JPH0825822A - Stencil printing plate - Google Patents

Stencil printing plate

Info

Publication number
JPH0825822A
JPH0825822A JP18789194A JP18789194A JPH0825822A JP H0825822 A JPH0825822 A JP H0825822A JP 18789194 A JP18789194 A JP 18789194A JP 18789194 A JP18789194 A JP 18789194A JP H0825822 A JPH0825822 A JP H0825822A
Authority
JP
Japan
Prior art keywords
layer
plate
printing plate
stainless steel
copper plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18789194A
Other languages
Japanese (ja)
Inventor
Tadashi Ishimatsu
忠 石松
Yuichi Fujita
裕一 藤田
Ikuo Hirota
郁夫 広田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP18789194A priority Critical patent/JPH0825822A/en
Publication of JPH0825822A publication Critical patent/JPH0825822A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a printed matter in which a printing plate can be easily engraved without surface defect and which has excellent printing shape by using a ferrite or martensite stainless steel plate having surface mean roughness of a specific value or less as a board. CONSTITUTION:A copper-plated layer 3 for forming ink cells 5 via an etching stop layer 2 is provided on one side surface of a ferrite or martensite stainless steel plate 1 having surface mean roughness of 0.02mumRa or less, and the surface is covered with a hard chromium plating 4. Thus, since the one side surface of the plate 1 is regulated to the surface mean roughness of 0.02mumRa or less, the layer 2 and the layer 3 are flatly formed thereon, and a stencil printing plate having no surface defect such as a protrusion, a pit is engraved. Since the stainless steel plate having small linear expansion coefficient is used as the board 1, the dimensional change due to the head of the layer 3 formed with ink cells 5 is suppressed, and the change of the entire printing plate is reduced.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、カラー液晶表示装置、
カラービデオカメラ、カラーイメージセンサなど、カラ
ー画像の入出力装置に使用されるカラーフィルタを、オ
フセット印刷によって製造する際に使用する凹版印刷版
の構造に関するものである。
BACKGROUND OF THE INVENTION The present invention relates to a color liquid crystal display device,
The present invention relates to a structure of an intaglio printing plate used when manufacturing a color filter used for a color image input / output device such as a color video camera and a color image sensor by offset printing.

【0002】[0002]

【従来の技術】上記カラーフィルタを印刷形成するため
の凹版印刷版としては、図2に例示した構成のものが周
知である。すなわち、従来の凹版印刷版は、鋼製の基板
1の片面にバラード銅めっき層6を所要の厚さ、例えば
30〜50μmの厚さに形成し、この銅層の上にニッケ
ルのエッチング停止層2を介して、溝状のインキセル5
を形成するための銅めっき層3を、例えば5〜15μm
の厚さに形成し、この表面に耐久性を高めるために硬質
クロムめっき4を薄く被覆した構成である。
2. Description of the Related Art As an intaglio printing plate for printing and forming the above color filter, the intaglio printing plate shown in FIG. 2 is well known. That is, in the conventional intaglio printing plate, the ballad copper plating layer 6 is formed on one surface of the steel substrate 1 to a required thickness, for example, 30 to 50 μm, and an etching stop layer of nickel is formed on the copper layer. 2 through the groove-shaped ink cell 5
The copper plating layer 3 for forming
The hard chrome plating 4 is thinly coated on the surface to increase durability.

【0003】[0003]

【発明が解決しようとする課題】上記構成の従来の凹版
においては、基板の表面が十分平滑でないため、この
上に銅などをめっきしてしても凹凸が残り、表面欠陥の
多い版となりがちである。基板の膨張率が大きいため
位置合わせ精度が出し難く、大型カラーフィルタの製造
が困難である。インキセルを形成する銅めっき層の下
にも表面欠陥をなくすためのバラード銅めっき層がある
ため、廉価で操作の容易な渦電流計によるインキセルの
深さ測定ができない。このため、版深不良として製版後
に廃棄処分しなければならないことがある。基板が錆
び易いため長期保管が困難である、などと云った種々の
問題点があり、これら問題点の解決が課題となってい
た。
In the conventional intaglio plate having the above structure, since the surface of the substrate is not sufficiently smooth, even if copper or the like is plated on it, unevenness tends to remain and the plate tends to have many surface defects. Is. Since the expansion coefficient of the substrate is large, it is difficult to obtain alignment accuracy, and it is difficult to manufacture a large color filter. Since there is also a ballad copper plating layer for eliminating surface defects under the copper plating layer forming the ink cell, it is impossible to measure the depth of the ink cell with an eddy current meter which is inexpensive and easy to operate. For this reason, it may be necessary to dispose of the product as a plate depth defect after plate making. There are various problems that the substrate is easily rusted and is difficult to store for a long period of time, and it has been a problem to solve these problems.

