JPH08269675A - Spray plating device of band-shaped metal - Google Patents

Abstract

PURPOSE: To make it possible tb execute spray plating stably over a long period of time by providing the respective surfaces of the inside walls, ceiling walls and partition walls in a plating chamber with cooled plating metal deposition preventive plates and imparting vibration thereon, thereby fixing and dropping suspended plating metallic particulates. CONSTITUTION: A band-shaped metallic sheet 1 is made to travel from below to above in the plating chamber 10 and a plating metal is supplied from a melting pot 8 to spray nozzles 11 by pumps 9 and is sprayed in the form of particulates 12 to the metallic sheet 1, by which the metallic sheet is plated. At this time, the plating metal deposition preventive plates 4, 5, 6 cooled to the m. p. of the plating metal or below are respectively installed to the partition walls, inside walls and ceiling walls in the plating chamber 10 and the vibration is applied thereon continuously or intermittently. The surfaces of the deposition preventive plates 4, 5, 6 are formed of oxide-, nitride-, carbide-boride-base ceramics and the surface roughness thereof is specified to <=0.5μm. As a result, the suspended particulates 12 are peeled and dropped by solidifying and depositing the particulates on the deposition preventive plates 4, 5, 6, by which the stable spray plating is executed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a strip metal spray plating apparatus, and more particularly to a strip metal spray plating apparatus in which plated metal protective plates are installed on the inner wall of a plating chamber, a ceiling wall and a partition wall. It is about.

[0002]

2. Description of the Related Art A spray plating method and apparatus for atomizing a molten metal by spraying and depositing the atomized metal on the surface of a strip-shaped metal which is continuously fed has been conventionally disclosed in JP-A-53-99047. Japanese Patent Laid-Open No. 1-2145
It is known from Japanese Patent Laid-Open No. 6-45255 and Japanese Patent Laid-Open No. 4-45255.

[0003]

However, in these spray plating methods, not all of the plating metal atomized by spraying and sprayed on the strip-shaped metal plate is plated. These non-plated plating metals float in the atmosphere of the plating chamber in the state of fine particles. In the conventional technology, since no consideration was given to the floating metal fine particles generated during spray plating, the floating metal fine particles adhere and deposit on the inner wall, ceiling wall and partition wall of the plating chamber. As a result, it becomes difficult to continue spray plating.

According to the present invention, in the method of spray-plating a strip-shaped metal, it is possible to prevent unplated floating metal fine particles from adhering to and depositing on the inner wall of the plating chamber, the ceiling wall and the partition wall, and performing stable spray plating for a long time. It is an object of the present invention to provide a spray-plating device for a strip-shaped metal that makes it possible.

[0005]

DISCLOSURE OF THE INVENTION The present invention is a spray-plating apparatus for strip-shaped metal capable of advantageously eliminating the drawbacks of the conventional method as described above. In a spray plating device for spraying atomized molten metal by spraying, a plated metal deposition preventive plate that is continuously or intermittently vibrated and cooled below the melting point of the plated metal is used as the inner wall, ceiling wall and partition of the plating chamber. A strip metal spray plating device characterized by being installed on the surface of a wall. (2) The strip metal spray plating apparatus according to the above (1), wherein at least the surface of the plated metal deposition plate on which the plated metal adheres is made of oxide-based, nitride-based, carbide-based or boride-based ceramics. (3) The strip metal spray plating apparatus according to the above (1) or (2), wherein the surface roughness of at least the side of the plated metal deposition plate to which the plated metal adheres is Ra ≦ 0.5 μm.

[0006]

The present invention will be described in detail below with reference to FIG. The strip-shaped metal plate 1 is guided from below into the plating chamber 10 from the pretreatment section through the deflector roll 2. A seal roll 3 is installed at the entrance of the plating chamber 10 to shut off the atmosphere between the pretreatment section and the plating chamber. Inside the plating chamber 10, plated metal deposition plates 4, 5, 6 and a spray nozzle 11 are installed. The plating metal is supplied from the plating metal melting pot 8 to the spray nozzle 11 by the plating metal supply pump 9, becomes fine particles 12 and is sprayed onto the strip-shaped metal plate 1 to be plated. Suction nozzle 13 on the outlet side of the plating chamber
Is installed. The fine metal particles leaking from the plating chamber to the outside are sucked and collected by the suction blower 14 from the suction nozzle 13. Here, each of the plated metal deposition plates 4, 5 and 6 comprises a partition wall plated metal deposition plate 4, an inner wall plated metal deposition plate 5, and a ceiling wall plated metal deposition plate 6.

