JPH08288632A - Solder carrier and manufacture of printed wiring board - Google Patents
Solder carrier and manufacture of printed wiring boardInfo
- Publication number
- JPH08288632A JPH08288632A JP11643595A JP11643595A JPH08288632A JP H08288632 A JPH08288632 A JP H08288632A JP 11643595 A JP11643595 A JP 11643595A JP 11643595 A JP11643595 A JP 11643595A JP H08288632 A JPH08288632 A JP H08288632A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- conductor circuit
- carrier
- pattern
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は，導体回路上に半田パタ
ーンを形成するための半田キャリア，及び該半田キャリ
アを用いて，半田パターンを有するプリント配線板を製
造する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder carrier for forming a solder pattern on a conductor circuit, and a method for manufacturing a printed wiring board having a solder pattern using the solder carrier.
【０００２】[0002]
【従来技術】従来，プリント配線板としては，図４に示
すごとく，絶縁基板６５の表面に導体回路６３を設け，
該導体回路６３の上に半田パターン３を形成したものが
ある。このプリント配線板６の表面は，半田パターン３
を除いて，ソルダーレジスト６６により被覆されてい
る。2. Description of the Related Art Conventionally, as a printed wiring board, a conductor circuit 63 is provided on the surface of an insulating substrate 65 as shown in FIG.
There is one in which the solder pattern 3 is formed on the conductor circuit 63. The surface of the printed wiring board 6 has the solder pattern 3
Other than the above, it is covered with a solder resist 66.
【０００３】上記プリント配線板を製造するに当たって
は，図５に示すごとく，絶縁基板６５の表面に導体回路
６３を形成し，次に，半田パターン転写部分を残して，
上記絶縁基板６５の表面全体にソルダーレジスト６６を
塗布して，導体回路基板６０を準備する。In manufacturing the above printed wiring board, as shown in FIG. 5, a conductor circuit 63 is formed on the surface of an insulating substrate 65, and then a solder pattern transfer portion is left,
A solder resist 66 is applied to the entire surface of the insulating substrate 65 to prepare the conductor circuit substrate 60.
【０００４】次いで，上記導体回路基板６０の表面に，
フラックスを塗布する。次いで，導体回路基板６０の表
面に，半田キャリア３０を位置合わせをして，載置す
る。半田キャリア３０は，転写基材３６の表面に半田パ
ターン３を形成したものである。次に，上記導体回路基
板６０を半田キャリア３０と共に，リフロー炉の中に入
れて，窒素雰囲気下において加熱する。これにより，半
田パターン３の半田が導体回路６３上に転写されて，図
４に示すプリント配線板が得られる。Then, on the surface of the conductor circuit board 60,
Apply flux. Next, the solder carrier 30 is aligned and placed on the surface of the conductor circuit board 60. The solder carrier 30 is formed by forming the solder pattern 3 on the surface of the transfer base material 36. Next, the conductor circuit board 60 together with the solder carrier 30 is put into a reflow furnace and heated in a nitrogen atmosphere. As a result, the solder of the solder pattern 3 is transferred onto the conductor circuit 63, and the printed wiring board shown in FIG. 4 is obtained.
【０００５】[0005]
【解決しようとする課題】しかしながら，上記従来のプ
リント配線板の製造方法においては，次の問題がある。
即ち，図６に示すごとく，上記転写用の加熱の際に，半
田キャリア３０と導体回路基板６０との間のフラックス
６９が加熱され，その中のイソプロピルアルコール等の
溶媒がガス化する。そして，この溶媒ガス８は，膨張し
て，その周囲の半田キャリア３０を凸状に湾曲させる。
そのため，導体回路基板６０の導体回路６３上に半田パ
ターン３が転写されないおそれがある。However, the above-mentioned conventional method for manufacturing a printed wiring board has the following problems.
That is, as shown in FIG. 6, during the heating for transfer, the flux 69 between the solder carrier 30 and the conductor circuit board 60 is heated, and the solvent such as isopropyl alcohol therein is gasified. Then, this solvent gas 8 expands and causes the solder carrier 30 around it to curve in a convex shape.
