JPH08287424A - Recording and reproducing separation type combined head and its production - Google Patents

Recording and reproducing separation type combined head and its production

Info

Publication number
JPH08287424A
JPH08287424A JP8508995A JP8508995A JPH08287424A JP H08287424 A JPH08287424 A JP H08287424A JP 8508995 A JP8508995 A JP 8508995A JP 8508995 A JP8508995 A JP 8508995A JP H08287424 A JPH08287424 A JP H08287424A
Authority
JP
Japan
Prior art keywords
recording
film
detecting element
head
processing amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8508995A
Other languages
Japanese (ja)
Inventor
Koji Kanayama
幸司 金山
Makoto Morijiri
誠 森尻
Chihiro Isono
千博 磯野
Akio Takakura
昭雄 高倉
Hiroaki Koyanagi
広明 小柳
Atsuko Tanaka
温子 田中
Shiroyasu Odai
城康 尾▲薹▼
Yukio Sasada
幸雄 佐々田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8508995A priority Critical patent/JPH08287424A/en
Publication of JPH08287424A publication Critical patent/JPH08287424A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To decrease the area of a reduction ratio detecting element and to increase a packaging density by commonly using the terminal part of the reduction ratio detecting element for an actual element. CONSTITUTION: This recording and reproducing sepn. type combined head is provided with an actual element A and a reduction ratio detecting element B in combination. A lower shield 3 of NiFe film formed by a sputtering method, etc., and a lower gap film 4 consisting of an insulating film of alumina, etc., are formed on a ceramic substrate 2 laminated with a base alumina film 1. Further, combined films consisting of a magneto-resistance effect film 5 and a magnetic domain control film 6 are successively and continuously formed thereon. At this time, the detecting part of the reduction ratio detecting element B is also arranged previously on a photomask and is simultaneously formed with the actual elements A by a photolithography technique. Electrodes for supplying current to the magneto-resistance effect film 5 are thereafter formed at the actual element A and the reduction ratio detecting element B by the method similar to the method for forming the detecting part. An upper shielding film 9 consisting of NiFe, etc., is formed similarly to the upper gap part 8 consisting of the insulating film of alumina, etc., and the lower shielding film, by which the magneto-resistive head used for reproduction is obtd.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は磁気ディスク装置に用い
られる薄膜磁気ヘッド、及びその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film magnetic head used in a magnetic disk device and a method for manufacturing the same.

【0002】[0002]

【従来の技術】誘導型記録ヘッドは基板上に多数の誘導
型記録ヘッドを一括形成し、その後、複数個の誘導型記
録ヘッドを搭載したブロック単位で、ヘッドスライダー
加工を行っていくため、ヘッド単体当たりの製造コスト
を低減でき、かつ、ヘッド機能を高精度化できるという
特徴がある。
2. Description of the Related Art Inductive recording heads are formed by forming a large number of induction recording heads on a substrate at a time and then performing head slider processing in blocks in which a plurality of induction recording heads are mounted. It is characterized in that the manufacturing cost per unit can be reduced and the head function can be made highly accurate.

【0003】この誘導型記録ヘッドの磁気信号の書き込
み、及び読みとり性能を決定する重要要因のひとつにギ
ャップ深さの寸法精度があり、その加工方法は前記のよ
うに、複数の誘導型記録ヘッドが搭載されたブロック状
態で加工する。その数は各製造者の決める方法により異
なるが、複数個の誘導型記録ヘッドが搭載されており、
そのブロックの長さは搭載数により異なる。このブロッ
クにおいて、円板に対する浮上面を研磨等の方法によ
り、加工して、各々の誘導型記録ヘッドのギャップ深さ
の寸法を、同一ブロック内で、均一に、しかも、高精度
に仕上げる。
One of the important factors that determines the writing and reading performances of the magnetic signal of this inductive recording head is the dimensional accuracy of the gap depth, and the processing method thereof is as described above. Machining in the mounted block state. The number varies depending on the method decided by each manufacturer, but a plurality of inductive recording heads are mounted,
The length of the block depends on the number of mounted units. In this block, the air bearing surface with respect to the circular plate is processed by a method such as polishing, so that the size of the gap depth of each induction type recording head is uniformly and highly accurately finished in the same block.

