JPH08242056A - Circuit board fitted with capacitor, and its manufacture - Google Patents

Abstract

PURPOSE: To provide a circuit board fitted with a capacitor equipped with a corner cover having an enough thickness. CONSTITUTION: On a circuit board 1 lie a printed capacitor PC and a gas deposition type capacitor GC. A part 2b1 of the corner of the lower electrode 2b positioned under the connection 8b of the printed capacitor PC is covered with a stacked film of superfine particles so as to make a corner cover 6. In the case of forming a gas deposition type capacitor GC on the same substrate, the corner cover 6 is made together when forming an induced layer 3a on the lower electrode 2c of the gas deposition type capacitor GC by gas deposition method.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board with a capacitor and a method for manufacturing the same.

[0002]

2. Description of the Related Art The applicant previously filed Japanese Patent Application No. 6-289733.
Proposed a circuit board with capacitors. In the circuit board with a capacitor filed previously, a capacitor formed by printing (hereinafter referred to as a printed capacitor) is arranged on a circuit board having a copper foil circuit on its surface. For example, a printed capacitor is prepared by first preparing a copper clad laminate having a copper foil circuit on at least one surface of an insulating substrate, using a part of the copper foil circuit as a lower electrode, and applying a dielectric paste, that is, a dielectric paint, on top of it. Applied to form a dielectric layer. Next, a conductive paint is applied on the dielectric layer to form an upper electrode. At this time, a connection portion for connecting the connection electrode formed on the circuit board and the upper electrode is also formed together with the upper electrode. The dielectric layer, the upper electrode, and the connecting portion may be formed by pre-firing and then main firing together. However, the dielectric layer, the upper electrode, and the connecting portion may be formed separately by main firing. . Since the corners of the copper foil are sharp, when the dielectric coating is applied on the lower electrode, the dielectric coating easily breaks at the corners. If the lower electrode is exposed from the dielectric layer, a short circuit will occur between the lower electrode and the upper electrode. In particular, since the connecting portion for connecting the upper electrode to the connecting electrode always passes over the corner of the lower electrode, there is a high possibility that a short circuit will occur between the connecting portion and the lower electrode.

Therefore, conventionally, when forming a dielectric layer,
In practice, the dielectric paint was applied by screen printing a plurality of times (generally three times) to form a plurality of dielectric layers, and the thick dielectric layer covered the corners of the lower electrode. Also, before forming the dielectric layer, the corners of the lower electrode located below the connection portion are covered with an insulating paint or a conductive paint to form a buffer layer, that is, a corner covering portion for alleviating an acute angle of the corner of the copper foil. It is also proposed.

[0004]

However, the technique of covering the corners of the copper foil by coating the dielectric paint multiple times to increase the thickness of the dielectric layer is to reduce the thickness of the dielectric layer as much as possible to reduce the capacitance of the capacitor. Not applicable when trying to raise. Further, this technique causes a problem that it is difficult to control the film thickness of the dielectric layer, the variation in the film thickness of the formed dielectric layer becomes large, and the variation in the capacitance of the capacitor also becomes large.

Further, the technique of forming the corner covering portion for covering the corner portion of the lower electrode with the insulating paint or the conductive paint to reduce the acute angle of the corner portion of the copper foil is suitable for reducing the thickness of the dielectric layer. It seems to be However, both the insulating paint and the conductive paint contain a solvent, and this solvent flies when the paint is dried and cured, so that the thickness of the corner covering portion becomes thin. For safety, it is necessary to apply the paint a plurality of times to increase the thickness of the corner covering portion even when the corner covering portion is formed.

[0006] Regardless of which technique is used, the number of man-hours for coating, drying and curing the paint is large, and thus the productivity has been poor in the past. In addition, if the coating work is not managed properly, the thickness of the dielectric layer and the corner coating cannot be made to be the necessary and sufficient thickness, and a short circuit may occur between the upper electrodes. There is.

An object of the present invention is to provide a circuit board with a capacitor provided with a corner covering portion having a sufficient thickness and a method for manufacturing the same.

Another object of the present invention is to provide a method of manufacturing a circuit board with a capacitor that can easily form a thick corner covering portion.

Still another object of the present invention is to provide a circuit board with a capacitor in which a short circuit does not occur even if the thickness of the dielectric layer is reduced, and a method for manufacturing the same.