Therefore, the solder pattern 3 may not be transferred onto the conductor circuit 63 of the conductor circuit board 60.
【０００６】本発明はかかる従来の問題点に鑑み，半田
パターンの転写歩留りが高い，半田キャリア及びこれを
用いた半田パターンを有するプリント配線板の製造方法
を提供しようとするものである。In view of the above conventional problems, the present invention aims to provide a solder carrier having a high solder pattern transfer yield and a method of manufacturing a printed wiring board having a solder pattern using the same.
【０００７】[0007]
【課題の解決手段】本発明は，導体回路基板に設けた導
体回路上に転写されるべき半田パターンと，該半田パタ
ーンを支持する転写基材とよりなる半田キャリアであっ
て，上記転写基材には，導体回路基板との間の間隙に対
して開口してなる少なくとも１つの貫通穴が形成されて
いることを特徴とする半田キャリアにある。The present invention relates to a solder carrier comprising a solder pattern to be transferred onto a conductor circuit provided on a conductor circuit board and a transfer base material supporting the solder pattern, the transfer base material comprising: In the solder carrier, there is formed at least one through hole opened to a gap between the conductor circuit board and the conductor circuit board.
【０００８】本発明において，上記半田キャリアには，
貫通穴を開口した転写基材に，半田パターンが設けられ
ている。貫通穴は，転写基材に一又は二以上設けられて
いる。上記貫通穴は，半田パターンの付近に設けてある
ことが好ましい。これにより，半田パターンの付近にお
いて発生した溶媒ガスを容易に外部へ逃すことができ，
半田キャリアの半田パターン付近が上方に持ち上げられ
るおそれがない。従って，半田パターンと導体回路との
間隔を一定に保持することができる。上記貫通穴は，半
田キャリアの中央部に設けることが好ましい。これによ
り，上記間隙の中央部において発生した溶媒ガスを容易
に逃がすことができる。In the present invention, the solder carrier is
A solder pattern is provided on the transfer base material having the through holes. One or more through holes are provided in the transfer substrate. The through holes are preferably provided near the solder pattern. This allows the solvent gas generated near the solder pattern to easily escape to the outside,
There is no possibility that the vicinity of the solder pattern of the solder carrier will be lifted upward. Therefore, the distance between the solder pattern and the conductor circuit can be kept constant. The through hole is preferably provided at the center of the solder carrier. Thereby, the solvent gas generated in the central portion of the gap can be easily released.
【０００９】１つ又は複数の貫通穴の合計の開口面積
は，０．００８〜１００ｍｍ2 であることが好ましい。
０．００８ｍｍ2 未満の場合には，半田キャリアと導体
回路基板との間の間隙においてフラックスの加熱により
発生した溶媒ガスを効率よく逃がすことができないおそ
れがある。一方，１００ｍｍ2 を越える場合には，半田
キャリアにおける半田パターンの高密度形成が困難とな
るおそれがある。The total opening area of the one or more through holes is preferably 0.008 to 100 mm 2 .
If it is less than 0.008 mm 2, the solvent gas generated by heating the flux may not be able to escape efficiently in the gap between the solder carrier and the conductor circuit board. On the other hand, if it exceeds 100 mm 2 , it may be difficult to form a high density solder pattern on the solder carrier.
【００１０】上記貫通穴の直径は，０．１〜１０ｍｍで
あることが好ましい。０．１ｍｍ未満の場合には，上記
溶媒ガスを効率よく逃がすことができないおそれがあ
る。一方，１０ｍｍを越える場合には，半田キャリアに
おける半田パターンの高密度形成が困難となるおそれが
ある。更に，上記貫通穴の直径は，０．１〜１０ｍｍで
あり，且つ複数個設けられていることが好ましい。これ
により，上記溶媒ガスを効率よく逃がすことができる。The diameter of the through hole is preferably 0.1 to 10 mm. If it is less than 0.1 mm, the solvent gas may not be able to escape efficiently. On the other hand, if it exceeds 10 mm, it may be difficult to form a high density solder pattern on the solder carrier. Further, it is preferable that the through hole has a diameter of 0.1 to 10 mm and a plurality of through holes are provided. As a result, the solvent gas can be efficiently released.
