JPH08304299A - Method for inspecting soldered state - Google Patents

Method for inspecting soldered state

Info

Publication number
JPH08304299A
JPH08304299A JP11289095A JP11289095A JPH08304299A JP H08304299 A JPH08304299 A JP H08304299A JP 11289095 A JP11289095 A JP 11289095A JP 11289095 A JP11289095 A JP 11289095A JP H08304299 A JPH08304299 A JP H08304299A
Authority
JP
Japan
Prior art keywords
camera
orientation
soldering
observed
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11289095A
Other languages
Japanese (ja)
Other versions
JP3152102B2 (en
Inventor
Shoichi Nishi
昭一 西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11289095A priority Critical patent/JP3152102B2/en
Publication of JPH08304299A publication Critical patent/JPH08304299A/en
Application granted granted Critical
Publication of JP3152102B2 publication Critical patent/JP3152102B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE: To finish inspection of soldered part in a short time by observing the soldered parts of a plurality of electronic devices while setting a camera in one selected direction and then observing the soldered parts similarly while altering the direction of camera. CONSTITUTION: Orientation of a camera 8 is set at 270 deg. by driving a motor and the camera 8 is held in that orientation. Electronic devices A, B are then observed on the sides A4 , B4 thereof making an angle of 270 deg.. Subsequently, the orientation of camera 8 is set at 0 deg. and the devices A, B are observed on the sides A1 , B1 thereof making an angle of 0 deg.. Similarly, the devices A, B are observed on the sides A2 , A3 and B2 , B3 thereof by setting the orientation at 90 deg. and 180 deg. thus finishing all observation. Since the observation is finished entirely by simply turning the camera sequentially by 270 deg., 0 deg., 90 deg. and 180 deg., when the images of both devices A, B are picked up, the time required for altering the orientation of camera 8 can be shortened drastically resulting in significant shortening of the total observation time.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、斜め方向から電子部品
の半田付け部を観察する半田付け状態の検査方法に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering state inspection method for observing a soldered portion of an electronic component from an oblique direction.

【0002】[0002]

【従来の技術】電子部品には、例えばJリード部品のよ
うに、半田付け部が電子部品の下方に位置し、真上から
カメラで観察したのでは、半田付け部の画像を得ること
ができないものもある。このような電子部品について
は、従来次に述べるような要領で、観察が行われてい
た。
2. Description of the Related Art An electronic component has a soldering portion located below the electronic component, such as a J lead component, and an image of the soldering portion cannot be obtained by observing with a camera from directly above. There are also things. Conventionally, such electronic components have been observed in the following manner.

【0003】図5は、従来の半田付け状態の検査方法の
説明図である。図5中、1は基板、2は基板1に半田付
けされたJリード部品などの電子部品、3、4は電子部
品2から下方に延出し、しかも内側に湾曲するリードで
ある。
FIG. 5 is an explanatory view of a conventional soldering state inspection method. In FIG. 5, 1 is a substrate, 2 is an electronic component such as a J lead component soldered to the substrate 1, 3 and 4 are leads extending downward from the electronic component 2 and curved inward.

【0004】リード3、4は、基板1の回路パターン
5、6に半田7により固着されている。そして、半田7
の付近の半田付け部をカメラ8で観察する場合には、図
5の実線で示すように、カメラ8を斜め上方から半田付
け部に向けて、しかも発光部9を同様の向きにセットし
て斜め上方から光をあてる必要がある。
The leads 3 and 4 are fixed to the circuit patterns 5 and 6 of the substrate 1 with solder 7. And solder 7
When observing the soldering part in the vicinity of the position with the camera 8, as shown by the solid line in FIG. 5, set the camera 8 from diagonally above to the soldering part and set the light emitting part 9 in the same direction. It is necessary to illuminate from diagonally above.

【0005】また10はカメラ8で得られた画像情報を
出力するための信号ケーブル、11は発光部9を発光さ
せるための照明ケーブルである。
Reference numeral 10 is a signal cable for outputting the image information obtained by the camera 8, and 11 is an illumination cable for causing the light emitting section 9 to emit light.

【0006】ここで、電子部品2の半田付け部は、図5
に示すとおり、複数の向きに存在しており、これらの半
田付け部を全て観察するためには、例えば図4の破線で
示すようにカメラ8及び発光部9の向きを変更する必要
がある。
The soldering portion of the electronic component 2 is shown in FIG.
As shown in FIG. 4, the orientations of the camera 8 and the light emitting unit 9 need to be changed, for example, as shown by the broken line in FIG. 4, in order to observe all the soldered portions.