[0010]

According to the present invention, there is provided a lower electrode formed of a copper foil on a circuit board, a corner covering portion for covering at least a part of a corner of the lower electrode, a lower electrode and A dielectric layer formed using a dielectric coating on the corner covering portion,
An upper electrode formed using a conductive coating on the dielectric layer,
A printed capacitor having a connecting portion connecting the upper electrode and a connecting electrode formed on the circuit board, the connecting portion passing over the corner covering portion with a portion of the dielectric layer interposed therebetween. A circuit board with a capacitor formed as described above is targeted for improvement. In the present invention, the corner covering portion is formed of a deposited film of ultrafine particles by a gas deposition method or the like. In the specification of the present application, the gas deposition method is a so-called JPS (trademark) film forming method, in which ultrafine particles are placed on a gas flow and jetted onto a substrate at a high speed through a nozzle to form a film on the substrate. This is a method of directly forming a (layer). The gas deposition method can be divided into an evaporation gas deposition method and an aerosol gas deposition method, depending on the method of placing ultrafine particles on a gas. Evaporation method gas deposition method is a method of using ultrafine particles generated in gas as it is, aerosol type gas deposition method puts ultrafine particles generated by other method in a container in powder form, It is a method of supplying ultrafine particles to a container and using them in the form of an aerosol. For details of the gas deposition method, for example, a paper has been published in the magazine "Electronic Materials" published in October 1994 under the title "Dry direct writing system using ultrafine particles". In the method of the present invention, the gas deposition method is used to inject the ultrafine particles of the dielectric material onto the lower electrode to form the corner covering portion made of the ultrafine particles deposited film.

Since the breakage of the dielectric layer due to the corner portion of the lower electrode can be prevented by the corner portion covering portion, the dielectric layer may have a one-layer structure. If the dielectric layer is formed as a single layer, the accuracy of controlling the thickness of the dielectric layer can be increased, so that the variation in the capacitance of the printed capacitor can be reduced. Further, in order to form the dielectric layer into a single layer structure, the dielectric layer may be formed by screen printing once.

Further, when a gas deposition type capacitor having a dielectric layer formed by a gas deposition method and an upper electrode on a lower electrode made of copper foil is provided on the same circuit board, a corner covering portion is required. It may be formed together when forming the dielectric layer or the upper electrode of the gas deposition type capacitor. By doing so, the corner covering portion formed by the gas deposition method can be formed together with the dielectric layer of the gas deposition type capacitor, so that the corner covering portion can be formed without requiring a special process.

[0013]

The thickness of the corner covering portion made of a deposited film of ultrafine particles does not decrease because it does not contain a vaporizing material such as a solvent. Therefore, according to the present invention, it is possible to surely form the corner covering portion having a required thickness, and it is possible to reliably prevent a short circuit between the lower electrode and the upper electrode. As a result, the dielectric layer can be formed by screen printing once to reduce the thickness of the dielectric layer, and a capacitor having a large capacitance can be formed. When the dielectric layer is formed as a single layer, the accuracy of controlling the thickness of the dielectric layer can be increased, so that the variation in the capacitance of the printed capacitor can be reduced.

In particular, when forming a corner coating portion made of a deposited film of ultrafine particles by a gas deposition method, the coating material of the ultrafine particles is placed on a gas flow and passed through a nozzle at a high speed to form a lower portion made of copper foil on a circuit board. It is sprayed on the corners of the electrode to directly form a film or layer covering the corners. The thickness of this film or layer is determined by the particle size of the ultrafine particles used and the moving speed of the nozzle. When increasing the thickness, the moving speed of the nozzle may be slowed, and when decreasing the thickness, the moving speed of the nozzle may be increased, so that the corner covering portion having an arbitrary thickness can be obtained.

When forming a gas deposition type capacitor on the same circuit board, the gas deposition type capacitor is formed before forming the printed capacitor. At that time, if the corner covering portion that covers the corner portion of the lower electrode of the printed capacitor is formed together, the working process can be reduced.

[0016]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1A is an enlarged cross-sectional view of an essential part of an embodiment of a circuit board with a capacitor according to the present invention, and FIG.
FIG. 2 is a plan view of the main part shown in FIG. In these figures, 1 is a circuit board made of a copper clad laminate having a circuit pattern 2 of copper foil on the surface. In this embodiment, as the circuit board 1, a copper clad laminate is used in which a copper foil is laminated on one surface of a glass epoxy substrate and the copper foil is subjected to an etching treatment to form a circuit pattern 2. A printed capacitor PC having a part 2b of the circuit pattern 2 as a lower electrode and a gas deposition type capacitor GC having a part 2c of the circuit pattern as a lower electrode are formed on the circuit board 1.

