JPH08236002A - Chip type current protecting element and its manufacture - Google Patents

Abstract

PURPOSE: To provide a chip type current protecting element excellent in insulation property after fused by having an insulating substrate, a pair of electrodes and a current protecting element wiring portion provided with a cavity in place to be fused. CONSTITUTION: An extremely thin copper foil 110 and a copper foil 130 are provided on both faces of an organic resin base material 120 to form the pattern of a current protecting element wiring portion 150 with 3-8μm wirings on the extremely thin copper foil 110. The pattern is formed for a plural of current protecting element wiring portion 150 to be longitudinally in series across an electrode portion 140 and laterally in one line of continuously parallel arrangement. Other copper foils 130 are provided on both faces, an organic resin base material 121 with a cavity forming hole 160 is prepared and the current protecting element wiring portion composition, the insulating material with the hole and an organic resin insulating base material 123 with a copper foil 130 on one face are adhered and jointed together. An end face connecting hole 170 is made in such a laminate, plating 180 is applied thereto and then an electrode portion 190 is formed. In this way, a chip type current protecting element excellent in fusion property is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic resin chip type current protection device and a method for manufacturing the same.

[0002]

2. Description of the Related Art Current protection devices are used for overcurrent protection of electronic equipment. The current protection element in the present invention is connected to an electric circuit in series, and when an overcurrent flows, the wiring in the protection element is cut, and the current after that is cut off to protect the device. . Such an element is generally called a fuse, but in order to be called a fuse, it is necessary to satisfy the characteristics defined in various standards. However, with the diversification of electronic devices, current protection devices having characteristics different from those of conventional fuse standards have also appeared. The present invention relates to a current protection element (English name: current protector) including a fuse, which operates as described above. In the overcurrent protection device, an electronic switch using a thyristor or a transistor can be used in addition to the current protection element as described above. However, in such a case, since the number of circuit components increases and the power consumed by the protection circuit also increases, miniaturization and low power consumption are required such as in battery-operated portable devices. It was not always suitable for some applications.

Therefore, as disclosed in JP-A-60-143544, silver or silver-palladium is used for the first layer, the nickel layer is used for the second layer, and the third layer is used for the ceramic substrate.
It is known that three layers of conductive layers of solder or tin are formed on the layers to improve the fusing characteristics during soldering. Also,
This publication also discloses coating the surface of the conductive layer with a non-combustible (flame-retardant) resin such as a silicone resin. However, a ceramic substrate provided with a current protection element (fuse) has a small thermal resistance of the ceramic substrate, and even if it is disclosed in the above-mentioned JP-A-60-143544, it is incombustible (flame-retardant). Even if the current protection element is covered with a conductive resin, the heat dissipation is high, and depending on the ambient temperature,
There was a problem that the current value for fusing often varied.

In order to solve the problem of this ceramic substrate, there is a method of using an organic resin insulating substrate. But,
When the substrate resin is an epoxy resin, a phenol resin, a polyimide resin, or the like, there is a problem of smoking or burning. Japanese Patent Laid-Open No. 5-166454 discloses that the use of a fluorine resin, which is one of the organic resins, for the insulating substrate can reduce the thermal conductivity as compared with ceramics and improve the fusing accuracy of the fuse. There is. This publication also discloses that the surface of the fuse wiring is covered with a silicone resin (rubber).

[0005]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
In JP-A No. 60-1435, by using a fluororesin having a nonflammable (flame retardant) property as a base material.
The above-mentioned problems of JP-A-44 have been solved. However, since silicone rubber is used to coat the surface of the fuse wiring, the silicone rubber coating is slightly damaged due to the high temperature at the time of fusing depending on the condition of overcurrent energization, and a slight amount of smoke is emitted for about 1 to 2 seconds. There was a problem that there was something.

The present invention is excellent in the accuracy of forming a current protection element (thickness and width of wiring), and by using an insulating substrate made of an organic resin, heat dissipation is suppressed and smoke and ignition are suppressed. An object of the present invention is to provide a chip-type current protection device having high insulation resistance and high reliability, and a method for manufacturing the same.

