JP3496695B2 - Boiling cooling device and manufacturing method thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a boiling cooling device for cooling a heating element such as an IGBT module.

[0002]

2. Description of the Related Art Conventionally, by utilizing the thermosiphon effect, I
A boiling cooling device for cooling a heating element such as a GBT module has been proposed. This evaporative cooling device includes a refrigerant tank that contains a refrigerant for cooling the heating element, and a radiator that is installed above the refrigerant tank, and the refrigerant vapor that has boiled to vaporize by absorbing the heat of the heating element. The heat generator is cooled by being cooled by the radiator and radiating heat to the atmosphere.

[0003]

However, in the above boiling cooling device, the number of heating elements attached to the refrigerant tank,
Or, if the heating element mounting pitches are different, if the refrigerant tank corresponding to the number of heating elements or the mounting pitch of the heating elements is composed of press-molded products, the number of heating elements or the mounting pitch of the heating elements can be adjusted for each minority. It is necessary to design a new press die. Therefore, there is a problem that the cost for the press die is significantly increased and the manufacturing cost of the refrigerant tank is increased.

The present invention has been made in view of the above circumstances, and its purpose is to determine the number of heating elements to be installed in a refrigerant tank,
Or, when the mounting pitch of the heating elements is different, it is possible to provide a method of manufacturing a boiling cooling device and a boiling cooling device thereof, which can manufacture a refrigerant tank capable of coping with a change in the number of heating elements or a mounting pitch of the heating elements at low cost. It is in.

[0005]

The present invention has the following features to attain the object mentioned above. In claim 1,
A heating element is attached to the outer wall surface by a fastening member, and a refrigerant tank containing a refrigerant that boils when receiving heat from the heating element inside is provided in communication with this refrigerant tank and boiled in the refrigerant tank. With a radiator for cooling and liquefying the vapor phase refrigerant,
The refrigerant tank is formed by bonding two thin members to each other at their joints. The thin member is formed into a predetermined shape and then the fastening member is fitted to the mounting position of the heating element. Is characterized in that a mounting hole or a screw hole is formed.

According to claim 2, the manufacturing according to claim 1
A cooling apparatus manufactured by the method, characterized in that between the two opposing said thin member, mounting member for receiving the tightening force of the fastening member in a position corresponding to the attachment hole is interposed And

According to a third aspect of the present invention, in the boiling cooling apparatus according to the second aspect, the attachment member is provided with a through hole through which the fastening member passes, and the fastening member is provided from one side of the refrigerant tank. It is characterized by comprising a bolt arranged on the other side through the through hole and a nut screwed to the bolt on the other side of the refrigerant tank.

According to a fourth aspect of the present invention, in the boiling cooling apparatus according to the second aspect, the fastening member is a screw member having an external thread formed on an outer periphery thereof, and the attachment member has a female thread for receiving the external thread of the fastening member. Is formed.

According to a fifth aspect, in the boiling cooling apparatus according to the fourth aspect, the female screw formed on the mounting member is
It is characterized in that the mounting member is individually formed from both end surface sides.

According to a sixth aspect, in the boiling cooling device according to any one of the second to fifth aspects, the fitting member is provided with a fitting portion that fits into the fitting hole. It is characterized by

According to claim 7, the manufacturing according to claim 1.
A boiling cooling device manufactured by a method , wherein the refrigerant tank is provided with a refrigerant chamber for containing a refrigerant and a fastening space for forming the screw hole, and the refrigerant chamber and the fastening space. And are airtightly divided.

According to an eighth aspect of the present invention, in the boiling cooling apparatus according to the seventh aspect, the fastening space includes a hollow mounting member provided by a member different from the thin member, and the mounting member has the screw hole. It is characterized in that it is arranged in the refrigerant tank in accordance with the position where the refrigerant is formed.

