JPH08316663A - Lateral deviation restraining structure for printed wiring board - Google Patents

Abstract

PURPOSE: To alleviate vibration and impact to a printed wiring board on which a plurality of stages are laminated and to restrain lateral deviation of the printed wiring board without performing rework or refabrication to a chassis. CONSTITUTION: A plurality of printed wiring boards 1-4 are laminated on a bottom plate of a chassis 5 via collars 6-8, and a restraining fitting 10 is provided between the uppermost stage printed wiring board 1 and the next stage printed wiring board 2 so that it sandwiches the collar 6. When a through bolt 9 is inserted through the printed wiring boards 1-4, the collars 6-8, and the restraining fitting 10 respectively, and is threaded to the bottom plate of the chassis 5, the printed wiring boards 1-4, the collars 6-8, and the restraining fitting 10 are fastened and fixed to the chassis 5. The restraining fitting 10 is compressed to the length of the collar 6 between the uppermost stage printed wiring board 1 and the next stage printed wiring board 2 by the fastening of the through bolt 9, and the abutting surface thereof is projected toward the side wall surface of the chassis 5 to abut thereto.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for suppressing lateral vibration of a printed wiring board, and more particularly to a PWB (Printed Wiring B) used in electronic equipment mounted on an artificial satellite or the like.
The present invention relates to a lateral shake suppressing structure for a board (printed wiring board).

[0002]

2. Description of the Related Art Conventionally, rockets and artificial satellites are equipped with electronic devices for replacing various measurement data in flight or in orbit with electronic signals and transmitting the acquired data to the ground via an antenna. ing.

At the time of launching or ascending the above rocket or artificial satellite, a large vibration or shock is applied to the electronic equipment. In order to reduce these vibrations and shocks, a collar for maintaining a space between them and a vibration damping material having elasticity are arranged between a plurality of printed wiring boards constituting the electronic device.

Further, when a plurality of printed wiring boards constituting the electronic device are laterally shaken due to vibration or impact on the electronic device, in order to prevent the lateral shake of the printed wiring boards, FIG. As shown in FIG. 5, a method of fixing the printed wiring board 1 to the side wall surface of the chassis 14 with the screw 17 via the mounting member 16 is also adopted.

In this case, collars 11 to 13 are provided between the printed wiring boards 1 to 4 to keep the distances between them, and the printed wiring boards 1 to 4 and the collars 11 to 13 are attached by screws 1 for mounting.
It is fastened to the chassis 14 by 5.

In addition to the above method, a method of providing a fixing member for fixing the printed circuit board with a locking piece for respectively locking the printed circuit boards stacked in a plurality of stages is disclosed in Japanese Utility Model Laid-Open No. 5562 / hei.
No. 6,086,045.

Further, by arranging a vibration isolating member between the chassis and the substrate and crushing and fixing the vibration isolating member,
A method of preventing the natural vibration of the substrate to reduce the vibration of the chassis is disclosed in Japanese Utility Model Laid-Open No. 12796/1990.

[0008]

In the above-mentioned conventional electronic equipment, a collar for maintaining a space between them and a vibration-proof material having elasticity are arranged between a plurality of printed wiring boards constituting the electronic equipment. Since it reduces the vibration and shock applied to the printed wiring board, it is effective against vertical vibration and shock to the printed wiring board, but it is weak against mechanical vibration environment applied from the outside in the lateral direction. , A large lateral shake phenomenon occurs.

Further, in the method of screwing the printed wiring board to the side wall surface of the chassis through the mounting metal fittings, it is possible to prevent lateral deflection of the printed wiring wiring board, but the mounting metal fittings and the chassis are aligned with each other. Must be accurate. In this case, holes must be drilled on the chassis to attach the mounting brackets, and the mounting holes on the chassis must be reworked or the chassis itself must be remanufactured each time the number of printed wiring board stacks is changed. It must be made.

Furthermore, in the method disclosed in Japanese Utility Model Laid-Open No. 5462/1993, a locking piece is added every time the number of stacked layers of the printed wiring board is increased, or a fixing member having the locking piece is remanufactured. Must be done.