【0004】[0004]

【課題を解決するための手段】本発明は上記従来技術の
課題を解決するため、表面平均粗さが0.02μmRa
以下のフェライト系またはマルテンサイト系ステンレス
鋼板の片面に、電解めっき法により形成したニッケルま
たはニッケル合金からなるエッチング停止層を介して、
溝状のインキセルを形成する銅めっき層を設け、表面を
硬質クロムめっきによって被覆した凹版印刷版を提供す
るものである。
In order to solve the above-mentioned problems of the prior art, the present invention has a surface average roughness of 0.02 μmRa.
On one surface of the following ferritic or martensitic stainless steel sheet, through an etching stop layer made of nickel or nickel alloy formed by electrolytic plating,
It is intended to provide an intaglio printing plate in which a copper plating layer for forming groove-shaped ink cells is provided and the surface is coated with hard chrome plating.

【0005】[0005]

【作用】基板の所要の片面が0.02μmRa以下の表
面平均粗さに調整されているので、この上に電解めっき
するニッケルまたはニッケル合金からなるエッチング停
止層と、インキセルを形成するための銅めっき層とが平
坦に形成され、突起やピットなどの表面欠陥のない凹版
印刷版が製版される、このため、画線精度、印刷形状に
優れた印刷物が得られる。
Since the required one surface of the substrate is adjusted to have a surface average roughness of 0.02 μmRa or less, an etching stop layer made of nickel or a nickel alloy to be electroplated thereon and a copper plating for forming an ink cell. The layer is formed flat, and an intaglio printing plate having no surface defects such as protrusions and pits is produced. For this reason, a printed matter excellent in drawing accuracy and printing shape can be obtained.

【0006】また、線膨張率が従来の鋼製基板の線膨張
率11.8×10-6/℃より10%程度以上は小さいフ
ェライト系またはマルテンサイト系のステンレス鋼板を
基板としているので、この基板に積層された線膨張率が
16.7×10-6/℃と大きい、インキセルを形成して
いる銅めっき層の熱に起因する寸法変動が効果的に抑え
られ、凹版印刷版全体の変動が小さくなる。これによ
り、位置精度の高い印刷が可能となり、面積の大きい大
型カラーフィルタの製造が可能になる。
Further, since a ferrite or martensitic stainless steel plate having a linear expansion coefficient smaller than the linear expansion coefficient of 11.8 × 10 −6 / ° C. of a conventional steel substrate by about 10% or more is used as the substrate, Large linear expansion coefficient of 16.7 × 10 -6 / ° C laminated on the substrate, dimensional variation due to heat of the copper plating layer forming the ink cell is effectively suppressed, and variation of the intaglio printing plate as a whole Becomes smaller. This makes it possible to perform printing with high positional accuracy and to manufacture a large color filter having a large area.

【0007】[0007]

【実施例】以下、本発明の実施例を図1に基づいてさら
に詳細に説明する。なお、理解を容易にするため、図1
においても前記図2において説明した部分と同様の機能
を有する部分には同一の符号を付した。
Embodiments of the present invention will now be described in more detail with reference to FIG. In addition, in order to facilitate understanding, FIG.
Also in the above, the same reference numerals are given to the portions having the same functions as the portions described in FIG.