According to a ninth aspect of the present invention, there is provided a boiling cooling device for cooling a heating element, which is formed by laminating two thin members facing each other, and accommodates a refrigerant which receives the heat of the heating element and boils therein. A cooling medium tank and a radiator provided in communication with the cooling medium tank for cooling and liquefying the vapor phase cooling medium that has been boiled in the cooling medium tank are provided, and the cooling medium tank is provided corresponding to the plurality of heating elements. A plurality of coolant chambers, and a fastening region formed between adjacent coolant chambers so as to be recessed, wherein the heating element is attached to a mounting member arranged in the fastening region. To do.

According to a tenth aspect of the present invention, in the boiling cooling apparatus according to the ninth aspect, the mounting member is provided on a flat plate material that is disposed in close contact with the surface of the refrigerant tank, and on the back surface of the flat plate material in the fastening region. The heating element is arranged in close contact with the surface of the flat plate material on the refrigerant chamber, and is mounted by fixing a fastening member to a screw hole formed in the mounting plate. It is characterized by being.

According to an eleventh aspect, in the boiling cooling apparatus according to the ninth aspect, the mounting member is a spacer interposed between the thin member and the mounting portion of the heating element that abut each other in the fastening region. And the heating element is fastened and fixed to the spacer by a fastening member.

[0016]

[Operation and effect of the invention]

(Claim 1) The thin member that forms the refrigerant tank is formed into a predetermined shape, and then a mounting hole or a screw hole for the fastening member is formed in accordance with the mounting position of the heating element. Therefore, even if the number or the mounting pitch of the heating elements attached to the refrigerant tank is different, after the thin-walled member is press-molded using the same press die, mounting holes or screw holes are formed according to the mounting pitch of each heating element. Should be formed. Therefore, it is not necessary to newly design a press die according to the number of heating elements or the mounting pitch, and the refrigerant tank can be manufactured at low cost.

(Claim 2) By interposing the mounting member which receives the tightening force of the fastening member between the two thin members, it is possible to prevent the thin member from being deformed by the tightening force of the fastening member. Further, since the mounting member can be freely arranged according to the mounting position of the heating element, the heating element can be effectively mounted when the number of heating elements or the mounting pitch is different.

(Claim 3) By providing a through hole in the mounting member, general bolts and nuts can be used as the fastening member.

(Claim 4) By forming a female screw in the mounting member, a screw member such as a bolt or a screw can be used as the fastening member.

(Claim 5) When the female screw is formed on the mounting member as described in claim 4, the heating element is mounted on both sides of the refrigerant tank by individually forming the female screw from both end surfaces of the mounting member. Even in this case, the attachment work can be performed only on one side of the refrigerant tank. That is, it is possible to say that the workability is good because it is not necessary to put hands on both sides of the refrigerant tank as in the case of using the bolt and the nut.

[0021] end surface of (claim 6) the mounting member, by providing the fitting portion fitted in a mounting hole formed in the thin member, is possible to position the attachment portion <br/> material for thin member it can. In this case, the fitting portions may be provided on both surfaces of the attachment member, or the fitting portion may be provided on only one surface to sufficiently perform the positioning function.

(Claim 7) By providing the fastening space partitioned from the refrigerant chamber, the refrigerant chamber is not affected even if the mounting pitch of the heating element is deviated within the fastening space. It is possible to attach different heating elements. The fastening space can be formed by bonding together two thin-walled members press-molded together with the refrigerant chamber at the joint portion.

(Claim 8) The fastening space described in claim 7 can be configured as a hollow mounting member formed of a member different from the press-molded thin member. Specifically, it can be realized by arranging and fixing (for example, brazing) the mounting member in the refrigerant tank in accordance with the position where the screw hole is formed. Incidentally, the hollow mounting member, for example,
A tube having a flat cross section can be used.

(Claim 9) Since the heating element can be attached to the attachment member arranged in the fastening region, it is not necessary to form the attachment hole or the screw hole in the molding plate. Even if they are different, the refrigerant tank can be formed by using a thin member press-molded by the same press die.

