JPH08250629A - Heat exchanger - Google Patents

Heat exchanger

Info

Publication number
JPH08250629A
JPH08250629A JP5310895A JP5310895A JPH08250629A JP H08250629 A JPH08250629 A JP H08250629A JP 5310895 A JP5310895 A JP 5310895A JP 5310895 A JP5310895 A JP 5310895A JP H08250629 A JPH08250629 A JP H08250629A
Authority
JP
Japan
Prior art keywords
heat
heat exchanger
heat dissipation
mounting member
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5310895A
Other languages
Japanese (ja)
Inventor
Takahide Oohara
貴英 大原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP5310895A priority Critical patent/JPH08250629A/en
Publication of JPH08250629A publication Critical patent/JPH08250629A/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To improve cooling performance by increasing heat transfer efficiency. CONSTITUTION: A heat exchanger 1 is constituted of a fixing member 3 on which electronic components 2 are mounted, a plurality of plates 4 for heat dissipation which are fixed on the fixing member 3, corrugate fins 5 interposed between each of the plates 4 for heat dissipation, etc. The fixing member 3 is composed of aluminum excellent in thermal conductivity, and planar board members are used for both the surface 3a and the back 3b. The plates 4 for heat dissipation are composed of aluminum in the same manner as the fixing member 3. The one side end part 4a bent in L-shape is soldered on the back 3b of the fixing member 3, and fixed in the state that the end part 4a stands almost straight to the fixing member 3. The plates 4 for heat dissipation are arranged in the width direction of the fixing member 3 so as to keep constant intervals.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子部品等の発熱体を
冷却するための熱交換器に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat exchanger for cooling a heating element such as an electronic component.

【0002】[0002]

【従来の技術】従来技術として、意願平2−39656
号公報に開示された電子部品冷却器がある。この冷却器
は、パワートランジスタやIC等の電子部品を空気冷却
するもので、図9に示すように、波形のフィン100と
板状の介装プレート110とを上下方向に交互に積層
し、その最上部に配置された取付プレート120上に電
子部品130がビス140により固定されている。
2. Description of the Related Art As a conventional technique, Japanese Patent Application No.
There is an electronic component cooler disclosed in the publication. This cooler is for air-cooling electronic components such as power transistors and ICs. As shown in FIG. 9, corrugated fins 100 and plate-like interposition plates 110 are alternately laminated in the vertical direction, and The electronic component 130 is fixed by screws 140 on the mounting plate 120 arranged at the top.

【0003】[0003]

【発明が解決しようとする課題】ところが、上記の冷却
器は、電子部品130から発生した熱が取付プレート1
20を介して一段目のフィン100へ伝わり、さらに一
段目の介装プレート110、二段目のフィン100、二
段目の介装プレート110と順次伝わって最下段のフィ
ン100まで伝熱する。この様に熱の伝わり方がフィン
100と介装プレート110の積層方向(上から下へ)
であるため伝熱効率が悪く、冷却器全体では、電子部品
からの距離が遠くなる程、つまり下へいく程、冷却媒体
への放熱量が著しく減少する。従って、フィン100と
介装プレート110とを積層して伝熱面積を拡大して
も、冷却器の下段側では熱移動の起動力となる冷却媒体
との温度差が大きく取れないため、伝熱面積に見合った
冷却性能が得られないという問題がある。本発明は、上
記事情に基づいて成されたもので、その目的は、伝熱効
率を高めて冷却性能の向上を図った熱交換器の提供にあ
る。
However, in the above-mentioned cooler, the heat generated from the electronic component 130 causes the mounting plate 1 to move.
The heat is transferred to the fin 100 of the first stage through the heat transfer plate 20, and then to the fin 100 of the lowermost stage by being sequentially transferred to the interposition plate 110 of the first stage, the fin 100 of the second stage, and the interposition plate 110 of the second stage. In this way, heat is transferred in the stacking direction of the fin 100 and the interposed plate 110 (from top to bottom).
Therefore, the heat transfer efficiency is low, and as the distance from the electronic component increases, that is, as the distance from the electronic component decreases, the amount of heat radiated to the cooling medium significantly decreases in the entire cooler. Therefore, even if the heat transfer area is expanded by stacking the fins 100 and the interposition plate 110, the temperature difference between the fin and the cooling medium, which is the starting force for heat transfer, cannot be made large on the lower side of the cooler, so that the heat transfer is reduced. There is a problem that the cooling performance commensurate with the area cannot be obtained. The present invention has been made based on the above circumstances, and an object of the present invention is to provide a heat exchanger with improved heat transfer efficiency and improved cooling performance.

