JPH08255510A - Insulator composition and green tape, and partition wall forming method for plasma display device using them - Google Patents

Abstract

PURPOSE: To facilitate the forming of a partition wall, having uniform height (thickness) and high reliability, and also sharply rationalize a partition wall forming process, by using a green tape, having a previously formed uniform thickness, for an insulator layer. CONSTITUTION: Inorganic solid powder is dispersed in a solution, wherein a given binder is dissolved in a volatile nonaquous organic solvent, to obtain a castable insulator composition for forming a green tape used to form the partition wall of a plasma display device (PDP device). In this case, following is used: inorganic solid fine powder, having a softening point lower by at least 50 deg.C than backing temperature and composed of an amorphous glass of 30-60 volume % and a fireproof oxide of 70-40 volume %; a binder composed of a polymer material of 40-60 volume % and a plasticizer of 60-40 volume %, and a volatility nonaqueous organic solvent. The uniformity of the partition wall in thickness (height) direction can be retained to improve the work efficiency and process management for sand blasting by using the green tape based on such a castable insulator composition.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming barrier ribs of a plasma display device (hereinafter referred to as "PDP device"), and more specifically, an insulating composition for forming a green tape suitable for barrier rib formation, The present invention relates to a green tape obtained by processing the insulating composition into a sheet and a method for forming partition walls of a PDP device using the green tape.

[0002]

2. Description of the Related Art PDP devices are being developed as flat displays used for large-sized wall-mounted televisions and high-definition displays which replace conventional CRTs. In a PDP device, a plurality of anodes optionally covered with an insulating layer on their inner surfaces and a pair of glass constituent substrates each having a cathode at a position opposite to the anodes are arranged to face each other with a predetermined gas discharge interval. After hermetically sealing the periphery with a sealing material, a predetermined discharge gas is sealed in the glass discharge interval to form a gas discharge section. The gas discharge interval is uniformly maintained in each part, and the discharge is performed in a constant space cell divided by an insulating partition. FIG. 5 shows the basic structure of such a PDP device of the DC type.

The PDP device is required to be large-sized, high-definition, and colored, and accordingly, it is required to secure the height of the partition wall, that is, the uniformity of the electrode interval, and at the same time, to improve the mass productivity. ing. The mainstream method of forming the partition walls of the PDP device is a screen printing method. In the screen printing method, as described in JP-A-58-150248, after forming an insulating powder such as glass into a printable paste, a mesh mask for screen printing is used for a small display. A process of printing and laminating lines or dots and spaces as a pair with a predetermined thickness with a resolution of, for example, about 3 pairs / mm is adopted. At this time, printing is repeated at least 3 to 4 times, and in the case of a large number, about 10 printing is repeated while maintaining the above-mentioned resolution, to stack up to a predetermined thickness (height). For this reason, the printing and laminating process requires precise registration for each printing process.
Further, it is required to pay attention to the flow-out of the paste each time, and to accurately control the film thickness so that the finally laminated heights are not uneven, which is a very complicated process with a low yield. In order to overcome this process defect, it is necessary for an experienced printing engineer to carefully print the image over time, which is a background for inducing a great increase in cost.

From such a background, a sandblast partition wall forming method has been developed and put into practical use in recent years, and the method will be described with reference to FIG. As a first step, an anode is formed on the glass substrate. Next, the insulator layer to be the partition wall is solid-printed to a desired thickness by a screen printing method. A patterned resist having sandblast resistance is adhered to the dried insulator layer, and an abrasive material is sprayed by a sandblasting machine to remove the insulator material other than the partition wall portion, that is, the region where the resist is patterned. Then, the resist is peeled off and finally baked to form thin and uniform partition walls.

[0005]

The screen printing method for printing an insulating layer having a desired pattern at a desired height using the above-mentioned paste containing an insulating powder such as glass as a main component is complicated in operation. It takes time and it is extremely difficult to maintain the uniformity of the insulating layer in the height (thickness) direction.

On the other hand, in the sandblasting method, since solid printing is used, the alignment is easy, but the number of printings is still large and it is difficult to control the uniformity of the film thickness. Further, due to the reliability requirement for the partition wall of the PDP device, the paste preparation and the printing work need to be performed with great care in order to avoid the defects in the process, and the atmosphere control of the working environment is required. Therefore, there is a problem that work efficiency and mass production efficiency are not improved.