(Claim 10) As a concrete example of the mounting member according to claim 9, a flat plate material that is arranged in close contact with the surface of the refrigerant tank and a mounting plate that is mounted on the back surface of the flat plate material in the fastening region. Boards and can be used. A screw hole is formed in the mounting plate in accordance with the mounting pitch of the heating element, and a hole through which the fastening member is inserted is formed in the flat plate member at the same position as the screw hole. Thus, the heating element arranged in close contact with the surface of the flat plate material can be attached by fastening and fastening the fastening member (for example, bolt) to the screw hole formed in the attachment plate in the fastening region.

(Claim 11) As another example of the mounting member described in claim 9, a spacer interposed between the thin member and the mounting portion of the heating element can be used. In this case, the two thin members forming the fastening region need to be in contact with each other so as not to be deformed by the tightening force applied to the spacer. Thereby, the fastening force of the fastening member that fixes the heating element can be received by the spacer.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of the boiling cooling apparatus of the present invention will be described with reference to the drawings. (First Embodiment) FIG. 1 is a front view of a boiling cooling device 1, and FIG. 2 is a side view of the boiling cooling device 1. The boiling cooling device 1 of the present embodiment is a cooling device for an IGBT module 2 (heating element of the present invention) that constitutes an inverter circuit (not shown) of an electric vehicle or a general power control device, and has a fluorocarbon-based refrigerant ( 3) (see FIG. 3), a radiator 4 mounted on the upper portion of the refrigerant tank 3, and a cooling fan 5 for blowing air to the radiator 4.

The coolant tank 3 has a substantially rectangular planar shape 2
It is composed of one molding plate 6 (see FIG. 3 / thin member of the present invention), and the two molding plates 6 are joined at their peripheral portions (excluding the upper end) to form a flat bag shape (thickness width t: about 12m
m) is formed. The inside of the refrigerant tank 3 is formed as a refrigerant chamber 7 (see FIG. 3) that contains the refrigerant, but the inside of the refrigerant tank 3 may be divided to form a plurality of refrigerant chambers 7, or it may be divided. Alternatively, the whole may be formed as one refrigerant chamber 7.

The upper end of the refrigerant tank 3 is opened as a connection port with the radiator 4. The forming plate 6 is a thin metal plate having good thermal conductivity, for example, an aluminum plate (plate thickness of about 1.6 m.
m) is press-molded and has a mounting area for mounting a plurality of IGBT modules 2, and a plurality of mounting holes 6a (see FIG. 3) are formed on the surface in accordance with the mounting positions of the IGBT modules 2. Has been. However, the mounting holes 6a are not opened at the same time during press molding, but are opened according to the number of IGBT modules 2 (six in this embodiment) actually mounted after press molding and the mounting pitch. There is.

Inside the coolant tank 3, spacers 8 are provided at the same positions as the mounting holes 6a formed in the molding plate 6.
(The mounting member of the present invention) is arranged. As shown in FIG. 3 (A-A cross-sectional view of FIG. 1), the spacer 8 is provided with a circular fitting portion 8a that is raised by the thickness of the molding plate 6 at the center of both end surfaces, The fitting portion 8a is sandwiched between the two molding plates 6 in a state of being fitted into the mounting hole 6a, and is joined to the molding plate 6 by integral brazing. Therefore, both end surfaces of the spacer 8 are at the same height (same plane) as the surface of each molding plate 6, and the refrigerant tank 3
Outside (however, the airtightness of the refrigerant tank 3 is secured by integral brazing). Also, this spacer 8
Is provided with a circular through hole 8b penetrating the central portion thereof in the thickness width direction of the refrigerant tank 3 (left-right direction in FIG. 3).

The IGBT module 2 has a heat radiating plate 2a (see FIG. 3) made of metal (for example, copper) having good heat conductivity, and this heat radiating plate 2a is an outer wall surface of the refrigerant tank 3 (attachment of the molding plate 6). Bolts 9 and nuts 1 in close contact with
It is attached to the refrigerant tank 3 by fastening 0. However,
In this embodiment, six I's are provided on each side of the refrigerant tank 3.
The GBT module 2 is attached, and two IGBT modules 2 facing each other across the refrigerant tank 3 are fastened by a common bolt 9 and nut 10.

