JPH08288633A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH08288633A JPH08288633A JP11799895A JP11799895A JPH08288633A JP H08288633 A JPH08288633 A JP H08288633A JP 11799895 A JP11799895 A JP 11799895A JP 11799895 A JP11799895 A JP 11799895A JP H08288633 A JPH08288633 A JP H08288633A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- conductor circuit
- carrier
- pattern
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は，加熱リフロー時に半田
キャリアの上に荷重板を載置することなく，正確な位置
に半田パターンを形成することができる，プリント配線
板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, which allows a solder pattern to be formed at an accurate position without placing a load plate on a solder carrier during heating reflow.
【０００２】[0002]
【従来技術】従来，プリント配線板としては，例えば，
図７に示すごとく，絶縁基板６３の表面に導体回路６５
を形成し，該導体回路６５を半田パターン１２を介し
て，マザーボード６７に接合するものがある。プリント
配線板６の表面は，上記半田パターン１２を除いて，ソ
ルダーレジスト９により被覆されている。2. Description of the Related Art Conventionally, as a printed wiring board, for example,
As shown in FIG. 7, a conductor circuit 65 is formed on the surface of the insulating substrate 63.
And the conductor circuit 65 is bonded to the mother board 67 via the solder pattern 12. The surface of the printed wiring board 6 is covered with a solder resist 9 except for the solder pattern 12.
【０００３】上記半田パターン１２を有するプリント配
線板６を製造するに当たっては，例えば，まず，図８に
示すごとく，基材６９の表面に半田パターン１２を形成
して，半田キャリア１を得る。次いで，表面にフラック
ス６５０を塗布した導体回路基板６０の表面に，上記半
田キャリア１を配置する。この際，導体回路基板６０の
導体回路６５の上に，半田キャリア１の半田パターン１
２が位置するように位置合わせをする。In manufacturing the printed wiring board 6 having the solder pattern 12, for example, first, as shown in FIG. 8, the solder pattern 12 is formed on the surface of the base material 69 to obtain the solder carrier 1. Next, the solder carrier 1 is placed on the surface of the conductor circuit board 60 having the surface coated with the flux 650. At this time, the solder pattern 1 of the solder carrier 1 is formed on the conductor circuit 65 of the conductor circuit board 60.
Align so that 2 is positioned.
【０００４】次いで，半田キャリア１の上に荷重板８を
載せる。これは，半田キャリア１が導体回路基板６０上
に塗布したフラックス６５０により滑ることを防止し
て，半田キャリア１と導体回路基板６０との間の位置ズ
レを防止するためである。Next, the load plate 8 is placed on the solder carrier 1. This is to prevent the solder carrier 1 from slipping due to the flux 650 applied on the conductor circuit board 60, and to prevent the positional deviation between the solder carrier 1 and the conductor circuit board 60.
【０００５】次いで，図９に示すごとく，荷重板８によ
り荷重をかけたまま，半田パターン１２を導体回路基板
６０の導体回路６５に密着させて，加熱リフロー炉に入
れ，加熱する。これにより，半田パターンが溶融して導
体回路６５に転写されて，図７に示す上記プリント配線
板６が得られる。Then, as shown in FIG. 9, the solder pattern 12 is brought into close contact with the conductor circuit 65 of the conductor circuit board 60 while being loaded by the load plate 8, and the solder pattern 12 is placed in a heating reflow furnace and heated. As a result, the solder pattern is melted and transferred to the conductor circuit 65, and the printed wiring board 6 shown in FIG. 7 is obtained.
【０００６】[0006]
【解決しようとする課題】しかしながら，上記従来のプ
リント配線板の製造方法においては，図９に示すごと
く，荷重板８を半田キャリア１の上に載置している。そ
のため，荷重板８の載置の際における荷重板８の衝撃に
より，半田パターン１２と導体回路６５との間に位置ズ
レが発生するおそれがある。そのため，導体回路の上の
正確な位置に半田パターンを形成することが困難とな
る。However, in the conventional method of manufacturing a printed wiring board, the load plate 8 is placed on the solder carrier 1 as shown in FIG. Therefore, when the load plate 8 is placed, an impact of the load plate 8 may cause a positional deviation between the solder pattern 12 and the conductor circuit 65. Therefore, it becomes difficult to form a solder pattern at an accurate position on the conductor circuit.