[0007]

The present inventors have used a method of manufacturing a PDP device in which a green tape having a uniform thickness formed in advance is used as an insulator layer so that a uniform height (thickness) can be obtained. The present invention has been completed by finding that a highly reliable partition wall can be easily formed and the partition wall formation process can be significantly streamlined.

The invention comprises: a) an inorganic solid fine powder consisting of 30 to 60% by volume of amorphous glass whose softening point is at least 50 ° C. below the firing temperature and 70 to 40% by volume of refractory oxides; b) a polymeric substance. 40-60% by volume and plasticizer 60-4
A binder comprising 0% by volume and c) a volatile non-aqueous organic solvent, wherein the inorganic solid powder of a) is dispersed in a solution prepared by dissolving the binder of b) in the volatile non-aqueous organic solvent of c). And a castable insulator composition for forming a green tape used for forming partition walls of a plasma display device.

The present invention also relates to a partition forming green tape for a plasma display device, which is obtained by casting the castable insulating composition on a flexible substrate and removing the volatile non-aqueous organic solvent by heating. .

Further, according to the present invention, a pair of substrates, which are opposed to each other with a plurality of electrodes forming a discharge light emitting display portion provided on at least one substrate surface and are separated from each other by a predetermined space, partition the discharge light emitting display portion. In the method for manufacturing a plasma display device, which comprises a partition wall for sealing the periphery with a sealing material, the method comprises: a) forming an electrode pattern layer of a conductive composition on a glass substrate, A flexible green tape is laminated and heated to 300 to 400 ° C. to form an insulating layer from which a part of organic substances in the layer is removed, and b) on the insulating layer obtained in the step c). A resist layer for sandblasting is formed, and a resist pattern corresponding to the partition is formed in a region other than the region to be etched by sandblasting, and the insulator in the region where the resist pattern formed in step c) b) is not formed. Is removed by sandblasting to form barrier ribs, and the barrier ribs formed by the insulating layer patterned in step d) and c) are fired after the resist for sandblasting is peeled off. The present invention relates to a partition forming method.

The present invention further provides, in the method of manufacturing a plasma display device, a) the green tape according to claim 2, wherein: a) the surface of the assembly having the electrode pattern layer of the thick film conductor composition formed on the glass substrate. And heating to 300 to 400 ° C. to form an insulating layer from which a part of organic substances in the layer is removed, and b) a photo-curable insulating paste on the insulating layer obtained in the step a). Alternatively, a green tape layer is formed, and a sandblasting mask pattern corresponding to the partition is formed in a region other than the region to be etched by sandblasting, and the insulating layer in the region where the sandblasting mask pattern formed in step c) b) is not formed is formed. The barrier ribs are removed by sandblasting to form barrier ribs, and the barrier ribs formed by the insulating layer patterned in step d) and c) are fired. That relates to the partition wall forming method of the plasma display apparatus.

The insulator composition of the present invention comprises an inorganic solid powder composed of amorphous glass and refractory oxide as described above.
A castable composition in which a binder comprising a polymeric material and a plasticizer is dispersed in a solution in a volatile non-aqueous organic solvent.

Each composition component will be described in detail below. a-1) Amorphous glass The composition of the glass used in the composition of the present invention is not important per se, it is amorphous under the conditions of use and has a softening point (Ts).
Is 50 ° C. or more lower than the firing temperature, and it is important that the viscosity (η) at the firing temperature is 1 × 10 ⁶ poise or less, and the glass viscosity at the sintering temperature is 1 × 10 ⁵ poise or less. Glass is preferred. A glass having a combination of the above-mentioned physical properties enables extremely good burn-out of organic substances when fired at 450 to 600 ° C., and is sintered to be dense enough for a discharge barrier and strength required for a structure. With appropriate liquidity that can achieve both.
The correlation of these two variables is necessary to define the viscosity-temperature characteristics of the glass that can be used in the present invention. The term "softening point (Ts)" as used herein refers to the softening point measured with an dilatometer.

It is essential that the glass be amorphous under the conditions of use. Furthermore, if the glass does not have any significant effect on the dissolution of the refractory oxide of the composition, or if it is one that highly solubilizes the refractory oxide, then the resulting solution will have an initial calcination. It has been found that it must have a suitable high viscosity at the firing temperature of both the stage and the entire firing stage. However, refractory oxides should not dissolve more than 20% by weight in the glass, preferably not more than 10% by weight.