Specifically, as shown in FIG. 3, the coolant tank 3
An IGBT mounted on one side (left side in FIG. 3) of the IGBT module 2 having bolts 9 inserted through the mounting portions 2b (four places) of the spacer 8 and further mounted on the other side of the refrigerant tank 3. The nut 10 which is inserted through the mounting portion 2b of the module 2 and is screwed from the tip thereof.
By tightening the
The GBT module 2 is attached.

The radiator 4 is composed of a radiation tube 11, an upper tank 12, an upper plate 12 ', a lower tank 13, a lower plate 13' and a radiation fin 14. The heat radiating tube 11 is made of an aluminum tube having a flat cross section, is alternately combined with the heat radiating fins 14, and is supported by the upper tank 12, the upper plate 12 ', the lower tank 13, and the lower plate 13'.
The upper plate 12 ′ is connected to the upper ends of the heat radiating tubes 11 to communicate the respective heat radiating tubes 11, and the lower plate 13 ′ is connected to the lower ends of the respective heat radiating tubes 11 to communicate the respective heat radiating tubes 11. is doing. Further, the lower tank 13 is provided with an elongated hole-shaped insertion port 13a into which the connection port of the refrigerant tank 3 is inserted.

The radiating fins 14 are formed by alternately bending thin plates of aluminum having a high thermal conductivity and are formed into a wavy shape. The radiating fins 14 are interposed between adjacent radiating tubes 11 and joined to the outer surface of the radiating tubes 11. There is. The heat dissipation fins 14 can improve the heat dissipation performance of the radiator 4 by increasing the surface area of the radiator 4 and increasing the thermal conductivity.

The cooling fan 5 is, for example, an axial flow fan,
Two radiators are arranged side by side on the front surface (or rear surface) of the radiator 4. The cooling fan 5 may be of a suction type located downstream of the radiator 4 in the blowing direction, or may be of a pushing type located upstream of the radiator 4 in the blowing direction. That is,
Either direction of air blow to the radiator 4 may be used.

Next, the operation of the boiling cooling device 1 of this embodiment will be described. When a semiconductor element (not shown) built in the IGBT module 2 generates heat, the IGBT module 2
By heat conduction from the heat radiating plate 2a to the forming plate 6 constituting the refrigerant tank 3, the refrigerant in the refrigerant tank 3 is boiled and vaporized. At this time, highly efficient heat transfer (up to 100 to 1000 times that during natural convection during boiling) is performed between the inner wall surface of the refrigerant tank 3 and the refrigerant. The boiled refrigerant becomes bubbles and rises in the refrigerant tank 3, flows into the lower tank 13 of the radiator 4, and then is distributed from the lower tank 13 to the respective heat radiation tubes 11 and rises in the heat radiation tube 11.

The refrigerant vapor flowing in the heat radiation tube 11 is
When the cooling fan 5 blows air, it condenses and liquefies on the inner wall surface of the heat dissipation tube 11 that is at a low temperature, and releases latent heat of condensation at this time. The refrigerant that has condensed into droplets flows down in the heat dissipation tube 11 due to its own weight, is temporarily accumulated in the lower tank 13, and then returns from the lower tank 13 into the refrigerant tank 3 again. On the other hand, the latent heat of condensation released when the refrigerant vapor is condensed is transmitted from the tube wall of the heat dissipation tube 11 to the heat dissipation fins 14 and released to the atmosphere. By repeating the boiling and condensation heat transfer of the refrigerant, the heat transferred from the IGBT module 2 is sequentially released to the atmosphere, and the semiconductor element is cooled.