【００１１】上記転写基材としては，例えば，ガラスク
ロスと樹脂との複合材料，ポリイミド，テフロン，ポリ
エステル，ガラスクロスの不織布と樹脂との複合材料が
ある。Examples of the transfer base material include composite materials of glass cloth and resin, polyimide, Teflon, polyester, and composite materials of glass cloth non-woven fabric and resin.
【００１２】次に，上記半田キャリアを用いた半田パタ
ーンを有するプリント配線板の製造方法としては，例え
ば，導体回路基板に形成した導体回路上に転写されるべ
き半田パターンと，該半田パターンを支持する転写基材
とよりなり，該転写基材には，導体回路基板との間の間
隙に対して開口してなる貫通穴が形成されている半田キ
ャリアを準備し，次に，上記半田キャリアの半田パター
ン側を上記導体回路基板の導体回路側に対向させて位置
合わせを行い，上記導体回路基板の上に上記半田キャリ
アを載置し，その後，加熱して半田パターンを溶融させ
て，該半田パターンを導体回路上に転写することを特徴
とするプリント配線板の製造方法がある。Next, as a method of manufacturing a printed wiring board having a solder pattern using the above solder carrier, for example, a solder pattern to be transferred onto a conductor circuit formed on a conductor circuit board and the solder pattern are supported. A solder carrier having a through hole formed in the gap between the conductor substrate and the transfer substrate. Positioning is performed with the solder pattern side facing the conductor circuit side of the conductor circuit board, the solder carrier is placed on the conductor circuit board, and then heated to melt the solder pattern, There is a method for manufacturing a printed wiring board, which is characterized in that a pattern is transferred onto a conductor circuit.
【００１３】本発明の製造方法において，転写基材に形
成した貫通穴は，例えば，上記半田キャリアに設けた貫
通穴と同様である。In the manufacturing method of the present invention, the through holes formed in the transfer substrate are the same as the through holes provided in the solder carrier, for example.
【００１４】上記の導体回路上に形成された半田パター
ンは，例えば，マザーボードとの接合のための半田パタ
ーンとして使用することができる。また，ＴＡＢ（Ｔａ
ｐｅＡｕｔｏｍａｔｅｄ Ｂｏｎｄｉｎｇ），又はＱＦ
Ｐ（Ｑｕａｄ ＦｌａｔＰａｃｋａｇｅ）としても使用
することができる。The solder pattern formed on the conductor circuit can be used as a solder pattern for joining with a mother board, for example. Also, TAB (Ta
peAutomated Bonding), or QF
It can also be used as P (Quad Flat Package).
【００１５】[0015]
【作用及び効果】本発明の半田キャリアには，貫通穴
が，導体回路基板との間の間隙に対して開口している。
そのため，半田パターンをリフローするための加熱の際
に，半田キャリアと導体回路基板との間においてフラッ
クスから発生した溶媒ガスを，上記貫通穴を通じて外部
に逃がすことができる。In the solder carrier of the present invention, the through hole is opened to the gap between the solder carrier and the conductor circuit board.
Therefore, at the time of heating for reflowing the solder pattern, the solvent gas generated from the flux between the solder carrier and the conductor circuit board can be released to the outside through the through hole.
【００１６】そのため，上記加熱時においても，半田キ
ャリアは溶媒ガスの膨張により湾曲することがなく，そ
の形状を平坦に維持することができる。それ故，半田キ
ャリアと導体回路基板との間の間隔を一定に保持するこ
とができる。従って，半田キャリアに形成したすべての
半田パターンを導体回路基板上の導体回路に転写するこ
とができ，半田パターンの転写歩留りが高い。Therefore, even during the above heating, the solder carrier does not bend due to the expansion of the solvent gas, and its shape can be maintained flat. Therefore, the space between the solder carrier and the conductor circuit board can be kept constant. Therefore, all the solder patterns formed on the solder carrier can be transferred to the conductor circuit on the conductor circuit board, and the solder pattern transfer yield is high.