【0004】[0004]

【課題を解決するための手段】本発明は、上記目的を達
成するために、以下の構成を採用した。請求項1では、
通電を受けて発熱する発熱体が固定されて、その発熱体
の熱を冷却媒体に放出して前記発熱体を冷却する熱交換
器であって、表面に前記発熱体が熱的に密着した状態で
取り付けられる取付部材と、この取付部材の裏面に対し
て略直立した状態で、一定の間隔を保って並設された複
数の平板状を成す放熱用プレートとを備え、この放熱用
プレートは、前記取付部材との接合端部に平坦な接合面
を有し、この接合面で前記取付部材の裏面に接合されて
いることを特徴とする。
The present invention has the following features to attain the object mentioned above. In claim 1,
A heat exchanger in which a heating element that generates heat upon receiving electricity is fixed, and the heat of the heating element is released to a cooling medium to cool the heating element, in which the heating element is in thermal contact with the surface. In the state of being substantially upright with respect to the back surface of the mounting member, a plurality of flat plate-shaped heat radiating plates arranged side by side at a constant interval, the heat radiating plate, It is characterized in that it has a flat joint surface at a joint end portion with the mounting member, and is joined to the back surface of the mounting member at this joint surface.

【0005】請求項2では、請求項1に記載した熱交換
器において、一定の間隔を保って隣合う前記放熱用プレ
ート同士の間にフィンが介在されていることを特徴とす
る。
According to a second aspect of the present invention, the heat exchanger according to the first aspect is characterized in that fins are interposed between the heat radiation plates adjacent to each other with a constant space.

【0006】請求項3では、請求項1または2に記載し
た熱交換器において、前記放熱用プレートは、前記接合
端部が隣接する前記放熱用プレートとの間隔を保つスペ
ーサとして機能していることを特徴とする。
According to a third aspect of the present invention, in the heat exchanger according to the first or second aspect, the heat radiating plate functions as a spacer for keeping a distance between the joint end and the heat radiating plate adjacent to each other. Is characterized by.

【0007】請求項4では、請求項1〜3に記載した何
れかの熱交換器において、前記取付部材は、前記放熱用
プレートの両端側にそれぞれ配置されていることを特徴
とする。
According to a fourth aspect of the present invention, in the heat exchanger according to any one of the first to third aspects, the mounting members are arranged on both end sides of the heat radiation plate, respectively.

【0008】[0008]

【作用および発明の効果】[Operation and effect of the invention]

(請求項1)発熱体から発生する熱は、取付部材へ伝わ
った後、この取付部材に接合された複数の放熱用プレー
トを介して冷却媒体へ放熱される。ここで、放熱用プレ
ートは、従来のフィン材と比較して断面積が大きく熱抵
抗が小さいことから、取付部材から各放熱用プレートに
伝わった熱が、放熱用プレートの端部まで速やかに伝導
する。その結果、放熱用プレート全体で冷却媒体との温
度差を大きく取ることができるため、伝熱効率が良く、
冷却性能の向上を図ることができる。また、放熱用プレ
ートは、接合端部の平坦な接合面で取付部材に接合され
ている。従って、取付部材に対して放熱用プレートの数
を適宜増減することができるため、所要の放熱性能(冷
却性能)に応じて容易に熱交換器の大きさを変更して対
応することができる。
(Claim 1) The heat generated from the heating element is transmitted to the mounting member and then radiated to the cooling medium via the plurality of heat radiation plates joined to the mounting member. Here, since the heat dissipation plate has a larger cross-sectional area and smaller thermal resistance than the conventional fin material, the heat transferred from the mounting member to each heat dissipation plate is quickly conducted to the end of the heat dissipation plate. To do. As a result, the temperature difference between the heat dissipation plate and the cooling medium can be made large, resulting in good heat transfer efficiency.
The cooling performance can be improved. Further, the heat dissipation plate is joined to the attachment member at the flat joint surface at the joint end. Therefore, since the number of heat radiation plates can be appropriately increased or decreased with respect to the mounting member, it is possible to easily change the size of the heat exchanger according to the required heat radiation performance (cooling performance).

