JP3972399B2 - Cleaning device and cleaning method - Google Patents
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【０００１】
【発明の属する技術分野】
この発明は、半導体ウェハ等の被洗浄物の洗浄、乾燥等の処理を行なう洗浄装置及び洗浄方法に関し、特に被洗浄物を収容して密閉した洗浄槽に給液配管及び排液配管を介して洗浄液を循環させて被洗浄物の洗浄を行なうことにより設置スペースの低減及び処理効率の向上を図ったものである。
【０００２】
【従来の技術】
従来、半導体ウェハ用の洗浄装置としては、複数の洗浄液槽を平面上に一列に配置しておき、多数枚の半導体ウェハを保持したキャリアを複数の洗浄液槽に順次に浸漬しつつ移動させることにより半導体ウェハの洗浄を行なうものが提案されている。
【０００３】
一方、機械加工された機械部品用の洗浄装置としては、処理室内に浸漬洗浄槽及び噴射洗浄室を上下方向に並べて配置すると共に乾燥室を配置し、多数の機械部品を収容した通水性のバスケットを浸漬洗浄槽、噴射洗浄室及び乾燥室の順に移動させることにより機械部品に浸漬洗浄、噴射洗浄及び乾燥を施すものが知られている（例えば、特開平８−８９９１３号公報参照）。
【０００４】
【発明が解決しようとする課題】
上記した半導体ウェハ用の洗浄装置によると、（イ）洗浄液槽を平面的に配列すると共にその周辺に排気設備を設ける必要があることから設置スペースが極めて大きいこと、（ロ）各洗浄槽では洗浄液が汚れやすく、洗浄液の補充乃至交換を頻繁に行なう必要があることから洗浄液の使用量が極めて多いこと、（ハ）半導体ウェハを保持したキャリアを各洗浄槽毎に搬入し、浸漬し、搬出することから処理効率が低いこと、（ニ）浸漬時には各半導体ウェハの表面に洗浄液を単に接触させて洗浄を行なうことから洗浄効果のウェハ面内ばらつきが大きいことなどの問題点がある。
【０００５】
一方、上記した機械部品用の洗浄装置によると、浸漬洗浄槽及び噴射洗浄室を上下方向に並べて配置するので、設置スペースをある程度低減可能である。しかし、機械部品を通水性のバスケットに収容した状態で浸漬洗浄、噴射洗浄及び乾燥を行なうので、これらの処理部を間仕切りで互いに分離すると共に間仕切りにはバスケットの搬送を可能にするために開閉部を設ける必要があり、省スペース化が制約される。
【０００６】
また、浸漬洗浄方式であるため、前述した半導体ウェハ用の洗浄装置と同様に洗浄液の使用量が多いこと、処理効率が低いこと、洗浄効果のばらつきが大きいことなどの問題点を免れない。
【０００７】
この発明の目的は、上記した従来技術の問題点を解決した新規な洗浄装置を提供することにある。
【０００８】
【課題を解決するための手段】
この発明に係る洗浄装置は、
上方開口部を介して被洗浄物を収容するための容器と、この容器を前記上方開口部にて密閉するための蓋とを有する洗浄槽であって、給液配管及び排液配管をそれぞれ着脱可能な第１及び第２の配管装着孔が設けられたものと、
それぞれ前記給液配管及び前記排液配管として用いられる第１及び第２の配管を有する第１の洗浄手段であって、前記容器に前記被洗浄物が収容され且つ前記容器が前記蓋で密閉された状態で前記第１及び第２の配管装着孔に前記第１及び第２の配管をそれぞれ装着して前記第１及び第２の配管を介して前記洗浄槽に第１種の洗浄液を循環させることにより前記被洗浄物を洗浄し、その洗浄の終了後に前記第２の配管を介して前記洗浄槽から前記第１種の洗浄液を抜取り且つ前記洗浄槽から前記第１及び第２の配管を取外すものと、
前記第１及び第２の配管装着孔の一方及び他方にそれぞれ着脱可能な第３及び第４の配管を有する第２の洗浄手段であって、前記第１の洗浄手段による配管取外しの終了後に前記第１及び第２の配管装着孔の一方及び他方に前記第３及び第４の配管をそれぞれ装着して前記第３及び第４の配管を介して前記洗浄槽に前記第１種の洗浄液とは異なる第２種の洗浄液を循環させることにより前記被洗浄物を洗浄するものと、
前記洗浄槽を第１の洗浄位置からそれとは別の第２の洗浄位置に搬送する搬送手段とを備え、
前記第１の洗浄手段は前記第１の洗浄位置において前記第１種の洗浄液による洗浄と前記第１種の洗浄液の抜取りと前記第１及び第２の配管の取外しとを行ない、前記第２の洗浄手段は前記第２の洗浄位置において前記第２種の洗浄液による洗浄を行ない、前記第１の洗浄手段は、前記第２の洗浄手段が洗浄を行なっているときに前記第１の洗浄位置において前記洗浄槽と同様の構成の他の洗浄槽の複数の配管装着孔に前記第１及び第２の配管をそれぞれ装着して前記第１及び第２の配管を介して該他の洗浄槽に前記第１種の洗浄液を循環させることにより該他の洗浄槽内の被洗浄物を洗浄するものである。
【０００９】
この発明の構成によれば、密閉した洗浄槽の中で被洗浄物の洗浄を行なうので、排気設備や間仕切り等が不要である。従って、設置スペースの低減が可能であり、しかも被洗浄物に対するパーティクルの付着量が従来のキャリアや通水性バスケットを使用する場合に比べて大幅に低減される。
【００１０】
