JPH0822933A - Chip solid electrolytic capacitor and manufacture threof - Google Patents

Abstract

PURPOSE:To make it possible to mount a plurality of kinds of capacitor elements, which are different in external size, by a common lead frame having one kind of a terminal structure. CONSTITUTION:In a chip solid electrolytic capacitor of a constitution that an anode metal terminal 10 and a cathode metal terminal 4 with the point part bent into a step form are made to arrange in opposition to each other and an electrode extraction layer 5 of a capacitor element and an anode lead 2 of the capacitor element are respectively bonded on the bent inner surface of the terminal 4 and to the electrode 10 and are mounted to the terminals 4 and 10, the point part 10a of the terminal 10, which is bonded to the element, is flexibly formed and the terminal 10 is bendably bonded to the lead 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type solid electrolytic capacitor and a method for manufacturing the same, and more particularly to a lead frame having one type of terminal structure so that a plurality of types of capacitor elements having different outer dimensions can be assembled. Is.

[0002]

2. Description of the Related Art As shown in FIG. 3, a solid electrolytic capacitor of this type has a capacitor element 1 which is formed by press-molding and sintering a metal powder having a valve action into a prismatic shape.
A metal wire having a valve action was erected as an anode lead 2, a plate-shaped anode metal terminal 3 was welded to the anode lead 2, and a plate-shaped cathode metal terminal 4 was formed on the peripheral surface of the capacitor element 1. The electrode lead-out layer 5 is joined using a conductive adhesive 6, and the main part including the capacitor element 1 is
The exterior resin material 7 is molded and coated.

To manufacture a solid electrolytic capacitor having such a structure, as shown in FIG. 4, the anode metal terminal 3 and the tip end are bent in a stepwise manner, and the joint portion 4a with the capacitor element 1 is formed on the bent inner surface side. A plurality of pairs of the cathode metal terminals 4 formed with are arranged so as to face each other, and the lead frame 8 integrally connected is used, and the capacitor element 1 is assembled as follows. .

That is, a conductive adhesive 6 is applied to the bent inner surface of each cathode metal terminal 4, the capacitor element 1 is placed thereon, and the anode lead 2 is attached to the tip of the anode metal terminal 3. After welding, the conductive adhesive 6 is thermoset, the electrode extraction layer 5 on the peripheral surface of the capacitor element 1 and the cathode metal terminal 4 are joined, and the capacitor element 1 is assembled to the lead frame 8. Then, the assembled lead frame 8 is molded with the exterior resin material 7 by an injection molding device,
By cutting and separating into individual capacitors and bending both terminals 3 and 4, a solid electrolytic capacitor having a shape as shown in FIG. 3 is obtained.

As described above, the solid electrolytic capacitor in which the capacitor element 1 is mounted on the lead frame 8 and resin-molded has a uniform outer shape formed by injection molding or the like and is suitable for a chip component. The processing step such as resin molding is characterized by high efficiency in batch processing.

[0006]

By the way, in general, the capacitance C of the capacitor element 1 differs depending on the size of its outer diameter, and when the same material is used, the capacitance of a large outer shape becomes large. For this reason, as shown in FIG. 4, the lead frame 8 is used in which the bending depth h of the joining portion 4a at the tip is different according to the thickness dimension T of the capacitor element 1 to be assembled. For example, FIG. 5 (a) (b)
As shown in FIG. 5, a lead frame 8a having a shallow bending depth h ₁ is used for the capacitor element 1a having a small thickness dimension T ₁ , and a deep bending depth h is used for the capacitor element 1b having a large thickness dimension T _{2. 2} leadframe 8b
Were used respectively.

As described above, in the manufacture of the conventional chip-type solid electrolytic capacitor, the bending depth h of the joining portion 4a at the tip of the cathode metal terminal 4 is set in accordance with the thickness dimension T of the capacitor element 1, and each of them is static. It is necessary to prepare and separately use the lead frame 8 having a different terminal structure for each type of the capacitance C, which causes problems such as poor work efficiency, an increase in the number of stocked members in stock, and a mistake in use. It was

Therefore, the present invention has been made in view of the problems in the production of such a chip type solid electrolytic capacitor, and it is possible to easily manage materials and prevent a decrease in work efficiency and a work error. It is an object.