【0009】(請求項2)隣合う放熱用プレートの間に
フィンを介在させることにより放熱面積が拡大して放熱
性能が向上する。この場合、取付部材から放熱用プレー
トに伝わった熱が速やかに放熱用プレートの端部まで伝
導するため、フィンの放熱用プレートとの接合部を速や
かに高温にする。そのため、フィン全体で冷却媒体との
温度差を大きく取ることができる。即ち、熱交換器全体
として優れた伝熱効率が得られるため、フィンの放熱面
積拡大に相応した放熱性能の向上効果を期待できる。
(Claim 2) By arranging the fins between the adjacent heat radiation plates, the heat radiation area is expanded and the heat radiation performance is improved. In this case, the heat transferred from the mounting member to the heat dissipation plate is quickly conducted to the end portion of the heat dissipation plate, so that the joint portion of the fin with the heat dissipation plate is quickly heated to a high temperature. Therefore, a large temperature difference between the fin and the cooling medium can be secured. That is, since excellent heat transfer efficiency is obtained in the heat exchanger as a whole, it is possible to expect an effect of improving the heat dissipation performance corresponding to the expansion of the heat dissipation area of the fin.

【0010】(請求項3)放熱用プレートの接合端部
が、隣接する放熱用プレートとの間隔を保つスペーサと
して機能することにより、取付部材に対して各放熱用プ
レートの間隔を適正に保つことができる。
According to a third aspect of the present invention, the joint end portion of the heat radiating plate functions as a spacer for keeping the distance between the heat radiating plate and the adjacent heat radiating plate, so that the distance between the heat radiating plates is properly maintained with respect to the mounting member. You can

【0011】(請求項4)取付部材を放熱用プレートの
両端側に配置することにより、当然の如く、それぞれの
取付部材に発熱体を取り付けて冷却することができる。
(Claim 4) By arranging the mounting members on both ends of the heat dissipation plate, as a matter of course, the heating elements can be mounted on the respective mounting members for cooling.

【0012】[0012]

【実施例】次に、本発明の熱交換器の実施例を図面に基
づいて説明する。 (第1実施例)図1は電子部品を取り付けた熱交換器の
正面図である。本実施例の熱交換器1は、例えばパワー
トランジスタやIC等の電子部品2を空気冷却するもの
で、電子部品2が固定される取付部材3と、この取付部
材3に接合される複数の放熱用プレート4、および隣接
する放熱用プレート4間に介在されるコルゲートフィン
5等より構成されている。
Embodiments of the heat exchanger of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1 is a front view of a heat exchanger to which electronic parts are attached. The heat exchanger 1 of the present embodiment is for cooling an electronic component 2 such as a power transistor or an IC with air, and a mounting member 3 to which the electronic component 2 is fixed, and a plurality of heat dissipation members joined to the mounting member 3. The plate 4 and the corrugated fins 5 and the like interposed between the adjacent plates 4 for heat dissipation.

【0013】取付部材3は、熱伝導性に優れる材質、例
えばアルミニウム製で、表面3aおよび裏面3bともに
平坦な平板形状に設けられている。電子部品2は、発生
した熱を放出する放熱板2aを有し、この放熱板2aが
熱伝導性グリス(図示しない)等を介して取付部材3の
表面3aに密着して取り付けられ、ボルト6によって取
付部材3に固定されている。
The mounting member 3 is made of a material having excellent thermal conductivity, for example, aluminum, and is provided in a flat plate shape having a front surface 3a and a back surface 3b. The electronic component 2 has a heat radiating plate 2a that radiates the generated heat, and the heat radiating plate 2a is attached in close contact with the surface 3a of the attaching member 3 via a heat conductive grease (not shown) or the like, and the bolt 6 It is fixed to the mounting member 3 by.