Similarly, the amount of glass relative to the amount of refractory oxide is extremely important. When using a glass having a density of 2-5 g / cm ² , the amount of glass is 30-60% by volume,
Preferably, it is 40 to 50% by volume, and the rest is a refractory oxide. The exact amount of glass requires more glass than if the viscosity of the glass at the firing temperature is relatively high, and less if the viscosity of the glass is relatively low. If the amount of glass is too small, the densification of the layer during firing will be insufficient, while if it is too large, the layer will soften too much at the firing temperature, so the shape of the partition walls will change and the preferred electrode spacing and cell shape will be maintained. As well as being unable to do so, the glass flows out into the conductor layer adjacent to the layer, creating potential short circuit and open problems in the conductive circuit. Moreover, such glass flow makes it very difficult to join adjacent conductors. Excessive glass causes organic material entrapment, which causes blistering of the insulator layer during subsequent firing. On the other hand, when the amount of glass is less than 30% by volume, the fired structure becomes too porous and is not sufficiently densified. Considering these changes, solid fine powder is
It preferably contains 40 to 50% by volume of amorphous glass.

A-2) Refractory Oxide The refractory oxide used in the present invention has no solubility in any glass used with it, or has a minimum solubility, if any. I have not done it. When the assembly is constructed in multiple layers, it is important in forming the multilayer system that the insulator layer has expansion properties comparable to those of the substrate, especially so that it is dimensionally stable against warpage of the substrate. Within this criterion, the refractory oxide is chosen so that its coefficient of expansion TCE of its mixture with glass approximates that of the substrate to which it is applied. That is, if the glass has a lower TCE than the refractory oxides with which it is used, eg Al ₂ O ₃ , α-quartz or CaZr
High TCE fillers such as O ₃ are used with refractory oxides. On the other hand, when using high TCE glass,
It is preferred to use low TCE fillers such as fused silica, cordierite or mullite with refractory oxides. The TCE of the glass-refractory oxide mixture must be controlled to approximate that of the substrate to which it is applied.

In order to obtain a further densification of the insulation layer by firing, it is important that the glass-refractory oxide mixture has a very small particle size. In particular, each individual particle should not exceed 15 μm, preferably 10 μm or less. Substantially all of the inorganic solid particles are preferably in the range of 0.2-5 μm.

B-1) Polymeric substance The inorganic solid powder of glass-refractory oxide is a polymer substance, a plasticizer and optionally a dissolving substance such as a release agent, a dispersant, a release agent, an anti-reflective agent. It is dispersed in a medium in which a binder composed of a stain agent, a wetting agent, etc. is dissolved in a volatile non-aqueous organic solvent. As the main component of the binder, it is possible to use a wide range of polymeric materials that have been used in conventional methods of making green tapes which are fired at high temperatures such that the binder will burn out more easily in air. Such polymer substances include poly (vinyl butyral), poly (vinyl acetate), poly (vinyl alcohol),
Cellulosic polymers such as methyl cellulose, ethyl cellulose, hydroxyethyl cellulose, methyl hydroxyethyl cellulose, atactic polypropylene, polyethylene, poly (methylsiloxane), silicon polymers such as poly (methylphenylsiloxane), polystyrene, butadiene / styrene copolymer Various combinations of polymers, poly (vinylpyrrolidone), polyamides, high molecular weight polyethers, copolymers of ethylene oxide and propylene oxide, polyacrylamides, sodium polyacrylates, poly (lower alkyl acrylates), lower alkyl acrylates and methacrylates. Various acrylic polymers such as the copolymers and multi-polymers can be exemplified. Copolymers of ethyl methacrylate and methyl acrylate and terpolymers of ethyl acrylate, methyl methacrylate and methacrylic acid have long been used as binders for slip molding materials.

Recently US Patent Application No. 5 by Usala
No. 01,978, 0-100% by weight
C₁~ C₈Alkyl methacrylate, 100-0% by weight
C ₁~ C₈Alkyl acrylate and 0-5% by weight
Compatible with ethylenically unsaturated carboxylic acids or amines
Organic tape for green tape consisting of a mixture of ruti polymers
Inders can also be used.

Preferably, it is 400 to 6 under an oxidizing atmosphere.
A polymer of poly (α-methylstyrene) or a monofunctional methacrylate represented by the structural formula 1 below, which burns extremely cleanly and completely without leaving carbonaceous residue in the insulating layer even at a low firing temperature of 50 ° C. To use.

