JPH08245230A - Quartz glass product for semiconductor production process and its production - Google Patents

Abstract

PURPOSE: To obtain such a quartz glass product for the production process of a semiconductor that marks which can be optically read out is deposited to be firmly stuck to the quartz glass so that the marks do not contaminate a semiconductor in the production process of a semiconductor. CONSTITUTION: A black coloring agent excellent in heat resistance and acid resistance having very little content of alkali metal elements and transition metals is deposited by fusing along the form of the objective mark on the surface of a quartz glass product or deposited in a groove or recessed part formed on the surface of the glass. As a result, the coloring agent does not act as the contamination source for the use environments but the mark does not deteriorate in color or quality nor disappear with heat or acid for a long period.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a quartz glass product for a semiconductor manufacturing process such as a crucible for pulling a silicon single crystal by a CZ method, a bell jar for epitaxial growth, a furnace core tube or boat for diffusion, a boat for CVD or a bell jar for etching, and the like. More particularly, the present invention relates to a quartz glass product for a semiconductor manufacturing process, which has an optical readable barcode such as a bar code reader or an OCR, and symbols such as letters or numbers, and a manufacturing method thereof.

[0002]

2. Description of the Related Art Generally, it is effective to attach an optically readable symbol to a product not only for product distribution control but also for process control and inventory control in the manufacturing process.
It is also effective for the user to manage the number of uses. This is because there is a problem with keyboard input in that mistakes made by the user cannot be avoided, and fatigue and time consuming input work when the number of products increases. Conventionally, there is no quartz glass product for a semiconductor manufacturing process with an optically readable symbol. One of the reasons for this is that the semiconductor manufacturing process is performed in an extremely clean environment, but when a symbol is attached to a quartz glass product using a normal colorant, it may contaminate the usage environment. Is. Quartz glass products are often washed with hydrofluoric acid, ammonium fluoride or a mixed acid of hydrofluoric acid and other acids for the purpose of removing the surface contamination layer during the manufacturing process and during the semiconductor manufacturing process. However, the reason is that ordinary colorants cannot withstand these acid treatments. Further, in the manufacturing process of quartz glass products, deformation processing, welding, polishing, etc. are performed by so-called glassworking processing, while in the semiconductor manufacturing process, diffusion,
Many processes such as epitaxial growth, CVD, etching, etc. are exposed to heat or heat and plasma at the same time, and with ordinary colorants, alteration or disappearance due to these heat treatments is also the cause.

[0003]

However, even in the case of a quartz glass product for a semiconductor manufacturing process, an optical reading is required for convenience of management of the manufacturing process, inventory, distribution management or management during the semiconductor manufacturing process. The appearance of those with possible symbols is desired. Therefore, the present invention provides a quartz glass product for a semiconductor manufacturing process and a manufacturing method thereof, which does not contaminate the semiconductor in the semiconductor manufacturing process, is firmly fixed to the quartz glass, and is provided with a symbol that enables optical reading. The purpose is to do.

[0004]

In order to solve the above problems, the quartz glass product for a semiconductor manufacturing process according to the first aspect of the present invention has excellent heat resistance and acid resistance, and an alkali metal element or a transition element content rate. Very little black colorant,
It is characterized in that the quartz glass product is adhered to the surface of the quartz glass product or a groove or a recess formed in the surface by melting, following the shape of the symbol. The second quartz glass product for semiconductor manufacturing process is characterized in that, in the first one, the colorant is silicon, carbon, silicon carbide or silicon nitride, or a mixture thereof with quartz glass. A third quartz glass product for semiconductor manufacturing process is characterized in that, in the first or second one, the groove or the recess is airtightly covered with a thin quartz glass plate. In addition, the first method for manufacturing a quartz glass product for a semiconductor manufacturing process is
An almost black colorant with excellent acid resistance and a very low content of alkali metal elements and transition elements is applied to the surface of the printed area of the symbol on the quartz glass product, and laser light is applied to the symbol in the shape of the symbol. It is characterized in that the irradiation is performed after copying. A second method for manufacturing a quartz glass product for a semiconductor manufacturing process is to irradiate a surface of the quartz glass product with a laser beam to form a groove or a recess following the shape of a symbol,
It is characterized in that a substantially black colorant having excellent heat resistance and acid resistance and having a very low content of alkali metal element or transition element is applied to the inside of the groove or recess, and the applied portion is irradiated with laser light. . According to a third method for manufacturing a quartz glass product for semiconductor manufacturing process, in the first or second method, the coloring agent is silicon, carbon, silicon carbide or silicon nitride, or a mixture of these and quartz glass. Characterize. A fourth method for manufacturing a quartz glass product for a semiconductor manufacturing process is the method according to the second or third method, in which all the grooves or recesses are covered with a quartz glass thin plate after the laser light irradiation, and the entire circumference of the quartz glass thin plate is covered. Is hermetically welded to the surface.

