・・突
出孔、６５・・取付ネジ挿通孔、８・・ＡＣコード、９
・・電源回路基板。1 ... Case, case body, 2a ... Partition plate, 2
b ・ ・ Hinge part, 21 ・ ・ Back plate part, 22 ・ ・ Side plate part, 2
3a ... top plate part, 23b ... bottom plate part, 24, 42c ...
Collar part, 25..Connecting plug projecting hole, 26, 28, 3a, 53
d ... Screw hole, 27 ... Notch, 3 ... First shield plate, 3b ... Mounting piece, 31 ... Board part, 32, 33.
.Side plates, 34 ... Tongues, 35, 42d, 5a, 7 ...
Mounting screw, 4 ... Cover, 41 ... Top cover, 41a,
42a ... Front plate part, 41b, 42b ... Side plate part, 41
c ... Top plate part, 41d ... Edge, 42 ... Lower cover, 5
..High-frequency circuit board, 51..F type plug, 52..TP
F-type plug, 53 ··· plug mounting member, 53a · · mounting plate, 53b · · support plate, 53c · · base, 6 · second shield plate, 61 · · contact piece, 62, 63, 64 ... Projection hole, 65 ... Mounting screw insertion hole, 8 ... AC cord, 9
..Power supply circuit boards
Claims (2)
する電子機器用ケースであって、前面開口の箱状ケース
本体と、このケース本体の開口面にかぶせるカバーとを
備え、前記ケース本体及びカバーを合成樹脂製材料で形
成し、前記高周波回路基板の底面を覆う第１のシールド
板と、前記高周波回路基板の上面を覆うとともに、前記
第１のシールド板と電気的に導通可能な第２のシールド
板とを有する電子機器用ケース。1. A case for electronic equipment for housing a high-frequency circuit board and another circuit board, comprising: a box-shaped case body having a front opening; and a cover for covering the opening surface of the case body. A cover is formed of a synthetic resin material, and a first shield plate that covers the bottom surface of the high-frequency circuit board and a second shield plate that covers the upper surface of the high-frequency circuit board and is electrically conductive with the first shield plate. Electronic device case having a shield plate of.
回路基板側を覆う下カバーと、前記他の回路基板側を覆
う上カバーとから成り、前記下カバーが前記ケース本体
の所定箇所を支点にして開閉可能に取付けられている請
求項１記載の電子機器用ケース。2. The cover comprises a lower cover that covers the high-frequency circuit board side of the case body and an upper cover that covers the other circuit board side, and the lower cover uses a predetermined portion of the case body as a fulcrum. The electronic device case according to claim 1, wherein the electronic device case is attached so that it can be opened and closed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15867894A JP3331421B2 (en) | 1994-07-11 | 1994-07-11 | Electronic device case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15867894A JP3331421B2 (en) | 1994-07-11 | 1994-07-11 | Electronic device case |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0832267A true JPH0832267A (en) | 1996-02-02 |
| JP3331421B2 JP3331421B2 (en) | 2002-10-07 |
Family
ID=15676979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15867894A Expired - Lifetime JP3331421B2 (en) | 1994-07-11 | 1994-07-11 | Electronic device case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3331421B2 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0946081A (en) * | 1995-07-28 | 1997-02-14 | Nippon Antenna Co Ltd | Electronic apparatus case |
| US6979774B2 (en) | 2003-06-06 | 2005-12-27 | Kabushiki Kaisha Toshiba | Cable modem module and transmitter-receiver |
| US7067734B2 (en) | 2003-06-06 | 2006-06-27 | Kabushiki Kaisha Toshiba | Cable modem module and transmitter-receiver |
| US7159236B2 (en) | 2000-06-30 | 2007-01-02 | Kabushiki Kaisha Toshiba | Transmission/reception integrated radio-frequency apparatus |
| US7207106B2 (en) | 2003-06-06 | 2007-04-24 | Kabushiki Kaisha Toshiba | Method of assembling cable modem device |
| JP2009081277A (en) * | 2007-09-26 | 2009-04-16 | Sharp Corp | Printed circuit board securing structure, and tuner unit |
| US7903429B2 (en) | 2003-08-08 | 2011-03-08 | Siemens Aktiengesellschaft | Housing for receiving printed circuit boards whose components form at least parts of a communication system |
| JP2011086644A (en) * | 2009-10-13 | 2011-04-28 | Hosiden Corp | Shield cover, shield case and substrate module |
| JP2013207143A (en) * | 2012-03-29 | 2013-10-07 | Nohmi Bosai Ltd | Electronic apparatus housing |
| CN108494360A (en) * | 2018-04-13 | 2018-09-04 | 江西新赣能光伏科技有限公司 | Photovoltaic plant is idle zero energy-consuming device |
| CN114069933A (en) * | 2020-07-31 | 2022-02-18 | 日本电产（大连）有限公司 | Drive member and drive system |
-
1994
- 1994-07-11 JP JP15867894A patent/JP3331421B2/en not_active Expired - Lifetime
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0946081A (en) * | 1995-07-28 | 1997-02-14 | Nippon Antenna Co Ltd | Electronic apparatus case |
| US7159236B2 (en) | 2000-06-30 | 2007-01-02 | Kabushiki Kaisha Toshiba | Transmission/reception integrated radio-frequency apparatus |
| US7680509B2 (en) | 2000-06-30 | 2010-03-16 | Kabushiki Kaisha Toshiba | Transmission/reception integrated radio-frequency apparatus |
| US6979774B2 (en) | 2003-06-06 | 2005-12-27 | Kabushiki Kaisha Toshiba | Cable modem module and transmitter-receiver |
| US7067734B2 (en) | 2003-06-06 | 2006-06-27 | Kabushiki Kaisha Toshiba | Cable modem module and transmitter-receiver |
| US7207106B2 (en) | 2003-06-06 | 2007-04-24 | Kabushiki Kaisha Toshiba | Method of assembling cable modem device |
| US7450392B2 (en) | 2003-06-06 | 2008-11-11 | Kabushiki Kaisha Toshiba | Cable modem device and method of assembling the same |
| US7903429B2 (en) | 2003-08-08 | 2011-03-08 | Siemens Aktiengesellschaft | Housing for receiving printed circuit boards whose components form at least parts of a communication system |
| JP2009081277A (en) * | 2007-09-26 | 2009-04-16 | Sharp Corp | Printed circuit board securing structure, and tuner unit |
| JP2011086644A (en) * | 2009-10-13 | 2011-04-28 | Hosiden Corp | Shield cover, shield case and substrate module |
| JP2013207143A (en) * | 2012-03-29 | 2013-10-07 | Nohmi Bosai Ltd | Electronic apparatus housing |
| CN108494360A (en) * | 2018-04-13 | 2018-09-04 | 江西新赣能光伏科技有限公司 | Photovoltaic plant is idle zero energy-consuming device |
| CN114069933A (en) * | 2020-07-31 | 2022-02-18 | 日本电产（大连）有限公司 | Drive member and drive system |
| CN114069933B (en) * | 2020-07-31 | 2024-05-17 | 日本电产（大连）有限公司 | Driving part and driving system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3331421B2 (en) | 2002-10-07 |
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