【００１７】次に，本発明のプリント配線板の製造方法
においては，上記の半田キャリアを用いている。そのた
め，上記のごとく，半田キャリアと導体回路基板との間
を一定に保持でき，半田キャリアの半田パターンを導体
回路上に確実に転写することができる。Next, in the method for manufacturing a printed wiring board of the present invention, the above solder carrier is used. Therefore, as described above, the space between the solder carrier and the conductor circuit board can be held constant, and the solder pattern of the solder carrier can be reliably transferred onto the conductor circuit.
【００１８】本発明によれば，半田パターンの転写歩留
りが高い，半田キャリア及びこれを用いた半田パターン
を有するプリント配線板の製造方法を提供することがで
きる。According to the present invention, it is possible to provide a solder carrier having a high solder pattern transfer yield and a method for manufacturing a printed wiring board having a solder pattern using the same.
【００１９】[0019]
実施例１ 本発明の実施例にかかる半田キャリア及びバンプ付きプ
リント配線板の製造方法について，図１〜図３を用いて
説明する。本例の半田キャリア１は，図１に示すごと
く，導体回路基板６０に設けた導体回路６３上に転写さ
れるべき半田パターン３と，半田パターン３を支持する
転写基材１６とよりなる。Example 1 A method of manufacturing a solder carrier and a printed wiring board with bumps according to an example of the present invention will be described with reference to FIGS. As shown in FIG. 1, the solder carrier 1 of this example includes a solder pattern 3 to be transferred onto a conductor circuit 63 provided on a conductor circuit board 60, and a transfer substrate 16 that supports the solder pattern 3.
【００２０】転写基材１６の中央部には，図１，図２に
示すごとく，導体回路基板６０との間の間隙に対して開
口してなる貫通穴１０が形成されている。貫通穴１０の
直径は１．０ｍｍである。貫通穴１０の開口面積は，
０．７８５ｍｍ2 である。転写基材１６の大きさは，８
ｍｍ×８ｍｍである。転写基材１６には，直径２４０μ
ｍの半田パターンが４００μｍピッチで配列されてい
る。As shown in FIGS. 1 and 2, a through hole 10 is formed in the center of the transfer substrate 16 so as to open to a gap between the transfer substrate 16 and the conductor circuit board 60. The diameter of the through hole 10 is 1.0 mm. The opening area of the through hole 10 is
It is 0.785 mm 2 . The size of the transfer substrate 16 is 8
It is mm × 8 mm. The transfer substrate 16 has a diameter of 240 μ
m solder patterns are arranged at a pitch of 400 μm.
【００２１】上記半田キャリア１を製造するに当たって
は，転写基材１６（厚み０．１ｍｍ）と，圧延半田箔
（Ｓｎ／Ｐｂ＝６３／３７，厚み３５μｍ）とを積層
し，一体化する。上記転写シート１６は，ガラスクロス
と樹脂とよりなる，透光性を有するシートである。次い
で，その半田箔の表面に液体レジストを塗布し，写真法
によりエッチングレジストを形成する。次いで，塩化鉄
をエッチング材料として半田をエッチングし，その後エ
ッチングレジストを剥離して，所望の半田パターン３を
形成する。In manufacturing the solder carrier 1, the transfer substrate 16 (thickness 0.1 mm) and the rolled solder foil (Sn / Pb = 63/37, thickness 35 μm) are laminated and integrated. The transfer sheet 16 is a translucent sheet made of glass cloth and resin. Then, a liquid resist is applied to the surface of the solder foil, and an etching resist is formed by a photographic method. Next, the solder is etched using iron chloride as an etching material, and then the etching resist is peeled off to form a desired solder pattern 3.
【００２２】上記導体回路基板６０は，絶縁基板６５の
表面に導体回路６３が形成されている。絶縁基板６５
は，ガラスエポキシ基板である。導体回路６３は銅及び
Ｎｉ／Ａｕめっきよりなる。In the conductor circuit board 60, a conductor circuit 63 is formed on the surface of an insulating substrate 65. Insulating substrate 65
Is a glass epoxy substrate. The conductor circuit 63 is made of copper and Ni / Au plating.