【０００７】また，荷重板８は，上記リフロー時におい
て半田キャリア１から熱を奪う。そのため，加熱リフロ
ー炉の中を，過剰に高い温度に設定しなければならず，
余分の加熱エネルギーが必要となる。The load plate 8 also removes heat from the solder carrier 1 during the reflow process. Therefore, it is necessary to set an excessively high temperature in the heating reflow furnace,
Extra heating energy is required.
【０００８】本発明はかかる従来の問題点に鑑み，加熱
リフロー時に半田キャリアの上に荷重板を載置すること
なく，半田パターンを正確な位置に形成することができ
る，プリント配線板の製造方法を提供しようとするもの
である。In view of the above-mentioned conventional problems, the present invention is a method for manufacturing a printed wiring board in which a solder pattern can be formed at an accurate position without placing a load plate on a solder carrier during heating reflow. Is to provide.
【０００９】[0009]
【課題の解決手段】本発明は，導体回路基板に設けた導
体回路と，該導体回路上に設けた半田パターンとを有す
るプリント配線板を製造する方法において，まず，上記
導体回路上に形成するための半田パターンを基材上に設
けてなる半田キャリアを準備し，次に，上記半田キャリ
アを真空チャック付き吸引治具により真空吸引して保持
し，次に，上記吸引治具により保持した半田キャリアを
上記導体回路基板の上に配置すると共に，上記導体回路
基板の導体回路の上に上記半田キャリアの半田パターン
が位置するように両者の位置合わせを行い，次に，上記
吸引治具を下降させて，上記導体回路基板の導体回路の
上に上記半田キャリアの半田パターンを接触させると共
に，上記吸引治具により半田キャリアを押圧して上記半
田パターンを上記導体回路に仮固定し，その後，上記導
体回路の上に半田パターンを形成することを特徴とする
プリント配線板の製造方法にある。The present invention is a method for manufacturing a printed wiring board having a conductor circuit provided on a conductor circuit board and a solder pattern provided on the conductor circuit. First, the printed circuit board is formed on the conductor circuit. A solder carrier in which a solder pattern is provided on a base material, and then the above solder carrier is vacuum-sucked and held by a suction jig with a vacuum chuck, and then solder held by the suction jig. The carrier is placed on the conductor circuit board, the both are aligned so that the solder pattern of the solder carrier is located on the conductor circuit of the conductor circuit board, and then the suction jig is lowered. Then, the solder pattern of the solder carrier is brought into contact with the conductor circuit of the conductor circuit board, and the solder carrier is pressed by the suction jig to form the solder pattern. Temporarily fixed to the body circuit, then, in the manufacturing method of a printed wiring board and forming a solder pattern on the conductor circuit.
【００１０】本発明において最も注目すべきことは，真
空チャック付き吸引治具の吸引力により半田キャリアを
保持して導体回路基板の上に位置するように位置合わせ
を行い，次に上記吸引治具により上記半田キャリアを押
圧して半田パターンを上記導体回路基板の導体回路に仮
固定することである。What is most noticeable in the present invention is that the suction force of the suction jig with the vacuum chuck holds the solder carrier so that the solder carrier is positioned on the conductor circuit board. To press the solder carrier to temporarily fix the solder pattern to the conductor circuit of the conductor circuit board.
【００１１】上記半田キャリアは，導体回路上に形成す
るための半田パターンと，該半田パターンを表面に形成
した基材とを有している。上記基材は，透光性を有する
ことが好ましい。これにより，半田パターンと導体回路
との位置関係を半田キャリアの上方から透視できるた
め，両者の位置合わせが容易となる。The solder carrier has a solder pattern to be formed on the conductor circuit and a base material having the solder pattern formed on the surface. The base material preferably has a light-transmitting property. As a result, the positional relationship between the solder pattern and the conductor circuit can be seen through from above the solder carrier, which facilitates the alignment of the two.
【００１２】また，基材が透光性である場合，例えば，
半田パターンと導体回路との配置関係は，例えばＣＣＤ
カメラ等の光学的手段により認識して，容易に両者の位
置合わせを行うことができる。上記半田パターンは，半
田を用いて形成したものであり，導体回路よりも柔らか
い。When the substrate is translucent, for example,
The arrangement relationship between the solder pattern and the conductor circuit is, for example, CCD.