【0004】このような加工方法の例としては、「特開
平3−272008号公報」に記載の方法が行われてい
る。この特許では、誘導型記録ヘッドを複数個搭載した
ブロック状態で、ギャップ深さの加工を行う際のギャッ
プ深さの寸法の把握、及び制御方法として、ヘッドブロ
ックの両端、もしくは、その他の位置に、ギャップ深さ
の寸法値に対応して、信号が変化する加工量検出素子を
個別に設けておき、この素子の信号を端子より加工中に
検出しながら、光学的に直接観察できないギャップ深さ
寸法を間接的に検出し、加工を行うという方法である。
このほかにも、検出信号に電気抵抗以外の磁気信号ある
いは磁気ヘッドのインダクタンス等が用いられている。
また、磁気抵抗効果型ヘッド再生ヘッドとし、誘導型記
録ヘッドと組み合わせた記録再生分離型複合ヘッドの場
合にも、同様に高精度に加工する必要があり、加工量検
出素子を用いた加工法が実施されている。
As an example of such a processing method, the method described in Japanese Patent Application Laid-Open No. 3-272008 is used. In this patent, in a block state in which a plurality of inductive recording heads are mounted, grasping the size of the gap depth when processing the gap depth and controlling the gap depth are performed at both ends of the head block or at other positions. , A machining amount detection element whose signal changes corresponding to the dimension value of the gap depth is provided separately, and the gap depth that cannot be observed directly optically while detecting the signal of this element during processing from the terminal. In this method, the dimensions are indirectly detected and processed.
In addition to this, a magnetic signal other than electric resistance or an inductance of a magnetic head is used for the detection signal.
Further, also in the case of a recording / reproducing separated type composite head in which a magnetoresistive head reproducing head is combined with an inductive recording head, it is necessary to perform processing with high precision as well, and a processing method using a processing amount detection element is required. It has been implemented.

【0005】[0005]

【発明が解決しようとする課題】今後更に記録再生分離
型複合ヘッドのスライダーサイズの縮小、及び加工精度
の高精度化に伴う加工量検出素子数の増加は、基板内に
占める加工量検出素子の面積比率をますます増加し、ス
ライダー単本当たりの製造コストを増加させる。また、
スライダーサイズ同様、加工量検出素子のサイズも縮小
の方向に進んでおり、それに伴う端子部の小型化によ
り、信号検出時の位置ズレや検出信号の劣化を起こす。
In the future, the slider size of the recording / reproducing separated type composite head will be further reduced, and the number of processing amount detecting elements will be increased due to the higher processing accuracy. The area ratio is increased more and more, and the manufacturing cost per slider is increased. Also,
Similar to the slider size, the size of the processing amount detection element is also in the direction of shrinking, and the miniaturization of the terminal part accompanying it causes position shift at the time of signal detection and deterioration of the detection signal.

【0006】本発明は、高精度の加工技術を保ちつつ、
加工量検出素子の面積を低減することにより、同一サイ
ズ基板での実装数の増加をはかり、低コストで高精度な
記録再生分離型複合ヘッドの量産を可能にしたものであ
る。また、加工量検出素子を使用する時に、磁気抵抗効
果型ヘッドに電圧が加わらないようにし、磁気抵抗効果
膜の破壊を防止したものである。
The present invention, while maintaining high-precision processing technology,
By reducing the area of the processing amount detection element, it is possible to increase the number of mountings on the same size substrate and to mass-produce the recording / reproducing separated type composite head with high accuracy at low cost. Further, when the processing amount detecting element is used, no voltage is applied to the magnetoresistive head to prevent destruction of the magnetoresistive film.

【0007】[0007]

【課題を解決するための手段】上記の課題を解決するた
めに、基板上に形成された記録再生分離型複合ヘッドの
端子部と加工量検出素子の端子部を共用したものであ
る。
In order to solve the above problems, a terminal portion of a recording / reproducing separated composite head and a terminal portion of a processing amount detecting element formed on a substrate are shared.

【0008】さらに、記録再生分離型複合ヘッドの磁気
抵抗効果膜の破壊防止のために、磁気抵抗効果型ヘッド
の端子部を用いず、誘導型記録ヘッドの端子部と加工量
検出素子の端子部を共用したものである。
Further, in order to prevent destruction of the magnetoresistive film of the recording / reproducing separated type composite head, the terminal of the magnetoresistive head is not used and the terminal of the induction recording head and the terminal of the processing amount detecting element are not used. Is shared.

