JPH08227870A - Wet treatment device - Google Patents

Abstract

PURPOSE: To provide a wet treatment device which is capable of decreasing cleaning pure water in amount and efficiently cleaning a work with pure water. CONSTITUTION: A wet treatment device is equipped with a chemical tank 7 where semiconductor wafers are treated and a rinsing tank 1 where semiconductor wafers are cleaned with pure water, wherein a pipe through which pure water is fed to the rinsing tank 1 is provided along outside the outer wall 1D, of the rinsing tank 2 extending in the direction of Y, exhaust nozzles 3 arranged in the direction of Y are provided in the outer wall 1D, and the exhaust nozzles 3 and the pipe 2 are connected together, whereby pure water is spouted out of the exhaust nozzles 3 into the rinsing tank 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wet processing apparatus for processing a semiconductor wafer in a semiconductor device manufacturing process, and more particularly to a washing tank in the wet processing apparatus and a pure water supply mechanism for the washing tank.

[0002]

2. Description of the Related Art Conventionally, various types of wet processing apparatuses for processing semiconductor wafers have been proposed. For example, Japanese Patent Application Laid-Open No. 4-80924 intends to downsize a cleaning device by supplying a cleaning liquid and pure water to a single tank, but as for the supply of pure water, one shower is provided above. Only the pure water supply port is provided at the bottom with the port, and no consideration is given to the efficient cleaning of the semiconductor wafer with pure water.

In order to efficiently clean a semiconductor wafer, especially a large number of semiconductor wafers mounted on a carrier, with pure water,
It is necessary to eject pure water from a pipe for supplying pure water through a plurality of ejection ports.

For this reason, conventionally, a water washing tank and a pure water supply mechanism therefor as shown in FIG. 4 have been used. That is, the washing tank 11 for washing a large number of semiconductor wafers mounted on a carrier with pure water is a side surface portion 11A, 11A, 11B, 1
1B and an outer wall having a bottom portion 11C, a pipe 12 for supplying pure water as shown by an arrow 10 is introduced from the side surface portion 11B of the outer wall into the water washing tank 11 through the packing 15, and the pipe inside the water washing tank 11 is introduced. A plurality of jet outlets 13 are formed at 12 locations, and pure water is jetted 14 therefrom.

[0005]

However, in the above-mentioned conventional structure, a space for drawing the pipe 12 into the tank and a space for installing the pipe 12 in the lower part of the tank are required, and therefore, the volume of the washing tank 11 becomes large. Therefore, a large amount of pure water is required. The use of a large amount of pure water causes a problem that the pure water purifier must be upsized, and also a wastewater treatment device must be upsized. It is important to reduce the amount of pure water used to reduce initial investment and running costs.

Therefore, an object of the present invention is to provide a wet processing apparatus capable of reducing the amount of pure water used and efficiently cleaning pure water.

[0007]

A feature of the present invention is to provide a wet processing apparatus comprising a chemical bath for containing a chemical liquid and treating a semiconductor wafer therein, and a washing bath for rinsing the semiconductor wafer with pure water. A pipe for supplying pure water to the washing tank is provided outside the outer wall of the washing tank so as to extend in one direction along the outer wall, and a plurality of jet ports arranged in the one direction are formed in the outer wall. The pure water is jetted into the washing tank from the jet port by connecting the jet port and the pipe.
The outer wall of the washing tank has a side surface portion, a bottom surface portion, and an inclined surface portion that is bent inward from the side surface portion toward the bottom surface portion, and the plurality of ejection ports are formed in the inclined surface portion. Is preferred.

[0008]

According to the present invention, since the plurality of jetting means for efficiently cleaning the semiconductor wafer with pure water are formed without the pipe for supplying pure water entering the washing tank.
The volume of the washing tank can be reduced, and therefore the amount of pure water used can be reduced.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a washing tank according to an embodiment of the present invention and a mechanism for supplying pure water thereto, and FIG. 2 is a side sectional view thereof.
FIG. 3 is a diagram showing an outline of the wet processing apparatus according to the embodiment of the present invention.

First, referring to FIG. 3, the wet processing apparatus comprises a chemical solution tank 7, a water washing tank 1 in which a pure water supply pipe 2 is arranged, and a dryer 8 such as a centrifugal dehydration dryer. The semiconductor wafer is transported as shown by an arrow 9, treated with a chemical in the chemical bath 7, washed with pure water in the washing bath 1 and dried in the dryer 8.