また、給液配管及び排液配管を介して洗浄槽に洗浄液を循環させて洗浄を行なうので、被洗浄物の表面を清浄な洗浄液がたえず洗い去るようになり、均一で迅速な洗浄が可能である。また、洗浄槽が密閉されているため、洗浄液の加圧供給や減圧排出も可能である。従って、処理効率が向上すると共に洗浄液の使用量も少なくて済む。
【００１１】
さらに、給液配管及び排液配管を洗浄槽の配管装着孔に着脱自在としたので、配管の交換により異種の洗浄液による洗浄や乾燥等の処理を簡単に行なうことができ、処理効率を一層向上させることができる。
【００１２】
【発明の実施の形態】
図１は、この発明の一実施形態に係る洗浄装置を示すもので、この洗浄装置で用いられる洗浄槽と循環装置及び配管着脱装置とは、それぞれ図２と図３とに示されている。
【００１３】
箱体１０は、処理室１０Ａを構成するもので、上部には搬入口１０ａ及び搬出口１０ｂが設けられている。搬入口１０ａから処理室１０Ａの底部に向けて垂直方向に延長するように一対の搬送路１２ａ，１２ｂが設けられている。搬送路１２ａ，１２ｂは、処理室１０Ａの底部において水平方向に延長すると共に処理室１０Ａの底部から搬出口１０ｂに向けて垂直方向に延長し、さらに箱体１０の上部において搬出口１０ｂから搬入口１０ａに向けて水平方向に延長しており、全体として閉ループ状に設けられている。
【００１４】
搬送台１２Ａ〜１２Ｇは、図示しない搬送機構により搬送路１２ａ，１２ｂに沿って洗浄槽２０Ａ〜２０Ｇをそれぞれ搬送するもので、各搬送台は、搬入口１０ａに相当する開始位置Ａから薬液洗浄位置Ｂ1 〜Ｂ3 、純水洗浄（リンス）位置Ｃ、乾燥位置Ｄを経由して搬出口１０ｂに相当する終了位置Ｅに至り、この後開始位置Ａに戻るようになっている。また、搬送台１２Ａ〜１２Ｇは、例えば搬送台１２Ａが開始位置Ａから洗浄位置Ｂ1 に移動するのに同期して搬送台１２Ｇが洗浄位置Ｂ1 から洗浄位置Ｂ2 に移動するようにして互いに同期して現在位置から次の位置に矢印Ｓ1 〜Ｓ7 で示すように移動するようになっている。
【００１５】
洗浄槽２０Ａ〜２０Ｇは、互いに同様の構成を有するもので、代表として洗浄槽２０Ｇの構成を図１，２について説明する。洗浄槽２０Ｇは、容器２２と、この容器を密閉するための蓋２４とを備えている。蓋２４は、図１の洗浄槽２０Ａに関して示すように開いた状態で容器２２に保持されると共に、図１の洗浄槽２０Ｇに関して示すように閉じた状態で洗浄液Ｗが漏れないように容器２２の開口部に液密的に係合するようになっている。このような保持・密閉機構は、特殊なものではないので、図示を省略した。
【００１６】
容器２２内には、多数枚の被処理ウェハ（例えば半導体ウェハ）２８を保持するウェハホルダ２６が収容される。ウェハホルダ２６は、一例として、対向する支持板３０Ａ，３０Ｂにより平行な保持バー３２Ａ，３２Ｂを固定的に支持すると共に保持バー３２Ａ，３２Ｂに刻設した対向する溝毎に被処理ウェハ２８を保持する構成のものを使用することができる。
【００１７】
容器２２の底部近傍には、給液配管１４ａ及び排液配管１４ｂをそれぞれ着脱可能な配管装着孔２２ａ及び２２ｂが設けられている。配管装着孔２２ａ，２２ｂには、洗浄位置Ｂ2 の給液配管１４ｃ及び排液配管１４ｄもそれぞれ着脱可能であり、洗浄位置Ｂ3 の給液配管１４ｅ及び排液配管１４ｆもそれぞれ着脱可能であり、洗浄位置Ｃの給液配管１４ｇ及び排液配管１４ｈもそれぞれ着脱可能であり、乾燥位置Ｄの給気配管１６ａ及び排気配管１６ｂもそれぞれ着脱可能である。
【００１８】
開始位置Ａには、被処理ウェハ（２８に対応）を保持したウェハホルダ（２６に対応）を洗浄槽２０Ａの容器２２内に搬入する機構と、容器２２に蓋２４をかぶせる機構とが設けられているが、図示を省略した。
【００１９】
洗浄位置Ｂ1 ，Ｂ2 ，Ｂ3 は、洗浄液として互いに種類を異にする薬液１，２，３をそれぞれ用いて洗浄を行なう所である。洗浄位置Ｂ1 には、搬送台１２Ｇの停止時における洗浄槽２０Ｇの配管装着孔２２ａ及び２２ｂの位置にそれぞれ対応して給液配管１４ａ及び排液配管１４ｂが設けられ、同様にして洗浄位置Ｂ2 には給液配管１４ｃ及び排液配管１４ｄが、洗浄位置Ｂ3 には給液配管１４ｅ及び排液配管１４ｆがそれぞれ設けられる。
【００２０】
洗浄位置Ｃは、洗浄液として純水を用いてリンス洗浄を行なう所である。洗浄位置Ｃには、搬送台１２Ｄの停止時における洗浄槽２０Ｄの配管装着孔（２２ａ及び２２ｂに対応）の位置に対応して給液配管１４ｇ及び排液配管１４ｈが設けられる。
【００２１】
乾燥位置Ｄは、熱窒素ガス等の乾燥ガスを用いて乾燥を行なう所である。乾燥位置Ｄには、搬送台１２Ｃの停止時における洗浄槽２０Ｃの配管装着孔（２２ａ及び２２ｂに対応）の位置に対応して給気配管１６ａ及び排気配管１６ｂが設けられる。
【００２２】
終了位置Ｅには、洗浄槽２０Ｂの蓋（２４に対応）を開放する機構と、洗浄槽２０Ｂから洗浄及び乾燥を終えた被処理ウェハ（２８に対応）を保持するウェハホルダ（２６に対応）を搬出する機構とが設けられているが、図示を省略した。
【００２３】
処理室１０Ａ内には、図３（Ａ）に示すような洗浄液循環装置１４Ｂ1 ，１４Ｂ2 ，１４Ｂ3 ，１４Ｃと、図３（Ｂ）に示すような乾燥ガス循環装置１６と、図３（Ｃ）に示すような配管着脱装置１８Ｂ1 ，１８Ｂ2 ，１８Ｂ3 ，１８Ｃ，１８Ｄとが設けられ、必要に応じてバブリングガス供給装置（図示せず）も設けられる。