【0009】[0009]

【作用】本発明により、加工量検出素子の面積の低減が
可能となり、基板上の記録再生分離型複合ヘッドの実装
数増加によるコストの低減ができる。
According to the present invention, the area of the processing amount detecting element can be reduced, and the cost can be reduced by increasing the number of mounted recording / reproducing separation type composite heads on the substrate.

【0010】[0010]

【実施例】以下、本発明を実施例をもって詳細に説明す
る。
EXAMPLES The present invention will be described in detail below with reference to examples.

【0011】(実施例1)図1に実素子である記録再生
分離型複合ヘッドの形成されたスライダーブロックの一
実施例を示す斜視図である。Aは記録再生分離型複合ヘ
ッドの実素子、Bは加工量検出素子である。図2に示し
た実素子Aの斜視図の一部、及び図3に示した実素子A
の断面図にて形成方法を詳細に示す。ベースアルミナ膜
1が積層されたセラミック基板上2に、スパッタリング
法等で成膜されたNiFeなる下部シールド3、アルミ
ナ等の絶縁膜から成る下部ギャップ膜4を成膜する。更
に、磁気抵抗効果膜5、磁区制御膜6からなる複合膜を
この上に、順次、連続的に形成する。このとき、加工量
検出素子の検出部もフォトマスク上にあらかじめ配置し
ておき、フォトリソグラフィ技術により実素子Aと同時
に形成する。その後、磁気抵抗効果膜5に電流を供給す
るための電極7を実素子、及び加工量検出素子に検出部
と同様の方法により形成し、アルミナ等の絶縁膜から成
る上部ギャップ8、下部シールド膜同様、NiFe等か
ら成る上部シールド膜9を形成することにより、再生に
用いられる磁気抵抗効果型ヘッドが形成される。
(Embodiment 1) FIG. 1 is a perspective view showing an embodiment of a slider block in which a recording / reproducing separation type composite head which is an actual element is formed. A is an actual element of the recording / reproducing separated type composite head, and B is a processing amount detecting element. Part of the perspective view of the real element A shown in FIG. 2 and the real element A shown in FIG.
A detailed description will be given of the forming method with the cross-sectional view. On a ceramic substrate 2 on which a base alumina film 1 is laminated, a lower shield 3 made of NiFe formed by a sputtering method and a lower gap film 4 made of an insulating film such as alumina are formed. Further, a composite film including the magnetoresistive film 5 and the magnetic domain control film 6 is sequentially and continuously formed thereon. At this time, the detection portion of the processing amount detection element is also arranged in advance on the photomask and is formed simultaneously with the actual element A by the photolithography technique. After that, an electrode 7 for supplying a current to the magnetoresistive film 5 is formed on the actual element and the processing amount detection element by the same method as the detection part, and the upper gap 8 and the lower shield film made of an insulating film such as alumina are formed. Similarly, by forming the upper shield film 9 made of NiFe or the like, a magnetoresistive head used for reproduction is formed.

【0012】さらに、磁気抵抗効果型ヘッドの上部シー
ルド上に、記録用ヘッドのギャップ10を形成後、順
次、層間絶縁膜11、コイル12、上部磁性膜13を形
成し、記録用誘導型磁気ヘッドが形成される。このと
き、加工量検出素子の一方の電極7上に、誘導型磁気ヘ
ッドの端子接続用の引き出し線を接続する。これによ
り、後工程で端子部の共用が可能となる。
Further, after forming the gap 10 of the recording head on the upper shield of the magnetoresistive head, the interlayer insulating film 11, the coil 12 and the upper magnetic film 13 are sequentially formed, and the recording induction magnetic head. Is formed. At this time, a lead wire for connecting a terminal of the induction type magnetic head is connected to one electrode 7 of the processing amount detection element. As a result, it becomes possible to share the terminal portion in a later process.