【0014】放熱用プレート4は、両面にろう材がクラ
ッドされたアルミニウム製のクラッド材(板厚:2mm程
度)より成り、その両端部4a、4bがL字形状に折り
曲げられている。この放熱用プレート4は、L字形状に
折り曲げられた一方の端部4a(本発明の接合端部)が
取付部材3の裏面3bにろう付けされて、取付部材3に
対して略直立した状態で固定され、取付部材3の幅方向
(図1の左右方向)に一定の間隔を保って複数配置され
ている。
The heat radiating plate 4 is made of an aluminum clad material (plate thickness: about 2 mm) whose both surfaces are clad with a brazing material, and both ends 4a and 4b thereof are bent into an L shape. The heat radiating plate 4 is in an upright state with respect to the mounting member 3 by brazing one end 4a (joint end of the present invention) bent into an L shape to the back surface 3b of the mounting member 3. And a plurality of mounting members 3 are arranged at regular intervals in the width direction of the mounting member 3 (left and right direction in FIG. 1).

【0015】コルゲートフィン5は、細長いアルミニウ
ム製の薄板(板厚:0.08mm程度)を交互に折り返し
て波形状としたもので、隣合う放熱用プレート4間に介
在されて、各折り返し部が放熱用プレート4の表面にろ
う付けされている。この熱交換器1は、取付部材3に対
して各放熱用プレート4と各コルゲートフィン5とを交
互に積層した状態で配置し、治具(図示しない)により
全体を位置決めして、炉中にて一体ろう付けされる。こ
れにより、放熱用プレート4は、一方の端部4aが、そ
の平坦面で取付部材3の裏面3bに接合されるととも
に、各コルゲートフィン5が折り返し部で放熱用プレー
ト4の表面に接合される。
The corrugated fins 5 are thin aluminum plates (thickness: about 0.08 mm) which are alternately folded back to have a corrugated shape. It is brazed to the surface of the heat dissipation plate 4. This heat exchanger 1 is arranged in a state in which the heat radiating plates 4 and the corrugated fins 5 are alternately stacked on the mounting member 3, and the whole is positioned by a jig (not shown) to be placed in the furnace. Are brazed together. As a result, one end 4a of the heat dissipation plate 4 is joined to the back surface 3b of the mounting member 3 at its flat surface, and each corrugated fin 5 is joined to the front surface of the heat dissipation plate 4 at the folded portion. .

【0016】次に、本実施例の熱交換器1の作用および
効果を説明する。電子部品2で発生した熱は、放熱板2
aから取付部材3を介して各放熱用プレート4へ伝わ
り、さらに各コルゲートフィン5へ伝導する。ここで、
取付部材3から放熱用プレート4に伝導した熱は、放熱
用プレート4が従来の熱交換器に使用されるフィン材と
比べて断面積が大きく熱抵抗が小さいことから、放熱用
プレート4の他方の端部4bまで速やかに伝導する。即
ち、放熱用プレート4では、取付部材3に接合される一
方の端部4aに対して他方の端部4bの温度低下が小さ
いため、熱交換器1に送風される空気との温度差を熱交
換器の全面積において大きく取ることができる。つま
り、放熱用プレート4に接合されたコルゲートフィン5
全体にも効率良く伝熱されるため、コルゲートフィン5
によって放熱面積を拡大した効果と相まって優れた伝熱
効率を発揮することができ、コルゲートフィン5の放熱
面積拡大に相応した放熱性能の向上効果が得られる。
Next, the operation and effect of the heat exchanger 1 of this embodiment will be described. The heat generated by the electronic component 2 is generated by the heat sink 2
It is transmitted from a through the mounting member 3 to each heat dissipation plate 4, and further to each corrugated fin 5. here,
The heat conducted from the mounting member 3 to the heat radiating plate 4 has a larger cross-sectional area and a smaller thermal resistance than the fin material used in the conventional heat exchanger. Conducts rapidly to the end 4b of the. That is, in the heat radiating plate 4, the temperature difference between the one end 4a joined to the mounting member 3 and the other end 4b is small, so that the temperature difference from the air blown to the heat exchanger 1 is reduced. It can be made large in the entire area of the exchanger. That is, the corrugated fins 5 joined to the heat dissipation plate 4
Since heat is efficiently transferred to the whole, corrugated fins 5
Thus, excellent heat transfer efficiency can be exhibited in combination with the effect of expanding the heat dissipation area, and the effect of improving heat dissipation performance corresponding to the expansion of the heat dissipation area of the corrugated fins 5 can be obtained.