[0021]

Embedded image

In the above methacrylic monomer, the α-carbon must have two or three hydrogen atom substituents depending on the presence or absence of β-carbon. If there is no β-carbon, it is replaced by a hydrogen atom, such as methylmethacrylate. On the other hand, when it has β-carbon,
R ₁ , R ₂ and R ₃ are independently selected from alkyl, aryl or aralkyl groups or one of three R groups
If one is a hydrogen atom, the other two are preferably selected from alkyl, aryl or aralkyl groups. These two types of polymers are preferably homopolymers or, in the case of methacrylate polymers, polymers having only monomers meeting the above criteria.

The above two types of polymeric materials may contain up to about 15% by weight, preferably up to 5% by weight, of other types of comonomers and still provide good non-oxidative burnout properties. Examples of such other monomer include ethylenically unsaturated carboxylic acid and amine, acrylate, styrene, acrylonitrile, vinyl acetate, acrylamide and the like. Similarly, other copolymers outside of the above criteria may be used in place of the other comonomers, such as homopolymers and copolymers of up to about 15% by weight of the other monomers. The other monomers, whether they constitute another polymer or those contained in the main polymer chain, account for about 15% by weight of the total monomer present in the system, preferably 5% by weight. It is acceptable in all polymeric materials as long as it does not exceed

Whatever the polymeric material used, it is preferred that it have an intrinsic viscosity of at least 0.1 poise or higher as measured in methylene chloride at 20 ° C. in order to have sufficient bond strength. The upper limit of the molecular weight is not particularly limited, but in order to avoid the problem of solubility, it is preferable to use a polymer having an intrinsic viscosity of 1.0 or less, and particularly a polymer having an intrinsic viscosity of 0.3 to 0.6. The use of coalescence has been successful in the present invention.

B-2) Plasticizer One or more plasticizers that contribute to the reduction of the glass transition point (Tg) of the polymeric material are used. Such plasticizers also help ensure lamination of the composition to the substrate. The choice of plasticizer is largely determined by the polymer to be modified. As a plasticizer used in various binder systems,
Diethyl phthalate, dibutyl phthalate, butyl benzyl phthalate, dibenzyl phthalate, alkyl phosphates, polyalkylene glycols, poly (ethylene oxide), hydroxyethylated alkylphenols, tricresyl phosphate, triethylene glycol diacetate and polyester plasticizers Can be mentioned. Dibutyl phthalate is frequently used in the metechryl polymer system because it can be used in relatively low concentrations.

It is particularly preferred to use a plasticizer which cleanly volatilizes with the high molecular weight polymeric material and leaves virtually no residue. Benzyl butyl phthalate is mentioned as such a plasticizer. By using this, the plasticity of the binder can be adjusted, the green tape fits well around the conductor wire laminated on the substrate, and is not tacky enough to make the handling of the green tape difficult. Nor is it too weak.

The total amount of the binder, including the plasticizer contained therein, is required to be an amount sufficient to obtain good lamination and high green tape strength, but the amount of the inorganic solid powder to be reduced is reduced. Should not be large. If the amount of the organic substance contained in the green tape is too large, the sintering and densification during firing tend to be insufficient. For this reason, the binder content is preferably 30 to 50% by volume, more preferably 40 to 50% by volume of the volume of the solvent-free green tape.

C) Organic solvent As the organic solvent, the polymer substance, the plasticizer and optionally added additives can be completely dissolved and easily evaporated by heating at a relatively low level under atmospheric pressure. Those having sufficiently high volatility are selected. In addition, it must have a lower boiling point than any of the other optional additives included in the composition. Therefore, 15
An organic solvent having a boiling point of 0 ° C. or lower is used. As such a solvent, acetone, xylene, methanol, ethanol, isopropanol, methyl ethyl ketone,
1,1,1-trichloroethane, tetrachloroethylene,
Amyl acetate, 2,2,4-triethylpentanediol-1,3-monoisobutyrate, toluene, methylene chloride and fluorocarbons. The individual components of the solvent need not be complete solvents of the polymerizable material, and they will function as a solvent upon mixing with other solvent components.

The green tape of the present invention is obtained by casting the above-mentioned insulator composition on a flexible substrate such as a copper belt or a polymer film and molding it into a layer having a uniform film thickness. It is a tape of an insulator composition in which a volatile non-aqueous organic solvent is volatilized and removed by heating. The heating temperature is above the boiling point of the organic solvent and below the boiling point or decomposition point of the binder component. If the heating temperature is too high, it causes blisters, which is not preferable. The partition wall forming method of the present invention is based on a sandblast method, and is characterized in that the green tape of the present invention is used for forming partition walls.