【0007】したがって、従来回転軸12に軸着された
ターンテーブル13において、回転軸12から偏心した
位置に、カメラ8をブラケット14で固定し、回転軸1
2を水平回転させることによって、複数の向きから電子
部品2の半田付け部を観察するようにしていた。しか
も、従来の半田付け状態の検査方法では、電子部品の実
装の順序に従い、第1番目の実装順序にあたる電子部品
について、必要な向きの観察を全て完了してから、次に
第2番目以降の実装順序にあたる電子部品毎に、同様な
観察を行うようになっていた。
Therefore, in the conventional turntable 13 pivotally mounted on the rotary shaft 12, the camera 8 is fixed by the bracket 14 at a position eccentric from the rotary shaft 12, and the rotary shaft 1
By rotating 2 horizontally, the soldered part of the electronic component 2 is observed from a plurality of directions. Moreover, according to the conventional soldering state inspection method, after observing all the necessary orientations of the electronic components corresponding to the first mounting sequence according to the mounting sequence of the electronic components, the second and subsequent electronic components are completed. Similar observations were made for each electronic component in the mounting order.

【0008】[0008]

【発明が解決しようとする課題】しかしながら、このよ
うな観察の順序では、基板1に実装された電子部品の全
個数分回転軸を回転させる必要がある。即ち、極めて長
い検査時間を要するという問題点があった。
However, in such an observation order, it is necessary to rotate the rotary shaft by the total number of electronic components mounted on the substrate 1. That is, there is a problem that an extremely long inspection time is required.

【0009】そこで本発明は、短時間で基板に実装され
た電子部品の半田付け部の検査を完了できる半田付け状
態の検査方法を提供することを目的とする。
It is therefore an object of the present invention to provide a soldering state inspection method capable of completing inspection of a soldered portion of an electronic component mounted on a board in a short time.

【0010】[0010]

【課題を解決するための手段】本発明の半田付け状態の
検査方法は、カメラの向きを複数の向きから選んだ一つ
の向きにしたまま、複数個の電子部品の半田付け部を観
察し、次にカメラの向きを更新し、更新した向きにした
まま、複数個の電子部品の半田付け部を観察するもので
ある。
A soldering state inspection method according to the present invention comprises observing soldered portions of a plurality of electronic components while keeping a camera in one orientation selected from a plurality of orientations. Next, the orientation of the camera is updated, and the soldered portions of the plurality of electronic components are observed while keeping the updated orientation.

【0011】[0011]

【作用】上記構成により、基板に実装された電子部品の
個数だけターンテーブルを回転させるのではなく、また
電子部品の実装順序にとらわれることなく、カメラの向
きを一旦設定したならば、検査の対象となる全ての電子
部品について、設定した向きにおける半田付け状態を観
察し、そしてカメラの向きを次の向きに更新して、同様
な観察を行うものである。これにより、ターンテーブル
の回転に要する時間を、従来の半田付け状態の検査方法
に比べて、飛躍的に少なくすることができ、短い検査時
間内に全ての観察を完了することができる。
With the above structure, the turntable is not rotated by the number of electronic components mounted on the board, and once the orientation of the camera is set regardless of the mounting order of the electronic components, the inspection target With respect to all the electronic components, the soldering state in the set orientation is observed, the orientation of the camera is updated to the next orientation, and the same observation is performed. As a result, the time required to rotate the turntable can be dramatically reduced as compared with the conventional soldering state inspection method, and all observations can be completed within a short inspection time.

【0012】[0012]

【実施例】次に図面を参照しながら、本発明の実施例を
説明する。
Embodiments of the present invention will now be described with reference to the drawings.

【0013】図1は、本発明の一実施例における半田付
け状態の検査装置を示すブロック図である。なお図中、
従来の構成を示す図5と同様の構成要素については、同
一符号を付すことにより説明を省略する。
FIG. 1 is a block diagram showing a soldering state inspection apparatus according to an embodiment of the present invention. In the figure,
Constituent elements similar to those of FIG. 5 showing the conventional configuration are denoted by the same reference numerals and the description thereof will be omitted.