It is possible to easily align the two by recognizing them by an optical means such as a camera. The solder pattern is formed using solder and is softer than the conductor circuit.
【００１３】上記半田キャリアは，真空チャック付き吸
引治具により吸引保持して，導体回路基板に対して押圧
する。上記吸引治具による押圧力は，５〜５０ｋｇｆ／
ｃｍ2 であることが好ましい。５ｋｇｆ／ｃｍ2 未満の
場合には，半田パターンが導体回路に対して充分に強く
仮固定できないおそれがある。一方，５０ｋｇｆ／ｃｍ
2 を越える場合には，導体回路或いは導体回路基板を損
傷するおそれがある。The solder carrier is suction-held by a suction jig with a vacuum chuck and pressed against the conductor circuit board. The pressing force applied by the suction jig is 5 to 50 kgf /
It is preferably cm 2 . If it is less than 5 kgf / cm 2 , the solder pattern may not be sufficiently firmly fixed to the conductor circuit. On the other hand, 50 kgf / cm
If it exceeds 2 , the conductor circuit or the conductor circuit board may be damaged.
【００１４】次に，半田キャリアの半田パターンを，導
体回路基板の導体回路上に形成する。その好ましい形成
方法としては，例えば，半田パターンを導体回路上に仮
固定した後，半田キャリアから上記吸引治具を取り外
し，その後上記導体回路基板を上記半田キャリアと共に
加熱することにより，半田キャリアの半田パターンを加
熱リフローさせて導体回路上に転写する方法がある。Next, a solder pattern of the solder carrier is formed on the conductor circuit of the conductor circuit board. As a preferable forming method, for example, after the solder pattern is temporarily fixed on the conductor circuit, the suction jig is removed from the solder carrier, and then the conductor circuit board is heated together with the solder carrier to solder the solder carrier. There is a method in which a pattern is heated and reflowed and transferred onto a conductor circuit.
【００１５】この転写方法では，半田パターンのリフロ
ー用の加熱は，半田キャリアから吸引治具を取り外した
後に行う。そのため，従来のように荷重板によってリフ
ロー用の熱が奪われることもない。従って，リフロー時
の加熱エネルギーの省力化を図ることができる。In this transfer method, heating for reflowing the solder pattern is performed after removing the suction jig from the solder carrier. Therefore, the heat for reflow is not taken away by the load plate unlike the conventional case. Therefore, it is possible to save the heating energy during reflow.
【００１６】上記の導体回路上に形成された半田パター
ンは，例えば，相手部材との接合のための半田バンプと
して使用することができる。また，ＴＡＢ（Ｔａｐｅ
Ａｕｔｏｍａｔｅｄ Ｂｏｎｄｉｎｇ），又はＱＦＰ
（Ｑｕａｄ Ｆｌａｔ Ｐａｃｋａｇｅ）としても使用
することができる。The solder pattern formed on the conductor circuit can be used, for example, as a solder bump for joining with a mating member. Also, TAB (Tape
Automated Bonding) or QFP
It can also be used as (Quad Flat Package).
【００１７】[0017]
【作用及び効果】本発明のプリント配線板の製造方法に
おいては，半田キャリアを真空チャック付き吸引治具に
より吸引保持して導体回路基板に対して位置決めを行う
と共に連続して上記吸引治具により半田キャリアを押圧
して半田パターンを導体回路に仮固定している。即ち，
上記の仮固定は半田パターンを導体回路に対して圧着固
定することにより行う。そのため，導体回路基板に対し
て半田キャリアを正確な位置に位置決め，固定すること
ができる。In the method for manufacturing a printed wiring board according to the present invention, the solder carrier is sucked and held by the suction jig with the vacuum chuck to position the conductor carrier on the conductor circuit board and continuously soldered by the suction jig. The carrier is pressed to temporarily fix the solder pattern to the conductor circuit. That is,
The temporary fixing is performed by crimping and fixing the solder pattern to the conductor circuit. Therefore, it is possible to position and fix the solder carrier at an accurate position with respect to the conductor circuit board.