【００２３】次に，上記半田キャリア１を用いて半田パ
ターンを有するバンプ付きプリント配線板を製造する方
法について説明する。まず，図１に示すごとく，上記導
体回路基板６０の表面に，ロジン系のフラックス６９を
塗布する。塗布量は，１．０ｍｇ／ｃｍ2 である。次い
で，上記半田キャリア１の半田パターン３側を，上記導
体回路基板６０の導体回路６３側に対向させて位置合わ
せを行う。次いで，導体回路基板６０の上に半田キャリ
ア１を載置して，両者が位置ずれしないように保持す
る。Next, a method of manufacturing a printed wiring board with bumps having a solder pattern using the solder carrier 1 will be described. First, as shown in FIG. 1, a rosin-based flux 69 is applied to the surface of the conductor circuit board 60. The coating amount is 1.0 mg / cm 2 . Next, the solder pattern 3 side of the solder carrier 1 is opposed to the conductor circuit 63 side of the conductor circuit board 60 to perform alignment. Next, the solder carrier 1 is placed on the conductor circuit board 60 and held so as not to be displaced.
【００２４】その後，これをリフロー炉に入れて，窒素
雰囲気下において加熱する。これにより，図３に示すご
とく，半田パターン３を溶融させて，半田パターン３を
導体回路６３上に転写する。これにより，バンプを有す
るプリント配線板６を得る（図４参照）。Then, this is placed in a reflow furnace and heated in a nitrogen atmosphere. As a result, as shown in FIG. 3, the solder pattern 3 is melted and the solder pattern 3 is transferred onto the conductor circuit 63. As a result, the printed wiring board 6 having bumps is obtained (see FIG. 4).
【００２５】次に，本例の作用効果について説明する。
本例の半田キャリア１には，図１，図２に示すごとく，
貫通穴１０が，導体回路基板６０との間の間隙に対して
開口している。そのため，図３に示すごとく，半田パタ
ーン３をリフローするための加熱の際に，半田キャリア
１と導体回路基板６０との間においてフラックス６９か
ら発生した溶媒ガス８を，上記貫通穴１０を通じて外部
に逃がすことができる。Next, the function and effect of this example will be described.
In the solder carrier 1 of this example, as shown in FIGS.
The through hole 10 is open to the gap between the through hole 10 and the conductor circuit board 60. Therefore, as shown in FIG. 3, during heating for reflowing the solder pattern 3, the solvent gas 8 generated from the flux 69 between the solder carrier 1 and the conductor circuit board 60 is exposed to the outside through the through hole 10. You can escape.
【００２６】そのため，上記加熱時においても，図３に
示すごとく，半田キャリア１は溶媒ガスの膨張により湾
曲することがなく，その形状を平坦に維持することがで
きる。それ故，半田キャリア１と導体回路基板６０との
間の間隔を一定に保持することができる。従って，半田
キャリア１に形成したすべての半田パターン３を導体回
路基板上の導体回路６３に転写することができ，半田パ
ターンの転写歩留りが高い。Therefore, even during the heating, as shown in FIG. 3, the solder carrier 1 does not bend due to the expansion of the solvent gas, and its shape can be maintained flat. Therefore, the space between the solder carrier 1 and the conductor circuit board 60 can be kept constant. Therefore, all the solder patterns 3 formed on the solder carrier 1 can be transferred to the conductor circuit 63 on the conductor circuit board, and the solder pattern transfer yield is high.
【００２７】次に，本例のプリント配線板の製造方法に
おいては，上記の半田キャリア１を用いている。そのた
め，上記のごとく，半田キャリア１と導体回路基板６０
との間を一定に保持でき，半田キャリア１の半田パター
ンを半田パターン３として導体回路６３上に確実に転写
することができる。Next, in the method for manufacturing a printed wiring board of this example, the above solder carrier 1 is used. Therefore, as described above, the solder carrier 1 and the conductor circuit board 60 are
Can be held constant, and the solder pattern of the solder carrier 1 can be reliably transferred onto the conductor circuit 63 as the solder pattern 3.