[0007]

A chip-type current protection device according to the present invention comprises an organic resin insulating substrate, a pair of electrodes provided at both ends of the insulating substrate, and an inside of the insulating substrate. And a current protection element wiring section formed by wiring between the electrodes, and the wiring thickness of the current protection element wiring section is 3 to 8
It is characterized in that it is of a micron size, and that a void is provided at least in a portion to be blown out of the current protection element wiring portion.

If the thickness of the wiring portion of the current protection element is 3 μm or less, it is difficult to control the thickness accuracy and it is unavoidable that pinholes are generated. If the thickness is 8 μm or more, it becomes difficult to form the current protection element wiring for accurately performing the fusing when the overcurrent is applied. As a metal foil used for an insulating substrate for forming wiring, an ultra-thin copper foil or an ultra-thin copper foil with an aluminum carrier, a copper (carrier) / nickel alloy (Japanese Patent Laid-Open No. 4-217815 ( There is a method of using a composite foil of stopper) / copper (extremely thin copper).

For the purposes of the present invention, the accuracy of the metal foil thickness is extremely important. From the experimental results obtained by the authors, in order to suppress the variation in the resistance of the current protection element wiring part to 15% or less, the accuracy of the thickness of the metal foil needs to be within ± 5%. In order to suppress the variation to 12% or less, the accuracy of the thickness of the metal foil needs to be within plus or minus 3%. The above ultra-thin copper foil or composite foil is manufactured by an electrolytic method or a rolling method, and its thickness accuracy is
Even those that are generally available are extremely good. As a result of the weight measurement (in the composite foil, the ultra-thin copper layer was dissolved and measured), the average value was about ± 1% in the same lot. Although the required accuracy of the thickness of the metal foil differs depending on the tolerance of the resistance variation, from the above results, the accuracy of the thickness of the metal foil is within ± 5%, more preferably within 3%. .

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The organic resin insulating substrate used in the present invention preferably uses a base material composed of a resin and a reinforcing material, and the resin is preferably a fluororesin. The reinforcement is
It is desirable that it is selected from glass cloth and glass paper. The fluororesin used for the base material itself is extremely difficult to burn and smoke, so the effect is further enhanced by combining this structure with this structure. The fluororesin includes polytetrafluoroethylene, copolymers such as tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene-ethylene copolymer, tetrafluoroethylene-perfluoroalkoxyethylene copolymer, and fluorine. A modified resin obtained by modifying the resin with another organic resin can be used. From the price, polytetrafluoroethylene is cheap and suitable. Further, since the molding temperature is low, a tetrafluoroethylene-perfluoroalkoxyethylene copolymer and a lower tetrafluoroethylene-ethylene copolymer are suitable.

Such a chip-type current protection device has the following features: a. In an insulating substrate having metal foil laminated on both sides, the thickness of the metal foil on at least one side is 3 to 8 μm, and by etching this metal foil, a plurality of current protection element wiring parts are formed on one side of the insulating substrate. Forming, b. Separately, a step of producing an insulating material having holes for forming voids at specific locations, c. The current protective element wiring part, the insulating material with a hole for forming a void in a specific place, and the insulating material with a metal foil stretched only on one surface are A step of aligning and laminating a protective element wiring part, and d. Drilling a hole for end face connection in this laminated adhesive, e. A step of plating to make the inside of the hole for end face connection a conductor, f. A step of forming an electrode portion by etching, g. It can be manufactured by a series of steps including a step of cutting into individual chip-type current protection elements by cutting the end face connection hole portion so that this portion becomes the electrode portions at both ends.

