JPH08264701A - Plating jig for multipin element - Google Patents

Plating jig for multipin element

Info

Publication number
JPH08264701A
JPH08264701A JP9038695A JP9038695A JPH08264701A JP H08264701 A JPH08264701 A JP H08264701A JP 9038695 A JP9038695 A JP 9038695A JP 9038695 A JP9038695 A JP 9038695A JP H08264701 A JPH08264701 A JP H08264701A
Authority
JP
Japan
Prior art keywords
pin
coil spring
compression coil
contact
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9038695A
Other languages
Japanese (ja)
Inventor
Shuji Ando
修司 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NHK Spring Co Ltd
Original Assignee
NHK Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NHK Spring Co Ltd filed Critical NHK Spring Co Ltd
Priority to JP9038695A priority Critical patent/JPH08264701A/en
Publication of JPH08264701A publication Critical patent/JPH08264701A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To put pins of a multipin element and a conductive contact in continuity without fail and also to enable repeated use of a plating jig by a method wherein the pin is inserted into a hole of an insulative main body of the plating jig, the pin and an electrification terminal are put in continuity through a conductive compression coil spring and the contact and electrolytic plating is applied to the pin. CONSTITUTION: A plating jig has an insulative main body 2 and a presser 3 of an element pressing body and holds PGA 1 between them. The main body 2 is provided with holes 4 in the same number as pins 1a of the PGA 1 and each hole is constituted of a small-diameter part 4a on the side of insertion of the pin 1a and a large-diameter hole part 4b on the side opposite to the foregoing. A compression coil spring 7 and a ball 8 as a conductive contact having a larger diameter than the small-diameter hole part 4a are inserted into the large-diameter hole part 4b. Next, the PGA 1 is pressed against the main body 2 by the presser 3 and set thereon. Thereby the fore end of the pin 1a is brought into contact with the ball 8 with a contact pressure corresponding to the amount of deflection of the compression coil spring 7. Accordingly, contact is ensured between an etching plate 5 and the pin 1a.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、多ピン素子用めっき治
具に関し、特に、PGA(Pin Grid Array)などのLS
Iの製造工程時に使用するのに適する多ピン素子用めっ
き治具に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-pin element plating jig, and more particularly to an LS such as PGA (Pin Grid Array).
The present invention relates to a plating jig for a multi-pin element suitable for use in the manufacturing process of I.

【0002】[0002]

【従来の技術】従来、PGAなどの多ピン素子の製造工
程において、電解めっきによりピン及びパターンに金め
っきを施す工程がある。そのめっき工程において使用さ
れるめっき治具として、例えば図5に部分的に示した導
電端子板11を用いたものがある。
2. Description of the Related Art Conventionally, in a manufacturing process of a multi-pin element such as PGA, there is a step of electrolytically plating a pin and a pattern with gold. As a plating jig used in the plating process, there is, for example, one using the conductive terminal board 11 partially shown in FIG.

【0003】図5の導電端子板11にあっては、0.2
mm厚程度のエッチング材(KOVAR、SUS304
など)を使用して形成されており、その導電端子板11
には互いに連通する大・小孔部からなる複数のクランプ
孔12が、メッキ対象のPGA1の各ピン1aに対応し
て配設されている。めっきを行う際にはピン1aの先端
部をクランプ孔12の大孔部12aに挿通し、その後図
6に示されるようにピン1aを小孔部12bに差し込
む。このようにして全ピン1aをクランプ孔12の小孔
部12bによりクランプした状態にして、導電端子板1
1に通電してめっきを行っていた。
In the conductive terminal board 11 of FIG. 5, 0.2
mm thick etching material (KOVAR, SUS304
And the like) and its conductive terminal board 11
, A plurality of clamp holes 12 made up of large and small holes communicating with each other are provided corresponding to each pin 1a of the PGA 1 to be plated. When performing plating, the tip of the pin 1a is inserted into the large hole 12a of the clamp hole 12, and then the pin 1a is inserted into the small hole 12b as shown in FIG. In this way, all the pins 1a are clamped by the small holes 12b of the clamp holes 12, and the conductive terminal board 1
1 was energized for plating.