【００１８】また，上記押圧時には，半田パターンは導
体回路よりも柔らかいため，導体回路との接触部分が導
体回路に沿って凹み，半田パターンが導体回路に対して
仮固定される。このため，半田パターンと導体回路との
間に位置ズレは発生しない。それ故，加熱リフローの際
に，荷重板により半田キャリアを押さえつける必要もな
い。従って，正確な位置に半田パターンを形成すること
ができる。Further, at the time of pressing, since the solder pattern is softer than the conductor circuit, the contact portion with the conductor circuit is dented along the conductor circuit, and the solder pattern is temporarily fixed to the conductor circuit. Therefore, no positional deviation occurs between the solder pattern and the conductor circuit. Therefore, it is not necessary to press the solder carrier by the load plate during the heating reflow. Therefore, the solder pattern can be formed at an accurate position.
【００１９】本発明によれば，加熱リフロー時に半田キ
ャリアの上に荷重板を載置することなく，半田パターン
を正確な位置に形成することができる，プリント配線板
の製造方法を提供することができる。According to the present invention, it is possible to provide a method for manufacturing a printed wiring board, which can form a solder pattern at an accurate position without placing a load plate on a solder carrier during heating reflow. it can.
【００２０】[0020]
【実施例】本発明の実施例にかかるプリント配線板の製
造方法について，図１〜図６を用いて説明する。本例
は，絶縁基板の表面に設けた導体回路の上に，半田パタ
ーンを形成したプリント配線板を製造する方法である。EXAMPLE A method for manufacturing a printed wiring board according to an example of the present invention will be described with reference to FIGS. This example is a method of manufacturing a printed wiring board having a solder pattern formed on a conductor circuit provided on the surface of an insulating substrate.
【００２１】即ち，図１に示すごとく，半田キャリア１
を真空チャック付きの吸引治具２（後述の図７）により
吸引保持して導体回路基板６０の上に配置し，位置決め
を行う。次に，図２，図３に示すごとく，吸引治具２に
より半田キャリア１を押圧して該半田キャリアの半田パ
ターン１２を絶縁基板６３の導体回路６５に仮固定す
る。次に，図５に示すごとく，半田キャリア１から吸引
治具２を取り外し，その後導体回路基板６０を半田キャ
リア１と共に加熱することにより，半田パターン１２を
導体回路６５上に転写して，上記プリント配線板を得
る。That is, as shown in FIG. 1, the solder carrier 1
Is suction-held by a suction jig 2 with a vacuum chuck (FIG. 7, which will be described later), placed on the conductor circuit board 60, and positioned. Next, as shown in FIGS. 2 and 3, the solder carrier 1 is pressed by the suction jig 2 to temporarily fix the solder pattern 12 of the solder carrier to the conductor circuit 65 of the insulating substrate 63. Next, as shown in FIG. 5, the suction jig 2 is removed from the solder carrier 1, and then the conductor circuit board 60 is heated together with the solder carrier 1 so that the solder pattern 12 is transferred onto the conductor circuit 65 and the above-mentioned print is performed. Get the wiring board.
【００２２】以下，これを詳説する。まず，図１に示す
ごとく，導体回路６５上に形成するための半田パターン
１２を基材１６上に設けた半田キャリア１を準備する。
基材１６は，透光性を有するプリプレグシートである。
半田は，ＳｎとＰｂとからなる共晶合金である。This will be described in detail below. First, as shown in FIG. 1, a solder carrier 1 in which a solder pattern 12 for forming on a conductor circuit 65 is provided on a base material 16 is prepared.
The base material 16 is a translucent prepreg sheet.
Solder is a eutectic alloy composed of Sn and Pb.
【００２３】一方，絶縁基板６３の表面に導体回路６５
を形成する。次いで，半田パターンが形成される部分を
除く，絶縁基板６３の表面をソルダーレジスト９により
被覆して，導体回路基板６０を得る。導体回路６５は，
例えば，Ｃｕ又はＣｕ−Ｎｉ／Ａｕ等の導体材料であ
る。絶縁基板６３は，例えば，ガラス・エポキシ樹脂，
ガラス・ポリイミド樹脂，又はガラスビスマレイミドト
リアジン樹脂からなる。また，導体回路６５の上にフラ
ックス６５０を塗布する。On the other hand, a conductor circuit 65 is formed on the surface of the insulating substrate 63.