As another method, a. Of the metal foils laminated on both sides, at least one metal foil has a first copper layer having a thickness in the range of 10 to 50 microns and a second copper layer having a thickness in the range of 3 to 8 microns. And a metal foil having a nickel or alloy layer thereof having a thickness of 1 micron or less as an intermediate layer between the two copper layers, and the second copper layer of the metal foil is laminated so as to contact the insulating substrate. A step of producing an insulating substrate b. Removing the first copper layer, c. Further, removing the intermediate layer and exposing the second copper layer, d. Forming a plurality of current protection element wiring parts on one surface of an insulating substrate by etching the second copper layer, e. Separately, a step of manufacturing an insulating material having holes at specific locations, f. The current protective element wiring part, the insulating material with a hole for forming a void in a specific place, and the insulating material with a metal foil stretched only on one surface are Step of stacking and aligning with the protective element wiring part, and g. Making a hole for end face connection in this laminated adhesive, h. A step of performing plating to make the inside of the hole for end face connection into a conductor, i. A step of forming an electrode portion by etching, j. It can be manufactured by a series of steps including a step of cutting into individual chip-type current protection elements by cutting the end face connection hole portion so that this portion becomes the electrode portions at both ends.

Environmental temperature change of the place where the element is installed,
The thermal stress due to the temperature change caused by turning on and off the current flowing through the element itself is likely to be concentrated at the place where the current protection element wiring portion is connected to the end face connecting hole portion. Therefore, increasing the thickness of this portion of the current protection element wiring portion is effective in improving the connection reliability. The thicker it is, the more effective it is, but if it is too thick, the manufacturing burden (increase in working time, increase in material, change in lamination adhesion condition due to deterioration in embedding property due to resin material, etc.) increases. Further, when the thickness is a certain amount or more, the effect becomes small even if the thickness is further increased. From these, the thickness is suitably 10 to 50 microns.

The insulating material having holes for forming voids and another material may be adhered to each other by a material having a low softening point formed on the surface of the insulating material having holes for forming voids in advance. In addition, the softening point between the insulating material having holes and another insulating plate material is lower than that of the resin of the insulating material having holes, and the thickness thereof is preferably 5 to 30 μm, more preferably A resin film having a thickness of 5 to 15 μm may be inserted and adhered by this film. Both of them are used together, that is, on the surface of the insulating material with holes,
It is also possible to use a method in which a material having a low softening point is formed, and the latter resin film is interposed and laminated and adhered thereon. In this case, the thickness corresponding to the above-mentioned desirable range is the total thickness of the resin film and the material having a low softening point formed on the surface of the insulating material having holes. In addition,
When the resin film is inserted and laminated and adhered, the current protection element wiring portion is covered with the film, which serves as a protective coating layer of the current protection element. In the laminated adhesion, a combination of using polytetrafluoroethylene as an insulating material other than adhesion and using a copolymer of tetrafluoroethylene and ethylene having a lower softening point than polytetrafluoroethylene is suitable for adhesion. There is. With such a combination, when laminating and adhering, a material lower than the softening point of the resin material used for the formation of the current protection element wiring part is used,
The lamination adhesion temperature can be lowered, and the thermal distortion of the current protection element wiring portion can be reduced.