[0005]

In the first quartz glass product for semiconductor manufacturing process and the first and second manufacturing methods thereof according to the present invention, as a symbol attached to the surface of the quartz glass product or the groove or recess formed in the surface, The colorant does not become a pollution source of the use environment, and does not cause fading, deterioration, or disappearance due to heat, acid or the like for a long period of time. In the second quartz glass product and the third manufacturing method thereof, the colorant has a color tone of dark brown to black. Further, in the third quartz glass product and the fourth manufacturing method thereof, the symbol is protected by the quartz glass thin plate.

Symbols include bar codes, characters, marks,
A code or arithmetic number is used. Irradiation with laser light is performed by a solid-state laser such as a carbon dioxide gas laser or a YAG laser. The heating of the coloring agent by the laser light is performed in the air or in a non-oxidizing atmosphere such as argon gas in correspondence with the coloring agent.

[0007]

EXAMPLES Examples of the present invention will be described in detail below. Examples 1 to 4 As a coloring agent, an aqueous solution prepared by previously dissolving 10% by weight of PVA (polyvinyl alcohol) in 10 parts by weight of high-purity silicon nitride (Si ₃ N ₄ ) powder (average particle size 10 μm) , "10% PVA aqueous solution") was mixed in a beaker to form a slurry. This slurry is applied to the entire surface of a transparent and high-purity quartz glass plate having a thickness of 10 mm on which a bar code is printed, left to dry, and then output in the atmosphere using a carbon dioxide laser.
A laser beam of 0 W was irradiated onto the above-mentioned coated portion at a feeding speed of 2 m / min, following the shape of the barcode. Further, as colorants, high purity silicon carbide (SiC) powder (average particle size 10 to 50 μm), carbon (C) powder (excellent in oxidation resistance, average length 60 to 100 μm, average diameter 10 to 50 μm) are used. Needle coke) and silicon (Si) powder (average particle size 2
(0 to 80 μm) is similarly mixed with a 10% PVA aqueous solution to form slurries, and each slurry is applied to the entire surface of a bar code printed area on a similar quartz glass plate and dried, and then a laser beam is similarly applied to the bar. Irradiation was performed according to the shape of the cord.

As shown in Table 1, a bar code was printed on the surface of each quartz glass plate in a color tone of dark brown to black except for silicon. Si ₃ N ₄ was the best in the production of colorants, followed by C, SiC, and Si. Although the reason is not clear, it was confirmed that the working efficiency was improved by 20% when Si ₃ N ₄ was used as compared with the case where C, SiC, and Si were used. The surface of each quartz glass plate on which the barcode was printed was rubbed with a stainless needle, but the colorant did not peel off.
In addition, 10% of each quartz glass plate with a barcode printed
After being immersed in the hydrofluoric acid for 15 minutes and rubbed in the same manner, the coloring agent was not peeled off. On the other hand, when each of the quartz glass plates on which the barcode was printed was held at a temperature of 1000 ° C. for 2 hours in the atmosphere in which the silicon wafer was placed, as shown in Table 1, no contamination of the silicon wafer was observed, and ,
The carbon barcodes disappeared, but the silicon carbide and silicon nitride barcodes remained colored. When the bar code of each quartz glass plate was read by a bar code reader, it could be easily read.

[0009]

[Table 1]

When silicon is used as the colorant,
When laser heating was performed in a non-oxidizing atmosphere such as argon gas, the bar code could be printed in dark dark blue gray. In addition, a quartz glass plate having a bar code printed with carbon as a coloring agent was subjected to 1300 in a nitrogen gas atmosphere.
When kept at a temperature of ° C for 10 hours, the bar code remained colored.

Example 5 10 parts by weight of fine silica gas powder having a particle size of 1 μm or less produced by the sol or gel method was added to 10 parts of Si ₃ N ₄ powder having an average particle size of 5 μm.
Part by weight is mixed, and 10% PVA aqueous solution 2 is added to this mixed powder.
Parts by weight were mixed to form a slurry. 40 this slurry
After granulating by passing through a mesh nylon sieve and drying, pressurizing this with a pressure of 500 kg / cm ² to a diameter of 2
It was a green compact having a thickness of 0 mm and a thickness of 10 mm. This green compact was heated in a nitrogen gas atmosphere at a temperature of 1400 ° C. for 2 hours to produce a colored sintered body, which was crushed in a mortar and mixed with quartz glass and Si ₃ N ₄ as a coloring agent. A mixed powder was prepared. The mixed powder was slurried in the same manner as in Examples 1 to 4, and was applied to the entire surface of the same quartz glass plate on which the barcode was printed, and after drying, laser light was applied to the barcode in the same manner as in Examples 1 to 4. Irradiation was performed according to the shape.