【００２４】
洗浄液循環装置１４Ｂ1 ，１４Ｂ2 ，１４Ｂ3 ，１４Ｃには、それぞれ配管の組１４ａ−１４ｂ，１４ｃ−１４ｄ，１４ｅ−１４ｆ，１４ｇ−１４ｈが接続される。この結果、洗浄位置Ｂ1 では、洗浄槽２０Ｇに配管１４ａ，１４ｂを介して洗浄液を循環可能となり、このことは他の洗浄位置Ｂ2 ，Ｂ3 ，Ｃについても同様である。
【００２５】
乾燥ガス循環装置１６には、配管１６ａ，１６ｂが接続される。この結果、乾燥位置Ｄでは、洗浄槽２０Ｃに配管１６ａ，１６ｂを介して乾燥ガスを循環可能となる。
【００２６】
配管着脱装置１８Ｂ1 ，１８Ｂ2 ，１８Ｂ3 ，１８Ｃ，１８Ｄには、それぞれ配管駆動子の組１４Ａ−１４Ｂ，１４Ｃ−１４Ｄ，１４Ｅ−１４Ｆ，１４Ｇ−１４Ｈ，１６Ａ−１６Ｂが接続される。配管駆動子１４Ａ，１４Ｂは、配管１４ａ，１４ｂをそれぞれ電磁力又は流体圧等により矢印ａ，ｂで示すように往復的に駆動して配管装着孔２２ａ，２２ｂに対する配管１４ａ，１４ｂの着脱を行なう。これと同様にして、配管駆動子の組１４Ｃ−１４Ｄ，１４Ｅ−１４Ｆ，１４Ｇ−１４Ｈ，１６Ａ−１６Ｂは、それぞれ配管の組１４ｃ−１４ｄ，１４ｅ−１４ｆ，１４ｇ−１４ｈ，１６ａ−１６ｂを駆動して配管の着脱を行なう。
【００２７】
次に、図１の装置の動作を説明する。洗浄槽２０Ａを保持した搬送台１２Ａが開始位置Ａに到来して停止し、他の洗浄槽２０Ｂ〜２０Ｇもそれぞれ図示の位置に到来して停止したものとする。
【００２８】
開始位置Ａでは、洗浄槽２０Ａの容器２２内にウェハホルダが搬入され、所定位置にセットされる。ウェハホルダには、別の位置でウェハローダ等により多数枚の被処理ウェハが装填されている。ウェハホルダのセット後、容器２２の開口部が蓋２４で密閉される。
【００２９】
洗浄位置Ｂ1 では、洗浄槽２０Ｇの配管装着孔２２ａ，２２ｂに配管駆動子１４Ａ，１４Ｂにより配管１４ａ，１４ｂがそれぞれ装着された後、洗浄液循環装置１４Ｂ1 により配管１４ａ，１４ｂを介して洗浄槽２０Ｇに洗浄液（薬液１）Ｗが循環的に供給され、被処理ウェハ２８の洗浄が行なわれる。このとき、図示しないバブリングガス供給装置からガス配管を介して洗浄槽２０Ｇ内に窒素ガス等のバブリングガスを供給してバブリングを行なうことができる。また、洗浄液Ｗは、予め温度や成分を調整してから高速で循環させることもできる。
【００３０】
洗浄が終ると、洗浄槽２０Ｇから配管１４ｂを介して洗浄液Ｗが抜取られる。そして、配管装着孔２２ａ，２２ｂから配管駆動子１４Ａ，１４Ｂにより配管１４ａ，１４ｂがそれぞれ取外される。
【００３１】
洗浄位置Ｂ2 ，Ｂ3 においては、洗浄液の種類が異なるだけで洗浄位置Ｂ1 と同様にして洗浄槽２０Ｆ，２０Ｅ内の被処理ウェハの洗浄が行なわれる。また、洗浄位置Ｃにおいては、配管１４ｇ，１４ｈを介して洗浄槽２０Ｄに純水を循環させることにより洗浄槽２０Ｄ内の被処理ウェハのリンス洗浄が行なわれる。場合によっては、洗浄位置Ｂ2 ，Ｂ3 での洗浄を省略して洗浄位置Ｃでのリンス洗浄を行なうこともできる。
【００３２】
洗浄位置Ｂ2 ，Ｂ3 ，Ｃにおいては、洗浄の終了後、洗浄位置Ｂ1 に関して前述したと同様にして洗浄液の抜取りが行なわれる。そして、配管駆動子の組１４Ｃ−１４Ｄ，１４Ｅ−１４Ｆ，１４Ｇ−１４Ｈにより配管の組１４ｃ−１４ｄ，１４ｅ−１４ｆ，１４ｇ−１４ｈがそれぞれ取外される。
【００３３】
乾燥位置Ｄでは、洗浄槽２０Ｃの配管装着孔に配管１６ａ，１６ｂが装着された後、配管１６ａ，１６ｂを介して洗浄槽２０Ｃに乾燥ガスを循環的に供給することにより洗浄槽２０Ｃ内の被処理ウェハの乾燥が行なわれる。
【００３４】
乾燥が終ると、洗浄槽２０Ｃの配管装着孔から配管駆動子１６Ａ，１６Ｂにより配管１６ａ，１６ｂがそれぞれ取外される。
【００３５】
終了位置Ｅでは、洗浄槽２０Ｂの蓋２４が開放された後、容器２２内から洗浄及び乾燥を終えた被処理ウェハを保持したウェハホルダが搬出される。
【００３６】
上記したような位置Ａ〜Ｅの処理は互いに並行して行なわれる。そして、位置Ａ〜Ｅの処理のうちで最も長時間を要する処理が終ると、洗浄槽２０Ａ〜２０Ｇをそれぞれ保持した搬送台１２Ａ〜１２Ｇが移動を開始し、洗浄槽２０Ａ，２０Ｂ，２０Ｃ，２０Ｄ，２０Ｅ，２０Ｆ，２０Ｇは、それぞれ矢印Ｓ1 ，Ｓ2 ，Ｓ3 ，Ｓ4 ，Ｓ5 ，Ｓ6 ，Ｓ7 で示すように次の処理位置に移動する。この後、次の処理位置では、上記したと同様にして位置Ａ〜Ｅの処理がそれぞれ行なわれ、以下これと同様の処理が繰返される。この結果、２０Ａ〜２０Ｇの各洗浄槽の被処理ウェハが位置Ａ〜Ｅの処理を順次に受けることになる。
【００３７】
上記した洗浄装置によれば、密閉した洗浄槽の中で被処理ウェハを洗浄したり、乾燥したりするので、装置回りの排気設備やパーティクル対策用の設備が不要であり、処理室１０Ａ内に間仕切りを設ける必要もない。従って、コンパクトで安価な洗浄装置を実現できる。また、従来のキャリアや通水性バスケットを用いるものに比べてパーティクルの付着量を大幅に減らすことができる。
【００３８】