The present invention has a structure in which a current protection element wiring portion is housed in an insulating substrate so that sparks and smoke are less likely to be generated outside at the time of melting due to overcurrent. In particular, by using a fluororesin as the base material, the heat resistance of the fluororesin is high and it does not burn in the air, so that it is possible to obtain the advantages of preventing ignition of the element and high safety. Regarding this point, as described above, the one using ceramics as the base material is also safe, but ceramics has a low thermal resistance, and the heat necessary for fusing is difficult to concentrate locally, so it is low. It was difficult to manufacture a current protection element that melts due to an electric current. In the case of the present invention, the problem is solved because the organic resin is mainly used. Further, in the present invention, a void is provided in the current protection element wiring portion. The voids can hold air containing oxygen around the current protection element wiring portion, and the effect is that the wiring is quickly oxidized and melted by heat generated when an overcurrent is applied. Also, if there is air, it is considered that the fluororesin hardly produces carbides even when heated, and it quickly becomes a noncombustible gas, but in the absence of air, that is, in the fluororesin, the resistance wire It was found that when heated, the fluorocarbon resin also produces carbides. In the case of the present invention, by the air kept in the void,
The effect of preventing the formation of carbides and sufficiently increasing the insulation resistance after fusing is obtained, and it is particularly effective when the current protection element is used in applications requiring high reliability. In the void part,
A small amount of environmental substances, such as water vapor and sulfurous acid gas, that have penetrated from the cross section of the substrate may enter and corrode the current protection element wiring part. When this happens, the resistance value changes with time, which causes variations in the fusing characteristics, and is not suitable when high accuracy is required. In the case where the application requires high accuracy or is used in a bad environment, the method of inserting the resin film is effective. In this case, the size of the air gap existing on the upper surface of the current protection element wiring part should be small (in some cases,
The reason for this improvement is that the voids are eliminated), the exposed portions at the cross section of the voids, and the reinforcements that penetrate the substrate in the lateral direction are eliminated, so that the amount of diffusion of environmental substances is reduced. In this case, the effect of providing the voids may be reduced, but the effect of providing the voids can be obtained by appropriately adjusting the size of the voids, the resin material of the resin film, and the thickness. Adhesion of a protective layer to the surface of the current protection element wiring for protection is not suitable for the above-mentioned oxidation of copper during fusing due to the presence of air. When the thickness is 30 microns or less, more preferably 15 microns or less, the influence is relatively small. The reason is that the amount of resin is small, the resulting carbide is small, and the thickness is thin, so the high temperature at the time of fusing breaks the protective layer relatively easily and air is supplied to the fusing part. Can be considered. Whether or not to provide this protective layer, and how thick the protective layer should be, comprehensively consider the current standard, fusing characteristics, and operating environment of the chip-type current protective element to be designed, that is, It is necessary to make a decision after considering the balance between the adverse effect of providing the protective layer and the effect of removing the adverse effect of environmental substances. It should be noted that such a thin protective layer alone has a weak mechanical strength and cannot perform a sufficient function due to contact with other things, but in the case of the present invention, the current protection element wiring portion is provided on the insulating substrate. Since it is housed in a hollow space, mechanical strength is hardly required. Therefore, it is sufficient to prevent corrosion due to environmental substances, and such a thin protective film can achieve the purpose.

[0016]

【Example】

Example 1 An insulating substrate was prepared by laminating an ultrathin copper foil having a thickness of 5 μm on one surface and a normal copper foil having a thickness of 18 μm on the other surface (shown in FIG. 1 (a)). ). As the base material of this insulating substrate, a homemade glass cloth reinforced polytetrafluoroethylene resin prepreg is used, and ultra-thin copper foil and ordinary copper foil are overlaid, and the press conditions are temperature 380 ° C., time 90 minutes, pressure 20 kg. It was produced as / cm2. The pattern of the current protection element wiring portion was formed by etching an ultrathin copper foil of this product. The pattern is formed by arranging a plurality of current protection element wiring parts so as to be in series in the vertical direction with the electrodes sandwiched therebetween, and in a horizontal direction, one continuous array is arranged in parallel (see FIG. 1 (b ).). Separately, after etching the copper foil of the double-sided copper-clad laminate made of homemade glass cloth reinforced polytetrafluoroethylene resin on both sides,
Aflex film (a product of Asahi Glass, which is a copolymer of tetrafluoroethylene and ethylene
A 12 micron thick product (trade name) and a copper foil were superposed and thermocompression-bonded at a temperature of 280 ° C. for a time of 30 minutes and a pressure of 20 kg / cm 2 (shown in FIG. 1 (c)). This product has holes for forming voids (hole diameter 1.2 mm)
After being drilled (shown in FIG. 1D), the copper foils on both sides were removed by etching to obtain a perforated insulating material (shown in FIG. 1E) for forming voids. . The current protection element wiring portion formed product (shown in FIG. 1B) prepared above, and a perforated insulating material for forming voids (shown in FIG. 1E),
A glass cloth reinforced polytetrafluoroethylene resin insulating plate with a copper foil was laminated on one side and pressure-heated and bonded (Fig. 1).
(F). ). As shown in FIG. 1 (g), a hole for connecting the end faces is formed in this product, and plating is performed to a thickness of 15 microns. Then, as shown in FIG. 1 (h), the electrode portion is etched. Formed (shown in FIG. 1 (i)).