To form. Next, the surface of the insulating substrate 63 except the portion where the solder pattern is formed is covered with the solder resist 9 to obtain the conductor circuit board 60. The conductor circuit 65 is
For example, it is a conductor material such as Cu or Cu-Ni / Au. The insulating substrate 63 is made of, for example, glass epoxy resin,
It is made of glass / polyimide resin or glass bismaleimide triazine resin. Further, the flux 650 is applied on the conductor circuit 65.
【００２４】次に，図１に示すごとく，多数の吸引口２
００を開口させた真空チャック２０を有する吸引治具２
により，半田キャリア１を真空吸引する。これにより，
半田キャリア１が，吸引治具２の真空チャック２０に保
持される。なお，図１において，符号２１は吸引室，符
号２２は吸引ポンプである。Next, as shown in FIG. 1, a large number of suction ports 2
Suction jig 2 having a vacuum chuck 20 in which 00 is opened
Thus, the solder carrier 1 is vacuumed. By this,
The solder carrier 1 is held by the vacuum chuck 20 of the suction jig 2. In FIG. 1, reference numeral 21 is a suction chamber and reference numeral 22 is a suction pump.
【００２５】次に，半田キャリア１を保持した吸引治具
２を，上記導体回路基板６０の上に配置する。次いで，
半田キャリア１の半田パターン１２が導体回路６５の上
に位置するように位置合わせを行う。この位置合わせ
は，吸引治具２に取り付けたＣＣＤカメラ（図示略）に
より，透光性の基材６３を透視して，半田パターン１２
と導体回路６５との位置関係を認識することにより行
う。Next, the suction jig 2 holding the solder carrier 1 is placed on the conductor circuit board 60. Then,
Positioning is performed so that the solder pattern 12 of the solder carrier 1 is located on the conductor circuit 65. For this alignment, a CCD camera (not shown) attached to the suction jig 2 is used to see through the transparent base material 63, and the solder pattern 12
This is performed by recognizing the positional relationship between the conductor circuit 65 and the conductor circuit 65.
【００２６】次に，図２に示すごとく，上記位置合わせ
をした位置において，吸引治具２を下降させて，導体回
路基板６０の導体回路６５の上に半田キャリア１の半田
パターン１２を接触させる。更に，図３，図４に示すご
とく，吸引治具２により，半田キャリア１を押圧して，
半田パターン１２を導体回路６５に圧着し，仮固定す
る。吸引治具２による半田キャリア１の押圧力は，１０
ｋｇｆ／ｃｍ2 である。Next, as shown in FIG. 2, the suction jig 2 is lowered at the position where the above alignment has been made, and the solder pattern 12 of the solder carrier 1 is brought into contact with the conductor circuit 65 of the conductor circuit board 60. . Furthermore, as shown in FIGS. 3 and 4, the solder jig 1 is pressed by the suction jig 2,
The solder pattern 12 is pressure-bonded to the conductor circuit 65 and temporarily fixed. The pressing force of the solder carrier 1 by the suction jig 2 is 10
It is kgf / cm 2 .
【００２７】次に，吸引治具２の真空吸引を止めて，半
田キャリア１から吸引治具２を取り外す。次に，図５に
示すごとく，導体回路６５により仮固定した導体回路基
板６０と半田キャリア１とを加熱リフロー炉の中に入れ
て加熱する。加熱条件は，１８３℃以上，５０秒間であ
る。これにより，図６に示すごとく，半田パターン１２
が導体回路６５の上に転写，形成されて，上記プリント
配線板６が得られる。Next, the vacuum suction of the suction jig 2 is stopped, and the suction jig 2 is removed from the solder carrier 1. Next, as shown in FIG. 5, the conductor circuit board 60 temporarily fixed by the conductor circuit 65 and the solder carrier 1 are put into a heating reflow furnace and heated. The heating conditions are 183 ° C. or higher and 50 seconds. As a result, as shown in FIG.
Is transferred and formed on the conductor circuit 65, and the printed wiring board 6 is obtained.
【００２８】次に，本例の作用効果について説明する。
本例のプリント配線板の製造方法においては，半田キャ
リア１を真空チャック付き吸引治具２により吸引保持し
て導体回路基板６０に対して位置決めを行うと共に連続
して吸引治具２により半田キャリア１を押圧して半田パ
ターン１２を導体回路６５に仮固定している。即ち，上
記の仮固定は，図３に示すごとく，半田パターン１２を
導体回路６５に対して圧着固定することにより行う。そ
のため，導体回路基板６０に対して半田キャリア１を正
確な位置に位置決め，固定することができる。Next, the function and effect of this example will be described.