【0008】図1に例示した本発明の凹版印刷版(以
下、単に凹版と云う)は、所要の側の表面平均粗さが
0.02μmRa以下に研磨されたフェライト系の適宜
のステンレス鋼、例えばSUS430からなる基板1の
片面に、ニッケル合金のエッチング停止層2を介して溝
状のインキセル5を囲繞形成する銅めっき層3を設け、
この表面を硬質クロムめっき4によって薄く被覆したも
のである。
The intaglio printing plate of the present invention illustrated in FIG. 1 (hereinafter, simply referred to as an intaglio plate) is an appropriate ferritic stainless steel polished to have a surface average roughness of 0.02 μmRa or less on a desired side, for example, On one surface of the substrate 1 made of SUS430, a copper plating layer 3 that surrounds a groove-shaped ink cell 5 via an etching stop layer 2 of a nickel alloy is provided,
This surface is thinly coated with hard chrome plating 4.

【0009】上記構成の本発明になる凹版は、以下に示
す方法によって形成される。例えば板厚が3〜10mm
程度の市販のSUS430の片面を、例えば硝酸−アル
ミナ粉系の研磨剤液(上村工業(株)製のメカノックス
CB−1など)を用いて、表面平均粗さが0.02μm
Ra以下になるようにケミカル・バフ研磨する。
The intaglio plate having the above structure according to the present invention is formed by the following method. For example, the plate thickness is 3-10 mm
The surface average roughness of one side of commercially available SUS430 is about 0.02 μm using, for example, a nitric acid-alumina powder-based abrasive liquid (Mechanox CB-1 manufactured by Uemura Industry Co., Ltd.).
Chemical buffing is performed so as to be Ra or less.

【0010】上記性状に調整した基板1の研磨面を除く
部位を非導電性部材、例えばPETフィルムなどによっ
てマスキングし、組成が例えば硝酸ニッケル300g/
l、ニッケリン(B−1)200ml/l、pH1.4
であるめっき浴に浸漬し、電流密度2A/cm2 、めっ
き浴温度60℃の条件で電解めっきを行い、3μmの厚
さのニッケル−リン合金(リン10重量%、残部ニッケ
ル)からなるエッチング停止層2を基板1の平滑な面に
形成する。
A portion of the substrate 1 adjusted to the above properties other than the polished surface is masked with a non-conductive member such as PET film, and the composition is, for example, 300 g of nickel nitrate /
1, Nickelin (B-1) 200 ml / l, pH 1.4
Electroplating is performed under the conditions of a current density of 2 A / cm 2 and a plating bath temperature of 60 ° C., and an etching stop consisting of a nickel-phosphorus alloy with a thickness of 3 μm (phosphorus 10% by weight, balance nickel). The layer 2 is formed on the smooth surface of the substrate 1.

【0011】さらに、エッチング停止層2が上記のよう
にして片面に形成された基板1を、組成が硫酸銅200
g/l、硫酸55g/l、塩素70ppmのめっき浴に
浸漬し、電流密度2A/cm2 、めっき浴温度25℃の
条件で電解めっきを行い、厚さが10μmの銅めっき層
3をエッチング停止層2の上に形成する。
Further, the substrate 1 having the etching stopper layer 2 formed on one side as described above is formed into a copper sulfate 200 composition.
Immersion in a plating bath of g / l, sulfuric acid 55 g / l, chlorine 70 ppm, electrolytic plating under conditions of current density of 2 A / cm 2 and plating bath temperature of 25 ° C., and stopping etching of copper plating layer 3 having a thickness of 10 μm Formed on layer 2.

【0012】そして、銅めっき層3の上にそれ自体は従
来周知の図示しない感光性樹脂(例えば、東京応化
(株)製のPMER N−HC40など)を塗布し、マ
スク露光と現像を行って耐食性のレジストを所望のパタ
ーンに残存形成した後、塩化第二鉄液(ボーメ濃度40
度、温度35℃)に浸漬して銅めっき層3の露出部をエ
ッチングし、後に凹版のインキセル5となる深さ10μ
mの凹部を形成する。
Then, a photosensitive resin (not shown) which is well known in the art (for example, PMER N-HC40 manufactured by Tokyo Ohka Co., Ltd.) is applied onto the copper plating layer 3, and mask exposure and development are performed. After the corrosion-resistant resist is formed in a desired pattern, ferric chloride solution (Baume concentration 40
The exposed portion of the copper plating layer 3 is etched by immersing the exposed portion of the copper plating layer 3 in a temperature of 35 ° C.) to form an intaglio ink cell 5 at a depth of 10 μm.
m to form a recess.