Example 2 The same material and process as in Example 1 were used to form one surface of an insulating substrate,
A pattern of the current protection element wiring part was formed to produce a current protection element wiring part formation product (shown in FIG. 2B). Separately, a hole for forming a void (hole diameter: in a homemade glass cloth reinforced polytetrafluoroethylene resin double-sided copper clad laminate)
1.2 mm) was drilled, and then the copper foils on both sides were removed by etching to obtain a perforated insulating material for forming voids (shown in FIG. 2 (c)). The current protection element wiring part formation product prepared earlier, the perforated insulating material for forming a void, and the Aflex film (a copolymer of tetrafluoroethylene and ethylene) on both sides of the perforated insulating material (Asahi 12 μm thick glass (trade name, manufactured by Glass Co., Ltd.) and a polytetrafluoroethylene resin insulating plate with a copper foil on one side are stacked, and the press conditions are a temperature of 280 ° C.
Thermocompression bonding was performed for 30 minutes at a pressure of 20 kg / cm @ 2 (shown in FIG. 2 (d)). A hole for connecting an end face is formed in this product (shown in FIG. 2 (e)), plated with a thickness of 15 μm (shown in FIG. 2 (f)), and an electrode part is formed by etching (shown in FIG. 2 (f)). 2 (g).).

Example 3 As shown in FIG. 3A, a first copper layer having a thickness of 15 μm, a second copper layer having a thickness of 5 μm, and an intermediate layer between the two copper layers. With a thickness of 0.2 micron
A metal foil having a phosphorus alloy layer was prepared. This metal foil is
It is a known one also disclosed in Japanese Patent Laid-Open No. 4-217815. This metal foil is, as shown in FIG.
An insulating substrate was produced by laminating a copper foil of 18 μm on one surface and the other surface so that the second copper layer was in contact. The material of the insulating substrate and the lamination adhesion conditions are the same as those used when manufacturing FIG. 1A of Example 1. Next, a specific portion (planned electrode portion) of the first copper layer is removed by etching (see FIG.
It is shown in (c). ), Further, the intermediate layer is removed to expose the second copper layer, and then the second copper layer is etched to form a plurality of current protection element wiring portions (FIGS. 3D and 3E).
Shown in ). Separately, a substrate having polytetrafluoroethylene as a resin base material and a glass base material as a reinforcing material and having holes for forming voids formed at specific locations was manufactured (shown in FIG. 3 (f)). The current protective element wiring part formation product, the insulating material with holes for forming voids, and the Aflex film, which is a copolymer of tetrafluoroethylene and ethylene, arranged so as to be located on both sides of this insulating material (Asahi 12 μm thick glass (trade name, manufactured by Glass Co., Ltd.) and an insulating material with a single-sided copper foil made of polytetrafluoroethylene resin and glass reinforcement, and a hole portion of the insulating material with holes Was aligned with the current protection element wiring portion and laminated and adhered (shown in FIG. 3 (g)). The pressing conditions at this time were a temperature of 280 ° C., a time of 30 minutes, and a pressure of 20 kg / cm 2.
And A hole for end face connection is made in this laminated adhesive (Fig. 3
It shows in (h). ), Plating was performed (shown in FIG. 3 (i)), the inside of the end face connecting hole was made into a conductor, and then the electrode portion was formed by etching (shown in FIG. 3 (j)).

COMPARATIVE EXAMPLE In Example 2, the fabrication was carried out in the same manner except that the holes for forming the voids were not formed and the other steps and materials were the same.
The chip-type current protection element substrates prepared in Examples 1 to 3 and Comparative Example were cut into current protection element units. In both the example and the comparative example, the conductor width of the current protection element wiring part was 0.05 mm, and the resistance value was about 180 mΩ. As a result of performing 20 fusing tests each, in both Example 1 and Example 2, the resistance value after fusing was 10 megohms or more, and most were at the level of gigaohm. In the comparative example, it was in the range of 50 kilohms to 500 megohms. No ignition or smoke was found in any of the examples and comparative examples.