【0004】しかしながら、上記従来のめっき治具によ
るめっきにあっては、導電端子板11を外すために小孔
部12bからピン1aを抜く際に、小孔部12bの縁の
形状が変形し易く、変形してしまった場合には導電端子
板11を再利用することができないという問題があっ
た。
However, in the plating by the conventional plating jig described above, when the pin 1a is pulled out from the small hole portion 12b to remove the conductive terminal plate 11, the shape of the edge of the small hole portion 12b is easily deformed. However, there is a problem in that the conductive terminal plate 11 cannot be reused when it is deformed.

【0005】[0005]

【発明が解決しようとする課題】このような従来技術の
問題点に鑑み、本発明の主な目的は、繰り返し使用可能
な多ピン素子用めっき治具を提供することにある。
SUMMARY OF THE INVENTION In view of the above problems of the prior art, the main object of the present invention is to provide a plating jig for a multi-pin element that can be repeatedly used.

【0006】[0006]

【課題を解決するための手段】このような目的は、本発
明によれば、林立する複数のピンを有する多ピン素子の
当該各ピンをめっきするための多ピン素子用めっき治具
であって、前記複数のピンの先端部をそれぞれ同軸的に
受容可能な複数の孔を配設された絶縁性本体と、前記多
ピン素子を前記ピンの先端部を前記孔に所定量挿入した
状態に保持するべく前記多ピン素子の前記ピンを設けら
れた側とは相反する側を押圧する素子押圧体と、前記孔
内に軸線方向に伸縮自在に保持された導電性圧縮コイル
ばねと、前記保持状態における前記ピンの先端に前記圧
縮コイルばねの弾発付勢力をもって当接するべく前記圧
縮コイルばねの一端に設けられた導電性接触体と、前記
圧縮コイルばねの他端に接触するめっき時通電端子とを
有することを特徴とする多ピン素子用めっき治具を提供
することにより達成される。
According to the present invention, such an object is to provide a multi-pin element plating jig for plating each pin of a multi-pin element having a plurality of standing pins. , An insulating main body having a plurality of holes for coaxially receiving the tips of the plurality of pins, and the multi-pin element held in a state in which the tips of the pins are inserted into the holes by a predetermined amount. In order to do so, an element pressing body that presses the side of the multi-pin element that is opposite to the side on which the pin is provided, a conductive compression coil spring that is held in the hole so that it can expand and contract in the axial direction, and the holding state. A conductive contact body provided at one end of the compression coil spring so as to come into contact with the tip of the pin with an elastic biasing force of the compression coil spring, and a plating current-carrying terminal that contacts the other end of the compression coil spring. Characterized by having It is achieved by providing a plating jig for a multi-pin element.

【0007】[0007]

【作用】このようにすれば、多ピン素子のピンを圧縮コ
イルばねの弾発付勢力に抗して絶縁性本体の孔に挿入す
ることにより、ピンの先端に導電性接触体が弾発的に当
接し、導電性圧縮コイルばねを介してピンとめっき時通
電端子とが電気的に導通するため、めっき時通電端子に
通電してピンに電解めっきを行うことができる。ピンに
は圧縮コイルばねに設けた導電性接触体を弾発的に当接
させるのみでピンに通電可能であることから、孔径をピ
ンの外径よりも十分大きくしておくことにより、めっき
終了後にピンを孔から抜く際に各部を傷つけることがな
い。
According to this structure, by inserting the pin of the multi-pin element into the hole of the insulating body against the elastic biasing force of the compression coil spring, the conductive contact body is elastically attached to the tip of the pin. Since the pin and the energizing terminal during plating are electrically connected to each other via the conductive compression coil spring, the energizing terminal during plating can be energized to perform electrolytic plating on the pin. Plating is completed by setting the hole diameter sufficiently larger than the outer diameter of the pin because the pin can be energized simply by elastically contacting the conductive contact body provided on the compression coil spring. Do not damage each part when pulling out the pin later.