In this embodiment, the gas deposition type capacitor GC is formed before forming the printed capacitor PC. Gas deposition type capacitor GC of the present embodiment
Is composed of a lower electrode 2c made of copper foil, a dielectric layer 3a formed on the lower electrode 2c, and an upper electrode 4a formed on the dielectric layer 3a. In this embodiment, the dielectric layer 3 made of a deposited film of ultrafine particles is formed by the gas deposition method, and a part of the dielectric layer 3 is the dielectric layer 3a.
Is composed. Further, the upper conductive layer 4 including the upper electrode 4a and the connecting portion 4b is formed by the gas deposition method. An overcoat layer 5 is formed above the gas deposition type capacitor GC so as to entirely cover the upper conductive layer 4.

Dielectric layer 3 for forming dielectric layer 3a
Is formed by spraying ultrafine particles of a dielectric material made of BaTiO ₃ by a gas deposition method so as to entirely cover the lower electrode 2c. For example, 5000-10,000p
In order to obtain the capacitance of F, the thickness of the dielectric layer 3 is set to 8 to 10
It may be formed in the range of μm. As will be described later, in this embodiment, the corner covering portion 6 of the printed capacitor PC is used.
Also, the dielectric layer 3 of the gas deposition type capacitor GC.
The same dielectric material is used to form the layers together by the gas deposition method.

Further, in this embodiment, the upper conductive layer 4 for forming the upper electrode 4a and the connecting portion 4b is also formed by the gas deposition method. Specifically, ultra-fine particles of Au, Ag, or Cu are jetted by a gas deposition method to form an upper conductive layer 4 made of a deposited film having a thickness of 3 to 10 μm.
Is formed. In this embodiment, the upper conductive layer 4 is formed so that the upper electrode 4a covers the entire dielectric layer 3a and the connecting portion 4b is connected to the connecting electrode 2d. The gas deposition type capacitor GC adjusts the capacitance of the capacitor according to the coating area of the upper electrode 4a. It is also possible to remove a part of the upper electrode 4a by laser trimming and perform trimming adjustment.

The overcoat layer 5 is formed of an ultraviolet-curable insulating resin paint, and is used for forming the dielectric layer 7a and the upper electrode 8a of the printed capacitor PC, which will be described later, when the dielectric layer 3 and the upper conductive layer are formed. 4 plays a role in preventing damage.

With the printed capacitor, only a capacitor having a capacity of about 2000 pF can be obtained, but with the gas deposition type capacitor GC used in the present embodiment,
A capacity of about 000 to 10,000 pF can be obtained.

The printed capacitor PC has a lower electrode 2b and
It is composed of a corner covering portion 6, a dielectric layer 7a, and an upper electrode 8a, and the upper electrode 8a is connected to a connecting electrode 2a formed on the circuit board 1 by a connecting portion 8b.

The corner covering portion 6 is formed of a deposited film of ultrafine particles by the gas deposition method using the same dielectric material as the dielectric layer 3 of the gas deposition type capacitor GC, and is formed below the connecting portion 8b. It covers the corner portion 2b1 of the lower electrode 2b within a predetermined range. The corner portion 6 is
The dielectric coating layer 7 is prevented from being cut at the corners of the lower electrode 2b. Since the corner covering portion 6 does not contain a material that vaporizes, such as a solvent, the thickness does not decrease.
Therefore, the dielectric layer 7a is formed by screen printing once on the lower electrode 2b on which the corner portion covering portion 6 is formed.
Even if the thickness of a is thinned, the dielectric layer 7a is formed on the corner covering portion 6
It is possible to form a capacitor with a large capacitance without breaking. If the dielectric layer 7a is formed as a single layer, the accuracy of controlling the thickness of the dielectric layer 7a can be increased, and thus the variation in the capacitance of the printed capacitor can be reduced. The corner covering portion may be formed so as to cover the entire corner of the lower electrode 2b, but if the dielectric coating layer 7 is cut off below the connecting portion 8b, a short circuit will occur between the connecting portion 8b and the lower electrode 2b. Therefore, in this embodiment, the corner covering portion 6 is formed so as to cover at least the lower corner 2b1 of the connecting portion 8b where a short circuit is expected to occur.

