JPH0831221A - Assembled lamp and its manufacture - Google Patents

Abstract

PURPOSE:To readily achieve waterproofness. CONSTITUTION:A sealant 10, which is an elastic material directly bonded to the periphery of a lamp base board 4, produces a sealing effect similar to those by the prior art by sealing a gap between a case main body 3 and the lamp base board 4 with the lamp base board 4 pressed by the case main body 3 and a hood 5. Therefore, the leakage of a potting agent 9 from the gap between the lamp base board 4 and the case 3 is reduced during potting, and the level of the potting agent is held constant. Of ptocesses prepared for the potting, laborious processes of installing packing and an O-ring, or laborious processes such as applying a filler become unnecessary, and in a single operation the elastic material can be printed onto a number of lump base board 4 only through a process for printing it onto the lump base boards 4.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a large number of LEDs,
The present invention relates to a structure of a collective lamp in one lamp unit and a manufacturing method of the collective lamp.

[0002]

2. Description of the Related Art Conventionally, the assembly type lamp is constructed so that the LED lead portion is sealed with a potting agent for waterproofing. However, the potting agent leaks to the back surface of the printed circuit board and the lead portion is insufficiently filled. To prevent the
To ensure the waterproofness of the collective lamp, packing,
Apply an O-ring to the underside of the substrate (41 in Fig. 4),
Further, the board is screwed (42 in FIG. 4), or the board is press-fitted into the case. The packing and O-ring are relatively expensive because the workability is deteriorated when the case has a square shape, and the packing and O-ring are specially designed. Therefore, in the square type collective lamp, a complicated method is used, such as a press-fitting method or sealing with a viscous potting agent when applying or potting a sealing agent. It's a reality.

[0003]

That is, in any of the above methods, a leak prevention measure is performed for each lamp.
Alternatively, since packing and O-rings are attached, workability is poor, reliability is not said to be perfect, and there is a problem that it also causes a cost increase. Originally, if the adhesion between the substrate and the case is high, the problem of liquid leakage should not occur in potting, but since the materials having a certain degree of rigidity are used for each other, even if the substrate is attached to the case by press fitting, Since there is always a mechanical error due to manufacturing variations and the like, a gap will inevitably occur. Therefore, the presence of such a gap may cause the filler to leak at a rate of some percentage during potting, which may lead to insufficient protection of the lead of the target LED. Therefore, the inspection after potting cannot be simplified, which causes a problem in cost.

Therefore, there is a need for an efficient and simple structure for potting, and an object of the present invention is to provide a collective lamp and a method of manufacturing the same that can easily realize waterproofness.

[0005]

In order to solve the above problems, the structure of the present invention has a plurality of LEDs, a lamp board on which the LEDs are arranged, and a lamp case in which the lamp board is housed and fixed. However, an elastic material is provided in advance on at least a portion of the lamp substrate that comes into contact with the lamp case. Further, the structure of the related invention is characterized in that the elastic material has a thickness that can be screen-printed at the time of manufacturing the substrate.

As an invention of a method of manufacturing the structure of the present invention, a step of forming a lamp substrate in a method of manufacturing a collective lamp in which LEDs are arranged to form one display unit,
A printing step of printing an elastic material on a portion of the lamp board that contacts the lamp case; an LED assembling step of assembling LEDs to the lamp board; and a board assembling step of assembling the lamp board to the lamp case. It is characterized by having. Furthermore, in addition to the above, the substrate assembling step includes a potting step of embedding the LED lead portions of the lamp substrate with a waterproof material.

[0007]

[Function] An elastic material such as a sealant directly provided on a portion of the lamp substrate that directly contacts the case has a sealing effect similar to packing and an O-ring, and the lamp substrate is mounted on the case and pressed by a hood. In the fixed state, the gap between the case and the lamp board comes into close contact. It is possible to print the elastic material on a large number of lamp substrates at once by eliminating the laborious steps of mounting packings, O-rings, and the like and only increasing the number of simple printing processes on the lamp substrates.

