JPH08267226A - Solder waving equipment - Google Patents

Abstract

PURPOSE: To facilitate the setting of the relative speed in a short time, and to control the quantity of adhesion of the solder with high precision by setting the optimum relative speed. CONSTITUTION: A solder waving equipment is provided with a cylindrical nozzle 103 having a number of holes, a sprocket 104, a chain 105 and a motor 106 as rotating means to rotate the cylindrical nozzle 103, a pump 107 as a molten solder feeding means to feed the molten solder 101 in the cylindrical nozzle 103, and a casing 108. In the condition where the molten solder 101 is waved from a number of holes in the cylindrical nozzle 103, and the cylindrical nozzle 103 is rotated, a printed circuit board 109 is brought into contact with the molten solder 101 to achieve the soldering.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder jet apparatus for jetting a molten solder from a nozzle arranged in a solder bath and bringing a printed circuit board into contact with the jetted molten solder for soldering. The present invention relates to a solder jet device that can easily control the amount of adhesion.

[0002]

2. Description of the Related Art As a conventional solder jet apparatus, there is one shown in FIGS. 6 (a) and 6 (b), for example. Figure 6
FIG. 6A shows a solder jet apparatus used in a conventional wave soldering apparatus, and FIG. 6B shows a line B- of FIG. 6A.
A B sectional view is shown.

The solder jet apparatus shown in FIG. 6 has a solder bath 601.
Molten solder 60 that is heated and melted by a heater (not shown)
2 and the molten solder 602 is sent into the casing 604 by the pump 603 and jetted from the opening of the nozzle 605. Also, the printed circuit board 6 to be soldered
06 is carried by the conveyor 607 and is soldered when it comes into contact with the jetted molten solder 602. In addition,
The adjusting plate 608 is for controlling the direction and speed of the flow of the jetted molten solder 602, and by moving the adjusting plate 608 in the vertical direction in the figure, the molten solder 60
2 can be blocked and its flow direction and speed can be adjusted.

In the figure, 609 is a conveyor 60.
The printed circuit board 606 conveyed by 7 comes into contact with the molten solder 602 jetted by the nozzle 605, and shows a separation point where the printed substrate 606 separates from the molten solder 602.

From such a nozzle 605, the molten solder 6
In a solder jet apparatus that jets 02 and makes the printed substrate 606 contact the jetted molten solder 602 to perform soldering, the amount of the molten solder 602 attached to the printed substrate 606 is determined by the amount of the molten solder 602 at the separation point 609. Is determined by a relative speed (hereinafter, referred to as a relative speed) between a flowing speed (including a flowing direction) of the printed circuit board 606 and a transfer speed of the printed circuit board 606. Therefore, by controlling the relative speed, a desired solder adhesion amount can be obtained. I am trying to get it.

As a solder jet apparatus using such an adjusting plate, there is, for example, a "solder bath" disclosed in Japanese Utility Model Laid-Open No. 2-148778.

[0007]

However, in the above-mentioned conventional solder jet apparatus, the relative speed at the separation point 609 is adjusted by adjusting the vertical position of the adjusting plate 608 and the pump 60.
Since the structure is determined by a combination of a plurality of factors such as the number of rotations of 3 and the transfer speed of the printed circuit board 606, each factor influences each other, and it takes time to control the relative speed. However, it was difficult to set the optimum relative speed.

Further, since it is difficult to set the optimum relative speed, it is not possible to accurately control the solder adhesion amount based on the relative speed, and there is a problem that solder failure may occur.

The present invention has been made by paying attention to such conventional problems, and the relative speed can be easily set in a short time, and the amount of solder adhesion can be controlled by setting the optimum relative speed. The purpose is to be able to perform with high accuracy.

