JP2003298246A - Case for electronic device - Google Patents

Case for electronic device

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Publication number
JP2003298246A
JP2003298246A JP2002096219A JP2002096219A JP2003298246A JP 2003298246 A JP2003298246 A JP 2003298246A JP 2002096219 A JP2002096219 A JP 2002096219A JP 2002096219 A JP2002096219 A JP 2002096219A JP 2003298246 A JP2003298246 A JP 2003298246A
Authority
JP
Japan
Prior art keywords
case
frame
case body
circuit board
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002096219A
Other languages
Japanese (ja)
Other versions
JP3977677B2 (en
Inventor
Kazuo Sugiyama
和生 杉山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maspro Denkoh Corp
Original Assignee
Maspro Denkoh Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maspro Denkoh Corp filed Critical Maspro Denkoh Corp
Priority to JP2002096219A priority Critical patent/JP3977677B2/en
Publication of JP2003298246A publication Critical patent/JP2003298246A/en
Application granted granted Critical
Publication of JP3977677B2 publication Critical patent/JP3977677B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a case for electronic device which is highly effective in shielding, lightweight, hardly rusted, and easy to conduct maintenance. <P>SOLUTION: This case for electronic device is for housing a high-frequency circuit board 5 and other circuit boards. The case is made of an electrically conductive material, and comprises a case body 2 of a box shape with an opened front face and a cover 4 that covers the opened face of the case body 2, wherein a frame 3 is provided, which is made of an electrically conductive material, corresponds to outer dimensions of the high-frequency circuit board 5, and has an opened upper face and an opened bottom face. Concave grooves 2b, 42e are respectively arranged on the inner-face side of the case body 2 and on the inner-face side of the cover 4 at positions that correspond to the edges of the openings of the frame 3 such that the inner-face side of the case body 2 engages with the edge 37 of the bottom-face opening of the frame 3 and the inner-face side of the cover 4 engages with the edge 36 of the upper-face opening of the frame 3. <P>COPYRIGHT: (C)2004,JPO