The dielectric layer 7a is formed by applying a dielectric paste or a dielectric paint by screen printing so as to entirely cover the lower electrode 2b and the corner covering portion 6, and the uncured dielectric paint layer 7 having a one-layer structure. Is formed, and this is cured by firing to be formed. The portion of the dielectric coating layer 7 formed on the lower electrode 2b constitutes the dielectric layer 7a. The dielectric paint layer 7 is formed by screen-printing a dielectric paste or a dielectric paint made by kneading a resin binder, a high dielectric material and a solvent on the copper clad laminate 1 and then firing it at a predetermined temperature. To do. As the high dielectric material, titanate such as barium titanate or strontium titanate can be used, and as the resin binder, a resin binder having a lower dielectric constant than that of titanate can be used. As such a resin binder, for example, a cyanoethyl group polymer-containing resin binder or the like can be used. For example, in a specific test example, 76% by weight of barium titanate, 19% by weight of a resin containing a cyanoethyl group polymer, and 5% by weight of a solvent (dimethylformamide) were kneaded to prepare a dielectric coating material. Dielectric layer 7 obtained by firing at 150 ° C. using this dielectric coating
The dielectric constant of a was about 70. The dielectric constant was 73 when the dielectric powder obtained by adding strontium titanate to barium titanate and firing at the same mixing ratio was used. By the way, the dielectric constant of the resin containing the cyanoethyl group polymer is about 10. The thickness of the dielectric paint layer 7 formed by one screen printing is about 10 μm.

The conductive paint layer 8 including the upper electrode 8a and the connecting portion 8b is formed by using a conductive paint. As this conductive paint, a copper silver paint, that is, a copper silver paste, a silver paste, a gold paste or the like can be used. Conductive paint layer 8
Of the above, the portion formed on the lower electrode 2b is the upper electrode 8
a and the other part constitutes the connecting portion 8b. The conductive paint layer 8 covers almost the upper part of the dielectric paint layer 7, and moreover, from the dielectric paint layer 7 to the connecting electrode (a part of the circuit pattern).
It is formed so as to extend to 2a. In this embodiment,
A silver paste is used as the conductive paint forming the conductive paint layer 8.

The dielectric coating layer 7 and the conductive coating layer 8 may be separately formed by main firing. In that case, the heat used for the conductive paste forming the conductive paint layer 8 is set so that the baking temperature or the hardening temperature of the conductive paint layer 8 is lower than the baking temperature or the hardening temperature of the dielectric paint layer 7. Select a curable resin. In this way, the heat of forming the conductive paint layer 8 does not significantly affect the characteristics of the dielectric layer 7a. When designing in consideration of the influence of heat, the firing temperature of the conductive paint layer 8 is set to the dielectric paint layer 7.
It goes without saying that the firing temperature may be higher than the firing temperature. Further, the dielectric paint layer 7 and the conductive paint layer 8 can be formed by a single main firing. In this case, the unfired dielectric paint layer and the conductive paint layer are pre-baked to form the pre-baked dielectric paint layer and the pre-baked conductive paint layer, and these are simultaneously fired. Similarly to the gas deposition type capacitor GC, the printed capacitor PC also adjusts the capacitance of the capacitor by the application area of the upper electrode 8a.

Next, an embodiment of a method for manufacturing the circuit board with a capacitor of the embodiment shown in FIG. 1 will be described. First,
The circuit board 1 having the copper foil circuit pattern 2 on the surface is immersed in dilute hydrochloric acid to remove the oxide film formed on the circuit pattern 2. Next, ultrafine particles of a dielectric material made of BaTiO ₃ are jetted from the nozzle of the apparatus for performing the gas deposition method onto the corners 2b1 of the lower electrode 2b and on the lower electrode 2c, as shown in FIG. 2 (A). Printed capacitors P
C corner coating 6 and gas deposition type capacitor G
The dielectric layer 3 of C is formed together. Specifically, even if the nozzles are arranged on the corners 2b1 and the lower electrode 2c respectively, and the ultrafine particles of the dielectric substance are ejected from the nozzles to form the corner covering portion 6 and the dielectric layer 3 simultaneously. Alternatively, it is also possible to spray the ultrafine particles of the dielectric material onto the corner 2b1 and the lower electrode 2c in order using one nozzle to form the corner covering 6 and the dielectric layer 3. The thickness of the corner covering portion 6 can be easily adjusted by changing the moving speed of the nozzle.