When the band-shaped metal is spray-plated, some of the sprayed fine particles 12 are not plated but float in the plating chamber 10 as they are. Before adhering to the inner wall portion, the ceiling wall portion and the partition wall of the plating chamber 10, the floating metal fine particles are brought into contact with the plated metal deposition preventive plates 4, 5 and 6 of the present invention, solidified and collected. The plated metal adhesion-preventing plates 4, 5, 6 are cooled to the melting point of the plated metal or lower. This is because the floating metal fine particles are immediately solidified when they come into contact with the plated metal deposition preventing plates 4, 5, 6. Since the floating metal fine particles are solidified on the plated metal deposition plates 4, 5 and 6, re-floating due to re-evaporation of the plated metal can be prevented. Also, since the temperature is low, the plated metal deposition plates 4, 5,
The reaction with 6 is less likely to occur, and the plated metal adhesion plate 4,
It becomes difficult for adhesion and deposition on the surfaces 5 and 6 to occur.

Intermittent or continuous vibration is applied to the plated metal deposition preventive plates 4, 5 and 6. This is because the floating metal fine particles solidified on the plated metal deposition preventive plates 4, 5 and 6 are peeled off and dropped from the plated metal deposition preventive plates 4, 5 and 6. The vibration applied to the plated metal deposition plates 4, 5 and 6 is
Although it is given by hammering, an ultrasonic vibrator, or the like, any method may be adopted as a specific means.

The solidified fine particles separated and dropped from the plated metal deposition plates 4, 5, 6 are recovered from the plating chamber 10 through the solidified plated metal recovery pipe 7 and redissolved in the plated metal dissolution pot 8. The solidified plated metal recovery pipe 7 is installed obliquely so that the solidified fine particles fall into the plated metal dissolving pot 8. Further, the plating metal melting pot 8 is installed at a position lower than the plating chamber 10.

When applied with intermittent or continuous vibration, the plated metal adhesion-preventing plates 4, 5 and 6 quickly separate and drop the solidified floating metal particles, so that they do not easily react with the plated metal. It is desirable to cover the surface on the side where the plating metal adheres with oxide-based, nitride-based, carbide-based or boride-based ceramics. Further, the reaction between the plated metal deposition-inhibiting plates 4, 5, 6 and the floating metal fine particles is also affected by the surface roughness of the plated metal deposition-inhibiting plate. Therefore, it is desirable that the surface roughness of the plated metal deposition preventive plate be Ra ≦ 0.5 μm.

[0011]

According to the present invention, it is possible to perform stable spray plating for a long time without the floating metal fine particles that have not been plated adhering to and depositing on the inner wall of the plating chamber, the ceiling wall and the partition wall. .

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a spray plating apparatus of the present invention.

[Explanation of symbols]

 1 Strip Metal Plate 2 Deflector Roll 3 Seal Roll 4 Plated Metal Protective Plate for Partition Wall 5 Plated Metal Protective Plate for Inner Wall 6 Plated Metal Protective Plate for Ceiling Wall 7 Solidified Plated Metal Recovery Tube 8 Plated Metal Melting Pot 9 Plated Metal Supply pump 10 Plating chamber 11 Spray nozzle 12 Atomized metal 13 Suction nozzle 14 Suction blower

Claims (3)

[Claims] 1. In a spray plating apparatus for spraying a strip-shaped metal plate with atomized molten metal for plating, continuous or intermittent vibration is applied, and the plated metal deposition preventive plate is cooled below the melting point of the plated metal. Is installed on the surfaces of the inner wall of the plating chamber, the ceiling wall and the partition wall. 2. The strip according to claim 1, wherein at least the surface of the plated metal deposition preventive plate on the side to which the plated metal adheres is made of oxide-based, nitride-based, carbide-based or boride-based ceramics. Metal spray plating equipment. 3. The strip metal spray plating apparatus according to claim 1, wherein the surface roughness of the plated metal deposition preventive plate at least on the side to which the plated metal is attached is Ra ≦ 0.5 μm.