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明は,主にアンテナに接
続するテレビ共同受信用ブースター,コンバーター,ミ
キサーなどの電子機器に用いるケースに関する。 【0002】 【従来の技術】従来,電子機器用ケース(以下,ケース
と略称する)として,ケース内の高周波回路がケース外
からの種々の雑音によって影響を受けないようにすると
ともに,ケース外へ不用意に高周波信号を漏洩しないよ
うにするため,ケース全体を金属性材料で形成したもの
や,ケースを合成樹脂製材料で形成するとともに,高周
波回路基板を金属性材料で包んでユニット化したものが
知られている。 【0003】 【発明が解決しようとする課題】しかし,従来の金属性
ケースは錆の問題がある。特にカバーの開閉機構を備え
た金属性ケースは蝶番部分が錆びると,カバーを開いて
内部の電子機器を点検・整備することが困難になる。し
かも金属性ケースは重量があるため,取扱いが不便であ
るし,取付ける支柱や壁面の補強が必要な場合もある。
一方,高周波回路基板をユニット化したケースの場合
は,製造工程の増加を招くし,回路基板のメンテナンス
が困難であるといった問題があった。こうした問題点に
鑑み,本発明は,シールド効果が高く,かつ軽量で錆び
にくく,メンテナンスが容易な電子機器用ケースを提供
することにある。 【0004】 【課題を解決するための手段】上記課題を解決するため
に,請求項1の発明は,高周波回路基板及び他の回路基
板を収納する電子機器ケースであって,前記電子機器ケ
ースは,電気的に導通可能な材料で形成された,前面開
口の箱状ケース本体と,このケース本体の開口面にかぶ
せるカバーとからなり,前記高周波回路基板の外形形状
に対応し,上面と底面を開口した電気的に導通可能な材
料で形成された枠体を有し,前記ケース本体の内面側
と,前記枠体の底面の開口端とが嵌合し,前記カバーの
内面側と,前記枠体の上面の開口端とが嵌合するよう前
記ケース本体とカバーの内面側の,前記枠体の開口端と
相対する位置に凹溝を設けるよう構成される。 【0005】 【発明の実施の形態】以下に,本発明を具体化した実施
形態の1例を,図面を基に詳細に説明する。図1は電子
機器ケースとして例示するテレビ共同受信用のブースタ
ーを一部分解した斜視図を示す。図2はテレビ受信用ブ
ースターの斜視図を示す。図3は高周波回路基板を納め
た枠体の斜視図を示す。図4は図2におけるA−A'の
断面図を示す。図5は図2におけるB−B'の断面図を
示す。図6は従来の電子機器のケースの例を一部分解し
た斜視図を示す。 【0006】ケース1は,ケース本体2と,このケース
本体2にかぶせるカバー4とを備え,高周波回路基板5
を収納する枠体3と,電源回路基板6と,をケース本体
2の内面側に収納するよう構成されている。ケース1は
図1の右上方向を上側に,左下方向を下側にして,周知
のアンテナ取付用の支柱や,配電ボックス奥の板壁面な
どに取付けられるものである。ケース本体2は,長方形
の背面板部21の長手方向各縁に側板部22を,上方及
び下方の各側縁に天板部23,底板部24をそれぞれ立
設した前面開口の箱状に形成されており,その材料は,
例えばアルミダイカスト,導電性を有する合成樹脂製材
料,もしくは,表面に導電性材料をメッキ又は塗布した
合成樹脂製材料等の導電性を有する材料で形成されてい
る。また,背面板部21の周縁には,カバー4の開口端
縁を当接するつば部25が形成され,底板部24には,
枠体3に取付けられたF型接栓を突出するための複数の
接栓突出孔26が形成されている。27は下カバー42
を固定するためのねじ孔,28はブースターを壁面に取
付けるためのネジ挿通用の切欠き部,29は背面板部2
1の内面側に設けられた凹溝であり,ACコード7の収
納用として,ケース本体2の底板部24から電源回路基
板6の方向に形成されている。 【0007】枠体3は,高周波回路基板5の外形形状に
対応し,上面と底面とを開口した枠状に形成されたもの
で,アルミ,銅,鉄板などの導電性のよい材料を用いて
プレス加工されたものである。33は枠体3の底板部で
あり,F型接栓34が固定されている。F型接栓34の
固定方法は,ナットを用いても良いし,圧入により固着
する方法でもよく,方法は問わない。尚,本願ではF型
接栓34が枠体3に固定されている例を示しているが,
F型接栓34を高周波回路基板5に固定する方法でも良
い。31,32は枠体3の側板部であり,側板部31,
32には複数個の突出し部3dが設けられ,高周波回路
基板5は突出し部3dに枠体3の上面側から載置された
後,高周波回路基板5のアースと突出し部3dとが半田
付けで固着され,これによって高周波回路基板5のアー
スと枠体3は電気的にも導通する。高周波回路基板5を
収納した枠体3は,枠体3に固着されたF型接栓34の
先端がケース本体2の接栓突出孔26から突出する状態
としてケース本体2に取付けられる。この時ケース本体
2の内面側には,枠体3の底面側の開口端37に相対す
るよう形成された凹溝2bが設けられており,枠体3は
前記凹溝2bに嵌合するよう取付けられる。ケース本体
2は,上述したように,例えばアルミダイカスト,導電
性を有する合成樹脂製材料,もしくは,表面に導電性材
料をメッキ又は塗布した合成樹脂製材料等の導電性を有
する材料で形成されているので,枠体3とケース本体2
は電気的に導通する。また,側板部31には複数個の取
付片3aが形成されており,枠体3は,前記取付片3a
に形成されたネジ孔3bと,ケース本体2の背面板部2
1上の取付部2cに設けられたネジ孔に,取付ネジ3c
でネジ止めすることにより固定される。尚,本願の実施
例では前記取付片3aが枠体3の側板部31に形成され
た例を示しているが,側板部31ばかりでなく,側板部
32にも取付片3aを形成するとともに,ケース本体2
の背面板部21上の,前記側板部32に形成した取付片
3aと相対する位置に取付部2cを設けて,枠体3をケ
ース本体2にネジ止めすることで固定するようにしても
よい。以上により,高周波回路基板5のアースと,枠体
3と,ケース本体2と,が電気的に導通し,高周波回路
基板5の裏面側がシールドされる。尚,高周波回路基板
5と枠体3の固定方法は半田付けの例を示しているが,
枠体3に取付片を設け,高周波回路基板5を枠体3にネ
ジ止めしても良い。 【0008】カバー4は,図1に示すように,回路基板
ごとにメンテナンスを行うことができるように,電源回
路基板6を覆う上カバー41及び高周波回路基板5を覆
う下カバー42から構成される。下カバー42は長方形
の前板部42aの相対向する1組の側縁に側板部42b
を形成した略断面コ字状に,導電性を有する合成樹脂製
材料,もしくは,導電性材料をメッキ又は塗装した合成
樹脂製材料等で形成されている。そして,ケース本体2
にかぶせたときに,下カバー42の各側板部42bの内
面側がケース本体2の側板部22の外面側に密着すると
ともに,側板部42bの端縁がケース本体2のつば部2
5上に密着し,防水を図る。42dは,下カバー42を
ケース本体2に固定する取付ネジであり,ケース本体2
に設けられたネジ孔27にねじ込むことで下カバー42
をケース本体2に固定する。尚,下カバー42は,ケー
ス本体2の側板部22に設けられた蝶番部2aを支点と
して,取付ネジ42d側が前方へ開放するよう取付けら
れている。下カバー42の前板部42aの内面側には,
枠体3の上面側の開口端の形状に相対した凹溝42e
が,下カバー42と一体に形成されており,下カバー4
2をケース本体2に取付ネジ42dで固定したときに,
枠体3の上面側の開放端と,前記凹溝42eと,が嵌合
するよう構成されている。この時下カバー42は,上述
したように導電性を有する合成樹脂製材料,もしくは,
導電性材料をメッキ又は塗装した合成樹脂製材料等で形
成されているので,下カバー42と枠体3とは電気的に
導通し,これにより高周波回路基板の表面側がシールド
される。上カバー41は,長方形の天板部41cの側縁
の内,相対抗する1組の側縁に側板部41bを,前縁に
前板部41aをそれぞれ形成した,背面及び下面が開口
した箱状に合成樹脂製材料で射出成型されている。そし
て,ケース本体2に被せたときに,各側板部41及び天
板部41cの内面側がケース本体2の側板部22及び天
板部23の外面側に密着するとともに,側板部41bの
縁端がケース本体2のつば部25上に密着し防水が図ら
れている。上カバー41の開口した下面の周縁41d
は,下カバー42に形成されたつば部42c上に密着
し,上カバー41と下カバー42との境界から雨水が浸
入しないよう構成されている。 【0009】このように,ケース本体2及び下カバー4
2が,例えばアルミダイカスト,導電性を有する合成樹
脂製材料,もしくは,表面に導電性材料をメッキ又は塗
布した合成樹脂製材料等の導電性を有する材料で形成さ
れ,上カバー41も合成樹脂材料で形成されているの
で,錆びの発生もない。また,蝶番部2aも合成樹脂製
であるため,下カバー42が開閉不可能となることもな
い。また更に,カバー4が合成樹脂材料で形成されてい
るため,金属性ケースに比べて軽量化がはかれ,支柱や
配電ボックス奥の板壁面への取付作業が容易となる。高
周波回路基板5を収納するシールドケースは,図6に示
す従来例のシールドケース8のようにユニット化するこ
となく,枠体3を形成するだけでよく,枠体3の上面及
び底面側の開口端は下カバー42,ケース本体の内面側
に設けられた,枠体3の開口端との形状と相対した大き
さの凹溝42e,2bと,枠体3とが嵌合することで,
高周波回路基板5のシールドがはかれるので,ケースの
軽量化がはかれ,メンテナンスも容易となる。 【0010】尚,図に示すのは一例であり,例えばケー
ス本体2のつば部25上にゴム,塩化ビニルなどで形成
されたパッキン材を取付けて,防水対策に万全を期して
もよい。また,更なるシールド性を求めるならばケース
本体2と下カバー2の内面側に設けられた凹溝42e,
2bに導電性パッキン材を取付けてもよいなど,適宜形
状を変えて実施してもよい。さらに,この実施例のケー
スをミキサー,コンバーターなど,他の電子機器用とし
て用いることもできる。 【0011】 【発明の効果】以上詳述したように,請求項1の発明に