[0009]

Therefore, according to the present invention, a plurality of types of capacitor elements having different thickness dimensions T are formed by flexibly forming a joining portion on the front end side to which the capacitor element of the anode metal terminal of the lead frame is connected. It can be assembled with a common lead frame having one type of terminal structure, and is specifically configured as follows. That is, in the chip-type solid electrolytic capacitor of the present invention, the anode metal terminal and the cathode metal terminal whose tip portion is bent stepwise are arranged to face each other, and the capacitor element is provided on the bent inner surface of the cathode metal terminal. A chip in which the electrode lead-out layer of (1) is joined to the anode leads of the capacitor element at the tip of the anode metal terminal, and the rear ends of both metal terminals are led out in opposite directions, and the main part including the capacitor element is covered with resin. The solid electrolytic capacitor of the type is characterized in that at least the tip end portion of the anode metal terminal to which the capacitor element is joined is formed flexibly and is joined flexibly to the anode lead. Further, the lead frame for a chip-type solid electrolytic capacitor of the present invention is configured such that a plurality of pairs of anode metal terminals and cathode metal terminals whose tip portions are bent in a stepwise manner are opposed to each other and are integrally connected to each other. In a lead frame for a solid electrolytic capacitor, wherein an electrode lead-out layer of a capacitor element is joined to a bent inner surface, and an anode lead of the capacitor element is joined to the anode metal terminal, the capacitor element is joined to the anode metal terminal. It is characterized in that the end portion to be formed is flexible. Further, the lead frame for a chip type solid electrolytic capacitor is characterized in that the tip end portion of the anode metal terminal is crushed into a thin wall by a press and is formed to be flexible. Further, in the method for manufacturing a chip-type solid electrolytic capacitor of the present invention, the capacitor element is arranged on a lead frame in which the anode metal terminal and the cathode metal terminal whose tip is bent stepwise are opposed to each other, and the bending is performed. An electrode lead-out layer of the capacitor element on the inner surface, the anode lead of the capacitor element is bonded to the tip of the anode metal terminal, respectively, in the method of manufacturing a chip-type solid electrolytic capacitor, the capacitor element is assembled to a lead frame, It is characterized in that the tip end side of the anode metal terminal is formed to be flexible and the tip end portion is bent and joined to the anode lead.

[0010]

Since the tip of the anode metal terminal is formed to be flexible, the height position of the anode lead of the capacitor element to be welded thereto is determined by the thickness T of the capacitor element.
Even if the position is displaced up and down, the tip can be freely bent and joined. Therefore, it is possible to assemble a plurality of types of capacitor elements having different thickness dimensions T by using a common lead frame in which the bending depth h of the tip portion of the cathode metal terminal is set to a certain fixed dimension.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 are sectional views and perspective views showing an assembling state of a chip type solid electrolytic capacitor according to an embodiment of the present invention.

As a feature of the present invention, as shown in FIG. 2, a lead frame 9 used for assembling the capacitor element 1 has at least a tip of an anode metal terminal 10 connected to the anode lead 2 of the capacitor element 1. The portion 10a is formed to be flexible, and the flexible tip portion 10a is bent and joined, and the other configurations are the same as the above-described conventional configurations. Therefore, the same components are designated by the same reference numerals and the description thereof will be omitted.

The anode metal terminal 10 is formed by crushing the tip end portion 10a into a thin wall by pressing to make it flexible, and as shown in FIG. 1, the tip end portion 10a is bent and joined to the anode lead 2.