【0008】[0008]

【実施例】以下、本発明の好適実施例を添付の図面につ
いて詳しく説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings.

【0009】図1は、本発明が適用された多ピン素子用
めっき治具を示す分解斜視図であり、矩形平板状のPG
A1に用いるめっき治具を示している。図1に示される
ように、本めっき治具は、絶縁性本体2と素子押圧体と
しての加圧押さえ3とを有し、両者間にPGA1を挟持
して用いられる。
FIG. 1 is an exploded perspective view showing a multi-pin element plating jig to which the present invention is applied.
The plating jig used for A1 is shown. As shown in FIG. 1, the present plating jig has an insulating main body 2 and a pressure presser 3 as an element pressing body, and PGA 1 is sandwiched between them for use.

【0010】本体2には、PGA1のピン1aと同数の
孔4が、各ピン1aの先端部の全数を同時に受容可能に
配設されていると共に、PGA1を載置する表面側の四
つ角にはPGA1の位置決め用のL字状のガイドブロッ
ク2aが突設されている。また、要部断面を拡大して示
す図2に併せて示されるように、本体2の裏面には、め
っき時通電端子としてのエッチングプレート5とプレー
トカバー6とがこの順に積層されており、本体2との間
にエッチングプレート5を挟持して固定するべく本体2
にエッチングプレート5がねじ止めされている。
The main body 2 is provided with the same number of holes 4 as the pins 1a of the PGA 1 so as to be able to simultaneously receive all the tips of the pins 1a, and the four corners on the front surface side on which the PGA 1 is mounted are arranged. An L-shaped guide block 2a for positioning the PGA 1 is provided in a protruding manner. Further, as also shown in FIG. 2 showing an enlarged cross section of a main part, an etching plate 5 and a plate cover 6 as current-carrying terminals during plating are laminated in this order on the back surface of the main body 2. The main body 2 for sandwiching and fixing the etching plate 5 between the main body 2 and
The etching plate 5 is screwed on.

【0011】加圧押さえ3は、本体2に載置した状態の
PGA1を本体2側に付勢して固定するためのものであ
り、PGA1の上面の周辺部と各側面の一部とを保持可
能に形成されており、適所に挿通された固定ねじを本体
2に対応して設けられたねじ孔にねじ込んで本体2に固
定されるようになっている。
The pressure retainer 3 is for urging and fixing the PGA 1 mounted on the main body 2 toward the main body 2 side, and holds the peripheral portion of the upper surface of the PGA 1 and a part of each side surface. It is formed so that it can be fixed to the main body 2 by screwing a fixing screw inserted in a proper place into a screw hole provided corresponding to the main body 2.

【0012】本体2の孔4は、図2に良く示されるよう
に厚さ方向に貫通しており、ピン1aを挿入する側に設
けられた小径孔部4aと、その小径孔部4aからピン1
aを挿入する側とは相反する側に設けられた大径孔部4
bとからなる。その大径孔部4b内には圧縮コイルばね
7が同軸的に受容されており、上記小径孔部4aと圧縮
コイルばね7の一端との間には、小径孔部4aよりも拡
径された導電性接触体としての球8が改装されている。
また、圧縮コイルばね7の他端が本体2の裏面に積層さ
れたエッチングプレート5に当接しており、球8が小径
孔部4aの肩部に弾発的に当接するように、ある程度の
初期荷重を有して孔4内に圧縮コイルばね7が収められ
ている。
As shown in FIG. 2, the hole 4 of the main body 2 penetrates in the thickness direction, and has a small-diameter hole portion 4a provided on the side where the pin 1a is inserted, and the small-diameter hole portion 4a to the pin. 1
Large-diameter hole portion 4 provided on the side opposite to the side where a is inserted
b. A compression coil spring 7 is coaxially received in the large diameter hole portion 4b, and a diameter between the small diameter hole portion 4a and one end of the compression coil spring 7 is larger than that of the small diameter hole portion 4a. The sphere 8 as a conductive contact has been refurbished.
Further, the other end of the compression coil spring 7 is in contact with the etching plate 5 laminated on the back surface of the main body 2, and the ball 8 is elastically contacted with the shoulder portion of the small diameter hole portion 4a to some extent in an initial stage. A compression coil spring 7 is housed in the hole 4 with a load.