The present invention relates to a washing tank and a mechanism for supplying pure water thereto, and an embodiment thereof will be described with reference to FIGS. 1 and 2.

The washing tank 1 comprises a pair of side surface portions 1A, 1A, a pair of side surface portions 1B, 1B, a bottom surface portion 1C, and side surface portions 1A, 1A.
To the bottom surface portion 1C, the outer wall is formed by a pair of inclined surface portions 1D and 1D that are bent inward.
A deionized water outlet is formed in the bottom surface portion 1C, but is not shown.

As shown by an arrow 10, a pipe 2 for supplying pure water extends in the X direction, and an inclined surface portion 1 of the outer wall of the washing tank 1
It extends along the outer surface of D and 1D and is fixed to this outer surface and extends in the Y direction.

On the other hand, a series of jet outlets 3 is formed in the Y direction on each of the inclined surface portions 1D and 1D, and the jet ports 3 and the inside of the pipe 2 are connected to each other to flow in the hype 2. Pure water is ejected 4 from the ejection port 3 into the washing tank 1. In this case, a hole corresponding to the ejection port 3 may be formed in the pipe 2, or a slit corresponding to the series of ejection ports 3 may be formed on the pipe side. It is necessary to weld or fix a portion of the outer surface of the inclined surface portions 1D, 1D near the ejection port 3 and the pipe 3 with a fixing material so that pure water does not leak from this portion.

As shown in FIG. 2, a carrier 6 having a large number of semiconductor wafers 5 mounted thereon is placed in the washing tank 1. Since the semiconductor wafers 5 are arranged in the Y direction (perpendicular to the paper surface in FIG. 2) and are mounted on the carrier 6 with a predetermined space therebetween, the pure water from the jet nozzles 3 arranged in the Y direction is collected. The jetting 4 enables efficient cleaning.

The portion of the pipe 2 for ejecting pure water, which extends in the Y direction, is located outside the outer wall without entering the washing tank.
2 formed by a virtual surface in which A and 1A are lowered as they are, and a virtual surface in which the bottom surface portion 1C is extended left and right, and inclined surface portions 1D and 1D
The volume of the washing tank can be reduced by the volume of one triangular column, and the amount of pure water used can be reduced.

[0018]

As described above, according to the present invention, since the pipe is not inserted into the washing tank, the washing tank can be downsized, and as a result, the amount of pure water used can be reduced.
Further, by reducing the usage amount, it is possible to downsize the pure water purifier and the wastewater treatment device.

[Brief description of drawings]

FIG. 1 is a perspective view showing a washing tank and a pure water supply pipe according to an embodiment of the present invention.

FIG. 2 is a side sectional view showing a washing tank and a pure water supply pipe according to an embodiment of the present invention.

FIG. 3 is a diagram showing an outline of a wet processing apparatus according to an embodiment of the present invention.

FIG. 4 is a perspective view showing a conventional technique.

[Explanation of symbols]

 1,11 Washing tank 1A, 1B, 11A, 11B Side surface of outer wall of washing tank 1C, 11C Bottom surface of outer wall of washing tank 1D Inclined surface of outer wall of washing tank 2,12 Pure water supply pipe 3,13 Jet port 4 , 14 Deionized pure water 5 Semiconductor wafer 6 Carrier 7 Chemical bath 8 Dryer 9 Semiconductor wafer transfer 10 Pure water flow

Claims (2)

[Claims] 1. A wet processing apparatus comprising a chemical bath for containing a chemical solution and treating a semiconductor wafer therein, and a washing bath for rinsing the semiconductor wafer with pure water. Pure water is supplied to the washing bath. A pipe is provided outside the outer wall of the flush tank so as to extend in one direction along the outer wall, and a plurality of jet outlets arranged in the one direction are formed in the outer wall, and the jet outlet and the pipe are A wet treatment apparatus characterized in that the pure water is jetted into the washing tank from the jet port by being connected. 2. The outer wall of the flush tank has a side surface portion, a bottom surface portion, and an inclined surface portion that is bent inward from the side surface portion toward the bottom surface portion, and the plurality of ejection ports are provided in the inclined surface portion. The wet processing apparatus according to claim 1, wherein the wet processing apparatus is formed.