【0013】同様に、磁気抵抗効果型ヘッドの端子部と
加工量検出素子Bの端子部を接続することは可能であ
る。しかしながら、磁気抵抗効果型ヘッドを構成する膜
が非常に薄く、絶縁破壊されやすいため、接続を行った
結果、スライダーブロックに切断後、浮上面加工時に加
工量検出素子に加工量を電気信号に変える為に電位を加
えると、不要な電位が磁気抵抗効果型ヘッド部に加わっ
て、磁気抵抗効果型ヘッドが破壊される場合がある。こ
れに対して、誘導型磁気ヘッドでは、コイルと磁気コア
間に膜厚数μmの絶縁膜があるため、加工量検出素子の
端子部と誘導型磁気ヘッドの端子部を接続しても誘導型
磁気ヘッドは破壊されない。従って、共用する端子は誘
導型ヘッドの端子とすべきである。
Similarly, it is possible to connect the terminal portion of the magnetoresistive head and the terminal portion of the processing amount detecting element B. However, since the film that constitutes the magnetoresistive head is extremely thin and is subject to dielectric breakdown, as a result of making the connection, the processing amount is changed to an electric signal in the processing amount detection element after cutting the slider block during air bearing surface processing. Therefore, if a potential is applied, an unnecessary potential may be applied to the magnetoresistive head, and the magnetoresistive head may be destroyed. On the other hand, in the inductive magnetic head, since the insulating film having a thickness of several μm is provided between the coil and the magnetic core, even if the terminal of the processing amount detecting element and the terminal of the inductive magnetic head are connected, The magnetic head is not destroyed. Therefore, the shared terminal should be the terminal of the inductive head.

【0014】最後に、実素子、及び加工量検出素子の両
素子に、柱状の下部端子14をめっき法等により形成す
る。さらに、スパッタ法で形成されたアルミナ等の保護
膜の表面をラップ加工して下部端子を所定量露出させた
後、リード線を接続するための上部端子15を形成し、
ウエハ作成工程は完了する。
Finally, columnar lower terminals 14 are formed on both the actual element and the processing amount detecting element by a plating method or the like. Furthermore, after laminating the surface of the protective film such as alumina formed by the sputtering method to expose the lower terminal by a predetermined amount, the upper terminal 15 for connecting the lead wire is formed,
The wafer making process is completed.

【0015】上記のような製造方法により形成されたウ
エハはスライダーブロック単位に切断される。このスラ
イダーブロックの長さは実素子A、及び加工量検出素子
Bの搭載数により、製造者毎に異なる。本発明により、
形成されたウエハでは実素子Aの実装数が従来の1.5
倍になり、加工精度を維持したまま、製造コストの低減
が可能になった。
The wafer formed by the above manufacturing method is cut into slider blocks. The length of the slider block differs depending on the manufacturer depending on the number of mounted real elements A and processing amount detection elements B. According to the invention,
In the formed wafer, the number of actual devices A mounted is 1.5 compared to the conventional number.
Doubled, it has become possible to reduce manufacturing costs while maintaining processing accuracy.

【0016】(実施例2)図4に本発明によるところの
スライダーブロックの別の実施例を示す斜視図である。
加工量検出素子の端子部をその両隣に配置された相異な
る実素子の端子部と共用した。これにより、加工量検出
素子の専用の端子部が不要となり、実素子Aの実装密度
が向上できるという効果がある。
(Embodiment 2) FIG. 4 is a perspective view showing another embodiment of the slider block according to the present invention.
The terminal portion of the processing amount detecting element is shared with the terminal portions of different actual elements arranged on both sides of the terminal portion. This eliminates the need for a dedicated terminal portion of the processing amount detection element, and has the effect of improving the mounting density of the actual elements A.

【0017】[0017]

【発明の効果】加工量検出素子の端子部を実素子と共用
することにより、加工量検出素子の面積が低減できるた
め、実装密度を上げることができる。また、加工量検出
素子の引出線を接続する端子部の上部端子の面積を拡大
することができ、加工量検出素子量から電気信号がとり
やすくすることができる。
Since the area of the processing amount detecting element can be reduced by sharing the terminal portion of the processing amount detecting element with the actual element, the mounting density can be increased. In addition, the area of the upper terminal of the terminal portion that connects the lead wire of the processing amount detection element can be increased, and an electric signal can be easily obtained from the amount of processing amount detection element.

【図面の簡単な説明】[Brief description of drawings]

【図1】スライダーブロックの斜視図の一例。FIG. 1 is an example of a perspective view of a slider block.