[0010]

In order to achieve the above-mentioned object, a solder jet apparatus according to a first aspect of the present invention jets molten solder from a nozzle arranged in a solder bath, and jets the molten solder into the jetted molten solder. In a solder jet apparatus for contacting a printed circuit board to perform soldering, a cylindrical nozzle having a large number of holes, and rotating means for rotating the cylindrical nozzle,
Molten solder delivery means for delivering molten solder into the cylindrical nozzle, wherein the molten solder is jetted from a large number of holes of the cylindrical nozzle, and the cylindrical nozzle is rotated, The soldering is carried out by bringing the molten solder into a molten jet.

The solder jet apparatus according to the second aspect is
In a solder jet apparatus for jetting molten solder from a nozzle arranged in a solder bath and bringing a printed circuit board into contact with the jetted molten solder to perform soldering, a tubular nozzle having a large number of holes, and the tubular nozzle Rotating means for rotating the nozzle, molten-solder delivering means for delivering molten solder into the cylindrical nozzle, conveying means for conveying the printed circuit board and bringing it into contact with the jetted molten solder, and rotation of the cylindrical nozzle Setting means for setting the speed and the conveying speed of the conveying means, and control means for performing drive control of the rotating means and the conveying means based on the rotation speed of the cylindrical nozzle and the conveying speed of the conveying means set by the setting means. And in a state in which the molten solder is jetted from a large number of holes of the tubular nozzle and the tubular nozzle is rotated,
The printed board is brought into contact with the jetted molten solder for soldering.

Further, the solder jet apparatus according to claim 3 is
In a solder jet apparatus for jetting molten solder from a nozzle arranged in a solder bath and bringing a printed circuit board into contact with the jetted molten solder to perform soldering, a tubular nozzle having a large number of holes, and the tubular nozzle Rotating means for rotating the nozzle, molten solder delivery means for delivering molten solder into the cylindrical nozzle, transport means for transporting the printed circuit board and contacting the jetted molten solder, and the printed circuit board Based on the relative speed set by the setting means for setting the relative speed between the conveying speed of the printed circuit board and the flowing speed of the molten solder at the separation point where the molten solder is separated from the molten solder after the contact , A control means for controlling driving of the rotating means and the conveying means, and jetting the molten solder from a large number of holes of the cylindrical nozzle. Allowed, and, while rotating the tubular nozzle, the printed circuit board is brought into contact with the molten solder is spouted and performs soldering.

A solder jet apparatus according to a fourth aspect is
A part of each of the holes arranged in adjacent positions among the many holes of the cylindrical nozzle exists on the same circumference.

The solder jet apparatus according to the fifth aspect is
The molten solder delivery means rotates the spiral fin to deliver the molten solder into the tubular nozzle.

[0015]

According to the solder jet apparatus of the present invention (claim 1), the molten solder is sent out into the cylindrical nozzle by the molten solder delivery means, the molten solder is jetted from a large number of holes of the tubular nozzle, and the rotating means is provided. While the cylindrical nozzle is rotated by the method, the jetted surface of the molten solder is smoothed by bringing the printed circuit board into contact with molten solder that has been jetted for soldering, and the soldering state is stable,
The relative speed at the separation point can be controlled only by adjusting the two factors of the rotational speed of the tubular nozzle and the transfer speed of the printed circuit board.

Further, in the solder jet apparatus of the present invention (claim 2), the molten solder is sent out into the tubular nozzle by the molten solder delivery means, and the molten solder is jetted from a large number of holes of the tubular nozzle, and While the cylindrical nozzle is rotated by the rotating means, the printed board is brought into contact with the molten solder that has been jetted to perform soldering, so that the jetted surface of the molten solder is smoothed and the soldering state is stabilized. The relative speed at the separation point can be controlled only by adjusting the two factors of the rotational speed of the cylindrical nozzle and the transfer speed of the printed circuit board.

When the rotating speed of the cylindrical nozzle and the conveying speed of the conveying means are set by using the setting means, the control means determines, based on the set rotating speed of the cylindrical nozzle and the conveying speed of the conveying means, Drive control of the rotating means and the conveying means is performed. Therefore, the relative speed at the separation point can be controlled by easily adjusting the rotation speed of the tubular nozzle and the conveyance speed of the printed circuit board.