よれば,高周波回路基板及び他の回路基板を収納する電
子機器ケースであって,前記電子機器ケースは,電気的
に導通可能な材料で形成された,前面開口の箱状ケース
本体と,このケース本体の開口面にかぶせるカバーとか
らなり,前記高周波回路基板の外形形状に対応し,上面
と底面を開口した電気的に導通可能な材料で形成された
枠体を有し,前記ケース本体の内面側と,前記枠体の底
面の開口端とが嵌合し,前記カバーの内面側と,前記枠
体の上面の開口端とが嵌合するよう前記ケース本体とカ
バーの内面側の,前記枠体の開口端と相対する位置に凹
溝を設けたので軽量で錆びない,かつ,メンテナンスが
容易に可能な電子機器用ケースを提供できる。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a case mainly used for an electronic device connected to an antenna, such as a booster for television reception, a converter, a mixer, and the like. 2. Description of the Related Art Conventionally, as a case for electronic equipment (hereinafter abbreviated as a case), a high-frequency circuit in the case is prevented from being affected by various kinds of noise from outside the case, and a case outside the case. In order to prevent inadvertent leakage of high-frequency signals, the entire case is made of a metallic material, or the case is made of a synthetic resin material, and the high-frequency circuit board is wrapped in a metallic material to form a unit. It has been known. However, the conventional metallic case has a problem of rust. In particular, in the case of a metal case provided with a cover opening / closing mechanism, when the hinge part is rusted, it becomes difficult to open the cover and inspect and maintain the internal electronic devices. In addition, since the metal case is heavy, it is inconvenient to handle, and there are cases where the supporting columns and wall surfaces need to be reinforced.
On the other hand, in the case of a unitized high-frequency circuit board, the number of manufacturing steps is increased, and there is a problem that maintenance of the circuit board is difficult. In view of the above problems, an object of the present invention is to provide a case for an electronic device which has a high shielding effect, is lightweight, hardly rusts, and is easy to maintain. [0004] In order to solve the above-mentioned problems, an invention of claim 1 is an electronic equipment case for housing a high-frequency circuit board and another circuit board, wherein the electronic equipment case is A box-shaped case body having a front opening, formed of a material that can be electrically conducted, and a cover covering the opening surface of the case body. The top and bottom surfaces correspond to the external shape of the high-frequency circuit board. An open frame formed of an electrically conductive material, wherein an inner surface of the case body and an open end of a bottom surface of the frame are fitted to each other, and an inner surface of the cover and the frame; A concave groove is provided at a position on the inner surface side of the case body and the cover opposite to the open end of the frame so that the open end of the upper surface of the body is fitted. An embodiment of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a partially exploded perspective view of a booster for television joint reception exemplified as an electronic device case. FIG. 2 is a perspective view of a television receiving booster. FIG. 3 is a perspective view of a frame housing the high-frequency circuit board. FIG. 4 is a sectional view taken along line AA ′ in FIG. FIG. 5 is a sectional view taken along the line BB ′ in FIG. FIG. 6 is a partially exploded perspective view of an example of a case of a conventional electronic device. The case 1 includes a case body 2 and a cover 4 that covers the case body 2.
And the power supply circuit board 6 are housed inside the case body 2. The case 1 is mounted on a well-known support column for mounting an antenna, a plate wall behind a distribution box, or the like, with the upper right direction of FIG. 1 upward and the lower left direction downward. The case body 2 is formed in a box shape with a front opening in which a side plate portion 22 is provided at each longitudinal edge of a rectangular back plate portion 21, and a top plate portion 23 and a bottom plate portion 24 are provided at respective upper and lower side edges. The material is
For example, it is formed of a conductive material such as aluminum die casting, a conductive synthetic resin material, or a synthetic resin material having a surface plated or coated with a conductive material. A flange 25 is formed on the periphery of the rear plate 21 so as to abut the opening edge of the cover 4.
A plurality of plug projecting holes 26 for projecting the F-type plug attached to the frame 3 are formed. 27 is the lower cover 42