【0017】また、本実施例では、L字形状に折り曲げ
られた放熱用プレート4の両端部4a、4bを隣接する
放熱用プレート4に接合することにより、各放熱用プレ
ート4全体で通風ダクトを構成することができる。この
時、L字形状に折り曲げられた両端部4a、4bが隣接
する放熱用プレート4との間隔を一定に保つスペーサと
しても機能するため、ろう付け工程において積層方向
(図1の左右方向)の圧縮量を決める治具の役目を果た
すことができ、良好なろう付け性が得られる。
Further, in this embodiment, by connecting both end portions 4a and 4b of the heat dissipation plate 4 bent in an L shape to the adjacent heat dissipation plate 4, the air dissipation ducts are formed as a whole in each heat dissipation plate 4. Can be configured. At this time, since both ends 4a and 4b bent into an L shape also function as spacers for keeping a constant distance from the adjacent heat dissipation plate 4, in the brazing process, the stacking direction (horizontal direction in FIG. 1) is increased. It can serve as a jig for determining the amount of compression, and good brazing properties can be obtained.

【0018】(第2実施例)図2は第2実施例を示す熱
交換器1の正面図である。本実施例の熱交換器1は、放
熱用プレート4に押し出し材を用いたもので、取付部材
3との接合部(一方の端部4a)が略T字形状(他方の
端部4bも同一形状)に設けられている。また、放熱用
プレート4に押し出し材を使用するため、取付部材3お
よびコルゲートフィン5を共にクラッド材としている。
(Second Embodiment) FIG. 2 is a front view of a heat exchanger 1 showing a second embodiment. The heat exchanger 1 of the present embodiment uses an extruded material for the heat dissipation plate 4, and the joint portion (one end portion 4a) with the mounting member 3 is substantially T-shaped (the other end portion 4b is also the same. Shape). Further, since the extruded material is used for the heat dissipation plate 4, both the mounting member 3 and the corrugated fin 5 are clad materials.

【0019】(第3実施例)図3は第3実施例を示す熱
交換器1の正面図である。本実施例の熱交換器1は、取
付部材3を放熱用プレート4の他方の端部4b側にも配
置して、その取付部材3が各放熱用プレート4の他方の
端部4bと接合されている。この場合、両方の取付部材
3に電子部品2を固定して冷却することができる。
(Third Embodiment) FIG. 3 is a front view of a heat exchanger 1 showing a third embodiment. In the heat exchanger 1 of this embodiment, the mounting member 3 is also arranged on the other end 4b side of the heat dissipation plate 4, and the mounting member 3 is joined to the other end 4b of each heat dissipation plate 4. ing. In this case, the electronic component 2 can be fixed to both the mounting members 3 and cooled.

【0020】(第4実施例)図4は第4実施例を示す熱
交換器1の正面図である。本実施例の熱交換器1は、隣
合う放熱用プレート4間にスパイラル状のフィン7を介
在させたものである。即ち、フィンの形状は第1実施例
に示したコルゲートフィン5に特定するものではない。
(Fourth Embodiment) FIG. 4 is a front view of a heat exchanger 1 showing a fourth embodiment. The heat exchanger 1 of this embodiment has a spiral fin 7 interposed between adjacent heat dissipation plates 4. That is, the shape of the fin is not limited to the corrugated fin 5 shown in the first embodiment.

【0021】(第5実施例)図5は第5実施例を示す熱
交換器1の正面図である。本実施例の熱交換器1は、隣
合う放熱用プレート4間にフィンを有していない構成で
ある。取付部材3に固定される電子部品2の発熱量が小
さい時には、本実施例のように、フィンを不要とするこ
ともできる。
(Fifth Embodiment) FIG. 5 is a front view of a heat exchanger 1 showing a fifth embodiment. The heat exchanger 1 according to the present embodiment has no fin between adjacent heat dissipation plates 4. When the amount of heat generated by the electronic component 2 fixed to the mounting member 3 is small, it is possible to eliminate the need for fins as in this embodiment.