Further, in the solder jet apparatus of the present invention (claim 3), the molten solder is sent into the tubular nozzle by the molten solder delivery means, and the molten solder is jetted from a large number of holes of the tubular nozzle, and While the cylindrical nozzle is rotated by the rotating means, the printed board is brought into contact with the molten solder that has been jetted to perform soldering, so that the jetted surface of the molten solder is smoothed and the soldering state is stabilized. The relative speed at the separation point can be controlled only by adjusting the two factors of the rotational speed of the cylindrical nozzle and the transfer speed of the printed circuit board.

Further, when the relative speed at the leaving point is set by using the setting means, the control means controls the drive of the rotating means and the conveying means based on the set relative speed. Therefore, the relative speed at the departure point can be easily controlled only by setting a desired relative speed.

Further, according to the solder jet apparatus of the present invention (claim 4), since a part of each of the holes arranged in adjacent positions in a large number of holes of the cylindrical nozzle exists on the same circumference, The jet surface of the molten solder is further smoothed.

Further, in the solder jet apparatus of the present invention (claim 5), the molten solder delivery means rotates the spiral fin to feed the molten solder into the tubular nozzle, whereby the molten solder from the tubular nozzle is removed. The jet flow rate is stable.

[0022]

EXAMPLE A solder jet apparatus of the present invention is described below.
[First Embodiment], [Second Embodiment], and [Third Embodiment] will be described in detail with reference to the drawings.

[Embodiment 1] FIG. 1 (a) shows a solder jet apparatus of Embodiment 1, and FIG. 1 (b) is an A- line of FIG. 1 (a).
A sectional view is shown. The solder jet apparatus according to the first embodiment includes a solder bath 102 filled with molten solder 101 heated and melted by a heater (not shown), and a cylindrical nozzle 10 having a large number of holes.
3 and a sprocket 104, a chain 105 and a motor 10 as rotating means for rotating the cylindrical nozzle 103.
6, a pump 107 and a casing 108 as a molten solder delivery means for delivering the molten solder 101 into the cylindrical nozzle 103, and a conveyor 110 as a delivery means for bringing the printed board 109 into contact with the jetted molten solder 101. Based on the operation panel 111 as setting means for setting the rotation speed of the tubular nozzle 103 and the transfer speed of the conveyor 110, and the rotation speed of the cylindrical nozzle 103 and the transfer speed of the conveyor 110 set on the operation panel 111, It comprises a motor 106 and a control unit 112 as a control means for controlling the drive of the conveyor 110.

The cylindrical nozzle 103 is used for the solder bath 10
The nozzle supporting base 113 is supported inside the nozzle 2 and the contact surface between the nozzle supporting base 113 and the cylindrical nozzle 103 is coated with a heat-resistant resin or the like to which solder does not adhere to prevent the rotation from being hindered.

The printed circuit board 10 to be soldered
As shown in the figure, the conveyor 110 that conveys 9 is arranged on the jetted molten solder 101. The arrangement of each part is characterized in that the separation point 114 between the printed board 109 and the molten solder 101 is the cylindrical nozzle 103. It is located on the center of.

Next, referring to FIG. 2, the cylindrical nozzle 103
The appearance will be described. A large number of holes 201 for jetting the molten solder 101 are arranged in the cylindrical nozzle 103. In the large number of holes 201, a part of the holes 201 arranged at the adjacent positions is formed by the cylindrical nozzle 10
3 are arranged on the same circumference. In other words, the holes 201 are arranged so as to have an overlapping margin. In this way, the cylindrical nozzle 103
A large number of holes 201 are arranged on the top of the cylindrical nozzle 103.
The surface of the molten solder 101 jetted from the hole 201 can be smoothed by rotating the.