(Effect of First Embodiment) In this embodiment, the mounting holes 6a formed in the molding plate 6 are not simultaneously opened during press molding, but the mounting of the IGBT module 2 actually mounted after press molding is performed. It is opened according to the number and mounting pitch. Therefore, even if the number or the mounting pitch of the IGBT modules 2 mounted in the refrigerant tank 3 is different, after the molding plate 6 is press-molded using the same press die, the individual IG
Mounting holes 6a according to the mounting pitch of the BT module 2
Just open it. Therefore, it is not necessary to newly design a press die according to the number of IGBT modules 2 or the mounting pitch, and the cost for the press die can be one press die cost. Therefore, the refrigerant tank 3 can be manufactured at low cost. You can

Since the spacer 8 can receive the tightening force of the bolt 9 and the nut 10, the refrigerant tank 3 can be prevented from being deformed without applying a large tightening load to the refrigerant tank 3. In other words, since the spacer 8 functions as a reinforcing material for the refrigerant tank 3, a large tightening force is applied to the IGBT.
It is possible to mount the T module 2 on the mounting surface of the molding plate 6. As a result, the contact thermal resistance between the heat radiating plate 2a of the IGBT module 2 and the molding plate 6 can be made as small as possible, so that improvement in heat radiating performance can be expected.
Further, the spacer 8 has a fitting portion 8a provided on its end face.
Since it is fixed while being fitted in the mounting hole 6a, it is easy to assemble without being displaced with respect to the mounting hole 6a.

(Second Embodiment) FIG. 4 is a sectional view of the refrigerant tank 3 (corresponding to the AA section in FIG. 1). In the present embodiment, a screw hole 8c penetrating the spacer 8 is formed, and the screw hole 8c is formed.
It shows an example in which the bolt 9 is screwed to c.

(Third Embodiment) FIG. 5 is a sectional view of the refrigerant tank 3 (corresponding to the AA section in FIG. 1). In this embodiment, the screw holes 8c are formed from both end surfaces of the spacer 8,
Each IG is connected to each side of the refrigerant tank 3 by an individual bolt 9.
It shows an example when the BT module 2 is fastened.

(Fourth Embodiment) FIG. 6 is a sectional view of the refrigerant tank 3. This embodiment shows an example of mounting the IGBT module 2 without opening the mounting hole 6a in the molded plate 6. For example, when a plurality of refrigerant chambers 7 are formed in the refrigerant tank 3 and the IGBT module 2 is attached to each refrigerant chamber 7, a recessed region is formed between adjacent refrigerant chambers 7. Therefore, this recessed area is used as a fastening area 15 for fastening the IGBT module 2.

Specifically, as shown in FIG. 6, a heat radiation plate 16 (a flat plate material of the present invention) is arranged on the surface of the coolant tank 3 including the fastening region 15, and only the fastening region 15 is provided with the heat radiation plate 16. The fastening plate 17 (mounting plate of the present invention) is attached to the back surface. The heat dissipation plate 16 has an IGBT
A round hole 16a through which the bolt 9 is inserted is opened in accordance with the mounting pitch of the module 2, and a screw hole 17a for screwing the bolt 9 at the same position as the round hole 16a is formed in the fastening plate 17 by burring or the like. Has been formed. The heat dissipation plate 16 is made of aluminum or copper having good thermal conductivity, and is closely bonded to the surface of the molding plate 6.

The IGBT module 2 is arranged with the heat radiating plate 2a in close contact with the surface of the heat radiating plate 16, and the bolt 9 inserted into the mounting portion 2b is passed through the round hole 16a of the heat radiating plate 16 to the fastening plate 17. It is attached by screwing into the formed screw hole 17a and tightening. In this embodiment, since it is not necessary to open the mounting hole 6a in the molded plate 6, if the fastening region 15 is secured to a certain size, the heat dissipation plate 16 can be provided even if the mounting pitch of the IGBT module 2 is slightly different. This can be dealt with only by changing the positions of the round hole 16a formed in the above and the screw hole 17a formed in the fastening plate 17. As a result, since the molding plate 6 itself can be of the same shape, it is not necessary to add a press die and the cost can be reduced.