【0014】図1に示す本実施例では、基板1に第1の
電子部品A及び第2の電子部品Bが半田付けされている
ものとする。また15は、基板1を保持する基板ホル
ダ、16はYモータ17が駆動されることにより、基板
ホルダ15をY方向に移動させるYテーブル、18はX
モータ19が駆動されることにより、Yテーブル16を
X方向に移動させるXテーブルである。また20は上方
に設けられたフレーム、21は回転軸12を回転させる
モータ、22は回転軸12の回転位置を検出するロータ
リエンコーダ、23は装置全体を制御するCPUなどの
制御部である。
In this embodiment shown in FIG. 1, it is assumed that the first electronic component A and the second electronic component B are soldered to the substrate 1. Further, 15 is a substrate holder that holds the substrate 1, 16 is a Y table that moves the substrate holder 15 in the Y direction by driving the Y motor 17, and 18 is an X table.
It is an X table that moves the Y table 16 in the X direction by driving the motor 19. Further, 20 is a frame provided above, 21 is a motor that rotates the rotary shaft 12, 22 is a rotary encoder that detects the rotational position of the rotary shaft 12, and 23 is a control unit such as a CPU that controls the entire apparatus.

【0015】24は、Yモータ17、Xモータ19、モ
ータ21をドライブするモータ制御部、25は発光部9
に照明ケーブル11を介して光を供給する照明ボックス
LBを制御する照明コントローラ、26はカメラ8から
信号ケーブル10を介して画像信号を入力し、得られた
画像についての処理を行う画像処理部である。
Reference numeral 24 is a motor control section for driving the Y motor 17, X motor 19, and motor 21, and 25 is a light emitting section 9.
An illumination controller that controls an illumination box LB that supplies light to the illumination cable 11 via the illumination cable 11, and 26 is an image processing unit that inputs an image signal from the camera 8 via the signal cable 10 and performs processing on the obtained image. is there.

【0016】次に、図2を参照しながら、本実施例にお
けるカメラの向きの説明を行う。本実施例では、矩形の
Jリード部品である第1の電子部品A、第2の電子部品
Bをのそれぞれの半田付け部を観察するものとする。ま
た第1の電子部品Aは、辺A1,A2,A3,A4のそ
れぞれに複数のリードを有し、第2の電子部品Bは、辺
B1,B2,B3,B4のそれぞれに複数のリードを有
する。そして図2に示すように、この辺の順に、0度、
90度、180度、270度というように、カメラ8の
向きを定義する。
Next, the orientation of the camera in this embodiment will be described with reference to FIG. In this embodiment, the soldering portions of the first electronic component A and the second electronic component B, which are rectangular J lead components, are observed. The first electronic component A has a plurality of leads on each of the sides A1, A2, A3, A4, and the second electronic component B has a plurality of leads on each of the sides B1, B2, B3, B4. Have. Then, as shown in FIG. 2, in order of this side, 0 degree,
The orientation of the camera 8 is defined as 90 degrees, 180 degrees, and 270 degrees.

【0017】そして、カメラ8が信号ケーブル10、照
明ケーブル11に接続されており、これらのケーブル1
0、11は、回転軸12とともに回転する。回転軸12
を、360度何巡も回転させるようにすると、これらの
ケーブル10、11が破断してしまう。従って、本実施
例では、360度のうち、ある原点方向(180度と2
70度の中間に原点方向θ0)を定め、回転軸12が原
点方向θ0を超えないように、回転させることとしてい
る。
The camera 8 is connected to the signal cable 10 and the illumination cable 11, and these cables 1
0 and 11 rotate together with the rotary shaft 12. Rotating shaft 12
If the cable is rotated 360 degrees many times, the cables 10 and 11 will be broken. Therefore, in the present embodiment, of 360 degrees, a certain origin direction (180 degrees and 2
The origin direction θ0) is set in the middle of 70 degrees, and the rotation shaft 12 is rotated so as not to exceed the origin direction θ0.

【0018】カメラ8の向きは、第1の要領として、2
70度を最初の向きとし、次に、0度、90度、180
度というように、原点方向θ0をまたがないように一巡
させる。また第2の要領として、180度を最初の向き
とし、90度、0度、270度としても良い。
The orientation of the camera 8 is 2 as a first procedure.
70 degree as the first direction, then 0 degree, 90 degree, 180 degree
In one degree, the rotation is made so as not to cross the origin direction θ0. As a second point, 180 degrees may be set as the initial direction and 90 degrees, 0 degrees, and 270 degrees may be set.