【0013】なお、エッチングプレート5には圧縮コイ
ルばね7の内径よりも若干小さくされた開口5aが孔4
と同軸的に設けられており、またプレートカバー6に
も、孔4と同軸的に貫通孔6aが設けられている。これ
により、孔4が軸線方向に貫通することになり、めっき
液の流れを良くすることができる。
The etching plate 5 has an opening 5a slightly smaller than the inner diameter of the compression coil spring 7 in the hole 4.
The plate cover 6 is also provided with a through hole 6a coaxially with the hole 4. As a result, the hole 4 penetrates in the axial direction, and the flow of the plating solution can be improved.

【0014】このようにして構成されためっき治具にあ
っては、PGA1を加圧押さえ3により本体2に押し付
けるようにセットすると、図3に示されるように、球8
にピン1aの先端が当接して圧縮コイルばね7が縮むた
め、ピン1aの先端に圧縮コイルばね7のたわみ量に応
じた接触圧にて球8が当接する。
In the plating jig thus constructed, when the PGA 1 is set so as to be pressed against the main body 2 by the pressure presser 3, as shown in FIG.
Since the tip of the pin 1a comes into contact with the compression coil spring 7 and the compression coil spring 7 contracts, the ball 8 comes into contact with the tip of the pin 1a with a contact pressure corresponding to the amount of deflection of the compression coil spring 7.

【0015】従って、エッチングプレート5とピン1a
との間が確実な接触状態にて電気的に接続され、エッチ
ングプレート5に通電することによりピン1aに対する
電解めっきを行うことができる。メッキ終了後には、加
圧押さえ3を本体2から取り除くことにより、PGA1
を分離可能であり、圧縮コイルばね7は復元力により初
期状態に戻り得る。
Therefore, the etching plate 5 and the pin 1a
Are electrically connected to each other in a reliable contact state, and the electroplating can be performed on the pin 1a by energizing the etching plate 5. After the plating is completed, the PGA 1 is removed by removing the pressure presser 3 from the main body 2.
Can be separated, and the compression coil spring 7 can return to the initial state by the restoring force.

【0016】本実施例では、小径孔部4aのピン1aを
挿入する側の開口周縁部に外方に向けて拡開するテーパ
面4cが形成されている。これにより、ピン1aを孔4
に挿入する際にピン1aを好適にガイドすることができ
る。
In this embodiment, a taper surface 4c is formed at the peripheral edge of the opening of the small-diameter hole 4a on the side where the pin 1a is inserted, the taper surface 4c expanding outward. As a result, the pin 1a is inserted into the hole 4
The pin 1a can be suitably guided when it is inserted into the.

【0017】また、圧縮コイルばね7の弾発力にて球8
をピンに1aに当接させるため、公差からピン1aと孔
4との関係が完全に一致していなくても許容し得る。例
えば孔4に対してピン1aの軸線が半径方向にずれてい
たり、ピン1aの長さが異なって高さ方向にずれていた
り、ピン1aが曲がって軸線が傾いていたりしているこ
とが考えられるが、それらを圧縮コイルばね7のたわみ
により好適に吸収して、いずれの場合にもピン1aの先
端と球8との確実な接触状態を確保することができる。
The elastic force of the compression coil spring 7 causes the ball 8 to move.
Since the pin is brought into contact with the pin 1a, it is acceptable even if the relationship between the pin 1a and the hole 4 does not completely match due to the tolerance. For example, the axis of the pin 1a may be displaced from the hole 4 in the radial direction, or the length of the pin 1a may be different from that of the hole 4 in the height direction, or the pin 1a may be bent and the axis may be inclined. However, it is possible to appropriately absorb them by the deflection of the compression coil spring 7 and ensure a reliable contact state between the tip of the pin 1a and the ball 8 in any case.