Furthermore, according to the method disclosed in Japanese Utility Model Laid-Open No. 12796/1990, when printed wiring boards are stacked in a plurality of stages, it is difficult to deal with the stacked printed wiring boards. It is weak and causes a large lateral shake phenomenon.

Therefore, an object of the present invention is to solve the above-mentioned problems and to alleviate vibrations and impacts on a printed wiring board having a plurality of stacked layers without reworking or remanufacturing the chassis. At the same time, another object of the present invention is to provide a lateral vibration restraint structure for a printed wiring board, which can prevent lateral vibration of the printed wiring board.

[0013]

According to an embodiment of the present invention, there is provided a printed wiring board lateral shake restraint structure for a printed wiring board in an electronic device in which a plurality of printed wiring boards are stacked and accommodated in a chassis having side walls. An elastic member is provided between the printed wiring boards and a part of which abuts against the side wall when the printed wiring boards are fastened to the bottom plate of the chassis.

[0014]

In an electronic device in which a plurality of printed wiring boards are stacked in a chassis having side wall surfaces via a collar for maintaining a space between them, the printed wiring boards are deformed when they are fastened to the bottom plate of the chassis. A stopper metal whose contact surface contacts the side wall surface is arranged between the uppermost printed wiring board and the next printed wiring board.

When the stopper metal is deformed and the contact surface abuts on the side wall surface of the chassis, elastic force or frictional force is generated between the printed wiring board and the chassis, and the lateral displacement of the printed wiring board is suppressed by the stopper metal. Function works.

Even if the number of printed wiring boards mounted in the chassis is increased, the increased number of mounted printed wiring boards can be immediately and easily accommodated by the collar and the stop fittings. Therefore, it is possible to rework or remanufacture the chassis. Without doing
It is possible to reduce vibrations and impacts on the printed wiring board in which a plurality of layers are stacked, and prevent lateral shake of the printed wiring board.

[0017]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of the present invention. In the figure, the printed wiring boards 1 to 4 are fastened to the chassis 5 with through bolts 9 via collars 6 to 8 for keeping the distance therebetween.

Further, a stop fitting 10 is arranged between the uppermost printed wiring board 1 and the next printed wiring board 2 so as to sandwich the collar 6. Here, the length of the collar 6 is shorter than the lengths of the other collars 7 and 8, and the stop fitting 1
0 is composed of a leaf spring having a predetermined elastic function.

FIG. 2 is a perspective view of the stopper fitting 10 of FIG. In the figure, the stopper 10 has insertion holes 10a and 10b through which the through bolt 9 is inserted, and abutment that abuts the side wall surface of the chassis 5 when the through bolt 9 is inserted into the insertion holes 10a and 10b and is compressed in the vertical direction. A surface 10c is provided.

FIG. 3 is a sectional view showing a state in which the printed wiring boards 1 to 4 of FIG. 1 are fastened to the chassis 5 by the through bolts 9. The mounting of the printed wiring boards 1 to 4 according to the embodiment of the present invention will be described with reference to FIGS. 1 to 3.

When mounting the printed wiring boards 1 to 4 on the chassis 5, a plurality of the printed wiring boards 1 to 4 are laminated on the bottom plate of the chassis 5 via the collars 6 to 8 and the printed wiring boards 1 on the uppermost stage and the next. With the stopper metal fitting 10 disposed so as to sandwich the collar 6 between the stepped printed wiring board 2 and the stepped printed wiring board 2, the through bolt 9
Are respectively inserted into the printed wiring boards 1 to 4, the collars 6 to 8 and the stopper fitting 10 (see FIG. 1).

After that, the through bolt 9 is screwed into a screwing portion (not shown) of the bottom plate of the chassis 5, so that the printed wiring boards 1 to 4, the collars 6 to 8 and the stopper 10 are attached to the chassis 5. Fastened and fixed.

At this time, the stopper 10 is compressed to the length of the collar 6 between the uppermost printed wiring board 1 and the next printed wiring board 2 by tightening the through bolts 9, and the contact surface 10c of the chassis 5 is adjusted. Is abutted by protruding to the side wall surface side (see FIG. 3).