【0013】この銅めっき層3の塩化第二鉄液によるエ
ッチングは、銅めっき層3の下側にニッケル−リン合金
からなるエッチング停止層2が配設されているので、前
記凹部が銅めっき層3の膜厚の10μmより深く形成さ
れることはない。
In the etching of the copper plating layer 3 with the ferric chloride solution, since the etching stop layer 2 made of a nickel-phosphorus alloy is disposed below the copper plating layer 3, the concave portion is formed by the copper plating layer. It is not formed deeper than 10 μm, which is the film thickness of 3.

【0014】そして、表面に溝状の凹部を有する上記板
状部材を組成が無水クロム酸250g/l、硫酸2.5
g/lのめっき浴に浸漬して、電流密度10A/cm
2 、めっき浴温度50℃の条件で電解めっきを行い、硬
質クロムめっき4を全面に薄く、例えば3μmの厚さの
形成すると、本発明の凹版が形成される。
Then, the above plate-shaped member having a groove-shaped recess on the surface is composed of chromic anhydride 250 g / l and sulfuric acid 2.5.
Immersion in g / l plating bath, current density 10A / cm
2. Electroplating is performed under the condition of a plating bath temperature of 50 ° C., and the hard chrome plating 4 is thinly formed on the entire surface to a thickness of, for example, 3 μm to form the intaglio plate of the present invention.

【0015】上記構成の凹版においては、基板1が従来
の炭素鋼より線膨張率の小さいフェライト系ステンレス
鋼から構成されているため、位置合わせ精度が向上する
と云った利点がある。
In the intaglio plate having the above-mentioned structure, since the substrate 1 is made of ferritic stainless steel having a linear expansion coefficient smaller than that of the conventional carbon steel, there is an advantage that the alignment accuracy is improved.

【0016】すなわち、従来は線膨張率が11.8×1
-6/℃程度の炭素鋼を使用していたが、線膨張率が1
0.4×10-6/℃程度と炭素鋼のそれより12%程小
さいSUS430を使用したことにより、基板1の上に
積層されてインキセル5を囲繞形成している、線膨張率
が16.7×10-6/℃と大きい銅めっき層3の熱に起
因する寸法変動が効果的に抑えられ、凹版印刷版全体の
変動が小さくなる。これにより、位置合わせ精度の高い
印刷が可能となり、面積の一層大きい大型カラーフィル
タの製造が可能になる。
That is, conventionally, the coefficient of linear expansion is 11.8 × 1.
0 -6 / ° C. of about had using carbon steel, linear expansion coefficient 1
By using SUS430, which is about 0.4 × 10 −6 / ° C., which is about 12% smaller than that of carbon steel, the linear expansion coefficient is 16, which is laminated on the substrate 1 to surround the ink cell 5. The dimensional variation due to the heat of the copper plating layer 3, which is as large as 7 × 10 −6 / ° C., is effectively suppressed, and the variation of the whole intaglio printing plate becomes small. This makes it possible to perform printing with high alignment accuracy and to manufacture a large-sized color filter having a larger area.