【0018】また、圧縮コイルばね7のばね定数やたわ
み量を変えることにより、導通性に影響する接触圧力の
調整が可能であり、特に接触圧を容易に高めることがで
きる。
Further, by changing the spring constant and the amount of deflection of the compression coil spring 7, it is possible to adjust the contact pressure which affects the conductivity, and in particular the contact pressure can be easily increased.

【0019】図4に、本発明の第2の実施例を示すが、
前記図2に対応する図であり、前記実施例と同様の部分
には同一の符号を付してその詳しい説明を省略する。こ
の第2の実施例では、前記本体2に相当する部材を厚板
9aと薄板9bとを互いに重ね合わせて形成したものの
である。
FIG. 4 shows a second embodiment of the present invention.
It is a figure corresponding to the said FIG. 2, the same code | symbol is attached | subjected to the part similar to the said Example, and the detailed description is abbreviate | omitted. In the second embodiment, a member corresponding to the main body 2 is formed by stacking a thick plate 9a and a thin plate 9b on each other.

【0020】図に良く示されるように、厚板9aに大径
孔部4bを形成し、薄板9bに小径孔部4aを形成して
おり、薄板9bの小径孔部4aの縁部に球8が弾発的に
当接するため、前記実施例と同様に球8及び圧縮コイル
ばね7を大径孔部4b内に受容し得る。この第2の実施
例においても前記第1の実施例と同様の作用効果を有す
る。
As shown in the figure, a large-diameter hole 4b is formed in the thick plate 9a and a small-diameter hole 4a is formed in the thin plate 9b, and a sphere 8 is formed at the edge of the small-diameter hole 4a of the thin plate 9b. Contact elastically, so that the ball 8 and the compression coil spring 7 can be received in the large-diameter hole 4b as in the above-described embodiment. The second embodiment also has the same effects as the first embodiment.

【0021】[0021]

【発明の効果】このように本発明によれば、多ピン素子
をめっき治具に着脱する際にめっき治具側が変形するこ
とがなく、めっき治具を繰り返し使用可能であると共
に、着脱容易なため作業性が向上し得る。また、ピンの
先端と導電性接触体とが弾発的に接触するため、孔に対
する芯ずれや高さの違いや倒れなどの多少のばらつきが
ピンにあってもピンと導電性接触体との確実な導通を確
保することができる。また、導通性に影響を及ぼす接触
圧力をばね定数及びたわみ量を変えることにより容易に
調整することができる。
As described above, according to the present invention, when the multi-pin element is attached to or detached from the plating jig, the plating jig is not deformed, the plating jig can be repeatedly used, and the attachment / detachment is easy. Therefore, workability can be improved. In addition, since the tip of the pin and the conductive contact body make elastic contact, the pin and the conductive contact body can be securely attached even if there is some variation in the pin such as misalignment with the hole, height difference, and tilt. It is possible to secure good continuity. Further, the contact pressure that affects the conductivity can be easily adjusted by changing the spring constant and the amount of deflection.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に基づく多ピン素子用めっき治具を示す
分解斜視図。
FIG. 1 is an exploded perspective view showing a multi-pin element plating jig according to the present invention.

【図2】ピンを導電性接触体に当接させる前のめっき治
具の要部拡大側断面図。
FIG. 2 is an enlarged side cross-sectional view of a main part of a plating jig before a pin is brought into contact with a conductive contact body.

【図3】ピンを導電性接触体に当接させた状態を示す図
2に対応する図。
FIG. 3 is a view corresponding to FIG. 2 showing a state where a pin is brought into contact with a conductive contact body.

【図4】第2の実施例を示す図2に対応する図。FIG. 4 is a diagram corresponding to FIG. 2 showing a second embodiment.

【図5】従来のめっき治具を示す要部斜視図。FIG. 5 is a perspective view of a main part of a conventional plating jig.

【図6】従来のめっき治具のピンをクランプした状態を
示す部分拡大平面図。
FIG. 6 is a partially enlarged plan view showing a state in which a pin of a conventional plating jig is clamped.