A screw hole for fixing the booster, 28 is a notch for screw insertion for mounting the booster on a wall surface, and 29 is a rear plate 2
1 is a concave groove provided on the inner surface side, and is formed from the bottom plate portion 24 of the case main body 2 to the power supply circuit board 6 for accommodating the AC cord 7. The frame 3 corresponds to the outer shape of the high-frequency circuit board 5 and is formed in a frame shape with an open top and bottom, and is made of a highly conductive material such as aluminum, copper, or iron plate. Pressed. Reference numeral 33 denotes a bottom plate portion of the frame 3, to which an F-type plug 34 is fixed. The method of fixing the F-type plug 34 may be a method using a nut or a method of fixing it by press-fitting, regardless of the method. Although the present application shows an example in which the F-type plug 34 is fixed to the frame 3,
The F-type plug 34 may be fixed to the high-frequency circuit board 5. Reference numerals 31 and 32 denote side plate portions of the frame 3, and the side plate portions 31,
32, a plurality of protrusions 3d are provided. After the high-frequency circuit board 5 is mounted on the protrusion 3d from the upper surface side of the frame 3, the ground of the high-frequency circuit board 5 and the protrusion 3d are soldered. As a result, the ground of the high-frequency circuit board 5 and the frame 3 are electrically connected. The frame 3 containing the high-frequency circuit board 5 is attached to the case body 2 in a state where the tip of the F-type plug 34 fixed to the frame 3 projects from the plug protrusion hole 26 of the case body 2. At this time, a concave groove 2b is formed on the inner surface side of the case body 2 so as to face the opening end 37 on the bottom surface side of the frame body 3 so that the frame body 3 fits into the concave groove 2b. Mounted. As described above, the case body 2 is formed of a conductive material such as aluminum die-cast, a conductive synthetic resin material, or a synthetic resin material having a surface plated or coated with a conductive material. Frame 3 and case body 2
Are electrically conductive. Further, a plurality of mounting pieces 3a are formed on the side plate portion 31, and the frame 3 is provided with the mounting pieces 3a.
Screw holes 3b formed on the rear plate 2 of the case body 2
The mounting screw 3c is inserted into the screw hole provided in the mounting
It is fixed by screwing with. In the embodiment of the present application, the mounting piece 3a is formed on the side plate 31 of the frame 3, but the mounting piece 3a is formed not only on the side plate 31 but also on the side plate 32. Case body 2
A mounting portion 2c may be provided at a position on the back plate portion 21 opposite to the mounting piece 3a formed on the side plate portion 32, and the frame 3 may be fixed to the case body 2 by screwing. . As described above, the ground of the high-frequency circuit board 5, the frame 3, and the case body 2 are electrically connected to each other, and the back surface of the high-frequency circuit board 5 is shielded. Although the method of fixing the high-frequency circuit board 5 and the frame 3 is an example of soldering,
A mounting piece may be provided on the frame 3 and the high-frequency circuit board 5 may be screwed to the frame 3. As shown in FIG. 1, the cover 4 includes an upper cover 41 covering the power supply circuit board 6 and a lower cover 42 covering the high-frequency circuit board 5 so that maintenance can be performed for each circuit board. . The lower cover 42 is provided with a pair of side plate portions 42b on opposite sides of a rectangular front plate portion 42a.
It is formed of a synthetic resin material having conductivity, a synthetic resin material plated or painted with a conductive material, or the like, in a substantially U-shaped cross section formed with. And the case body 2
When the lower cover 42 is covered, the inner surface side of each side plate portion 42b of the lower cover 42 is in close contact with the outer surface side of the side plate portion 22 of the case body 2, and the edge of the side plate portion 42b is
5 Closely contact and waterproof. Reference numeral 42d denotes a mounting screw for fixing the lower cover 42 to the case main body 2;
The lower cover 42 is screwed into the screw holes 27 provided in the lower cover 42.