[0008]

As compared with the packing and O-ring used to eliminate the gap between the lamp substrate and the case, the workability is improved and the sealing effect is the same. Therefore, at the time of potting, the potting agent is prevented from leaking through the gap between the lamp substrate and the case, and the potting liquid surface is kept constant. Therefore, among the steps prepared for potting, the step of attaching packings and O-rings for closing the gap between the lamp board and the case, or the laborious work such as application of the filler is unnecessary, and the board press-fitting type There is no need to apply stress to such a lamp substrate, and reliability is improved.

[0009]

EXAMPLES The present invention will be described below based on specific examples. (First Embodiment) FIG. 1 shows a collective lamp 1 embodying the present invention.
External view of the front view (Fig. 1 (a)) and vertical section (Fig. 1 (b))
Then, 25 LEDs (5 × 5) are arrayed to form a rectangular cross section. In this collective lamp 1, a lamp board 4 having LEDs arranged therein is inserted into a lamp case body 3 (hereinafter referred to as a case body), and a lamp hood 5 (hereinafter referred to as a hood) is fitted from above. The hood 5 presses the lamp substrate 4, and the protrusion 6 of the hood fixes the lamp substrate 4 to the case body 3 and also fixes the lamp substrate 4. A wiring 8 for controlling lighting from the lamp board 4 is connected to a connector (not shown) from the rear part of the case body 3. The collective lamp 1 has the circuit configuration shown in FIG. 3 and has a full-color display configuration by emitting three colors of blue (B) red (R) green (G). You don't have to.

The LED 2 is soldered to the lamp board 4 at the same height, leaving the lead portion 7 between the lamp board 4 and the lamp board 4,
Finally, the lead portion 7 is filled with a potting agent 9 so that the lead portion is embedded and waterproofed. The potting agent 9 is filled with a dispenser or the like with the opening of the lamp (the front of the lamp, FIG. 1A) facing upward. At this time, if there is a slight gap between the lamp board 4 and the case body 3, the potting agent 9 leaks under the board. However, in the present invention, as shown in FIG. There is a sealant 10 printed in the area corresponding to the stepped portion of the case 3 in the peripheral area, filling the gap, and the potting agent 9 does not leak. The presence of the sealing agent 10 closes the gap between the lamp substrate 4 and the case body 3, and transmits the pressure from the hood 5 to the case body 3 around the entire substrate.
It relieves the stress on you.

The hood 5 has a structure in which a few 0.5 mm projections (not shown) are provided on the holding (tip) portion of the hood 5 to hold down the lamp board 4, so that the lamp board 4 can be securely attached to the case body 3 side. It can be pressed down to. Nevertheless, the pressing pressure may be weakened due to a manufacturing error. Even in such a case, the present invention suppresses the risk of the potting agent 9 leaking due to the presence of the sealant 10 without causing a gap. It

The outline of each step of the method of manufacturing the collective lamp, which is a feature of the present invention, will be described. (a) The lamp substrates 4 are collectively formed from a large substrate material until a green mask is applied in a usual known substrate manufacturing process. At this point, the individual lamp substrates 4 are formed as, for example, 16 large substrate plates (substrate removing plates) 20 as shown in FIG. Depending on the case, the punching process for forming the individual lamp substrates 4 may be a post process. (b) Of the individual lamp substrates of this substrate removal plate 20,
The sealing agent 10 is applied by screen printing to the peripheral portion (FIG. 2B) which is the area in contact with the case. As the screen, for example, an 80 mesh stainless screen is used. Further, the thickness of the sealant 10 is such that it is applied by screen printing, but since the substrate 4 and the case 3 and the hood 5 are originally in a flat relationship, a gap that may possibly be formed is created. A small thickness to compensate is sufficient. Of course, it may be a step of printing more than once if necessary. (c) The sealant 10 applied by printing is cured by ultraviolet rays. In the case of a moisture-curing type sealant rather than an ultraviolet ray-curing type, instead of this step, the time of leaving in the air for a necessary time is taken. (d) Hereafter, LEDs are arranged in the same manner as in the normal substrate processing process,
After the soldering and the wiring 8 are soldered, the individual lamp substrates 4 are separated and assembled to the case body 3 and the hood 5.