【符号の説明】[Explanation of symbols]

1 PGA 1a ピン 2 本体 2a ガイドブロック 3 加圧押さえ 4 孔 4a 小径孔部 4b 大径孔部 4c テーパ面 5 エッチングプレート 5a 開口 6 プレートカバー 6a 貫通孔 7 圧縮コイルばね 8 球 9a 厚板 9b 薄板 11 導電端子板 12 クランプ孔 12a 大孔部 12b 小孔部 1 PGA 1a Pin 2 Main body 2a Guide block 3 Pressure holder 4 Hole 4a Small diameter hole 4b Large diameter hole 4c Tapered surface 5 Etching plate 5a Opening 6 Plate cover 6a Through hole 7 Compression coil spring 8 Ball 9a Thick plate 9b Thin plate 11 Conductive terminal board 12 Clamp hole 12a Large hole 12b Small hole

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 林立する複数のピンを有する多ピン素子
の当該各ピンをめっきするための多ピン素子用めっき治
具であって、 前記複数のピンの先端部をそれぞれ同軸的に受容可能な
複数の孔を配設された絶縁性本体と、前記多ピン素子を
前記ピンの先端部を前記孔に所定量挿入した状態に保持
するべく前記多ピン素子の前記ピンを設けられた側とは
相反する側を押圧する素子押圧体と、前記孔内に軸線方
向に伸縮自在に保持された導電性圧縮コイルばねと、前
記保持状態における前記ピンの先端に前記圧縮コイルば
ねの弾発付勢力をもって当接するべく前記圧縮コイルば
ねの一端に設けられた導電性接触体と、前記圧縮コイル
ばねの他端に接触するめっき時通電端子とを有すること
を特徴とする多ピン素子用めっき治具。
1. A multi-pin element plating jig for plating each pin of a multi-pin element having a plurality of standing pins, which can receive the tip ends of the plurality of pins coaxially. The insulating main body provided with a plurality of holes and the side of the multi-pin element provided with the pin to hold the multi-pin element in a state in which the tip portion of the pin is inserted into the hole by a predetermined amount. An element pressing body that presses the opposite sides, a conductive compression coil spring held in the hole so as to be able to expand and contract in the axial direction, and an elastic biasing force of the compression coil spring at the tip of the pin in the held state. A plating jig for a multi-pin element, comprising a conductive contact body provided at one end of the compression coil spring so as to abut, and a current-carrying terminal for plating that comes into contact with the other end of the compression coil spring.
JP9038695A 1995-03-22 1995-03-22 Plating jig for multipin element Pending JPH08264701A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9038695A JPH08264701A (en) 1995-03-22 1995-03-22 Plating jig for multipin element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9038695A JPH08264701A (en) 1995-03-22 1995-03-22 Plating jig for multipin element

Publications (1)

Publication Number Publication Date
JPH08264701A true JPH08264701A (en) 1996-10-11

Family

ID=13997147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9038695A Pending JPH08264701A (en) 1995-03-22 1995-03-22 Plating jig for multipin element

Country Status (1)

Country Link
JP (1) JPH08264701A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100726768B1 (en) * 2001-04-06 2007-06-11 삼성테크윈 주식회사 The appratus for gripping a window clamp
JP2018090848A (en) * 2016-12-01 2018-06-14 株式会社荏原製作所 Substrate holder, plating apparatus, and method of producing substrate holder
CN114921839A (en) * 2022-05-19 2022-08-19 强一半导体(苏州)有限公司 Method for gold plating of probe pin tail and positioning jig

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100726768B1 (en) * 2001-04-06 2007-06-11 삼성테크윈 주식회사 The appratus for gripping a window clamp
JP2018090848A (en) * 2016-12-01 2018-06-14 株式会社荏原製作所 Substrate holder, plating apparatus, and method of producing substrate holder
CN114921839A (en) * 2022-05-19 2022-08-19 强一半导体(苏州)有限公司 Method for gold plating of probe pin tail and positioning jig
CN114921839B (en) * 2022-05-19 2023-11-10 强一半导体(苏州)股份有限公司 Method for gold plating of probe tail and positioning jig

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