As a result, even if mechanical vibration is applied to the printed wiring boards 1 to 4 from the outside in the lateral direction, a large lateral shake phenomenon does not occur. In this case, a material having a large friction coefficient, such as a rubber plate, is attached to the contact surface 10c of the metal stopper 10, which is effective in preventing a large lateral shake phenomenon.

Further, the contact pressure between the contact surface 10c of the stopper 10 and the side wall surface of the chassis 5 can be adjusted by changing the protruding size of the stopper 10, and the chassis 5 and the printed wiring boards 1 to 4 can be adjusted. The vibration transfer characteristics of can be changed.

In the above example, the stopper 10 is arranged between the uppermost printed wiring board 1 and the next printed wiring board 2, but between the other printed wiring boards 2 to 4. It is also possible to arrange. However, since the printed wiring board 1 in the uppermost stage shakes the largest when mechanical vibration is applied from the outside in the lateral direction, the stopper metal fitting 10 is placed between the printed wiring board 1 in the uppermost stage and the printed wiring board 2 in the next stage. It is most suitable to arrange in.

In this way, in an electronic device in which a plurality of printed wiring boards 1 to 4 are stacked via collars 6 to 8 for keeping the intervals between them in the chassis 5 having side wall surfaces,
When the plurality of printed wiring boards 1 to 4 are fastened to the bottom plate of the chassis 5, a part (abutting surface 10c) of which comes into contact with the side wall is a stopper metal fitting 10 which is the uppermost printed wiring board 1 and the next printed wiring board. By disposing it between the printed wiring boards 1 to 4 and the chassis 5, the stopper fitting 10 is deformed and the contact surface 10c contacts the side wall surface of the chassis 5 by disposing it between the printed wiring boards 1 to 4 and the chassis 5. Or frictional force is generated, and the printed wiring boards 1 to 4 by the stopper 10
Lateral shake suppression function works.

Further, even if the number of the printed wiring boards 1 to 4 mounted in the chassis 5 is increased, the increased number of the printed wiring boards 1 to 4 can be immediately and easily dealt with by the collars 6 to 8 and the stop fitting 10. Therefore, it is possible to reduce vibrations and impacts on the printed wiring boards 1 to 4 in which a plurality of layers are stacked without reworking or remanufacturing the chassis 5, and to prevent lateral deflection of the printed wiring boards 1 to 4. Can be prevented.

[0030]

As described above, according to the present invention, in an electronic device in which a plurality of printed wiring boards are stacked in a chassis having side walls with a collar member for keeping the distance between them, a plurality of printing devices are printed. By arranging an elastic member, a part of which abuts the side wall of the chassis when the wiring board is fastened to the bottom plate of the chassis, between the printed wiring boards, multiple steps can be performed without reworking or remanufacturing the chassis. There is an effect that vibrations and impacts on the laminated printed wiring boards can be mitigated, and lateral shake of the printed wiring boards can be prevented.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a perspective view of the stopper fitting of FIG.

3 is a cross-sectional view showing a state in which the printed wiring board of FIG. 1 is fastened to a chassis by through bolts.

FIG. 4 is a cross-sectional view showing a conventional example.

[Explanation of symbols]

 1 to 4 printed wiring board 5 chassis 6 to 8 collar 9 through bolt 10 stopper metal fittings 10a, 10b insertion hole 10c contact surface

Claims (3)

[Claims] 1. A lateral runout restraint structure for a printed wiring board in an electronic device, wherein a plurality of printed wiring boards are stacked in a chassis having side walls via a collar member for maintaining a distance between the printed wiring boards. A lateral runout restraint structure comprising: an elastic member which is disposed between the substrates and has a part of which abuts against the side wall when the printed wiring boards are fastened to the bottom plate of the chassis. 2. The elastic member is arranged so as to sandwich the collar member between a printed wiring board laminated on the uppermost stage and a printed wiring board laminated on the lowermost stage. The lateral shake restraint structure according to Item 1. 3. The lateral runout restraint structure according to claim 1, wherein the elastic member is a leaf spring.