Although it is possible to form a screw hole in the heat dissipation plate 16 itself (therefore, the fastening plate 17 is not necessary), the thickness width of the heat dissipation plate 16 is set to receive the fastening force of the bolt 9. Need to thicken. In this case, not only the heat dissipation performance deteriorates due to the increased distance between the heat dissipation plate 2a of the IGBT module 2 and the molding plate 6, but also the material cost increases and the weight increases. Fastening plate 1 only for 15
It is advantageous to use 7 by bonding.

(Fifth Embodiment) FIG. 7 is a sectional view of the refrigerant tank 3. This embodiment is similar to the fourth embodiment in that the fastening area 15
2 shows another example in which the fastening plate 17 is attached to the back surface of the heat dissipation plate 16 for use. That is, in the fourth embodiment, since the fastening plate 17 is thin, the screw holes 17a are formed by burring or the like. However, in the present embodiment, as shown in FIG. The thickness is increased and the screw hole 17a is formed by the usual screw hole processing.

(Sixth Embodiment) FIG. 8 is a front view of the boiling cooling apparatus 1. This embodiment shows an example in which the fastening space 18 is formed only by the two molding plates 6 forming the coolant tank 3. For example, in FIG. 9 (BB of FIG. 8
As shown in the cross-sectional view), a constricted portion 6b is formed on one of the molding plates 6A, and the constricted portion 6b is joined in a state where the tip of the constricted portion 6b is in contact with the inner surface of the other molding plate 6B, whereby airtight partition The coolant chamber 7 and the fastening space 18 can be formed. In such a case, as shown in FIG.
Mounting pitch P1 for multiple IGBT modules 2
, P2 is substantially the same (if the pitch P1 is substantially the same), the pitch P2 can be set at an arbitrary position in the fastening space 18 extending in the vertical direction of the refrigerant tank 3 (vertical direction in FIG. 8). You can

Incidentally, FIG. 10 (corresponding to the BB cross section of FIG. 8)
As shown in FIG. 3, the same constricted portion 6b is formed on both of the molding plates 6A and 6B, and the constricted portions 6b are joined together in a state of being in contact with each other, whereby the refrigerant chamber 7 and the fastening space 18 are joined together.
Can also be formed. In this case, since the two molding plates 6 can have the same shape and the press molds of the molding plates 6 can be one, the cost can be reduced as compared with the case of FIG. 9. 9 and 10, an example in which the IGBT modules 2 are attached to both sides of the refrigerant tank 3 is shown, but as shown in FIG. 11 (corresponding to the BB cross section of FIG. 8), the refrigerant tank 3 is shown. The IGBT module 2 may be attached to only one side of the.

(Seventh Embodiment) FIG. 12 is a sectional view of the boiling cooling apparatus 1 (corresponding to the BB section in FIG. 8). This embodiment shows an example in which the fastening space 18 is formed by a tube 19 (a hollow mounting member of the present invention) which is a separate member from the molding plate 6. For example, as shown in FIG. 12, a flat tube 19 is sandwiched between two opposing molding plates 6 and brazed integrally with the molding plate 6 to form a fastening space 18 in the tube 19. Thus, the refrigerant chamber 7 is formed outside the fastening space 18. According to this configuration, since the mounting position of the tube 19, that is, the fastening space 18 can be freely moved within the refrigerant tank 3, it is possible to easily cope with the IGBT modules 2 having different mounting pitches. Further, since the shape of the molding plate 6 can be simplified, the cost can be reduced.

(Eighth Embodiment) FIG. 13 is a front view of the boiling cooling apparatus 1. In this embodiment, the bolt 9 is provided on the outside of the coolant tank 3.
This is an example in which the spacer 8 that receives the tightening force of is arranged. For example, as shown in FIG. 14 (C-C cross-sectional view of FIG. 13), the spacer 8 is arranged in the fastening region 15 (a recessed region of the molding plate 6) formed between the refrigerant chambers 7. Then, the bolts 9 are screwed into the screw holes 8c formed in the spacer 8 and tightened, whereby the IGBT modules 2 can be attached to both sides of the refrigerant tank 3. In this case, the IGBT module 2 can be attached simply by screwing the bolt 9 into the screw hole 8c, and thus the workability can be said to be good.