A pair of glass substrates constituting the PDP device,
That is, a case where a cathode or an anode electrode is formed on either the front plate or the back plate and a partition is formed on a glass substrate on which the anode is formed (hereinafter referred to as “rear plate”) is attached. The present invention will be described in detail with reference to FIGS.

Step 1) A terminal electrode for external input is formed on a glass substrate. Step 2) An anode bus is formed on the same substrate. Step 3) A current control resistor group electrically connected to the anode bus formed in the previous step is formed on the same substrate (this step is omitted when a substrate without a resistor is used). Step 4) A layer (insulating layer) that electrically insulates the bus bar from the discharge space is formed on the anode formed in Step 2).

Step 5) A partition wall for partitioning a discharge section (image cell) is formed by using an insulating composition corresponding to the arrangement of the anode and the resistor formed up to the above step. This partition forming step is constituted by the following steps (see FIG. 1).

Step 5-1) The green tape of the present invention is laminated on the lower structure formed on the glass substrate up to the above step by the number of layers selected from the range of 1 to 3 layers, and 100 to
An insulator layer having a desired film thickness in the range of 300 μm is formed. Step 5-2) The structure having the insulator layer formed thereon is set to 300 to 4
Heat to 00 ° C. Step 5-3) A sandblasting resist is applied to the uppermost part of the insulating layer, and a resist pattern is formed corresponding to the region where the insulating layer should be left by etching by sandblasting. Step 5-4) From the top of the sandblast resist layer,
The abrasive and air were blown simultaneously from the nozzle of the sandblasting machine, and the abrasive collided with the insulator layer in the area where the resist layer was not formed according to the pattern formed in the previous step, and was left after cutting. The region of the insulator layer forms a partition that partitions the image cell of the PDP device. Step 5-5) The sandblast resist layer is peeled off. Step 5-6) The structure in which the partition wall is formed of the insulating layer is fired.

In the step 5-2), the green tape made of the insulating composition of the present invention is laminated, and the structure having the insulating layer is heated to 300 ° C. to 400 ° C. Instead of removing at least a part of the organic substances contained in, the softening point of the amorphous glass contained in the insulator composition forming the green tape at a temperature equal to or lower than the firing temperature in step 5-6), for example, as described below. About 50 ° C from 453 ° C which is the softening point of the glass used in the example
Selectively adopting a step of heating at least a part of the amorphous glass [hereinafter referred to as step 5-2 ')] by heating the structure having the insulating layer formed at a temperature higher than a low temperature. You can also Whichever process is selected, not only the uniformity in the thickness direction of the partition walls is maintained in the formation of the resist pattern by etching using sandblast in the next process, but also the efficiency of the sandblast process can be improved, resulting in In addition, the partition walls can be formed efficiently and highly accurately regardless of the size of the structure formed from the insulating composition of the present invention.

For firing, a general firing furnace which is usually used in the field of thick film hybrid ICs can be used. Typical firing conditions are 40
Generally, the temperature is kept at about 0 to 650 ° C. for about 5 to 20 minutes. Used because the thermal characteristics of the amorphous glass and the refractory oxide in the insulator composition used to form the green tape are closely related to the firing temperature conditions, and good partition wall performance is obtained. It is desirable to determine firing conditions depending on the material. Therefore, depending on the firing conditions, part of the amorphous glass in the insulator composition may crystallize. The rate of temperature increase until reaching the peak temperature is 1 / min.
The temperature is preferably 0 to 50 ° C., but in the vicinity of the thermal decomposition temperature of the organic components present in the green tape, the rate of temperature rise is remarkably reduced to avoid rapid firing, and thereafter productivity and sinterability are re-established. It is more preferable to raise the temperature at a rate considering the above. This makes it possible to incinerate the organic substances in the green tape smoothly and more completely.

Step 6) The back plate constructed by the above steps is superposed on a predetermined position of the front plate on which one cathode is formed and assembled as a pair of glass substrates. Step 7) The periphery of the assembly in which the pair of glass substrates are arranged opposite to each other is sealed with a glass composition having a low melting point or the like, and is baked at a low temperature. Step 8) A discharge gas is filled in the cell hermetically sealed in the previous step 7) to form a gas discharge section.