【0019】次に図3を参照しながら、電子部品A,B
の二つのものについて、観察を行う例を説明する。上述
した順序の内第1の順序を採用することとし、まずモー
タ21を駆動して、カメラ8の向きを270度を選択
し、この向きにカメラ8を保持する。そして、電子部品
Aの270度を向く辺A4を観察し、電子部品Bについ
ても270度を向く辺B4を観察する。ここで、電子部
品A,Bの実装順序は、どちらが先でも良い。
Next, referring to FIG. 3, electronic components A and B
An example of observing the two will be described. The first of the above-mentioned orders is adopted. First, the motor 21 is driven to select the orientation of the camera 8 at 270 degrees, and the camera 8 is held in this orientation. Then, the side A4 of the electronic component A facing 270 degrees is observed, and the side B4 of the electronic component B facing 270 degrees is also observed. Here, the electronic components A and B may be mounted in either order.

【0020】次に、カメラ8の向きを0度に更新し、こ
の向きにカメラ8を保持する。そして、電子部品Aの0
度を向く辺A1を観察し、電子部品Bについても0度を
向く辺B1を観察する。
Next, the orientation of the camera 8 is updated to 0 degree, and the camera 8 is held in this orientation. And 0 of the electronic component A
The side A1 facing the angle is observed, and the side B1 facing the angle 0 ° is also observed for the electronic component B.

【0021】次に、カメラ8の向きを90度に更新し、
この向きにカメラ8を保持する。そして、電子部品Aの
90度を向く辺A2を観察し、電子部品Bについても9
0度を向く辺B2を観察する。
Next, the orientation of the camera 8 is updated to 90 degrees,
The camera 8 is held in this direction. Then, the side A2 of the electronic component A facing 90 degrees is observed, and the electronic component B is also 9
Observe side B2 facing 0 degree.

【0022】最後に、カメラ8の向きを180度に更新
し、この向きにカメラ8を保持する。そして、電子部品
Aの180度を向く辺A3を観察し、電子部品Bについ
ても180度を向く辺B3を観察する。これにより、全
ての観察を完了する。
Finally, the orientation of the camera 8 is updated to 180 degrees, and the camera 8 is held in this orientation. Then, the side A3 of the electronic component A facing 180 degrees is observed, and the side B3 of the electronic component B facing 180 degrees is also observed. This completes all observations.

【0023】以上のように、電子部品A,Bの両方につ
いての画像を取得する際に、カメラ8は、270度、0
度、90度、180度というように、ただ一巡するだけ
で、全ての観察を完了することができ、従来の半田付け
状態の検査方法に比べ、回転軸12の回転(カメラ8の
向きの変更)に要する時間を飛躍的に削減することがで
き、観察全体の時間も大幅に短縮できる。
As described above, when the images of both the electronic parts A and B are acquired, the camera 8 moves at 270 degrees and 0 degrees.
All observations can be completed by making only one round, such as degrees, 90 degrees, 180 degrees, etc., and rotation of the rotation shaft 12 (change of the orientation of the camera 8 is changed compared to the conventional soldering state inspection method. The time required for) can be dramatically reduced, and the time for the entire observation can be greatly reduced.

【0024】また次に基板ホルダ15へ搬送されてきた
未検査の基板を引き続き検査するには、前の基板と逆の
順序でカメラ8の向きを変更してもよい。この場合、未
検査の基板が基板ホルダ15に搬送されてくるまでの時
間内にカメラ8の向きを最初の向き(270°)に戻せ
ないとき等カメラ8の向きの調節に時間がかかる時に行
なうとよい。
Further, in order to subsequently inspect the uninspected substrate transferred to the substrate holder 15, the direction of the camera 8 may be changed in the reverse order of the previous substrate. In this case, it is performed when it takes time to adjust the orientation of the camera 8 such as when the orientation of the camera 8 cannot be returned to the initial orientation (270 °) within the time until the uninspected substrate is conveyed to the substrate holder 15. Good.

【0025】次に図4を参照しながら本発明の他の実施
例を説明する。他の実施例では、カメラを固定したまま
その光路の向きを前述した要領で更新するものである。
Next, another embodiment of the present invention will be described with reference to FIG. In another embodiment, the direction of the optical path is updated with the camera fixed, as described above.