その上、密閉した洗浄槽を介して洗浄液を循環させて洗浄を行なうので、被処理ウェハの表面を清浄な洗浄液がたえず洗い去るようになり、洗浄速度が向上すると共に洗浄効果のウェハ面内均一性が向上し、しかも薬液の使用量を抑制することができる。
【００３９】
さらに、配管の交換により異種洗浄液による洗浄や乾燥を行なうと共に複数種類の洗浄液による洗浄や乾燥を並行して行なうので、処理効率が向上する。
【００４０】
この発明は、上記した実施形態に限定されるものではなく、種々の改変形態で実施可能なものである。例えば、次のような変更が可能である。
【００４１】
（１）所望の洗浄槽の配管装着孔２２ａ，２２ｂに対して装着すべき配管を処理位置に応じて変更してもよい。例えば、洗浄位置Ｂ1では配管装着孔２２ａ及び２２ｂにそれぞれ給液配管１４ａ及び排液配管１４ｂを装着し、洗浄位置Ｂ2では配管装着孔２２ａ及び２２ｂにそれぞれ排液配管１４ｄ及び給液配管１４ｃを装着するようにしてもよい。また、乾燥位置Ｄにおいても、配管装着孔２２ａ及び２２ｂにそれぞれ排気配管１６ｂ及び給気配管１６ａを装着するようにしてもよい。
【００４２】
（２）所望の洗浄槽を移動させずに処理を行なうようにしてもよい。すなわち、所望の洗浄槽の近傍に各種洗浄液の配管や乾燥ガスの配管を設置するか又はこれらの配管を適宜移動可能とすることにより所望の配管の着脱を行なうようにしてもよい。
【００４３】
【発明の効果】
以上のように、この発明によれば、被洗浄物を収容して密閉した洗浄槽に給液配管及び排液配管を装着すると共にこれらの配管を介して洗浄槽に洗浄液を循環させて被洗浄物の洗浄を行なうようにしたので、設置スペースの低減及び処理効率の向上が可能となり、しかも洗浄液の使用量低減、洗浄効果のばらつき低減及びパーティクルの付着量低減が可能となる効果が得られる。
【００４４】
その上、配管の交換により異種洗浄液による洗浄を行なったり、複数種類の洗浄液による洗浄を並行して行なったり、配管の交換により乾燥を行なったり、洗浄と乾燥を並行して行なったりすると、処理効率が一層向上する効果もある。
【図面の簡単な説明】
【図１】 この発明の一実施形態に係る洗浄装置を示す断面図である。
【図２】 図１の装置で用いられる洗浄槽を示す分解斜視図である。
【図３】 図１の装置で用いられる循環装置及び配管着脱装置を示すブロック図である。
【符号の説明】
１０：箱体、１０Ａ：処理室、１２Ａ〜１２Ｇ：搬送台、１４Ｂ1 〜１４Ｂ3 ，１４Ｃ：洗浄液循環装置、１６：乾燥ガス循環装置、１８Ｂ1 〜１８Ｂ3 ，１８Ｃ，１８Ｄ：配管着脱装置、２０Ａ〜２０Ｇ：洗浄槽、２２：容器、２２ａ，２２ｂ：配管装着孔、２４：蓋、２６：ウェハホルダ、２８：被処理ウェハ、Ａ：開始位置、Ｂ1 〜Ｂ3 ：薬液洗浄位置、Ｃ：純水洗浄位置、Ｄ：乾燥位置、Ｅ：終了位置。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cleaning apparatus and a cleaning method for performing processing such as cleaning and drying of an object to be cleaned such as a semiconductor wafer, and in particular, via a liquid supply pipe and a drain pipe in a cleaning tank that contains the object to be cleaned and is sealed. By cleaning the object to be cleaned by circulating the cleaning liquid, the installation space is reduced and the processing efficiency is improved.
[0002]
[Prior art]
Conventionally, as a cleaning apparatus for semiconductor wafers, a plurality of cleaning liquid tanks are arranged in a line on a plane, and a carrier holding a plurality of semiconductor wafers is moved while being sequentially immersed in a plurality of cleaning liquid tanks. A device for cleaning a semiconductor wafer has been proposed.
[0003]