A PDP device can be manufactured through the above steps 1) to 8). In the first partition wall forming method of the PDP device (see FIG. 1), a sandblasting resist is applied to the uppermost part of the green tape laminate, but instead of this resist, a photopolymer monomer and a photopolymerization start are used. The sandblasting mask pattern may be formed by using a patterning insulator layer (insulator paste or green tape) containing an agent and containing a relatively large amount of a resin component (see FIG. 2). The other steps are the same as those of the first partition wall forming method. In the second partition wall forming method, it is not necessary to peel off the sandblasting mask pattern, the process is further simplified as compared with the first method, and the work efficiency and mass production efficiency are improved.

[0038]

EXAMPLES The present invention will be described in more detail by way of examples. However, the scope of the present invention is not limited by the following examples.

1) Preparation of Insulator Composition An inorganic solid fine powder having the composition shown in the table below, a binder and a volatile non-aqueous organic solvent were ball milled to prepare an insulator composition.

[0040]

[Table 1]

In the above table, the glass frit has the following weight composition. ZnO 8.0% SiO ₂ 15.0% PbO ₂ 65.0% B ₂ O ₃ 12.0%

As the inorganic solid fine powder, a fine powder having the following specific surface area was used. Glass frit 3.5 m ² / g Alumina 1.2 m ² / g

2) Preparation of green tape Silicone-treated polyester film with a thickness of 3 mil (trade name: Mylar, EI du Pont de Nemours & Co.
Cast) so that the thickness of the insulating composition prepared in 1) above is about 15 mils when wet, and then dried at room temperature to evaporate 80 to 90% by weight of the organic solvent. Thickness 120
A green tape of μm was obtained.

3) Formation of partition wall Using the green tape prepared above, P described above is used.
The partitions were formed on the glass substrate according to the first and second partition forming methods of the DP device. General test method for JIS coating of insulating layer (coating film) obtained by stacking green tapes: JI
The results of the pencil scratch test according to S K5400 _-1979 and the partition wall shapes before and after firing obtained by sandblasting are shown below.

[0045]

[Table 2]

In the table, the values of the partition wall shapes are the first method and the second method.
It is an average value of the values measured by randomly selecting 20 points from the partition walls formed by the method.

A green tape formed from the insulating composition prepared according to Example 2 was used to form a structure consisting of an insulating layer in which green tapes were laminated by the partition wall forming method exactly the same as the above-mentioned step 5-2). Step 5 instead of
The results obtained by processing according to 2 ') are shown in Table 3.

[0048]

[Table 3]

[0049]

In the partition wall forming method of the PDP device of the present invention, by using the green tape of the present invention based on the insulating composition of the present invention, the uniformity of the partition wall in the thickness (height) direction is maintained. In addition, the work of each process is extremely simple and the work time is shortened, and the work efficiency and process control of sandblasting are improved. Therefore, by using the insulator composition or the green tape of the present invention or adopting the partition wall forming method, it is possible to improve the mass productivity while achieving the size increase and the definition increase of the PDP device. Become.

Although the formation of the barrier ribs of the plasma display device of the present invention has been mainly described, the composition of the insulating composition can be changed and used for forming an overcoat of the insulating layer of the plasma display device.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a step of a first partition wall forming method in a method for manufacturing a PDP device according to the present invention.

FIG. 2 is a diagram illustrating a step of a second partition wall forming method in the manufacturing method of the PDP device of the present invention.

FIG. 3 is a flowchart of a partition wall forming method in the method for manufacturing a PDP device of the present invention.

FIG. 4 is a diagram illustrating a general sandblast technique.

FIG. 5 is a diagram showing a main part of an internal structure of a PDP device.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location H01J 17/04 H01J 17/04

Claims (8)