Is fixed to the case body 2. The lower cover 42 is mounted so that the mounting screw 42d side is opened forward with the hinge 2a provided on the side plate 22 of the case body 2 as a fulcrum. On the inner surface side of the front plate portion 42a of the lower cover 42,
The concave groove 42e corresponding to the shape of the opening end on the upper surface side of the frame 3
Are formed integrally with the lower cover 42, and the lower cover 4
2 is fixed to the case body 2 with the mounting screws 42d,
The open end on the upper surface side of the frame 3 and the concave groove 42e are configured to fit together. At this time, the lower cover 42 is made of a synthetic resin material having conductivity as described above, or
Since the lower cover 42 and the frame 3 are electrically connected to each other because they are made of a synthetic resin material plated or painted with a conductive material, the front side of the high-frequency circuit board is shielded. The upper cover 41 is a box having a back plate and a bottom plate that have side plates 41b formed on a pair of opposing sides of the rectangular top plate 41c and a front plate 41a formed on the front edge. It is injection molded with a synthetic resin material. Then, when placed on the case body 2, the inner surfaces of the side plate portions 41 and the top plate portion 41 c are in close contact with the outer surface sides of the side plate portions 22 and the top plate portion 23 of the case body 2, and the edge of the side plate portion 41 b is It is in close contact with the flange 25 of the case body 2 to achieve waterproofing. Peripheral edge 41d of the open lower surface of upper cover 41
Is in close contact with a flange portion 42c formed on the lower cover 42 so that rainwater does not enter the boundary between the upper cover 41 and the lower cover 42. As described above, the case body 2 and the lower cover 4
2 is made of a conductive material such as aluminum die casting, a conductive synthetic resin material, or a synthetic resin material having a surface plated or coated with a conductive material, and the upper cover 41 is also made of a synthetic resin material. No rust occurs because it is formed of Further, since the hinge portion 2a is also made of synthetic resin, the lower cover 42 does not become unable to open and close. Further, since the cover 4 is made of a synthetic resin material, the weight is reduced as compared with the metal case, and the work of attaching the cover 4 to the plate wall surface behind the distribution box is facilitated. The shield case for accommodating the high-frequency circuit board 5 does not need to be unitized as in the conventional shield case 8 shown in FIG. The ends of the lower cover 42 and the grooves 3e and 2b provided on the inner surface side of the case body and having a size opposite to the shape of the opening end of the frame 3 are fitted to the frame 3,
Since the shield of the high-frequency circuit board 5 is detached, the weight of the case can be reduced and the maintenance can be facilitated. FIG. 1 shows an example, and a packing material made of rubber, vinyl chloride, or the like may be attached to the brim portion 25 of the case body 2, for example, to ensure the waterproofness. Further, if further shielding properties are required, a concave groove 42e provided on the inner surface side of the case body 2 and the lower cover 2,
The shape may be appropriately changed, for example, a conductive packing material may be attached to 2b. Further, the case of this embodiment can be used for other electronic devices such as a mixer and a converter. As described above in detail, according to the first aspect of the present invention, there is provided an electronic equipment case for housing a high-frequency circuit board and another circuit board, wherein the electronic equipment case is an electric equipment case. A box-shaped case body having a front opening and a cover covering the opening surface of the case body, and having an upper surface and a bottom surface corresponding to the outer shape of the high-frequency circuit board. An inner surface of the case body and an opening end of a bottom surface of the frame are fitted to each other, and an inner surface of the cover and an upper surface of the frame are formed. A concave groove is provided at a position on the inner surface side of the case body and the cover opposite to the opening end of the frame so that the opening end of the case fits with the opening end of the case body. An equipment case can be provided.