【００２８】また，本例においては，貫通穴１０は中央
部に１つ設けた例を示したが，貫通穴１０は例えば中央
部以外にも複数個設けることもできる。これにより，よ
り効率良くガス抜きを行うことができる。Further, in this example, one through hole 10 is provided in the central portion, but a plurality of through holes 10 may be provided in other than the central portion. As a result, the gas can be degassed more efficiently.
【００２９】実施例２ 本例においては，半田キャリアを用いて製造したプリン
ト配線板の半田パターン転写歩留りを測定した。測定に
際して，実施例１の半田キャリアを用いた。各半田キャ
リアには，１０７個の半田パターンが形成されている。
これらの半田キャリアを用いて，実施例１と同様の方法
により，２４個のプリント配線板を製造した。Example 2 In this example, a solder pattern transfer yield of a printed wiring board manufactured using a solder carrier was measured. The solder carrier of Example 1 was used for the measurement. 107 solder patterns are formed on each solder carrier.
Using these solder carriers, 24 printed wiring boards were manufactured in the same manner as in Example 1.
【００３０】そして，半田キャリアの半田パターンの数
と，加熱により転写された半田パターンの数とを数え
て，前者を後者により除した百分率を求め，これを半田
パターン転写歩留り率を算出した。また，比較のため
に，貫通穴のない半田キャリアを用いて，同様の測定を
行った。その結果を表１に示した。Then, the number of solder patterns on the solder carrier and the number of solder patterns transferred by heating were counted to obtain a percentage obtained by dividing the former by the latter, and the yield of solder pattern transfer was calculated. For comparison, the same measurement was performed using a solder carrier without through holes. The results are shown in Table 1.
【００３１】その結果，本発明にかかる半田キャリアを
用いた場合には，すべての半田パターンが転写されて，
転写歩留り率は１００％であった。一方，比較例にかか
る半田パターンを用いた場合には，一部の半田パターン
が転写されず，転写歩留り率は７８％であった。As a result, when the solder carrier according to the present invention is used, all the solder patterns are transferred,
The transfer yield rate was 100%. On the other hand, when the solder pattern according to the comparative example was used, a part of the solder pattern was not transferred, and the transfer yield rate was 78%.
【００３２】[0032]
【表１】 [Table 1]
【図１】実施例１における，プリント配線板の製造方法
を示す説明図。FIG. 1 is an explanatory view showing a method for manufacturing a printed wiring board according to a first embodiment.
【図２】実施例１の半田キャリアの平面図。FIG. 2 is a plan view of the solder carrier according to the first embodiment.
【図３】実施例１の，半田パターンの加熱リフローの際
における，半田キャリアと導体回路基板との説明図。FIG. 3 is an explanatory diagram of a solder carrier and a conductor circuit board during a heating reflow of a solder pattern according to the first embodiment.
【図４】従来例のプリント配線板の断面図。FIG. 4 is a cross-sectional view of a conventional printed wiring board.
【図５】従来例の半田キャリアを用いた場合の，プリン
ト配線板の製造方法を示す説明図。FIG. 5 is an explanatory view showing a method for manufacturing a printed wiring board when a conventional solder carrier is used.
【図６】従来例の問題点を示す説明図。FIG. 6 is an explanatory diagram showing a problem of the conventional example.
１．．．半田キャリア， １０．．．貫通穴， １６．．．転写基材， ３．．．半田パターン， ３０．．．半田キャリア， ６．．．プリント配線板， ６０．．．導体回路基板， ６３．．．導体回路， ６９．．．フラックス， 1. ． ． Solder carrier, 10. ． ． Through hole, 16. ． ． Transfer substrate, 3. ． ． Solder pattern, 30. ． ． Solder carrier, 6. ． ． Printed wiring board, 60. ． ． Conductor circuit board, 63. ． ． Conductor circuit, 69. ． ． flux,
Claims (8)
されるべき半田パターンと，該半田パターンを支持する
転写基材とよりなる半田キャリアであって，上記転写基
材には，導体回路基板との間の間隙に対して開口してな
る少なくとも１つの貫通穴が形成されていることを特徴
とする半田キャリア。1. A solder carrier comprising a solder pattern to be transferred onto a conductor circuit provided on a conductor circuit board, and a transfer base material supporting the solder pattern, wherein the transfer base material includes a conductor circuit. A solder carrier, wherein at least one through hole opened to a gap between the substrate and the substrate is formed.