【0022】(第6実施例)図6は第6実施例を示す熱
交換器1の側面図、図7は図6のA−A断面図である。
本実施例の熱交換器1は、冷却媒体として液体を用いる
もので、隣合う各放熱用プレート4間に流体通路8(図
7参照)を形成して、その流体通路8の両端部に各流体
通路8と連絡する一対のタンク9を配置し、各タンク9
に各々液体を流通させるパイプ10を取り付けている。
この様に、熱交換器本体にタンク9とパイプ10を付加
することにより、冷却媒体として液体を使用する場合に
も容易に適用できる。
(Sixth Embodiment) FIG. 6 is a side view of a heat exchanger 1 showing a sixth embodiment, and FIG. 7 is a sectional view taken along line AA of FIG.
The heat exchanger 1 of the present embodiment uses a liquid as a cooling medium, and a fluid passage 8 (see FIG. 7) is formed between adjacent heat dissipation plates 4, and the fluid passage 8 is provided at both ends thereof. A pair of tanks 9 that communicate with the fluid passages 8 are arranged, and each tank 9
A pipe 10 for circulating a liquid is attached to each.
In this way, by adding the tank 9 and the pipe 10 to the heat exchanger main body, it can be easily applied even when using a liquid as the cooling medium.

【0023】(第7実施例)図8は第7実施例を示す熱
交換器1の斜視図である。本実施例の熱交換器1は、取
付部材3に対して放熱用プレート4の長さを延長し、そ
の延長部分で通風ダクト11を一体に構成したものであ
る。即ち、第1実施例で説明したように、各放熱用プレ
ート4の両端部4a、4bを隣接する放熱用プレート4
に接合した状態で取付部材3から延長することにより、
各放熱用プレート4全体で通風ダクト11を構成するこ
とができる。
(Seventh Embodiment) FIG. 8 is a perspective view of a heat exchanger 1 showing a seventh embodiment. In the heat exchanger 1 of this embodiment, the length of the heat radiating plate 4 is extended with respect to the mounting member 3, and the ventilation duct 11 is integrally configured at the extended portion. That is, as described in the first embodiment, both ends 4a and 4b of each heat dissipation plate 4 are adjacent to each other.
By extending from the mounting member 3 in the state of being joined to
The ventilation duct 11 can be formed by the entire heat dissipation plate 4.

【0024】〔変形例〕上記実施例では、取付部材3、
放熱用プレート4、およびコルゲートフィン5の材料と
してアルミニウム材を使用したが、銅材を用いても良
い。例えば、図1に示した例では、放熱用プレート4に
半田めっきされた銅材を使用し、取付部材3とコルゲー
トフィン5は共に銅材のみを使用することができる。ま
た、図2に示した例では、放熱用プレート4に銅材を使
用して、取付部材3とコルゲートフィン5は共に半田め
っきされた銅材を使用することができる。
[Modification] In the above embodiment, the mounting member 3,
Although an aluminum material is used as the material for the heat dissipation plate 4 and the corrugated fins 5, a copper material may be used. For example, in the example shown in FIG. 1, the heat dissipation plate 4 may be made of solder-plated copper material, and the mounting member 3 and the corrugated fins 5 may be made of only copper material. Further, in the example shown in FIG. 2, a copper material can be used for the heat dissipation plate 4, and the mounting member 3 and the corrugated fins 5 can both be solder-plated copper material.

【図面の簡単な説明】[Brief description of drawings]

【図1】電子部品を取り付けた熱交換器の正面図である
(第1実施例)。
FIG. 1 is a front view of a heat exchanger fitted with electronic components (first embodiment).

【図2】熱交換器の正面図である(第2実施例)。FIG. 2 is a front view of a heat exchanger (second embodiment).

【図3】電子部品を取り付けた熱交換器の正面図である
(第3実施例)。
FIG. 3 is a front view of a heat exchanger fitted with electronic components (third embodiment).

【図4】熱交換器の正面図である(第4実施例)。FIG. 4 is a front view of a heat exchanger (fourth embodiment).

【図5】熱交換器の正面図である(第5実施例)。FIG. 5 is a front view of a heat exchanger (fifth embodiment).

【図6】熱交換器の側面図である(第6実施例)。FIG. 6 is a side view of a heat exchanger (sixth embodiment).

【図7】図6のA−A断面図である(第6実施例)。FIG. 7 is a sectional view taken along line AA of FIG. 6 (sixth embodiment).

【図8】熱交換器の斜視図である(第7実施例)。FIG. 8 is a perspective view of a heat exchanger (seventh embodiment).