[0020]

As described above, the chip-type current protection device of the present invention does not ignite or emit smoke, can be formed with accurate wiring, and can control the conduction resistance of the current protection device wiring part. Since this portion is formed of a thin copper foil with a thickness of 8 μm to 8 μm, it melts sensitively to an overcurrent and thus has excellent fusing characteristics. Also,
It also has excellent insulation properties after fusing.

[Brief description of drawings]

1A to 1I are diagrams showing respective steps for explaining an embodiment of the present invention, and FIGS. 1A and 1C are sectional views and FIG. ) Is a plan view.

2A to 2G are diagrams showing respective steps for explaining another embodiment of the present invention, and FIGS. 2A and 2C are sectional views, FIG. b) is a plan view.

3 (a) to 3 (j) are diagrams showing respective steps for explaining still another embodiment of the present invention, FIG.
(A)-(d) and (f)-(j) is sectional drawing, (e) is a top view.

FIG. 4 is a perspective view showing an embodiment of the present invention.

[Explanation of symbols]

 110. Ultra-thin copper foil 120. Base material 130. Copper foil 140. Electrode part 150. Current protection element wiring part 121. Base material 122. Resin material with low softening point 123. Base material 160. Holes for forming voids 161. Void 170. Hole for connecting the end face 180. Plating 190. Electrode part 210. Composite metal foil 211. First copper layer 212. Middle layer 213. Second copper layer 220. Base material 230. Copper foil 240. Electrode part 250. Wiring part for current protection device 260. Hole for void formation 221. Resin material with low softening point 222. Base material 270. Hole for end face connection 280. Plating 290. Electrode part

Front page continuation (72) Inventor Taniguchi ▲ 穣 ▼ 1500 Ogawa, Shimodate, Ibaraki Shimodate Factory, Hitachi Chemical Co., Ltd. (72) Inventor Iron ▲ Gun ▼ Mitsuo Tsuka 1500 Ogawa, Shimodate, Ibaraki Hitachi Chemical Industrial Co., Ltd.Shimodate Factory (72) Inventor Wataru Shimizu 1500 Ogawa, Shimodate, Ibaraki Hitachi Chemical Co., Ltd. Shimodate Factory (72) Inventor Hisashi Kobori 1500, Ogawa, Shimodate, Ibaraki Shimodate Hitachi Chemical Co., Ltd. Inside the factory (72) Inventor Kosuke Takada 1500 Ogawa, Shimodate City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Shimodate Factory

Claims (16)