On the other hand, as a cleaning device for machined machine parts, a water-permeable basket in which a soaking tank and a spray cleaning chamber are arranged side by side in a vertical direction and a drying chamber is arranged in a processing chamber, and a large number of machine parts are accommodated. It is known that machine parts are subjected to immersion cleaning, jet cleaning and drying by moving the cleaning chamber in the order of an immersion cleaning tank, an injection cleaning chamber, and a drying chamber (see, for example, JP-A-8-89913).
[0004]
[Problems to be solved by the invention]
According to the semiconductor wafer cleaning apparatus described above, (b) the installation space is extremely large because it is necessary to arrange the cleaning liquid tanks in a plane and to provide exhaust equipment around them, and (b) the cleaning liquid in each cleaning tank. The amount of cleaning liquid used is very large because it is easy to get dirty and the cleaning liquid needs to be replenished or replaced frequently. (C) Carriers holding semiconductor wafers are loaded into each cleaning tank, immersed, and carried out. For this reason, there are problems such as low processing efficiency and (d) that the cleaning liquid is simply brought into contact with the surface of each semiconductor wafer at the time of immersion to perform cleaning, resulting in a large in-wafer variation in cleaning effect.
[0005]
On the other hand, according to the above-described cleaning device for machine parts, the immersion cleaning tank and the spray cleaning chamber are arranged side by side in the vertical direction, so that the installation space can be reduced to some extent. However, since immersion cleaning, spray cleaning, and drying are performed in a state where the mechanical parts are housed in a water-based basket, the processing parts are separated from each other by a partition, and an opening / closing part is provided in the partition to enable transport of the basket. Therefore, space saving is restricted.
[0006]
In addition, since it is an immersion cleaning method, problems such as a large amount of cleaning liquid used, a low processing efficiency, and a large variation in cleaning effect are unavoidable, as in the above-described semiconductor wafer cleaning apparatus.
[0007]
An object of the present invention is to provide a novel cleaning apparatus that solves the problems of the prior art described above.