【0017】また、表1に示したように、少な目に研磨
して基板1の所要の片面を0.03μmRaの表面平均
粗さとした比較例の凹版の場合には、この上に電解めっ
きするニッケルまたはニッケル合金からなるエッチング
停止層2と、インキセル5を形成する銅めっき層3とが
凸凹に形成されて、突起やピットなどの表面欠陥の多い
印刷版となり、印刷状態も良好でなかったが、基板1の
所要の片面が0.01μmRaと0.02μmRaの表
面平均粗さに調整されて製版された本発明の凹版では、
この上に電解めっきするニッケルまたはニッケル合金か
らなるエッチング停止層2と、インキセル5を形成する
銅めっき層3は何れも平坦に形成され、突起やピットな
どの表面欠陥のない印刷版が形成され、画線精度と印刷
形状に優れた印刷物が得られた。
Further, as shown in Table 1, in the case of the intaglio plate of the comparative example in which the required average surface roughness of the substrate 1 was 0.03 μmRa after polishing a little, nickel to be electroplated on this was used. Alternatively, the etching stop layer 2 made of a nickel alloy and the copper plating layer 3 forming the ink cell 5 are unevenly formed to form a printing plate having many surface defects such as protrusions and pits, and the printing state is not good, In the intaglio plate of the present invention in which one side of the substrate 1 is adjusted to have a surface average roughness of 0.01 μmRa and 0.02 μmRa, and the plate is made,
The etching stop layer 2 made of nickel or nickel alloy to be electroplated thereon and the copper plating layer 3 to form the ink cell 5 are both flatly formed to form a printing plate without surface defects such as protrusions and pits. A printed matter excellent in drawing accuracy and print shape was obtained.

【0018】[0018]

【表1】 [Table 1]

【0019】また、図2に示した従来の凹版とは違っ
て、銅層は銅めっき層3だけであるので、廉価で操作の
容易な渦電流計などを用いた非破壊検査によって、銅め
っき層3の厚さをエッチング工程に移行する前にも容易
に且つ正確に確認できる。このため、製版後になってイ
ンキセル5の深さ不足が判明し、廃棄しなければならな
いと云った不都合がなくなる。
Further, unlike the conventional intaglio plate shown in FIG. 2, since the copper layer is only the copper plating layer 3, the copper plating can be performed by a nondestructive inspection using an eddy current meter which is inexpensive and easy to operate. The thickness of the layer 3 can be easily and accurately confirmed before the etching process. For this reason, it becomes clear that the depth of the ink cell 5 is insufficient after the plate making, and there is no inconvenience that the ink cell 5 must be discarded.

【0020】なお、上記構成の本発明の凹版を用いてオ
フセット印刷された精細パターンを有するカラーフィル
タは、従来と同様必要に応じて研磨・圧延などの手段に
よって印刷面の平滑化処理などを行い、さらに電極の配
設と液晶の封入などの工程を経て液晶カラーディスプレ
イに仕上げられる。
The color filter having a fine pattern offset-printed by using the intaglio plate of the present invention having the above-mentioned structure is subjected to a smoothing treatment of the printing surface by means such as polishing and rolling as necessary as in the conventional case. After that, the liquid crystal color display is finished through the steps of disposing electrodes and enclosing the liquid crystal.

【0021】ところで、本発明は上記実施例に限定され
るものではないので、特許請求の範囲に記載の趣旨にそ
って各種の変形実施が可能である。
By the way, since the present invention is not limited to the above-mentioned embodiments, various modifications can be made in accordance with the spirit of the claims.

【0022】例えば、基板1はSUS430以外のフェ
ライト系ステンレス鋼、すなわちSUS405・SUS
429・SUS430F・SUS434などであっても
良いし、SUS403・SUS410・SUS630な
どのマルテンサイト系ステンレス鋼であっても良い。
For example, the substrate 1 is a ferritic stainless steel other than SUS430, that is, SUS405 / SUS.
429 / SUS430F / SUS434 or the like, or martensite stainless steel such as SUS403 / SUS410 / SUS630.

【0023】[0023]

【発明の効果】以上説明した様に本発明は、表面平均粗
さが0.02μmRa以下のフェライト系またはマルテ
ンサイト系ステンレス鋼板の片面に、電解めっき法によ
り形成したニッケルまたはニッケル合金からなるエッチ
ング停止層を介して、溝状のインキセルを形成する銅め
っき層を設け、表面を硬質クロムめっきによって被覆し
た凹版であるので、表面欠陥のない製版が容易に行え、
印刷形状に優れた印刷物が得られる。
As described above, according to the present invention, the etching stop made of nickel or nickel alloy formed by electrolytic plating on one surface of a ferritic or martensitic stainless steel sheet having a surface average roughness of 0.02 μmRa or less. Through the layer, a copper plating layer for forming groove-shaped ink cells is provided, and since the surface is an intaglio plate coated with hard chrome plating, plate making without surface defects can be easily performed,
A printed matter having an excellent print shape can be obtained.