[Claims] 1. An organic resin insulating substrate, a pair of electrodes provided at both ends of the insulating substrate, and wiring formed between the electrodes, and a current protection element wiring portion housed inside the insulating substrate. In the chip-type current protection device consisting of and, the wiring thickness of the current protection device wiring part is 3 to 8 microns,
Moreover, a chip-type current protection element, characterized in that it includes at least a planned fusing part of the current protection element wiring part, and a void is provided in the vicinity thereof. 2. The chip-type current protection device according to claim 1, wherein the thickness accuracy of the wiring having a thickness of 3 to 8 μm is within ± 5% of the average value. 3. The chip-type current protection device according to claim 1, wherein the thickness of the wiring at the connection between the current protection device wiring part and the electrode is 10 to 50 μm. 4. The organic resinous insulating substrate comprises a resin and a reinforcing material, the resin is a fluororesin, and the reinforcing material is selected from glass cloth and glass paper. Item 4. A chip-type current protection device according to any one of items 1 to 3. 5. The current protection element wiring portion located in the void portion,
5. The chip type current protection device according to claim 1, which is covered with a protective coating layer having a thickness of 5 to 30 μm. 6. The chip type current protection device according to claim 1, wherein the protective coating layer is made of a fluororesin material. 7. A. In an insulating substrate having metal foil laminated on both sides, the thickness of the metal foil on at least one side is 3 to 8 μm, and by etching this metal foil, a plurality of current protection element wiring parts are formed on one side of the insulating substrate. Forming, b. Separately, a step of producing an insulating material having holes for forming voids at specific locations, c. A current protective element wiring portion formed product, an insulating material with a hole for forming a void at a specific location, and an insulating material having a metal foil stretched only on one side, and the outermost layer is a metal foil, and A step of aligning a hole forming portion for forming a void with a current protection element wiring portion and laminating and adhering the same; d. Drilling a hole for end face connection in this laminated adhesive, e. A step of plating to make the inside of the hole for end face connection a conductor, f. A step of forming an electrode portion by etching, g. A method for manufacturing a chip-type current protection element, comprising the step of cutting into individual chip-type current protection elements such that the end-connecting hole portions are cut to form electrode portions at both ends. 8. In step a, a metal foil having a thickness of 3 to 8 μm attached to an insulating substrate is preliminarily plated so that the thickness of a portion to be an electrode becomes 10 to 50 μm. The method for manufacturing a chip-type current protection device according to claim 7, further comprising a step of performing. 9. A. Of the metal foils laminated on both sides, at least one metal foil has a first copper layer having a thickness in the range of 10 to 50 microns and a second copper layer having a thickness in the range of 3 to 8 microns. And a metal foil having a nickel or alloy layer thereof having a thickness of 1 micron or less as an intermediate layer between the two copper layers, and the second copper layer of the metal foil is laminated so as to contact the insulating substrate. A step of producing an insulating substrate b. Removing the first copper layer, c. Further, removing the intermediate layer and exposing the second copper layer, d. Forming a plurality of current protection element wiring parts on one surface of an insulating substrate by etching the second copper layer, e. Separately, a step of producing an insulating material having holes for forming voids at specific locations, f. A current protective element wiring portion formed product, an insulating material with a hole for forming a void at a specific location, and an insulating material having a metal foil stretched only on one side, and the outermost layer is a metal foil, and A step of aligning a hole portion for forming a void with a current protection element wiring portion and laminating and adhering the same; g. Making a hole for end face connection in this laminated adhesive, h. A step of performing plating to make the inside of the hole for end face connection into a conductor, i. A step of forming an electrode portion by etching, j. A method for manufacturing a chip-type current protection element, comprising the step of cutting into individual chip-type current protection elements such that the end-connecting hole portions are cut to form electrode portions at both ends. 10. The removal of the first copper layer in step b
The method for manufacturing a chip-type current protection device according to claim 9, wherein the process is performed only on a portion other than the electrode planned portion. 11. The insulating substrate comprises a resin and a reinforcing material, the resin is a fluororesin, and the reinforcing material is selected from glass cloth and glass paper. A method for manufacturing the chip-type current protection device according to any one of the above. 12. The insulating material is in the form of a fluororesin film or a fluororesin material reinforced with a material selected from glass cloth and glass paper. A method for manufacturing a chip-type current protection device according to any one of 1. 13. The thickness accuracy of the metal foil having a thickness of 3 to 8 μm or the second copper layer having a thickness of 3 to 8 μm is within ± 5% of the average value. 13. The method for manufacturing a chip-type current protection device according to claim 7, wherein the chip-type current protection device is manufactured. 14. An insulating material having a hole for forming a void at a specific position, and a resin material having a low softening point formed by a thickness of 5 to 30 μm on the surface of the insulating material. The method for manufacturing a chip-type current protection device according to claim 7, wherein the resin material is adhered to another material with a resin material having a low softening point. 15. A laminated bonding process of an insulating material having a hole for forming a void at a specific location and another material has a hole on both sides of an insulating material having a hole for forming a void at a specific location. The softening point is lower than that of the resin of the insulating material, and is performed by inserting a resin film having a thickness of 5 to 30 μm. Manufacturing method of chip-type current protection device. 16. The resin material having a low softening point is a copolymer of ethylene and tetrafluoroethylene, and the other material is a polytetrafluoroethylene resin. A method for manufacturing the chip-type current protection device described in.