【図面の簡単な説明】 【図1】電子機器ケースとして例示するテレビ共同受信
用のブースターを一部分解した斜視図を示す。 【図2】テレビ受信用ブースターの斜視図を示す。 【図3】高周波回路基板を納めた枠体の斜視図を示す。 【図4】図2に置けるA−A'の断面図を示す。 【図5】図2に置けるB−B'の断面図を示す。 【図6】電子機器のケースとして例示する,従来のテレ
ビ共同受信用のブースターを一部分解した斜視図を示
す。 【符号の説明】 1…ケース,2…ケース本体,2a…蝶番部,2b…凹
溝,21…背面板部,22…側板部,23…天板部,2
4…底板部,25…つば部,26…接栓突出孔,27…
ネジ孔,28…切欠き部,29…凹溝,3…枠体,3a
…取付片,3b…ネジ孔,3c…取付ネジ,3d…突出
し部,31…側板部,32…側板部,33…底板部,3
4…F型接栓,35…開口端,36…開口端,4…カバ
ー,41…上カバー,41a…前板部,41b…側板
部,41c…天板部,41d…周縁,41e…壁面取付
部,42…下カバー,42a…前板部,42b…側板
部,42c…つば部,42d…取付ネジ,42e…凹
溝,5…高周波回路基板,6…電源回路基板,7…AC
コード,8…シールドケース,9…壁面取付板
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partially exploded perspective view of a booster for television joint reception exemplified as an electronic device case. FIG. 2 shows a perspective view of a television receiving booster. FIG. 3 is a perspective view of a frame housing a high-frequency circuit board. FIG. 4 is a sectional view taken along the line AA ′ in FIG. 2; FIG. 5 is a sectional view taken along the line BB ′ in FIG. 2; FIG. 6 is a partially exploded perspective view illustrating a conventional booster for television reception, which is exemplified as a case of an electronic device. DESCRIPTION OF SYMBOLS 1 ... Case, 2 ... Case body, 2a ... Hinge part, 2b ... Concave groove, 21 ... Back plate part, 22 ... Side plate part, 23 ... Top plate part, 2
4 ... Bottom plate part, 25 ... Flange part, 26 ... Connecting protruding hole, 27 ...
Screw hole, 28 ... Notch, 29 ... Groove, 3 ... Frame, 3a
... mounting pieces, 3b ... screw holes, 3c ... mounting screws, 3d ... protruding parts, 31 ... side plate parts, 32 ... side plate parts, 33 ... bottom plate parts, 3
4 F-type plug, 35 open end, 36 open end, 4 cover, 41 upper cover, 41 a front plate, 41 b side plate, 41 c top plate, 41 d peripheral edge, 41 e wall surface Mounting part, 42 ... Lower cover, 42a ... Front plate part, 42b ... Side plate part, 42c ... Flange part, 42d ... Mounting screw, 42e ... Groove, 5 ... High frequency circuit board, 6 ... Power supply circuit board, 7 ... AC
Cord, 8: Shield case, 9: Wall mounting plate