The adhesion of the printed bar code is good, as shown in Table 1, and the silicon wafer is not contaminated by heating at a temperature of 1300 ° C. in the atmosphere together with the silicon wafer, and the bar code is The cord stayed well colored. Further, when the printed bar code was read by a bar code reader, it could be easily read.

Example 6 Using a carbon dioxide laser, output: 7 W, feed rate: 1 cm
Grooves were formed on the surface of the quartz glass plate in the same manner as in Examples 1 to 4 following the shape of the bar code under the condition of scanning 10 times per second. The groove depth was approximately 0.3 mm. The slurry made of Si ₃ N _{4 of} Example 1 was applied in the groove following the bar code, dried, and then irradiated with laser light as in Examples 1 to 4.

On the quartz glass plate, a black bar code is printed in a recessed portion from the surface thereof. As shown in Table 1, the bar code has the same effect as that of Example 1 and the quartz glass plate. Even when the plates were rubbed together, they did not come into contact with each other and did not separate.

Example 7 A bar code was printed in the same manner as in Example 6. The size of the printed barcode was 2 cm × 3.5 cm. A transparent quartz glass thin plate of 3 cm × 4 cm × 0.5 mm was placed on the quartz glass plate, and after covering the bar code, the entire circumference of this thin plate was covered with a transparent quartz glass-based welding rod with a diameter of 1 mm. The surface of the quartz glass plate was hermetically welded using a hydrogen burner.

As shown in Table 1, the bar code covered with the above-mentioned quartz glass thin plate shows no contamination of the silicon wafer even if it is held at a temperature of 1200 ° C. for 100 hours in the atmosphere in which the silicon wafer is kept. At the same time, it did not fade and was easy to read with a barcode reader. The colorant was carbon, the bar code was printed in the same manner as in Example 6, and the bar code was covered with the transparent quartz glass thin plate as described above. The silicon wafer was not contaminated and the bar code did not fade even after being held at the temperature of 10 hours, and it was easy to read with a bar code reader.

In each of the above embodiments, the case where the symbol is a bar code is described, but the present invention is not limited to this, and the symbol attached to the surface or the groove or recess formed in the surface is as follows. It may be a character or a numeral, and in this case, it is read by the OCR. Further, the laser is not limited to the gas laser and may be a solid laser.

[0018]

As described above, the first quartz glass product for semiconductor manufacturing process of the present invention and the first and second quartz glass products thereof are provided.
According to the manufacturing method of 1., since the coloring agent as a symbol attached to the surface of the quartz glass product or the groove or the recess formed on the surface does not become a pollution source of the use environment, it does not contaminate the semiconductor. At the same time, it does not fade or deteriorate or disappear due to heat or acid over a long period of time.
Adhesion to quartz glass can be robust and can allow optical reading. According to the second quartz glass product and the third method for manufacturing the same, the colorant exhibits a color tone from dark brown to black, so that optical reading can be easily performed. Further, according to the third quartz glass product and the fourth manufacturing method thereof, since the symbol is protected by the quartz glass thin plate, the symbol can be clearly held for a long period of time and the semiconductor is never contaminated.

Claims (7)

[Claims] 1. A groove formed by forming a substantially black colorant having excellent heat resistance and acid resistance and having an extremely low content of alkali metal elements and transition elements on the surface of a quartz glass product or on the surface according to the shape of the symbol. Alternatively, a quartz glass product for a semiconductor manufacturing process, characterized in that these are adhered to the inside of the recess by melting. 2. The quartz glass product for a semiconductor manufacturing process according to claim 1, wherein the colorant is silicon, carbon, silicon carbide, silicon nitride, or a mixture of these and quartz glass. 3. The quartz glass product for a semiconductor manufacturing process according to claim 1, wherein the groove or the recess is airtightly covered with a thin quartz glass plate. 4. A substantially black colorant having excellent heat resistance and acid resistance and having an extremely low content of alkali metal elements and transition elements is applied to the surface of the printed area of the symbol in the quartz glass product, and the applied portion is applied. A method of manufacturing a quartz glass product for a semiconductor manufacturing process, which comprises irradiating a laser beam according to the shape of a symbol. 5. The surface of the quartz glass product is irradiated with a laser beam to form a groove or a recess following the shape of the symbol, and the groove or the recess has excellent heat resistance and acid resistance, and an alkali metal element or transition. A method for manufacturing a quartz glass product for a semiconductor manufacturing process, which comprises applying a substantially black colorant having an extremely small content of elements and irradiating the applied portion with laser light. 6. The production of a quartz glass product for a semiconductor manufacturing process according to claim 4, wherein the colorant is silicon, carbon, silicon carbide or silicon nitride, or a mixture of these with quartz glass. Method. 7. The method according to claim 5, wherein after the irradiation with the laser beam, all the grooves or recesses are covered with a quartz glass thin plate, and the entire circumference of the quartz glass thin plate is hermetically welded to the surface. Manufacturing method of quartz glass products for semiconductor manufacturing process.