That is, as shown in FIGS. 1 (a) and 1 (b), the bending depth is small for both the capacitor element 1a having a small thickness dimension T _{1 and} the capacitor element 1b having a large thickness dimension T _2. Lead frames 9 having the same h and the same design are commonly used. In this case, in the capacitor element 1a having a small thickness dimension T ₁ , the anode lead 2 has the lead frame 9 as shown in FIG.
Although it is located below the anode metal terminal 10, the tip 10a is pressed downward by the welding jig 11, bent, and welded to the anode lead 2. For the capacitor element 1b having a large thickness T2, the anode lead 2 is connected to the lead frame 9 as shown in FIG.
The anode metal terminal 10 is located at substantially the same height as the anode metal terminal 10, and the anode metal terminal 10 is welded to the anode lead 2 without bending the tip portion 10a.

In the present invention, the lead frame 9 is made flexible by crushing the tip end portion 10a of the anode metal terminal 10 into a thin wall by pressing, but may be thinned by chemical etching. It is also possible to construct a separate piece such as by welding a flexible connecting piece to the tip of the anode metal terminal 10.

[0017]

As described above, according to the present invention, in the chip-type solid electrolytic capacitor, the lead frames for assembly can be unified even in the case where the external dimensions of the capacitor elements are different, and the work efficiency can be improved. It will be easier to improve, reduce the number of stockholdings, and manage materials such as elimination of misuse.

[Brief description of drawings]

1A and 1B are cross-sectional views showing an assembled state of a chip type solid electrolytic capacitor of the present invention.

FIG. 2 is a perspective view showing how the chip-type solid electrolytic capacitor of FIG. 1 is attached.

FIG. 3 is a cross-sectional view of a conventional chip type solid electrolytic capacitor.

FIG. 4 is a perspective view showing a mounting state of a conventional chip type solid electrolytic capacitor.

5A and 5B are cross-sectional views showing a mounting state of a conventional chip type solid electrolytic capacitor.

[Explanation of symbols] 1, 1a, 1b Capacitor element 2 Anode lead 4 Cathode metal terminal 5 Electrode extraction layer 7 Exterior resin material 9 Lead frame 10 Anode metal terminal 10a Tip

Claims (4)

[Claims] 1. An anode metal terminal and a cathode metal terminal whose tip portion is bent stepwise are arranged to face each other, and an electrode lead-out layer of a capacitor element is provided on the bent inner surface of the cathode metal terminal. In the chip type solid electrolytic capacitor, the anode lead of the capacitor element is respectively joined to the tip of the anode metal terminal, the rear ends of both metal terminals are led out in opposite directions, and the main part including the capacitor element is resin-coated. A chip-type solid electrolytic capacitor, characterized in that at least a tip portion of an anode metal terminal to which a capacitor element is joined is formed flexibly and is joined flexibly to an anode lead. 2. A plurality of pairs of anode metal terminals and cathode metal terminals whose tips are bent stepwise are integrally connected so as to face each other, and electrodes of capacitor elements are connected to the bent inner surfaces of the cathode metal terminals. In a lead frame for a solid electrolytic capacitor in which a lead layer is joined and an anode lead of a capacitor element is joined to the anode metal terminal, a tip portion of the anode metal terminal to which the capacitor element is joined is flexibly formed. A terminal frame for a chip-type solid electrolytic capacitor characterized by the above. 3. The terminal frame for a chip-type solid electrolytic capacitor according to claim 2, wherein the tip end portion of the anode metal terminal is crushed into a thin wall by a press to have flexibility. 4. A capacitor element is arranged on a lead frame in which a plurality of pairs of anode metal terminals and cathode metal terminals whose tips are bent stepwise are arranged so as to face each other, and electrodes of the capacitor elements are arranged on the bent inner surface. In the method for manufacturing a chip-type solid electrolytic capacitor, wherein a lead-out layer is formed by bonding the anode leads of the capacitor element to the tip of the anode metal terminal, and assembling the capacitor element to the lead frame, the tip side of the anode metal terminal. A method of manufacturing a chip-type solid electrolytic capacitor, which comprises flexibly forming a tip and bending the tip to join the anode lead.