[0008]
[Means for Solving the Problems]
The cleaning device according to the present invention is:
A cleaning tank having a container for containing an object to be cleaned through an upper opening and a lid for sealing the container at the upper opening, and a liquid supply pipe and a drain pipe are respectively attached and detached. Provided with possible first and second pipe mounting holes;
A first cleaning means having first and second pipes respectively used as the liquid supply pipe and the drain pipe, wherein the object to be cleaned is accommodated in the container, and the container is sealed with the lid. In this state, the first and second pipes are mounted in the first and second pipe mounting holes, respectively, and the first type cleaning liquid is circulated to the cleaning tank through the first and second pipes. Thus, the object to be cleaned is cleaned, and after the cleaning is completed, the first type of cleaning liquid is extracted from the cleaning tank via the second pipe, and the first and second pipes are removed from the cleaning tank. things and,
A second cleaning means having third and fourth pipes detachably attached to one and the other of the first and second pipe mounting holes, respectively, after the completion of the pipe removal by the first cleaning means; The third and fourth pipes are respectively attached to one and the other of the first and second pipe mounting holes, and the cleaning liquid of the first type is supplied to the cleaning tank via the third and fourth pipes. Cleaning the object to be cleaned by circulating different types of cleaning liquids;
Transporting means for transporting the cleaning tank from the first cleaning position to a second cleaning position different from the first cleaning position;
The first cleaning means performs cleaning with the first type of cleaning liquid, extraction of the first type of cleaning liquid, and removal of the first and second pipes at the first cleaning position, The cleaning means performs cleaning with the second type of cleaning liquid at the second cleaning position, and the first cleaning means performs the cleaning at the first cleaning position when the second cleaning means is cleaning. The first and second pipes are respectively attached to a plurality of pipe mounting holes of another cleaning tank having the same configuration as the cleaning tank, and the other cleaning tank is connected to the other cleaning tank via the first and second pipes. The object to be cleaned in the other cleaning tank is cleaned by circulating the first type cleaning liquid .
[0009]
According to the configuration of the present invention, the object to be cleaned is cleaned in a sealed cleaning tank, so that an exhaust facility, a partition, and the like are unnecessary. Therefore, the installation space can be reduced, and the amount of particles adhering to the object to be cleaned is greatly reduced as compared with the case where a conventional carrier or water-permeable basket is used.
[0010]
In addition, since the cleaning liquid is circulated through the cleaning tank through the liquid supply pipe and drain pipe, the surface of the object to be cleaned is constantly washed away, enabling uniform and quick cleaning. is there. Further, since the cleaning tank is hermetically sealed, the cleaning liquid can be pressurized and discharged under reduced pressure. Therefore, the processing efficiency is improved and the amount of cleaning liquid used is small.
[0011]
In addition, since the supply and drainage pipes can be freely attached to and removed from the pipe mounting holes of the cleaning tank, it is possible to easily perform processing such as cleaning and drying with different cleaning liquids by replacing the pipes, further improving processing efficiency. Can be made.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows a cleaning device according to an embodiment of the present invention, and a cleaning tank, a circulation device, and a pipe attaching / detaching device used in this cleaning device are shown in FIGS. 2 and 3, respectively.
[0013]
The box 10 constitutes the processing chamber 10A, and is provided with a carry-in port 10a and a carry-out port 10b in the upper part. A pair of transfer paths 12a and 12b are provided so as to extend in the vertical direction from the carry-in port 10a toward the bottom of the processing chamber 10A. The transfer paths 12a and 12b extend in the horizontal direction at the bottom of the processing chamber 10A, extend in the vertical direction from the bottom of the processing chamber 10A toward the carry-out port 10b, and further from the carry-out port 10b to the carry-in port at the top of the box body 10. It extends in the horizontal direction toward 10a and is provided in a closed loop as a whole.
[0014]
The transport bases 12A to 12G transport the cleaning tanks 20A to 20G along the transport paths 12a and 12b by a transport mechanism (not shown), and each transport base starts from the start position A corresponding to the transport inlet 10a. B 1 ~B 3, pure water cleaning (rinsing) the position C, reaches the end position E corresponding to the exit 10b via the drying position D, and turned back to this after the starting position a. Further, for example, the transport bases 12A to 12G are mutually connected such that the transport base 12G moves from the cleaning position B 1 to the cleaning position B 2 in synchronization with the transport base 12A moving from the start position A to the cleaning position B 1. Synchronously, the current position moves to the next position as indicated by arrows S 1 to S 7 .
[0015]
The cleaning tanks 20A to 20G have the same configuration, and the configuration of the cleaning tank 20G will be described with reference to FIGS. The cleaning tank 20G includes a container 22 and a lid 24 for sealing the container. The lid 24 is held in the container 22 in an open state as shown with respect to the cleaning tank 20A in FIG. 1, and is closed in a closed state as shown in relation to the cleaning tank 20G in FIG. It is adapted to be fluid-tightly engaged with the opening. Since such a holding / sealing mechanism is not special, the illustration is omitted.
[0016]
A wafer holder 26 that holds a large number of wafers to be processed (for example, semiconductor wafers) 28 is accommodated in the container 22. For example, the wafer holder 26 fixedly supports the parallel holding bars 32A and 32B by the opposing support plates 30A and 30B, and holds the wafer 28 to be processed for each of the opposed grooves formed in the holding bars 32A and 32B. A configuration can be used.
[0017]
In the vicinity of the bottom of the container 22, pipe mounting holes 22 a and 22 b are provided in which the liquid supply pipe 14 a and the drain pipe 14 b can be attached and detached, respectively. Pipe mounting hole 22a, the 22b, the liquid supply pipe 14c and the drainage pipe 14d of the cleaning position B 2 also is detachable, respectively, liquid supply pipe 14e and drainage pipe 14f of the cleaning position B 3 is also detachable, respectively The liquid supply pipe 14g and the drainage pipe 14h at the cleaning position C are detachable, and the air supply pipe 16a and the exhaust pipe 16b at the dry position D are also detachable.
[0018]
At the start position A, a mechanism for carrying a wafer holder (corresponding to 26) holding a wafer to be processed (corresponding to 28) into the container 22 of the cleaning tank 20A and a mechanism for covering the container 22 with a lid 24 are provided. The illustration is omitted.