Alternatively, as shown in FIG. 15 (corresponding to the C-C cross section of FIG. 13), a through hole 8b is formed in the spacer 8 arranged in the fastening region 15, and the bolt 9 is passed through the through hole 8b to pass through the nut 10. The IGBT modules 2 can be attached to both sides of the refrigerant tank 3 by tightening with. In the case of this embodiment, the two molding plates 6A and 6B in the fastening region 15 need to be in contact with each other. As a result, the tightening force of the bolt 9 can be received by the spacer 8, so that the molding plate 6 is not deformed. However, the spacer 8 has the same height (same plane) as the surface of the molding plate 6 forming the refrigerant chamber 7, or slightly lower.

(Ninth Embodiment) FIG. 16 is a front view of the boiling cooling apparatus 1. The present embodiment shows an example in which the inner fin 20 is inserted into the coolant tank 3 and the spacer 8 is positioned by the inner fin 20. When arranging the spacer 8 that receives the tightening force of the bolt 9 inside the refrigerant tank 3, as shown in FIG. 17 (D-D cross-sectional view of FIG. 16), the spacer 8 is inserted into the inner fin 3 which is inserted into the refrigerant tank 3. It can be fixed by 20. In this case, since the inner fin 20 can not only fix the spacer 8 but also increase the heat radiation area, the heat radiation performance can be improved.

According to the configurations shown in the above embodiments, I
The mounting portion 2b (the portion to which the tightening force of the bolt 9 is applied) of the GBT module 2 is always supported by the molding plate 6, the spacer 8 or the heat radiation plate 16, and has a structure as shown in FIG. Since the bending force is not applied to the IGBT module 2 as compared with the case where the lower side is hollow, the ceramic substrate (not shown) inside the IGBT module 2 is not adversely affected.

[Brief description of drawings]

FIG. 1 is a front view of a boiling cooling device (first embodiment).

FIG. 2 is a side view of a boiling cooling device (first embodiment).

FIG. 3 is a sectional view taken along line AA of FIG. 1 (first embodiment).

FIG. 4 is a sectional view of a refrigerant tank according to a second embodiment (FIG. 1).
Corresponding to the A-A cross section).

FIG. 5 is a sectional view of a refrigerant tank according to a third embodiment (FIG. 1).
Corresponding to the A-A cross section).

FIG. 6 is a sectional view of a refrigerant tank according to a fourth embodiment.

FIG. 7 is a sectional view of a refrigerant tank according to a fifth embodiment.

FIG. 8 is a front view of a boiling cooling device according to a sixth embodiment.

9 is a sectional view taken along line BB of FIG. 8 (sixth embodiment).

FIG. 10 is a cross-sectional view of a refrigerant tank (corresponding to the BB cross section of FIG. 8).
(Sixth embodiment).

FIG. 11 is a cross-sectional view of a refrigerant tank (corresponding to the BB cross section of FIG. 8).
(Sixth embodiment).

FIG. 12 is a cross-sectional view (corresponding to the BB cross section of FIG. 8) of the refrigerant tank according to the seventh embodiment.

FIG. 13 is a front view of a boiling cooling device according to an eighth embodiment.

FIG. 14 is a sectional view taken along line CC of FIG. 13 (eighth embodiment).

FIG. 15 is a sectional view of a refrigerant tank (corresponding to the CC section in FIG. 13) (eighth embodiment).

FIG. 16 is a front view of a boiling cooling device according to a ninth embodiment.

FIG. 17 is a sectional view taken along line DD of FIG. 16 (ninth embodiment).

FIG. 18 is a cross-sectional view showing a fastening structure of a heating element (conventional example).