【図9】従来技術を示す熱交換器の正面図である。FIG. 9 is a front view of a heat exchanger showing a conventional technique.

【符号の説明】[Explanation of symbols]

1 熱交換器 2 電子部品(発熱体) 3 取付部材 3a 取付部材の表面 3b 取付部材の裏面 4 放熱用プレート 4a 一方の端部(接合端部) 5 コルゲートフィン(フィン) 7 スパイラル状のフィン(フィン) DESCRIPTION OF SYMBOLS 1 heat exchanger 2 electronic component (heating element) 3 mounting member 3a front surface of mounting member 3b back surface of mounting member 4 heat dissipation plate 4a one end (joint end) 5 corrugated fin (fin) 7 spiral fin ( fin)

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】通電を受けて発熱する発熱体が固定され
て、その発熱体の熱を冷却媒体に放出して前記発熱体を
冷却する熱交換器であって、 表面に前記発熱体が熱的に密着した状態で取り付けられ
る取付部材と、 この取付部材の裏面に対して略直立した状態で、一定の
間隔を保って並設された複数の平板状を成す放熱用プレ
ートとを備え、 この放熱用プレートは、前記取付部材との接合端部に平
坦な接合面を有し、この接合面で前記取付部材の裏面に
接合されていることを特徴とする熱交換器。
1. A heat exchanger in which a heating element that generates heat upon receiving electricity is fixed, and the heat of the heating element is released to a cooling medium to cool the heating element. A mounting member that is mounted in close contact with each other, and a plurality of flat plate-shaped heat-dissipating plates that are juxtaposed at a constant interval in a substantially upright state with respect to the back surface of the mounting member. The heat radiating plate has a flat joint surface at a joint end portion with the mounting member, and is joined to the back surface of the mounting member at this joint surface.
【請求項2】請求項1に記載した熱交換器において、 一定の間隔を保って隣合う前記放熱用プレート同士の間
にフィンが介在されていることを特徴とする熱交換器。
2. The heat exchanger according to claim 1, wherein fins are interposed between the adjacent heat radiation plates with a constant space therebetween.
【請求項3】請求項1または2に記載した熱交換器にお
いて、 前記放熱用プレートは、前記接合端部が隣接する前記放
熱用プレートとの間隔を保つスペーサとして機能してい
ることを特徴とする熱交換器。
3. The heat exchanger according to claim 1, wherein the heat dissipation plate functions as a spacer that keeps a distance between the joint end portion and the adjacent heat dissipation plate. Heat exchanger to.
【請求項4】請求項1〜3に記載した何れかの熱交換器
において、 前記取付部材は、前記放熱用プレートの両端側にそれぞ
れ配置されていることを特徴とする熱交換器。
4. The heat exchanger according to claim 1, wherein the mounting members are arranged on both ends of the heat radiation plate.
JP5310895A 1995-03-14 1995-03-14 Heat exchanger Pending JPH08250629A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5310895A JPH08250629A (en) 1995-03-14 1995-03-14 Heat exchanger

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5310895A JPH08250629A (en) 1995-03-14 1995-03-14 Heat exchanger

Publications (1)

Publication Number Publication Date
JPH08250629A true JPH08250629A (en) 1996-09-27

Family

ID=12933607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5310895A Pending JPH08250629A (en) 1995-03-14 1995-03-14 Heat exchanger

Country Status (1)

Country Link
JP (1) JPH08250629A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19806978A1 (en) * 1998-02-19 1999-08-26 Behr Gmbh & Co Convection cooled heat sink for electronic components
DE19911204B4 (en) * 1999-03-13 2008-09-11 Behr Gmbh & Co. Kg Arrangement for cooling electronic components
JP2011071386A (en) * 2009-09-28 2011-04-07 Furukawa Electric Co Ltd:The Cooling apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19806978A1 (en) * 1998-02-19 1999-08-26 Behr Gmbh & Co Convection cooled heat sink for electronic components
DE19806978B4 (en) * 1998-02-19 2008-08-21 Behr Gmbh & Co. Kg Cooling device for cooling by convection
DE19911204B4 (en) * 1999-03-13 2008-09-11 Behr Gmbh & Co. Kg Arrangement for cooling electronic components
JP2011071386A (en) * 2009-09-28 2011-04-07 Furukawa Electric Co Ltd:The Cooling apparatus

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