[0019]
Cleaning positions B 1 , B 2 , and B 3 are places where cleaning is performed using chemical liquids 1, 2, and 3 that are different from each other as cleaning liquids. The cleaning position B 1 represents, cleaning tank 20G of the pipe attachment hole 22a and corresponding to the liquid supply pipe 14a and drain pipe 14b to the position of 22b is provided at the time of stopping the transfer table 12G, cleaning position in the same manner as B the 2 liquid supply pipe 14c and the drainage pipe 14d is, the cleaning position B 3 is provided a liquid supply pipe 14e and drainage pipes 14f, respectively.
[0020]
The cleaning position C is a place where rinse cleaning is performed using pure water as a cleaning liquid. At the cleaning position C, a liquid supply pipe 14g and a liquid discharge pipe 14h are provided corresponding to the positions of the pipe mounting holes (corresponding to 22a and 22b) of the cleaning tank 20D when the transport table 12D is stopped.
[0021]
The drying position D is a place where drying is performed using a drying gas such as hot nitrogen gas. In the drying position D, an air supply pipe 16a and an exhaust pipe 16b are provided corresponding to the positions of the pipe mounting holes (corresponding to 22a and 22b) of the cleaning tank 20C when the transport table 12C is stopped.
[0022]
At the end position E, there is a mechanism for opening the lid (corresponding to 24) of the cleaning tank 20B and a wafer holder (corresponding to 26) for holding the processing target wafer (corresponding to 28) that has been cleaned and dried from the cleaning tank 20B. An unloading mechanism is provided, but the illustration is omitted.
[0023]
In the processing chamber 10A, cleaning liquid circulation devices 14B 1 , 14B 2 , 14B 3 and 14C as shown in FIG. 3A, a dry gas circulation device 16 as shown in FIG. 3B, and FIG. C), as shown in (C), pipe attachment / detachment devices 18B 1 , 18B 2 , 18B 3 , 18C and 18D are provided, and a bubbling gas supply device (not shown) is also provided as necessary.
[0024]
The washing liquid circulation device 14B 1, 14B 2, 14B 3 , 14C are respectively a pipe pair 14a-14b, 14c-14d, 14e-14f, 14g-14h are connected. As a result, at the cleaning position B 1 , the cleaning liquid can be circulated to the cleaning tank 20G via the pipes 14a and 14b. The same applies to the other cleaning positions B 2 , B 3 and C.
[0025]
Pipes 16 a and 16 b are connected to the dry gas circulation device 16. As a result, at the drying position D, the drying gas can be circulated to the cleaning tank 20C via the pipes 16a and 16b.
[0026]
Pipe attachment apparatus 18B 1, 18B 2, 18B 3 , 18C, the 18D, pairs 14A-14B, respectively piping driver element, 14C-14D, 14E-14F , 14G-14H, 16A-16B are connected. The pipe drivers 14A and 14B drive the pipes 14a and 14b reciprocally as indicated by arrows a and b by electromagnetic force or fluid pressure, respectively, and attach and detach the pipes 14a and 14b to and from the pipe mounting holes 22a and 22b. . Similarly, the pipe driver sets 14C-14D, 14E-14F, 14G-14H, and 16A-16B drive the pipe sets 14c-14d, 14e-14f, 14g-14h, and 16a-16b, respectively. Remove and install the piping.
[0027]
Next, the operation of the apparatus shown in FIG. 1 will be described. It is assumed that the transport table 12A holding the cleaning tank 20A arrives at the start position A and stops, and the other cleaning tanks 20B to 20G also arrive at the illustrated positions and stop.
[0028]
At the start position A, the wafer holder is carried into the container 22 of the cleaning tank 20A and set at a predetermined position. The wafer holder is loaded with a large number of wafers to be processed by wafer loaders or the like at different positions. After setting the wafer holder, the opening of the container 22 is sealed with a lid 24.
[0029]
In the cleaning position B 1, after cleaning tank 20G of the pipe attachment hole 22a, the 22b to the pipe driver elements 14A, 14B by a pipe 14a, 14b are mounted respectively, the cleaning tank through a pipe 14a, 14b by the cleaning liquid circulating apparatus 14B 1 The cleaning liquid (chemical liquid 1) W is cyclically supplied to 20G, and the processing target wafer 28 is cleaned. At this time, bubbling can be performed by supplying a bubbling gas such as nitrogen gas from the bubbling gas supply device (not shown) into the cleaning tank 20G via the gas pipe. The cleaning liquid W can be circulated at a high speed after the temperature and components are adjusted in advance.
[0030]
When the cleaning is completed, the cleaning liquid W is extracted from the cleaning tank 20G through the pipe 14b. Then, the pipes 14a and 14b are removed from the pipe mounting holes 22a and 22b by the pipe drivers 14A and 14B, respectively.
[0031]
At the cleaning positions B 2 and B 3 , the wafers to be processed in the cleaning tanks 20F and 20E are cleaned in the same manner as the cleaning position B 1 except that the type of cleaning liquid is different. In the cleaning position C, pure water is circulated through the cleaning tank 20D through the pipes 14g and 14h to rinse the wafer to be processed in the cleaning tank 20D. In some cases, cleaning at the cleaning positions B 2 and B 3 can be omitted, and rinsing at the cleaning position C can be performed.