[Claims] 1. A) The softening point is at least 5 above the firing temperature.
Inorganic solid fine powder consisting of 30 to 60% by volume of 0 ° C low amorphous glass and 70 to 40% by volume of refractory oxide, b) 40 to 60% by volume of polymeric substance and 60 to 4 of plasticizer.
A binder comprising 0% by volume and c) a volatile non-aqueous organic solvent, wherein the inorganic solid powder of a) is dispersed in a solution prepared by dissolving the binder of b) in the volatile non-aqueous organic solvent of c). A castable insulator composition for forming a green tape used for forming partition walls of a plasma display device. 2. A partition for forming a plasma display device, characterized in that the insulating composition according to claim 1 is cast on a flexible substrate and the volatile non-aqueous organic solvent is removed by heating. Green tape. 3. A pair of substrates, which are provided on a surface of at least one of the substrates and which are provided with a plurality of electrodes constituting a discharge light emitting display unit and are opposed to each other with a predetermined space therebetween, and partition walls which partition the discharge light emitting display unit. A method of manufacturing a plasma display device, comprising: a glass substrate and an electrode pattern layer of a conductor composition formed on a glass substrate; The green tape described in the above is laminated and heated to 300 to 400 ° C. to form an insulating layer from which a part of organic substances in the layer is removed, and b) a sandblasting resist on the insulating layer obtained in the step a). A layer is formed, and a resist pattern corresponding to the partition is formed in a region other than the region to be etched by sandblasting, and the insulator layer in the region where the resist pattern formed in step c) and b) is not formed is sandblasted. And removing the barrier ribs to form barrier ribs, and the barrier ribs formed by the insulating layer patterned in step d) and c) are baked after the sandblast resist layer is peeled off. Forming method. 4. A pair of substrates provided with a plurality of electrodes forming a discharge light emitting display section on at least one surface of the substrate and facing each other with a predetermined space therebetween, and a partition wall partitioning the discharge light emitting display section. A method of manufacturing a plasma display device, comprising: a glass substrate and an electrode pattern layer of a conductor composition formed on a glass substrate; The green tape described in the above is laminated and heated to 300 to 400 ° C. to form an insulating layer in which a part of organic substances in the layer is removed, and b) photocurable on the insulating layer obtained in the step The insulating paste or green tape layer of 1) is formed, and the sandblasting mask pattern corresponding to the partition wall is formed in a region other than the region to be etched by sandblasting. C) The sandblasting mask pattern formed in step b). Plasma which is characterized in that the insulating layer in the region not formed is removed by sandblasting to form a partition wall portion, and the partition wall formed by the insulating layer patterned in step d) and c) is fired. A method for forming partition walls of a display device. 5. The method according to claim 3, wherein the number of laminated green tapes is 2 to 3. 6. A pair of substrates, which are provided with a plurality of electrodes constituting a discharge light emitting display section on at least one substrate surface and are opposed to each other with a predetermined space therebetween, and partition walls which partition the discharge light emitting display section. A method of manufacturing a plasma display device, comprising: a glass substrate and an electrode pattern layer of a conductor composition formed on a glass substrate; Laminating the green tape described in claim 3 and heating it at a temperature not higher than the firing temperature of step d) of claim 3 and not lower than about 50 ° C. lower than the amorphous glass softening point contained in the green tape. Forming an insulator layer obtained by softening at least a part of the amorphous glass contained in the green tape, and b) forming a resist layer for sandblasting on the insulator layer obtained in step a) and performing sandblasting. A resist pattern corresponding to the partition is formed in a region other than the etching region, and the insulating layer in the region where the resist pattern formed in step c) and b) is not formed is removed by sandblasting to form the partition portion. ) A method of forming a partition wall of a plasma display device, which comprises firing the partition wall formed of the patterned insulating layer in step c) after peeling off the sandblast resist layer. 7. A pair of substrates, which are provided on a surface of at least one of the plurality of electrodes forming a discharge light emitting display portion and are opposed to each other with a predetermined space therebetween, and a partition for partitioning the discharge light emitting display portion. A method of manufacturing a plasma display device, comprising: a glass substrate and an electrode pattern layer of a conductor composition formed on a glass substrate; Laminating the green tape described in claim 4, and heating at a temperature not higher than the firing temperature of step d) of claim 4 and not less than about 50 ° C. lower than the amorphous glass softening point contained in the green tape. Forming an insulator layer by softening at least part of the amorphous glass contained in the green tape, and b) a photocurable insulator paste or a green tape layer on the insulator layer obtained in step a). To form A mask pattern for sandblasting corresponding to the partition wall is formed in a region other than the region to be etched by sandblasting, and the insulating layer in the region in which the sandblasting mask pattern formed in step c) and b) is not formed is removed by sandblasting. A method of forming a partition wall of a plasma display device, comprising forming a partition wall portion, and baking the partition wall formed by the insulating layer patterned in the steps d) and c). 8. The method according to claim 6, wherein the number of laminated green tapes is 2 to 3.