【0024】また、従来の凹版より基板の線膨張率が1
0%程小さいため、位置合わせ精度の高い印刷が可能で
あり、面積のより大きいカラーフィルタが製造できる。
また、従来の凹版で必要であったバラード銅めっき層を
省いた構成であるため、製版工程が略化されると共に、
廉価で操作の容易な渦電流計による銅めっきの膜厚測定
が可能となり、これにより製版後になってインキセルの
深さ不良が発見されると云った不都合がなくなった。さ
らに、錆び難い構成であるので保管し易いと云った特長
があるなど、顕著な効果を奏するものである。
Further, the linear expansion coefficient of the substrate is 1 as compared with the conventional intaglio plate.
Since it is as small as 0%, it is possible to perform printing with high alignment accuracy and to manufacture a color filter having a larger area.
In addition, since the structure eliminates the ballad copper plating layer required in the conventional intaglio plate, the plate making process is simplified and
It is possible to measure the film thickness of copper plating with an eddy current meter, which is inexpensive and easy to operate, which eliminates the inconvenience of finding defective depth of ink cells after plate making. Further, it has a remarkable effect that it is easy to store because it has a structure that is difficult to rust.

【図面の簡単な説明】[Brief description of drawings]

【図1】 一実施例の説明図である。FIG. 1 is an explanatory diagram of an example.

【図2】 従来技術の説明図である。FIG. 2 is an explanatory diagram of a conventional technique.

【符号の説明】[Explanation of symbols]

1 基板 2 エッチング停止層 3 銅めっき層 4 硬質クロムめっき 5 インキセル 6 バラード銅めっき層 1 Substrate 2 Etching Stop Layer 3 Copper Plating Layer 4 Hard Chrome Plating 5 Ink Cell 6 Ballad Copper Plating Layer

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 表面平均粗さが0.02μmRa以下の
フェライト系またはマルテンサイト系ステンレス鋼板の
片面に、電解めっき法により形成したニッケルまたはニ
ッケル合金からなるエッチング停止層を介して、溝状の
インキセルを形成する銅めっき層を設け、表面を硬質ク
ロムめっきによって被覆したことを特徴とする凹版印刷
版。
1. A groove-shaped ink cell formed on one surface of a ferritic or martensitic stainless steel sheet having a surface average roughness of 0.02 μmRa or less, with an etching stopper layer made of nickel or nickel alloy formed by an electrolytic plating method interposed therebetween. An intaglio printing plate, comprising a copper plating layer for forming a film, the surface of which is coated with hard chrome plating.
JP18789194A 1994-07-19 1994-07-19 Stencil printing plate Pending JPH0825822A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18789194A JPH0825822A (en) 1994-07-19 1994-07-19 Stencil printing plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18789194A JPH0825822A (en) 1994-07-19 1994-07-19 Stencil printing plate

Publications (1)

Publication Number Publication Date
JPH0825822A true JPH0825822A (en) 1996-01-30

Family

ID=16214008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18789194A Pending JPH0825822A (en) 1994-07-19 1994-07-19 Stencil printing plate

Country Status (1)

Country Link
JP (1) JPH0825822A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002172752A (en) * 2000-12-06 2002-06-18 Utec:Kk Doctor blade and printing plate
JP2006217921A (en) * 1997-11-28 2006-08-24 Daiwa Seiko Inc Tubular body and production thereof
US7836249B2 (en) 1999-02-02 2010-11-16 Hitachi, Ltd. Disk subsystem

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006217921A (en) * 1997-11-28 2006-08-24 Daiwa Seiko Inc Tubular body and production thereof
US7836249B2 (en) 1999-02-02 2010-11-16 Hitachi, Ltd. Disk subsystem
JP2002172752A (en) * 2000-12-06 2002-06-18 Utec:Kk Doctor blade and printing plate

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