【図2】記録再生分離型複合ヘッドの斜視図の一例。FIG. 2 is an example of a perspective view of a recording / reproducing separated type composite head.

【図3】記録再生分離型複合ヘッドの断面図の一例。FIG. 3 is an example of a cross-sectional view of a recording / reproducing separated type composite head.

【図4】加工量検出素子の端子部を両隣に配置された相
異なる実素子の端子部と共用した記録再生分離型複合ヘ
ッドのスライダーブロックの斜視図の一例。
FIG. 4 is an example of a perspective view of a slider block of a recording / reproducing separated type composite head in which the terminals of the processing amount detection element are shared with the terminals of different actual elements arranged on both sides.

【符号の説明】[Explanation of symbols]

A…実素子、 B…加工量検出素子、 1…ベ
ースアルミナ、2…基板、 3…下部シール
ド、 4…下部ギャップ、5…磁気抵抗効果膜、 6
…磁区制御膜、 7…電極、8…上部ギャップ、
9…上部シールド兼下部コア、10…記録ヘッド用ギ
ャップ、 11…層間絶縁膜、12…コ
イル、 13…上部磁性膜、 14…下部端
子、15…保護膜、 16…上部端子。
A ... Actual element, B ... Machining amount detection element, 1 ... Base alumina, 2 ... Substrate, 3 ... Bottom shield, 4 ... Bottom gap, 5 ... Magnetoresistive film, 6
... magnetic domain control film, 7 ... electrode, 8 ... upper gap,
9 ... Upper shield and lower core, 10 ... Recording head gap, 11 ... Interlayer insulating film, 12 ... Coil, 13 ... Upper magnetic film, 14 ... Lower terminal, 15 ... Protective film, 16 ... Upper terminal.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 高倉 昭雄 神奈川県小田原市国府津2880番地株式会社 日立製作所ストレージシステム事業部内 (72)発明者 小柳 広明 神奈川県小田原市国府津2880番地株式会社 日立製作所ストレージシステム事業部内 (72)発明者 田中 温子 神奈川県小田原市国府津2880番地株式会社 日立製作所ストレージシステム事業部内 (72)発明者 尾▲薹▼ 城康 神奈川県小田原市国府津2880番地株式会社 日立製作所ストレージシステム事業部内 (72)発明者 佐々田 幸雄 神奈川県小田原市国府津2880番地株式会社 日立製作所ストレージシステム事業部内 ─────────────────────────────────────────────────── --- Continuation of the front page (72) Inventor Akio Takakura 2880 Kozu, Odawara, Kanagawa Hitachi Storage Systems Division (72) Inventor Hiroaki Koyanagi 2880, Kozu, Odawara, Kanagawa Hitachi Storage Systems Business Inside (72) Inventor Atsuko Tanaka 2880 Kozu, Odawara-shi, Kanagawa Hitachi Storage Systems Division (72) Inventor Otsuka Kano 2880 Kozu, Odawara, Kanagawa Hitachi Storage Systems Division ( 72) Inventor Yukio Sasada 2880, Kozu, Odawara-shi, Kanagawa Hitachi Storage Systems Division