【0026】ここで図4において、30は固定されたフ
レーム、31はフレーム30内に下向きに収納されるカ
メラ、32はL字状をなす鏡筒であり、ミラー34,3
5によってカメラ31の光路を半田付け部に斜めから向
けるものである。また鏡筒32の上部はベアリング33
によりフレーム30に対して水平回転自在に装着されて
いる。
In FIG. 4, 30 is a fixed frame, 31 is a camera housed downward in the frame 30, 32 is an L-shaped lens barrel, and mirrors 34, 3 are provided.
5, the optical path of the camera 31 is directed obliquely to the soldering portion. In addition, the upper part of the lens barrel 32 is a bearing 33.
Thus, the frame 30 is mounted so as to be horizontally rotatable.

【0027】36はフレーム30の側部にその出力軸3
7が下向きとなるように固定されるモータ、38は出力
軸37の下端部に軸着されるプーリである。また、鏡筒
32の外周にはプーリ39が外嵌され、プーリ38,3
9にはベルト40が調帯されている。したがって、モー
タ36を駆動すると、鏡筒32を水平面内においてθ方
向に回転させることができ、これによりカメラ31の光
路の向きを任意に更新することができる。
Reference numeral 36 denotes the output shaft 3 on the side of the frame 30.
The motor 7 is fixed so as to face downward, and 38 is a pulley that is axially attached to the lower end of the output shaft 37. Further, a pulley 39 is fitted onto the outer periphery of the lens barrel 32, and the pulleys 38, 3
A belt 40 is attached to the belt 9. Therefore, when the motor 36 is driven, the lens barrel 32 can be rotated in the θ direction in the horizontal plane, whereby the orientation of the optical path of the camera 31 can be arbitrarily updated.

【0028】なお他の実施例におけるカメラ31の光路
の更新及び半田付け部の観察の要領は、上述した実施例
と同様であるので説明を省略する。
The procedure of updating the optical path of the camera 31 and observing the soldering portion in the other embodiment is the same as that of the above-mentioned embodiment, and the description thereof will be omitted.

【0029】[0029]

【発明の効果】本発明の半田付け状態の検査方法は、カ
メラの向きを複数の向きから選んだ一つの向きにしたま
ま、複数個の電子部品の半田付け部を観察し、次にカメ
ラの向きを更新し、更新した向きにしたまま、複数個の
電子部品の半田付け部を観察するので、ターンテーブル
の回転を一巡させるだけで、全ての向きの半田付け部を
観察することができ、ターンテーブルの回転に要する時
間を節約することにより、全ての観察に要する時間を大
幅に削減することができる。
According to the soldering state inspection method of the present invention, the soldered portions of a plurality of electronic components are observed while the camera is oriented in one direction selected from a plurality of orientations, and then the camera The orientations are updated, and the soldered portions of a plurality of electronic components are observed while keeping the updated orientations, so it is possible to observe the soldered portions in all orientations by rotating the turntable once. By saving the time required to rotate the turntable, the time required for all observations can be significantly reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例における半田付け状態の検査
装置を示すブロック図
FIG. 1 is a block diagram showing a soldering state inspection device according to an embodiment of the present invention.

【図2】本発明の一実施例におけるカメラの向きの説明
FIG. 2 is an explanatory diagram of a camera orientation according to an embodiment of the present invention.

【図3】本発明の一実施例における原点方向の説明図FIG. 3 is an explanatory diagram of an origin direction in an embodiment of the present invention.

【図4】本発明の他の実施例における半田付け状態の検
査装置を示すブロック図
FIG. 4 is a block diagram showing a soldering state inspection device according to another embodiment of the present invention.

【図5】従来の半田付け状態の検査方法の説明図FIG. 5 is an explanatory diagram of a conventional soldering state inspection method.

【符号の説明】[Explanation of symbols]

1 基板 8 カメラ 12 回転軸 13 ターンテーブル A 第1の電子部品 B 第2の電子部品 1 substrate 8 camera 12 rotating shaft 13 turntable A first electronic component B second electronic component