In the process of assembling the case body 3 and the hood 5 described above, in the conventional construction, packing or O-ring is attached to each case body 3 in order to prevent leakage of the potting agent 9 (41 in FIG. 4). ), A step (not shown) of applying a gel-like resin to the stepped portion on which the lamp substrate is placed is necessary, but the manufacturing method according to the present invention does not require such a step and the number of parts is reduced.

If the sealant is a moisture-curable material, it may be cured by moisture in the air during the next step. Therefore, in that case, the fixing step is substantially incorporated into the moving time as a manufacturing step.

As shown in FIG. 2 (a), a large number of lamp substrates 4 are formed on the substrate removing plate 20, and thereafter, all the lamp substrates 4 are screen-printed at a time in the state of the substrate removing plate 20 by elastic printing. The sealant 10 which is the material is applied in advance. The application by printing is flexible and efficient because the film can be formed almost uniformly on a screen, a large number of substrates can be treated at one time, and lamp substrates of any shape can be used. Since this printing process can also be performed by the equipment of the conventional printed circuit board manufacturing process, new investment is not required and it is economical.

It should be noted that screen printing may be performed after forming a large number of lamp substrates with the substrate removing plate 20, or the stamping process may be performed after printing the sealant 10 which is an elastic material on the lamp substrates. Further, the printing of the sealing agent may be performed without interruption on the entire periphery of the lamp substrate 4, and even if there is some error in the width of the printed sealing agent 10, the purpose is to stop the potting agent 9 from leaking. There is no problem with print width as it is achieved.

(Second Embodiment) The upper surface side of the substrate, that is, the substrate 4
The same effect can be obtained by the configuration in which the sealant 10 is printed on the side that is not the solder surface, that is, the side where the LED is located and the side where potting is performed. That is, not only the lower surface side but also the upper surface side hits the lamp substrate 4, so that only one of the gaps needs to be eliminated to prevent the potting agent 9 from flowing out, and the position of the sealing agent 10 is set to the lower surface. This is because it does not matter whether it is on the side or the top surface.

The substrate removing plate (large substrate plate) is a large substrate material for manufacturing a large number of lamp substrates 4 at a time, and is the same substrate material as the lamp substrate 4.
Further, the elastic material is not limited to a material such as a sealant printed by screen printing, but may be any material provided around the lamp substrate 4, and the degree of elasticity is not particularly limited.

[Brief description of drawings]

FIG. 1 is a schematic front view and a configuration cross-sectional view of a collective lamp to which the present invention has been applied.

2A and 2B are a schematic plan view of a substrate of the collective lamp of FIG. 1 and an explanatory diagram of screen printing.

3 is a circuit diagram showing an example of a circuit of the collective lamp shown in FIG.

FIG. 4 is a schematic configuration sectional view of a conventional collective lamp.

[Explanation of symbols]

 1 Collective Lamp 2 LED 3 Lamp Case Main Body 4 Lamp Substrate 5 Lamp Hood 6 Hood Protrusion 7 LED Lead 8 Wiring 9 Potting Agent 10 Sealant (Elastic Material) 20 Large Substrate Plate (Substrate Removal Plate) 41 O-ring 42 Screw

Claims (4)

[Claims] 1. A plurality of LEDs, a lamp substrate on which the LEDs are arranged, and a lamp case in which the lamp substrate is housed and fixed, wherein the lamp substrate has at least a portion in contact with the lamp case. A collective lamp characterized in that an elastic material is provided in advance. 2. The collective lamp according to claim 1, wherein the elastic material has a thickness that can be screen-printed when a substrate is manufactured. 3. A method of manufacturing a collective lamp in which LEDs are arranged to form one display unit, a step of forming a lamp substrate, and printing by printing an elastic material on a portion of the lamp substrate that contacts the lamp case. A method of manufacturing a collective lamp, comprising: a step of assembling an LED on the lamp board; an LED assembling step; and a board assembling step of assembling the lamp board on the lamp case. 4. The lamp substrate is assembled in the substrate assembling step.
The method of manufacturing the collective lamp according to claim 3, further comprising a potting step of embedding a lead portion of the LED with a waterproof material.