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】加工量検出素子を有する記録再生分離型複
合ヘッドにおいて、加工量検出素子の端子部が記録再生
分離型複合ヘッドの端子部と1ヶ以上共用することを特
徴とする記録再生分離型複合ヘッド。
1. A recording / reproducing separation type composite head having a processing amount detecting element, wherein a terminal portion of the processing amount detecting element shares one or more terminals with the recording / reproducing separation type composite head. Type composite head.
【請求項2】上記請求項1に記載の記録再生分離型複合
ヘッドにおいて、 記録再生分離型複合ヘッドと加工量検出素子が共有する
端子部が誘導型記録ヘッドの端子部であることを特徴と
する記録再生分離型複合ヘッド。
2. The recording / reproducing separated composite head according to claim 1, wherein the terminal portion shared by the recording / reproducing separated composite head and the processing amount detection element is a terminal portion of the induction recording head. Separate recording / playback type composite head.
【請求項3】上記請求項1に記載の記録再生分離型複合
ヘッドにおいて、 加工量検出素子の検出部に磁気抵抗効果膜を用いたこと
を特徴とする記録再生分離型複合ヘッド。
3. The recording / reproducing separated type composite head according to claim 1, wherein a magnetoresistive effect film is used for a detection portion of the processing amount detecting element.
【請求項4】請求項1〜4に記載の記録再生分離型複合
ヘッドにおいて、 加工量検出素子の端子部と記録再生分離型複合ヘッドの
端子部が共用する工程を有して成る記録再生分離型複合
ヘッドの製造方法。
4. The recording / reproducing separation type composite head according to claim 1, comprising a step in which the terminal portion of the processing amount detecting element and the terminal portion of the recording / reproduction separation type composite head are shared. Method for manufacturing die composite head.
【請求項5】記録再生分離型複合ヘッドを製造する為の
スライダーブロック、及びウエハにおいて、加工量検出
素子の端子部と記録再生分離型複合ヘッドの端子部が共
有することを特徴とする。
5. A slider block for manufacturing a recording / reproducing separated composite head, and a wafer, wherein a terminal portion of a processing amount detecting element and a terminal portion of a recording / reproducing separated composite head are shared.
JP8508995A 1995-04-11 1995-04-11 Recording and reproducing separation type combined head and its production Pending JPH08287424A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8508995A JPH08287424A (en) 1995-04-11 1995-04-11 Recording and reproducing separation type combined head and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8508995A JPH08287424A (en) 1995-04-11 1995-04-11 Recording and reproducing separation type combined head and its production

Publications (1)

Publication Number Publication Date
JPH08287424A true JPH08287424A (en) 1996-11-01

Family

ID=13848884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8508995A Pending JPH08287424A (en) 1995-04-11 1995-04-11 Recording and reproducing separation type combined head and its production

Country Status (1)

Country Link
JP (1) JPH08287424A (en)

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US6274222B1 (en) 1999-09-07 2001-08-14 Tdk Corporation Thin-film magnetic head material and method of manufacturing same and method of manufacturing thin-film magnetic head
SG93218A1 (en) * 1998-05-06 2002-12-17 Tdk Corp Thin-film magnetic head material and method of manufacturing same and method of manufacturing thin-film magnetic heads
JP2006209866A (en) * 2005-01-27 2006-08-10 Shinka Jitsugyo Kk Wafer for thin film magnetic head
US7092212B2 (en) 2001-03-02 2006-08-15 Tdk Corporation Method for fabricating a thin film magnetic head and wafer structure
JP2007334934A (en) * 2006-06-12 2007-12-27 Shinka Jitsugyo Kk Polishing amount detecting element for laminate, wafer, and polishing method of laminate
US7362544B2 (en) 2003-10-30 2008-04-22 Hitachi Global Storage Technologies Netherlands B.V. Thin film magnetic head slider, magnetic head support mechanism, magnetic disk drive, and method of manufacturing magnetic head

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG93218A1 (en) * 1998-05-06 2002-12-17 Tdk Corp Thin-film magnetic head material and method of manufacturing same and method of manufacturing thin-film magnetic heads
US6581271B2 (en) 1998-05-06 2003-06-24 Tdk Corporation Method of manufacturing thin-film magnetic head
US6807722B2 (en) 1998-05-06 2004-10-26 Tdk Corporation Thin-film magnetic head material and method of manufacturing same and method of manufacturing thin-film magnetic head
US6274222B1 (en) 1999-09-07 2001-08-14 Tdk Corporation Thin-film magnetic head material and method of manufacturing same and method of manufacturing thin-film magnetic head
US7092212B2 (en) 2001-03-02 2006-08-15 Tdk Corporation Method for fabricating a thin film magnetic head and wafer structure
US7362544B2 (en) 2003-10-30 2008-04-22 Hitachi Global Storage Technologies Netherlands B.V. Thin film magnetic head slider, magnetic head support mechanism, magnetic disk drive, and method of manufacturing magnetic head
JP2006209866A (en) * 2005-01-27 2006-08-10 Shinka Jitsugyo Kk Wafer for thin film magnetic head
JP4589741B2 (en) * 2005-01-27 2010-12-01 新科實業有限公司 Thin film magnetic head wafer
JP2007334934A (en) * 2006-06-12 2007-12-27 Shinka Jitsugyo Kk Polishing amount detecting element for laminate, wafer, and polishing method of laminate

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