JPH05340733A - Semiconductor device inspecting device - Google Patents

Abstract

PURPOSE:To obtain a semiconductor device inspecting device which can perform high-speed processing by shortening the data processing time of the device in such a way that one piece of semiconductor device is inspected by one time of picture input. CONSTITUTION:Light reflecting means 5 are provided around a semiconductor device 1 mounted on a mounting stage 2. The image of the device 1 is picked up with an image pickup means 3 and the picture signal of the means 3 is inputted to a picture recognizing means 4 which recognizes the defect of the device 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection apparatus for a semiconductor device (device) such as an LSI, and more particularly to an inspection apparatus for inspecting a lead bend, a lead float, a character printed on the surface of a device. Is.

[0002]

2. Description of the Related Art A semiconductor device such as an LSI is diced from a wafer manufactured in a previous step, sealed in plastic or ceramic, and then electrically inspected.
Then, they are visually inspected and shipped. In the visual inspection, lead bending, lead floating, product name, standard and other characters printed on the device surface are inspected.

Conventionally, the visual inspection is performed by image recognition technology in order to save labor, but it is performed by imaging each portion such as lead bending, lead floating, and characters, and performing image processing.

For example, the lead bend is imaged and inspected from the upper surface of the device, the lead float is imaged and inspected from the side surface, and the character portion is separately imaged and inspected from the upper surface of the device.
In the case of a flat package, it is necessary to image from the four sides, and four cameras are installed or the installation table is rotated.

[0005]

As described above, in the conventional device, the number of cameras is required to be 3 to 6, and the function of switching between these cameras is required by hardware, and the adjustment and input of illumination are required. There were also timing restrictions. Also, many pre-adjustments such as focus adjustments took time.

Further, since there are many input images, the processing time per LSI becomes long, and the number of processings per time is limited.

In view of the above points, the present invention provides a semiconductor device inspection apparatus capable of inspecting one semiconductor device with one image input, and having a short data processing time and high-speed processing. It is an issue.

[0008]

SUMMARY OF THE INVENTION According to the present invention, a mounting table for mounting a semiconductor device to be inspected, an image pickup means for picking up an image of the semiconductor device, and a defect of the semiconductor device by an image signal obtained by the image pickup means. In the inspection apparatus for a semiconductor device, which is provided with an image recognition means for recognizing the above, the installation table is provided with a light reflection means around the semiconductor device.

[0009]

According to the present invention, the side surface and the top surface of the semiconductor device can be simultaneously imaged by the light reflecting means, and the image processing can be performed simultaneously on one screen, so that the inspection can be performed at high speed with a simple device configuration. be able to.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings.

1A and 1B are views showing a main part of an inspection apparatus according to the present invention. FIG. 1A is a side view and FIG. 1B is a top view thereof.

In the figure, 1 is a semiconductor device (device) to be inspected, 1A is a lead, 2 is an installation stand, 3 is an image pickup means, 4 is an image recognition means, 5 is a light reflection means (mirror), 6
Is lighting.

The image pickup means 3 is, for example, a CCD (Charg).
An e Coupled Device) camera can be used. The image recognition means 4 is, for example, a microcomputer.

The mirrors 5 are provided on four sides of the device 1 so that the side surface of the device 1 is input as an image signal when the image pickup means 3 picks up an image from the upper surface of the device 1. That is, the mirror 5 is the installation table 2
Has an angle of 45 to 60 with respect to the upper surface of the. The mirror 5 may be provided only on two sides in the case of a package in which pins are provided on only two sides such as DIP.

The inspection is performed in the following procedure.

When the device 1 is installed on the installation table 2, the illumination 6 is turned on and the image pickup means 3 takes an image of the device 1. FIG. 2 is a diagram showing an image captured by the above inspection device. This image is represented by 256 gradations, for example.

In FIG. 2, 7 is an image of the upper surface of the device directly taken by the image pickup means 3, and 7A is an image of the lead. 8 is an image of the side surface of the device taken through the mirror, and 8A is an image of the lead. It is possible to recognize and evaluate the bending and characters of the lead from the image on the top of the device, and the floating of the lead from the image on the side of the device.
This image signal from the image pickup means 3 is inputted to the image recognition means 4, and the well-known image recognition technique is used to recognize whether or not the device 1 is defective.

FIG. 3 is a flowchart showing the operation of the image recognition means 4.

First, the image signals as shown in FIG. 2 are collectively fetched into the storage device of the image recognition means 4 (step S1).
00).

Then, each window shown by a dotted line in FIG. 2 is divided into necessary blocks. In FIG. 2, a lead inspection window (bending) 10, a lead inspection window (float) 20, and a character inspection window 30 are provided.
It is divided into blocks (step S200).

Next, an inspection is performed for each window using a known image recognition technique (step S300). In the lead inspection window (bend) 10, the center pitch of the lead is measured and compared with a standard value stored in advance to detect the bend. In the lead inspection window (float) 20, the deviation is calculated with respect to a virtual reference line in which the lead projected on the mirror 5 is stored in advance, and the floating amount is calculated. In the character inspection window 30, character inspection is performed by pattern matching of characters. Finally, the inspection result obtained as described above is output (step S400).

In this way, each part can be inspected by imaging one screen.

[0023]

As described above, according to the present invention, lead bending, lead floating, and character inspection can be simultaneously performed by inputting one screen, and the processing time per semiconductor device can be shortened. .. Also, since the device has a simple structure, setting is easy and the device is inexpensive.

[Brief description of drawings]

FIG. 1 is a diagram showing an inspection apparatus of the present invention.

FIG. 2 is a diagram showing an image obtained by the inspection device of the present invention.

FIG. 3 is a flowchart showing the operation of the image recognition means.

[Explanation of symbols]

 1 semiconductor device (device) 2 installation base 3 imaging means 4 image recognition means 5 light reflection means (mirror) 6 illumination

Claims (1)

[Claims] 1. A mounting base for mounting a semiconductor device to be inspected, an image pickup means for picking up an image of the semiconductor device, and an image recognition means for recognizing a defect of the semiconductor device by an image signal obtained by the image pickup means. In the semiconductor device inspection device, the semiconductor device inspection device is characterized in that the installation table is provided with a light reflecting means around a periphery where the semiconductor device is installed.