フロントページの続き Fターム(参考) 4E360 AB02 AB14 BA08 BB02 CA02 EA27 ED02 ED27 EE02 FA02 GA34 GA47 GB97 GC08 5E321 AA03 AA14 BB23 CC12 CC22 GG05 GH07 5E348 AA02 AA07 AA16 AA32 CC06 CC08 CC09 EE29 EF04 EF38 FF03 Continuation of front page    F term (reference) 4E360 AB02 AB14 BA08 BB02 CA02                       EA27 ED02 ED27 EE02 FA02                       GA34 GA47 GB97 GC08                 5E321 AA03 AA14 BB23 CC12 CC22                       GG05 GH07                 5E348 AA02 AA07 AA16 AA32 CC06                       CC08 CC09 EE29 EF04 EF38                       FF03

Claims (1)

【特許請求の範囲】 【請求項1】高周波回路基板及び他の回路基板を収納す
る電子機器ケースであって,前記電子機器ケースは,電
気的に導通可能な材料で形成された,前面開口の箱状ケ
ース本体と,このケース本体の開口面にかぶせるカバー
とからなり,前記高周波回路基板の外形形状に対応し,
上面と底面を開口した,電気的に導通可能な材料で形成
された枠体を有し,前記ケース本体の内面側と,前記枠
体の底面の開口端とが嵌合し,前記カバーの内面側と,
前記枠体の上面の開口端とが嵌合するよう前記ケース本
体とカバーの内面側の,前記枠体の開口端と相対する位
置に凹溝を設けたことを特徴とした電子機器用ケース。
Claims 1. An electronic equipment case for housing a high-frequency circuit board and another circuit board, wherein the electronic equipment case is formed of an electrically conductive material and has a front opening. It consists of a box-shaped case body and a cover that covers the opening of the case body, and corresponds to the external shape of the high-frequency circuit board.
An inner surface of the case body and an open end of a bottom surface of the frame body are fitted to each other, and an inner surface of the cover is formed on the inner surface of the cover; Side and
A case for an electronic device, wherein a concave groove is provided at a position on the inner surface side of the case body and the cover opposite to the opening end of the frame so that the opening end of the upper surface of the frame is fitted.
JP2002096219A 2002-03-29 2002-03-29 Case for electronic equipment Expired - Fee Related JP3977677B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002096219A JP3977677B2 (en) 2002-03-29 2002-03-29 Case for electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002096219A JP3977677B2 (en) 2002-03-29 2002-03-29 Case for electronic equipment

Publications (2)

Publication Number Publication Date
JP2003298246A true JP2003298246A (en) 2003-10-17
JP3977677B2 JP3977677B2 (en) 2007-09-19

Family

ID=29387384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002096219A Expired - Fee Related JP3977677B2 (en) 2002-03-29 2002-03-29 Case for electronic equipment

Country Status (1)

Country Link
JP (1) JP3977677B2 (en)

Also Published As

Publication number Publication date
JP3977677B2 (en) 2007-09-19

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