[Explanation of symbols]

1 boiling cooling system 2 IGBT module (heating element) 3 Refrigerant tank 4 radiator 6 Molded plate (thin member) 6a Mounting hole 7 Refrigerant chamber 8 Spacer (mounting member) 8a Spacer fitting part 8b Spacer through hole 8c Spacer screw hole 9 bolts (fastening members, screw members) 10 Nut (fastening member) 15 fastening area 16 Heat dissipation plate (flat plate material) 17 Fastening plate (mounting plate) 18 fastening space 19 tube (hollow mounting member)

─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 23/427 H05K 7/20

Claims (11)

(57) [Claims] 1. A refrigerant tank, in which a heating element is attached to an outer wall surface by a fastening member, and which contains a refrigerant that boils when receiving the heat of the heating element, and a refrigerant tank provided in communication with the refrigerant tank. And a radiator that cools and liquefies the vapor phase refrigerant that has boiled and vaporized in the tank. The refrigerant tank is formed by bonding two thin members at their joints, and the thin member has a predetermined shape. A method for manufacturing a boiling cooling device, characterized in that, after being molded into, the mounting hole or the screw hole of the fastening member is formed in accordance with the mounting position of the heating element. 2. Manufacturing by the manufacturing method according to claim 1.
A cooling apparatus which is, between the two opposing said thin member, boil the mounting member for receiving the tightening force of the fastening member in a position corresponding to the mounting hole, characterized in that it is interposed Cooling system. 3. The boiling cooling device according to claim 2, wherein the attachment member is provided with a through hole through which the fastening member is passed, and the fastening member is provided from one side of the refrigerant tank to the other side thereof. A boiling cooling device comprising a bolt arranged through the through hole and a nut screwed to the bolt on the other side of the refrigerant tank. 4. The boiling cooling device according to claim 2, wherein the fastening member is a screw member having an external thread formed on the outer periphery, and the mounting member is provided with an internal thread for receiving the external thread of the fastening member. A boiling cooling device characterized in that 5. The boiling cooling device according to claim 4, wherein the female screw formed on the mounting member is individually formed from both end surfaces of the mounting member. 6. In any of the cooling apparatus according to claim 2-5, boiling cooling to the mounting member is characterized in that the fitting portion fitted before Symbol mounting hole is provided apparatus. 7. Produced by the production method according to claim 1.
A cooling apparatus which is said refrigerant tank includes a refrigerant chamber for accommodating a refrigerant, and a fastening space is provided for forming the screw hole, the fastening space and airtight and the coolant chamber A boiling cooling device characterized by being partitioned into. 8. The boiling cooling apparatus according to claim 7, wherein the fastening space includes a hollow mounting member provided by a member different from the thin member, and the mounting member forms the screw hole. A boiling cooling device arranged in the refrigerant tank according to a position. 9. A boiling cooling device for cooling a heating element, which is formed by laminating two thin members facing each other, and has a refrigerant tank for containing a refrigerant which receives the heat of the heating element and boils therein. And a radiator provided in communication with the refrigerant tank for cooling and liquefying the vapor-phase refrigerant boiled and vaporized in the refrigerant tank, wherein the refrigerant tank is provided in a plurality corresponding to the plurality of heating elements. Of the cooling chamber and a fastening region formed between adjacent cooling chambers in a depressed manner, wherein the heating element is attached to a mounting member arranged in the fastening region. apparatus. 10. The boiling cooling apparatus according to claim 9, wherein the mounting member is mounted on a back surface of the flat plate material in a close contact with a flat plate material that is disposed in close contact with the surface of the coolant tank. The heating element is arranged in close contact with the surface of the flat plate material on the refrigerant chamber, and is mounted by fixing a fastening member to a screw hole formed in the mounting plate. A boiling cooling device characterized by the above. 11. The boiling cooling device according to claim 9, wherein the mounting member is a spacer interposed between the thin member and the mounting portion of the heating element that abut each other in the fastening region, The boiling cooling device, wherein the heating element is clamped and fixed to the spacer by a fastening member.