In the method for manufacturing a printed wiring board of this example, the solder carrier 1 is suction-held by the suction jig 2 with a vacuum chuck to position the conductor circuit board 60, and the solder carrier 1 is continuously sucked by the suction jig 2. Is pressed to temporarily fix the solder pattern 12 to the conductor circuit 65. That is, the above-mentioned temporary fixing is performed by crimping and fixing the solder pattern 12 to the conductor circuit 65 as shown in FIG. Therefore, the solder carrier 1 can be positioned and fixed at an accurate position with respect to the conductor circuit board 60.
【００２９】また，上記押圧時には，半田パターン１２
は導体回路６５よりも柔らかいため，図４に示すごと
く，導体回路６５との接触部分１２５が導体回路６５に
沿って凹み，半田パターン１２が導体回路６５に対して
仮固定される。このため，半田パターン１２と導体回路
６５との間に位置ズレは発生しない。それ故，加熱リフ
ローの際に荷重板により半田キャリアを押さえつける必
要もない。従って，正確な位置に半田パターンを転写，
形成することができる。At the time of pressing, the solder pattern 12
Is softer than the conductor circuit 65, the contact portion 125 with the conductor circuit 65 is recessed along the conductor circuit 65, and the solder pattern 12 is temporarily fixed to the conductor circuit 65, as shown in FIG. Therefore, no positional deviation occurs between the solder pattern 12 and the conductor circuit 65. Therefore, it is not necessary to press the solder carrier by the load plate during the heating reflow. Therefore, transfer the solder pattern to the correct position,
Can be formed.
【００３０】また，半田パターン１２のリフロー用の加
熱は，半田キャリア１から吸引治具２を取り外した後に
行う。そのため，従来のように荷重板によってリフロー
用の熱が奪われることもない。従って，リフロー時の加
熱エネルギーの省力化を図ることができる。The reflow heating of the solder pattern 12 is performed after the suction jig 2 is removed from the solder carrier 1. Therefore, the heat for reflow is not taken away by the load plate unlike the conventional case. Therefore, it is possible to save the heating energy during reflow.
【図１】実施例における，導体回路基板の上に半田キャ
リアを配置し，位置合わせを行う方法を示す説明図。FIG. 1 is an explanatory view showing a method of arranging a solder carrier on a conductor circuit board and performing alignment in an embodiment.
【図２】実施例における，半田キャリアの半田パターン
を導体回路基板の導体回路に接触した状態を示す説明
図。FIG. 2 is an explanatory view showing a state in which the solder pattern of the solder carrier is in contact with the conductor circuit of the conductor circuit board in the embodiment.
【図３】実施例における，半田パターンを導体回路に対
して仮固定する方法を示す説明図。FIG. 3 is an explanatory view showing a method for temporarily fixing the solder pattern to the conductor circuit in the embodiment.
【図４】実施例における，導体回路に仮固定された半田
パターンの説明図。FIG. 4 is an explanatory diagram of a solder pattern that is temporarily fixed to a conductor circuit according to the embodiment.
【図５】実施例における，加熱リフロー炉内における，
導体回路基板と半田キャリアとを示す説明図。FIG. 5 is a schematic diagram of a heating reflow furnace according to an embodiment,
Explanatory drawing which shows a conductor circuit board and a solder carrier.
【図６】実施例における，半田パターンの半田が導体回
路上に形成された状態を示す説明図。FIG. 6 is an explanatory diagram showing a state in which solder of a solder pattern is formed on a conductor circuit in the example.
【図７】従来例のプリント配線板の説明図。FIG. 7 is an explanatory diagram of a conventional printed wiring board.
【図８】従来例における，導体回路基板の上に半田キャ
リアを配置する方法を示す説明図。FIG. 8 is an explanatory view showing a method of disposing a solder carrier on a conductor circuit board in a conventional example.
【図９】従来例における，加熱リフロー炉内における，
導体回路基板と半田キャリアとを示す説明図。FIG. 9 shows a conventional reflow furnace in a conventional example,
Explanatory drawing which shows a conductor circuit board and a solder carrier.