Next, ultrafine particles of a conductive material made of Au are jetted from the nozzle of the apparatus for carrying out the gas deposition method onto the dielectric layer 3 and in the range from the dielectric layer 3 to the electrode 2d to form the upper conductive layer 4. To form. The BaTiO ₃ has an average particle size of 0.5 to 0.5 prepared by a solid phase method, a precipitation method or the like.
0.7 μm powder is used. Also, a fine dielectric layer can be formed by reducing the amount of gas when ejecting the ultrafine particles and reducing the particle size of the ultrafine particles. Next, the upper conductive layer 4
A UV-curable insulating resin coating is applied so as to cover the film and then cured to form an overcoat layer 5 as shown in FIG. 2B. When forming an overcoat with a thermosetting insulating resin coating, the work of removing the oxide film on the copper foil again is performed after the overcoat is formed.

Next, the dielectric coating material is applied once by screen printing so as to cover the lower electrode 2b and the corner portion coating portion 6 as a whole to form an unfired dielectric coating material layer. Next, the unfired dielectric paint layer is pre-baked to form a pre-fired dielectric paint layer. Then, a conductive paint is applied on the dielectric paint layer by screen printing to form an unfired conductive paint layer, and then the unfired conductive paint layer is pre-baked to form a pre-baked conductive paint layer. Finally, the pre-baked conductive paint layer 8 and the pre-baked dielectric paint layer 7 of the printed capacitor PC are main-baked together to complete the circuit board with capacitors shown in FIGS. 1 and 2.

In this embodiment, the printed capacitor PC and the gas deposition type capacitor G are provided on the same circuit board 1.
However, the present invention is not limited to this, and in the case where only the printed capacitor PC is formed on the circuit board, other printed electronic elements such as a printed inductance and the printed capacitor are provided. It can also be applied to the case where the PC and the PC are formed on the same circuit board.

In the present embodiment, the corner portion 6 is formed together with the dielectric layer 3 of the gas deposition type capacitor GC, but the corner portion 6 is formed on the upper conductive layer 4 of the gas deposition type capacitor GC. It can also be formed with. In that case, after forming the dielectric layer 3, the corner covering portion 6 and the upper conductive layer 4 are formed together with ultrafine particles of a conductive material made of Au. In this case, since the corner covering portion 6 is not a dielectric material, the capacitance may be different from that of the gas deposition type capacitor GC of this embodiment. In that case, the capacitor is formed by laser trimming of the upper electrode 8a. The capacity may be adjusted appropriately.

The circuit pattern of the copper foil formed on the circuit board 1 is not limited to this embodiment. Of course, another circuit pattern may be added on this circuit board by using a conductive paint.

Further, in the present embodiment, the upper electrode 4a of the gas deposition type capacitor GC is formed by the gas deposition method, but the upper electrode 4a may be formed by another method using a conductive paint or the like. When the upper electrode 4a is formed by a method such as conductive paint, the corner covering portion 6 cannot be formed together with the upper conductive layer 4.

In this embodiment, the overcoat layer 5 is formed on the dielectric layer 3 in order to form the printed capacitor PC after the gas deposition type capacitor GC. If the printed capacitor PC is formed before the capacitor GC, the overcoat layer 5 is unnecessary.

According to the present embodiment described above, the deposited film of the ultrafine particles of the corner covering portion 6 and the dielectric layer 3 was formed by the gas deposition method. A deposited film of fine particles may be formed.

The structure of some of the inventions described in the specification will be shown below.

(1) A lower electrode made of copper foil formed on a circuit board, a corner covering portion covering at least a part of a corner of the lower electrode, the lower electrode and the corner covering portion. A dielectric layer formed by using a dielectric paint on the top, an upper electrode formed by using a conductive paint on the dielectric layer, a connecting electrode formed on the circuit board, and the upper electrode A printed capacitor having a connecting portion for connecting with,
A circuit board with a capacitor, wherein the connecting portion is formed so as to pass over the corner portion covering portion with a portion of the dielectric layer interposed therebetween, the corner portion covering portion being formed by a gas deposition method. A circuit board with a capacitor, which comprises a deposited film.

(2) The circuit board with a capacitor according to (1), wherein the dielectric layer has a one-layer structure.