Reference numeral 202 denotes a contact portion between the nozzle support base 113 and the cylindrical nozzle 103, and the contact portion 202 is coated with a heat resistant resin to which the molten solder 101 does not adhere, as described above.

Further, as shown in the sectional view of FIG. 3, the cylindrical nozzle 103 has a structure capable of being divided at the dividing position 301. By dividing at the dividing position 301, cleaning of the inside of the cylindrical nozzle 103, etc. Maintainability is ensured.

Next, the concept of determining the relative speed at the departure point 114 will be described with reference to FIG. When the rotation speed of the tubular nozzle 103 is V ₁ and the transfer speed of the conveyor 110 is V ₂ , the molten solder 101 jetted with the printed circuit board 109.
The relative velocity V at the departure point 114 of is determined by V = V ₂ −V ₁ and is not affected by other factors. In other words, the relative velocity V at the separation point 114 is determined by the cylindrical nozzle 10
2 of the rotation speed of 3 and the transfer speed of the printed circuit board 109.
It can be controlled by adjusting only one factor.

The operation of the above configuration will be described. First, the basic operation will be described with reference to FIG. The molten solder 101 in the solder bath 102 is sent out by a pump 107 and jetted from a large number of holes 201 of the cylindrical nozzle 103 via a casing 108. Further, the cylindrical nozzle 103 is rotated by the motor 106, and the jetted molten solder 101 can obtain a speed corresponding to the rotation speed of the motor 106 on the surface of the cylindrical nozzle 103.

Furthermore, the printed circuit board 1 to be soldered
09 is conveyed by the conveyor 110, and the cylindrical nozzle 1
It is soldered when it comes into contact with the molten solder 101 jetted from 03.

Next, a case where the relative speed at the separation point 114 is controlled according to the state of the printed circuit board 109 will be described. First, when the reference rotation speed of the cylindrical nozzle 103 and the conveyance speed of the conveyor 110 are set using the operation panel 111, the control unit 112 causes the control unit 112 to set the rotation speed of the cylindrical nozzle 103 and the conveyance speed of the conveyor 110. Based on the above, drive control of the motor 106 and the conveyor 110 is performed. The cylindrical nozzle 1 set by this
03 relative to the rotational speed of 03 and the conveying speed of the conveyor 110, the relative speed at the departure point 114, the printed circuit board 109
Soldering is performed.

Then, the amount of solder adhered to the printed board 109 soldered in the above setting is observed, and the increase / decrease in the relative speed is determined according to the amount of solder adhered. For example, if the solder deposition amount is excessive, the relative speed needs to be increased to reduce the solder deposition amount, and if the solder deposition amount is too small, the relative speed needs to be reduced to increase the solder deposition amount. is there.

Next, based on the determined increase or decrease in the relative speed, the rotational speed of the cylindrical nozzle 103 and the transfer speed of the conveyor 110 are reset through the operation panel 111, and the soldering is performed again. Hereinafter, similarly, the cylindrical nozzle 103 is adjusted so that the amount of solder adhered to the printed circuit board 109 becomes an appropriate amount.
And the conveying speed of the conveyor 110 are set.

As described above, in the first embodiment, the relative speed at the separation point 114 between the printed circuit board 109 and the molten solder 101 can be controlled only by setting the rotation speed of the cylindrical nozzle 103 and the transfer speed of the conveyor 110, which is optimum. It is possible to control the amount of solder adhesion with high accuracy by setting the relative speed.

Since the rotational speed of the cylindrical nozzle 103 and the transport speed of the conveyor 110 are set via the operation panel 111, the relative speed can be easily set in a short time.

[Second Embodiment] In the second embodiment, the relative speed is set by using the operation panel 111 in the same configuration as the first embodiment, and the control unit 112 sets the relative speed of the motor 106 based on the set relative speed. The drive control of the rotation speed and the conveyance speed of the conveyor 110 is performed. At this time,
It is assumed that the control unit 112 stores the rotation speed of the tubular nozzle 103 and the transfer speed of the conveyor 110 as a table in advance in association with the relative speed.