１．．．半田キャリア， １２．．．半田パターン， １６．．．基材， ２．．．吸引治具， ６．．．プリント配線板， ６０．．．導体回路基板， ６３．．．絶縁基板， ６５．．．導体回路， ９．．．ソルダーレジスト， 1. ． ． Solder carrier, 12. ． ． Solder pattern, 16. ． ． Substrate, 2. ． ． Suction jig, 6. ． ． Printed wiring board, 60. ． ． Conductor circuit board, 63. ． ． Insulating substrate, 65. ． ． Conductor circuit, 9. ． ． Solder resist,
Claims (5)
体回路上に設けた半田パターンとを有するプリント配線
板を製造する方法において，まず，上記導体回路上に形
成するための半田パターンを基材上に設けてなる半田キ
ャリアを準備し，次に，上記半田キャリアを真空チャッ
ク付き吸引治具により真空吸引して保持し，次に，上記
吸引治具により保持した半田キャリアを上記導体回路基
板の上に配置すると共に，上記導体回路基板の導体回路
の上に上記半田キャリアの半田パターンが位置するよう
に両者の位置合わせを行い，次に，上記吸引治具を下降
させて，上記導体回路基板の導体回路の上に上記半田キ
ャリアの半田パターンを接触させると共に，上記吸引治
具により半田キャリアを押圧して上記半田パターンを上
記導体回路に仮固定し，その後，上記導体回路の上に半
田パターンを形成することを特徴とするプリント配線板
の製造方法。1. In a method for manufacturing a printed wiring board having a conductor circuit provided on a conductor circuit board and a solder pattern provided on the conductor circuit, first, a solder pattern to be formed on the conductor circuit is formed. A solder carrier provided on a base material is prepared, then the solder carrier is vacuum-sucked and held by a suction jig with a vacuum chuck, and then the solder carrier held by the suction jig is held in the conductor circuit. The conductors are arranged on the board and aligned so that the solder pattern of the solder carrier is located on the conductor circuit of the conductor circuit board, and then the suction jig is lowered to move the conductor. The solder pattern of the solder carrier is brought into contact with the conductor circuit of the circuit board, and the solder carrier is pressed by the suction jig to temporarily fix the solder pattern to the conductor circuit. Then, a method for manufacturing a printed wiring board, characterized by forming a solder pattern on the conductor circuit.
を有することを特徴とするプリント配線板の製造方法。2. The method for manufacturing a printed wiring board according to claim 1, wherein the base material has a light-transmitting property.
による押圧力は，５〜５０ｋｇｆ／ｃｍ2 であることを
特徴とするプリント配線板の製造方法。3. The method for manufacturing a printed wiring board according to claim 1, wherein the pressing force applied by the suction jig is 5 to 50 kgf / cm 2 .
パターンとの位置合わせは，光学的手段により行うこと
を特徴とするプリント配線板の製造方法。4. The method of manufacturing a printed wiring board according to claim 2, wherein the alignment between the conductor circuit and the solder pattern is performed by an optical means.
上記半田パターンを導体回路に仮固定した後，上記吸引
治具の真空吸引を止めて，上記半田キャリアから上記吸
引治具を取り外し，その後上記導体回路基板を上記半田
キャリアと共に加熱して，上記導体回路の上に上記半田
パターンを転写することを特徴とするプリント配線板の
製造方法。5. The method according to any one of claims 1 to 4,
After the solder pattern is temporarily fixed to the conductor circuit, the vacuum suction of the suction jig is stopped, the suction jig is removed from the solder carrier, and then the conductor circuit board is heated together with the solder carrier to remove the conductor. A method for manufacturing a printed wiring board, which comprises transferring the solder pattern onto a circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11799895A JP3650853B2 (en) | 1995-04-18 | 1995-04-18 | Method for manufacturing printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11799895A JP3650853B2 (en) | 1995-04-18 | 1995-04-18 | Method for manufacturing printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08288633A true JPH08288633A (en) | 1996-11-01 |
| JP3650853B2 JP3650853B2 (en) | 2005-05-25 |
Family
ID=14725519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11799895A Expired - Lifetime JP3650853B2 (en) | 1995-04-18 | 1995-04-18 | Method for manufacturing printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3650853B2 (en) |
-
1995
- 1995-04-18 JP JP11799895A patent/JP3650853B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP3650853B2 (en) | 2005-05-25 |
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