(3) A corner portion covering portion is formed on the circuit board to cover at least a part of the corner portion of the lower electrode made of copper foil, and a dielectric is formed on the lower electrode and the corner portion covering portion. A dielectric layer is formed using a body paint, an upper electrode is formed on the dielectric layer using a conductive paint, and a connecting portion that connects the connection electrode formed on the circuit board and the upper electrode A printed capacitor formed so as to pass over the corner covering portion with a part of the dielectric layer interposed therebetween, and a lower electrode made of copper foil on the circuit board by a gas deposition method. A method for manufacturing a circuit board with a capacitor, comprising a gas deposition type capacitor having a formed dielectric layer and an upper electrode, wherein the corner portion is covered with the dielectric layer and the gas of the gas deposition type capacitor. Deposit And forming the gas deposition type capacitor on the circuit board, and then forming an overcoat layer so as to entirely cover the upper electrode of the gas deposition type capacitor, and the overcoat layer A method of manufacturing a circuit board with a capacitor, comprising forming the dielectric layer and the upper electrode of the printed capacitor after forming the printed capacitor, and manufacturing the printed capacitor on the circuit board.

[0040]

According to the present invention, the corner covering portion having a required thickness can be reliably formed, and the short circuit between the lower electrode and the upper electrode can be reliably prevented. As a result, the dielectric layer can be formed by screen printing once to reduce the thickness of the dielectric layer, and a capacitor having a large capacitance can be formed.
When the dielectric layer is formed as a single layer, the accuracy of controlling the thickness of the dielectric layer can be increased, so that the variation in the capacitance of the printed capacitor can be reduced.

[Brief description of drawings]

1A is an enlarged cross-sectional view of a main part of a circuit board with a capacitor according to an embodiment of the present invention, and FIG. 1B is a plan view of the main part shown in FIG.

2A and 2B are enlarged cross-sectional views of a main part of a circuit board with a capacitor in a manufacturing process.

[Explanation of symbols]

 1 Circuit Board 2 Circuit Patterns 2b, 2c Lower Electrode 3a Dielectric Layer 4a Upper Electrode 5 Overcoat Layer 6 Corner Cover 7a Dielectric Layer 8a Upper Electrode PC Printing Capacitor GC Gas Deposition Capacitor

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Ryuichiro, 3158 Shimookubo, Osawano-cho, Kamishinagawa-gun, Toyama Prefecture Hokuriku Electric Industry Co., Ltd.

Claims (5)

[Claims] 1. A lower electrode made of copper foil formed on a circuit board, a corner covering portion covering at least a part of a corner portion of the lower electrode, and a lower electrode and the corner covering portion. A dielectric layer formed by using a dielectric coating on the upper surface, an upper electrode formed by using a conductive coating on the dielectric layer, a connection electrode formed on the circuit board, and the upper electrode. A circuit board with a capacitor, the printed circuit board having a printed circuit board having a connecting part for connecting the above-mentioned parts, and the connecting part being formed so as to pass over the corner portion covering part with a part of the dielectric layer interposed therebetween. A circuit board with a capacitor, wherein the corner portion covering portion is made of a deposited film of ultrafine particles. 2. The circuit board with a capacitor according to claim 1, wherein the dielectric layer has a one-layer structure. 3. A corner covering portion is formed to cover at least a part of a corner portion of a lower electrode made of a copper foil formed on a circuit board, and the corner covering portion is formed on the lower electrode and the corner covering portion. A dielectric layer is formed on the dielectric layer, an upper electrode is formed on the dielectric layer using a conductive coating, and the connection electrode formed on the circuit board is connected to the upper electrode. A method of manufacturing a circuit board with a capacitor, wherein a connecting portion is formed so as to pass over the corner portion covering portion with a part of the dielectric layer interposed therebetween, wherein the corner portion covering portion is formed by a gas deposition method. A method of manufacturing a circuit board with a capacitor, which comprises depositing and forming ultrafine particles. 4. The method for manufacturing a circuit board with a capacitor according to claim 3, wherein the dielectric layer is formed by screen printing once. 5. A gas deposition type capacitor having a dielectric layer formed by a gas deposition method on a lower electrode made of copper foil and an upper electrode is provided on the circuit board, and the corner portion is provided. 5. The method for manufacturing a circuit board with a capacitor according to claim 3, wherein the coating portion is formed together when the dielectric layer or the upper electrode of the gas deposition type capacitor is formed.