積は，０．００８〜１００ｍｍ2 であることを特徴とす
る半田キャリア。2. The solder carrier according to claim 1, wherein the through hole has an opening area of 0.008 to 100 mm 2 .
は，上記半田パターンの付近に設けてあることを特徴と
する半田キャリア。3. The solder carrier according to claim 1, wherein the through hole is provided near the solder pattern.
上記貫通穴は，直径０．１〜１０ｍｍであり，且つ複数
個設けてあることを特徴とする半田キャリア。4. The method according to claim 1, wherein
The solder carrier has a diameter of 0.1 to 10 mm and a plurality of through holes are provided.
写されるべき半田パターンと，該半田パターンを支持す
る転写基材とよりなり，該転写基材には，導体回路基板
との間の間隙に対して開口してなる貫通穴が形成されて
いる半田キャリアを準備し，次に，上記半田キャリアの
半田パターン側を上記導体回路基板の導体回路側に対向
させて位置合わせを行い，上記導体回路基板の上に上記
半田キャリアを載置し，その後，加熱して半田パターン
を溶融させて，該半田パターンを導体回路上に転写する
ことを特徴とするプリント配線板の製造方法。5. A solder pattern to be transferred onto a conductor circuit formed on a conductor circuit board, and a transfer base material that supports the solder pattern. A solder carrier in which a through hole opened to the gap is formed is prepared. Next, the solder pattern side of the solder carrier is made to face the conductor circuit side of the conductor circuit board, and alignment is performed. A method for manufacturing a printed wiring board, comprising placing the solder carrier on a conductor circuit board, heating the solder pattern to melt the solder pattern, and transferring the solder pattern onto the conductor circuit.
積は，０．００８〜１００ｍｍ2 であることを特徴とす
るプリント配線板の製造方法。6. The method for manufacturing a printed wiring board according to claim 5, wherein the opening area of the through hole is 0.008 to 100 mm 2 .
は，上記半田パターンの付近に設けてあることを特徴と
するプリント配線板の製造方法。7. The method of manufacturing a printed wiring board according to claim 5, wherein the through hole is provided near the solder pattern.
上記貫通穴は，直径０．１〜１０ｍｍであり，且つ複数
個設けてあることを特徴とするプリント配線板の製造方
法。8. The method according to claim 5, wherein
A method for manufacturing a printed wiring board, wherein the through hole has a diameter of 0.1 to 10 mm and a plurality of through holes are provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11643595A JPH08288632A (en) | 1995-04-17 | 1995-04-17 | Solder carrier and manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11643595A JPH08288632A (en) | 1995-04-17 | 1995-04-17 | Solder carrier and manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08288632A true JPH08288632A (en) | 1996-11-01 |
Family
ID=14687043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11643595A Pending JPH08288632A (en) | 1995-04-17 | 1995-04-17 | Solder carrier and manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08288632A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008251622A (en) * | 2007-03-29 | 2008-10-16 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board |
| CN103262227A (en) * | 2010-11-26 | 2013-08-21 | 田中贵金属工业株式会社 | Transfer substrate for forming metal wiring and method for forming metal wiring using the same |
| US9238278B2 (en) | 2011-03-29 | 2016-01-19 | Panasonic Intellectual Property Management Co., Ltd. | Solder transfer substrate, manufacturing method of solder transfer substrate, and solder transfer method |
-
1995
- 1995-04-17 JP JP11643595A patent/JPH08288632A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008251622A (en) * | 2007-03-29 | 2008-10-16 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board |
| CN103262227A (en) * | 2010-11-26 | 2013-08-21 | 田中贵金属工业株式会社 | Transfer substrate for forming metal wiring and method for forming metal wiring using the same |
| US9238278B2 (en) | 2011-03-29 | 2016-01-19 | Panasonic Intellectual Property Management Co., Ltd. | Solder transfer substrate, manufacturing method of solder transfer substrate, and solder transfer method |
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