Therefore, in the second embodiment, in addition to the effect similar to that of the first embodiment, the relative speed at the departure point can be easily controlled only by setting a desired relative speed. Easy to set up and control.

[Third Embodiment] FIG. 5 shows the structure of a solder jet apparatus according to a third embodiment, which is the pump 1 of the first embodiment shown in FIG.
Instead of the 07 and the casing 108, a spiral solder 501, a sprocket 502, a chain 503 and a motor 504 are used to constitute a molten solder delivery means for delivering the molten solder 101 into the cylindrical nozzle 103. Note that other configurations and operations are common to those of the first embodiment, and only different parts will be described here.

In the above structure, the spiral fin 5
01 rotation causes the molten solder 101 to move the molten solder 101 into a cylindrical nozzle 103
It is sent inside and the cylindrical nozzle 103 is rotated,
The molten solder 101 is jetted from the hole 201.

According to the second embodiment, in addition to the effect similar to that of the first embodiment, the casing 108 of the first embodiment is not necessary, so that the apparatus can be downsized as compared with the first embodiment. Further, since the molten solder delivery means is configured using the spiral fin 501, it is unlikely to be affected by the amount of solder and clogging of the nozzle hole, and the jet flow rate from the tubular nozzle 103 is stable.

[0042]

As described above, according to the solder jet apparatus of the present invention (claim 1), the cylindrical nozzle having a large number of holes, the rotating means for rotating the cylindrical nozzle, and the inside of the cylindrical nozzle are provided. And a molten solder delivery means for delivering molten solder to the printed circuit board, wherein the molten solder is jetted from a large number of holes of the tubular nozzle, and the printed circuit board is jetted while the tubular nozzle is rotated. Since the soldering is performed by contacting the solder, the relative speed can be easily set in a short time, and the amount of solder adhesion can be accurately controlled by setting the optimum relative speed.

Further, the solder jet apparatus of the present invention (claim 2) is a cylindrical nozzle having a large number of holes, a rotating means for rotating the cylindrical nozzle, and a melting device for feeding molten solder into the cylindrical nozzle. Solder sending means, carrying means for carrying the printed circuit board to contact the jetted molten solder, setting means for setting the rotational speed of the tubular nozzle and the carrying speed of the carrying means, and the setting means Control means for controlling the drive of the rotating means and the conveying means based on the rotational speed of the cylindrical nozzle and the conveying speed of the conveying means, and the molten solder is jetted from a large number of holes of the cylindrical nozzle. In addition, since the soldering is performed by bringing the printed board into contact with the molten solder that has been jetted while the cylindrical nozzle is rotated, the relative speed can be set in a short time. Performed in easy and can be accurately controlled solder adhesion amount by setting the optimal relative velocity.

In the solder jet apparatus of the present invention (claim 3), a cylindrical nozzle having a large number of holes, a rotating means for rotating the cylindrical nozzle, and a melting device for feeding the molten solder into the cylindrical nozzle. A solder delivering means, a carrying means for carrying the printed circuit board to contact the jetted molten solder; and a printed circuit board at a detaching point at which the printed circuit board separates from the molten solder after coming into contact with the jetted molten solder. A setting means for setting a relative speed between the transfer speed and the flowing speed of the molten solder; and a control means for controlling drive of the rotating means and the transfer means based on the relative speed set by the setting means, Molten solder is jetted from a large number of holes of the tubular nozzle, and while the tubular nozzle is rotated, molten solder is jetted from the printed circuit board. To do is touch by soldering, further setting the relative speed is easily performed in a short time, and can be accurately controlled solder adhesion amount by setting the optimal relative velocity.

Further, in the solder jet device of the present invention (claim 4), since a part of each of the holes arranged in adjacent positions in a large number of holes of the cylindrical nozzle exists on the same circumference, melting The solder jet surface is further smoothed, and the amount of solder adhesion can be controlled with high accuracy.