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】ターンテーブルにカメラを傾斜した姿勢で
支持し、基板に半田付けされた複数個の電子部品の半田
付け部を複数の向きから観察して半田付け状態の検査を
行う半田付け状態の検査方法であって、 前記カメラの向きを前記複数の向きから選んだ一つの向
きにしたまま、複数個の電子部品の半田付け部を観察
し、次に前記カメラの向きを更新し、更新した向きにし
たまま、複数個の電子部品の半田付け部を観察すること
を特徴とする半田付け状態の検査方法。
1. A soldering state in which a camera is supported on a turntable in an inclined posture, and soldering states of a plurality of electronic components soldered to a board are observed from a plurality of directions to inspect the soldering state. In the inspection method, while keeping the orientation of the camera in one direction selected from the plurality of orientations, observing the soldered portions of a plurality of electronic components, and then updating the orientation of the camera, A method for inspecting a soldering state, which comprises observing soldered portions of a plurality of electronic components while keeping the same orientation.
【請求項2】前記カメラの向きに原点方向を設定し、こ
の原点方向をまたがない順序となるように、前記カメラ
の向きを一巡させることを特徴とする請求項1記載の半
田付け状態の検査方法。
2. The soldering state according to claim 1, wherein the direction of the origin is set to the direction of the camera, and the direction of the camera is cycled so that the order does not cross the direction of the origin. Inspection methods.
【請求項3】カメラと、このカメラの光路を基板に半田
付けされた半田付け部へ向ける鏡筒と、前記鏡筒の向き
を水平回転させるモータとを含む検査装置を用い、前記
半田付け部を複数の向きから観察する半田付け状態の検
査方法であって、 前記カメラの光路の向きを前記複数の向きから選んだ一
つの向きにしたまま、複数個の電子部品の半田付け部を
観察し、次に前記カメラの光軸の向きを更新し、更新し
た向きにしたまま、複数個の電子部品の半田付け部を観
察することを特徴とする半田付け状態の検査方法。
3. A soldering part using a camera, a lens barrel for directing an optical path of the camera to a soldering part soldered on a substrate, and a motor for horizontally rotating the lens barrel. Is a method of inspecting a soldering state for observing from a plurality of directions, with the direction of the optical path of the camera kept in one direction selected from the plurality of directions, and observing a soldering portion of a plurality of electronic components. Then, the method for inspecting the soldering state is characterized in that the direction of the optical axis of the camera is updated, and the soldered portions of a plurality of electronic components are observed while keeping the updated direction.
JP11289095A 1995-05-11 1995-05-11 Inspection method of soldering condition Expired - Fee Related JP3152102B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11289095A JP3152102B2 (en) 1995-05-11 1995-05-11 Inspection method of soldering condition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11289095A JP3152102B2 (en) 1995-05-11 1995-05-11 Inspection method of soldering condition

Publications (2)

Publication Number Publication Date
JPH08304299A true JPH08304299A (en) 1996-11-22
JP3152102B2 JP3152102B2 (en) 2001-04-03

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ID=14598086

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006220425A (en) * 2005-02-08 2006-08-24 Matsushita Electric Ind Co Ltd Visual inspection device and visual inspection method for printed circuit board
JP2006337217A (en) * 2005-06-03 2006-12-14 Shindenshi Corp Method for visually inspecting surface-mounted substrate etc. and device thereof
JP2007003360A (en) * 2005-06-24 2007-01-11 Matsushita Electric Ind Co Ltd Visual examination device
JP2009229155A (en) * 2008-03-21 2009-10-08 Nikon Corp Substrate inspection apparatus, and manufacturing method of substrate for mask
US7602487B2 (en) 2006-05-16 2009-10-13 Kirin Techno-System Corporation Surface inspection apparatus and surface inspection head apparatus
DE102009017695B3 (en) * 2009-04-15 2010-11-25 Göpel electronic GmbH Method for inspecting solder joints on electrical and electronic components

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006220425A (en) * 2005-02-08 2006-08-24 Matsushita Electric Ind Co Ltd Visual inspection device and visual inspection method for printed circuit board
JP2006337217A (en) * 2005-06-03 2006-12-14 Shindenshi Corp Method for visually inspecting surface-mounted substrate etc. and device thereof
JP4653568B2 (en) * 2005-06-03 2011-03-16 新電子株式会社 Method and apparatus for visual inspection of surface mount substrate
JP2007003360A (en) * 2005-06-24 2007-01-11 Matsushita Electric Ind Co Ltd Visual examination device
US7602487B2 (en) 2006-05-16 2009-10-13 Kirin Techno-System Corporation Surface inspection apparatus and surface inspection head apparatus
JP2009229155A (en) * 2008-03-21 2009-10-08 Nikon Corp Substrate inspection apparatus, and manufacturing method of substrate for mask
DE102009017695B3 (en) * 2009-04-15 2010-11-25 Göpel electronic GmbH Method for inspecting solder joints on electrical and electronic components
EP2241878A3 (en) * 2009-04-15 2017-05-03 Göpel electronic GmbH Method for inspecting soldering points of electric and electronic components

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