Further, in the solder jet apparatus of the present invention (claim 5), the molten solder sending means sends the molten solder into the cylindrical nozzle by rotating the spiral fin, so that the apparatus can be miniaturized. At the same time, the amount of molten solder jetted out is stable, and the amount of solder adhesion can be controlled accurately.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a configuration of a solder jet apparatus according to a first embodiment.

FIG. 2 is an explanatory diagram showing an appearance of a cylindrical nozzle of Example 1.

3 is a cross-sectional view of the tubular nozzle of FIG.

FIG. 4 is an explanatory diagram showing a concept of determining a relative speed at a departure point according to the first embodiment.

FIG. 5 is an explanatory diagram showing a configuration of a solder jet apparatus according to a third embodiment.

FIG. 6 is an explanatory view showing a conventional solder jet apparatus.

[Explanation of symbols]

101 Molten Solder 103 Cylindrical Nozzle 104 Sprocket 105 Chain 106 Motor 107 Pump 108 Casing 109 Printed Circuit Board 110 Conveyor 111 Operation Panel 112 Control Unit 114 Detachment Point 201 Cylindrical Nozzle Hole 501 Spiral Fin 502 Sprocket 503 Chain 504 Motor

Claims (5)

[Claims] 1. A cylindrical nozzle having a large number of holes in a solder jet apparatus in which molten solder is jetted from a nozzle arranged in a solder bath and a printed circuit board is brought into contact with the jetted molten solder for soldering. And rotating means for rotating the tubular nozzle, and molten solder delivery means for delivering molten solder into the tubular nozzle, wherein the molten solder is jetted from a large number of holes of the tubular nozzle, and A solder jet device, wherein soldering is performed by bringing the printed board into contact with molten solder that has been jetted while the cylindrical nozzle is rotated. 2. A cylindrical nozzle having a large number of holes in a solder jet apparatus for jetting molten solder from a nozzle arranged in a solder bath and bringing a printed circuit board into contact with the jetted molten solder for soldering. Rotating means for rotating the tubular nozzle; molten solder delivery means for delivering molten solder into the tubular nozzle; delivery means for delivering the printed circuit board and bringing it into contact with the jetted molten solder; Setting means for setting the rotational speed of the cylindrical nozzle and the conveying speed of the conveying means, and driving of the rotating means and the conveying means based on the rotating speed of the cylindrical nozzle and the conveying speed of the conveying means set by the setting means. A control means for controlling the molten solder, jetting the molten solder through a large number of holes of the tubular nozzle, and rotating the tubular nozzle, A solder jetting device, characterized in that a printed circuit board is brought into contact with molten jetted solder for soldering. 3. A cylindrical nozzle having a large number of holes in a solder jet device for jetting molten solder from a nozzle arranged in a solder bath and bringing a printed circuit board into contact with the jetted molten solder for soldering. Rotating means for rotating the tubular nozzle; molten solder delivery means for delivering molten solder into the tubular nozzle; delivery means for delivering the printed circuit board and bringing it into contact with the jetted molten solder; Setting means for setting the relative speed between the conveying speed of the printed board and the flowing speed of the molten solder at the separation point where the printed board is separated from the molten solder after coming into contact with the jetted molten solder, and the setting means Control means for controlling the drive of the rotating means and the conveying means based on the relative speed, and the molten solder is supplied to a large number of the cylindrical nozzles. A solder jet apparatus, wherein the printed board is brought into contact with the jetted molten solder for soldering in a state where the nozzle is jetted from the hole and the cylindrical nozzle is rotated. 4. The plurality of holes of the tubular nozzle are characterized in that some of the holes arranged at adjacent positions are present on the same circumference. Solder jet device. 5. The solder jet apparatus according to claim 1, wherein the molten solder sending means sends a molten solder into the cylindrical nozzle by rotating a spiral fin.