[0032]
In the cleaning positions B 2 , B 3 , and C, the cleaning liquid is extracted in the same manner as described above with respect to the cleaning position B 1 after the cleaning is completed. Then, the pipe sets 14c-14d, 14e-14f, and 14g-14h are removed by the pipe driver sets 14C-14D, 14E-14F, and 14G-14H, respectively.
[0033]
In the drying position D, after the pipes 16a and 16b are mounted in the pipe mounting holes of the cleaning tank 20C, the dry gas is circulated to the cleaning tank 20C via the pipes 16a and 16b to circulate the target in the cleaning tank 20C. The processed wafer is dried.
[0034]
When drying is completed, the pipes 16a and 16b are removed from the pipe mounting holes of the cleaning tank 20C by the pipe drivers 16A and 16B, respectively.
[0035]
At the end position E, after the lid 24 of the cleaning tank 20B is opened, the wafer holder holding the wafer to be processed that has been cleaned and dried is carried out of the container 22.
[0036]
The processes at positions A to E as described above are performed in parallel with each other. Then, when the processing that requires the longest time among the processing at positions A to E is finished, the transport tables 12A to 12G that respectively hold the cleaning tanks 20A to 20G start moving, and the cleaning tanks 20A, 20B, 20C, and 20D are moved. , 20E, 20F, and 20G move to the next processing position as indicated by arrows S 1 , S 2 , S 3 , S 4 , S 5 , S 6 , and S 7 , respectively. Thereafter, at the next processing position, the processing at positions A to E is performed in the same manner as described above, and the same processing is repeated thereafter. As a result, the wafers to be processed in the respective cleaning tanks 20A to 20G sequentially receive the processing at the positions A to E.
[0037]
According to the above-described cleaning apparatus, the wafer to be processed is cleaned or dried in a sealed cleaning tank, so that exhaust equipment around the apparatus and equipment for dealing with particles are not necessary, and the processing chamber 10A has no need for it. There is no need to provide a partition. Therefore, a compact and inexpensive cleaning device can be realized. In addition, the amount of adhered particles can be greatly reduced as compared with conventional carriers and water-permeable baskets.
[0038]
In addition, the cleaning liquid is circulated through the sealed cleaning tank to perform cleaning, so that the surface of the wafer to be processed is constantly cleaned by the cleaning liquid, improving the cleaning speed and uniforming the cleaning effect within the wafer surface. Property can be improved and the amount of the chemical used can be suppressed.
[0039]
Furthermore, since cleaning and drying with different types of cleaning liquids are performed by exchanging pipes, and cleaning and drying with a plurality of types of cleaning liquids are performed in parallel, the processing efficiency is improved.
[0040]
The present invention is not limited to the above-described embodiment, and can be implemented in various modifications. For example, the following changes are possible.
[0041]
(1) You may change the piping which should be mounted | worn with respect to the piping mounting holes 22a and 22b of a desired washing tank according to a process position. For example, each of the cleaning position B 1 pipe mounting hole 22a and 22b fitted with a liquid supply pipe 14a and drain pipe 14b, respectively in the cleaning position B 2 pipe mounting holes 22a and 22b drain pipe 14d and the liquid supply pipe 14c You may make it wear. Also at the drying position D, the exhaust pipe 16b and the air supply pipe 16a may be mounted in the pipe mounting holes 22a and 22b, respectively.
[0042]
(2) Processing may be performed without moving the desired cleaning tank. In other words, pipes for various cleaning liquids and pipes for dry gas may be installed in the vicinity of a desired washing tank, or desired pipes may be attached and detached by appropriately moving these pipes.
[0043]
【The invention's effect】
As described above, according to the present invention, the liquid supply pipe and the drain pipe are attached to the cleaning tank that contains the object to be cleaned and is sealed, and the cleaning liquid is circulated to the cleaning tank through these pipes to be cleaned. Since the object is cleaned, the installation space can be reduced and the processing efficiency can be improved. In addition, it is possible to reduce the amount of the cleaning liquid used, reduce the variation in the cleaning effect, and reduce the amount of adhered particles.
[0044]
In addition, the processing efficiency is improved when cleaning with different types of cleaning liquids is performed by exchanging pipes, cleaning with multiple types of cleaning liquids is performed in parallel, drying is performed by exchanging pipes, and cleaning and drying are performed in parallel. Has the effect of further improving.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a cleaning apparatus according to an embodiment of the present invention.
2 is an exploded perspective view showing a cleaning tank used in the apparatus of FIG. 1. FIG.
3 is a block diagram showing a circulation device and a pipe attaching / detaching device used in the device of FIG. 1. FIG.
[Explanation of symbols]
10: box, 10A: treatment chamber, 12A to 12G: carrier table, 14B 1 ~14B 3, 14C: washing liquid circulation device, 16: drying gas circulating device, 18B 1 ~18B 3, 18C, 18D: piping attachment apparatus, 20A to 20G: cleaning tank, 22: container, 22a, 22b: piping mounting hole, 24: lid, 26: a wafer holder, 28: treated wafer, A: start position, B 1 .about.B 3: chemical cleaning position, C: Pure water cleaning position, D: drying position, E: end position.
Claims (4)
それぞれ前記給液配管及び前記排液配管として用いられる第１及び第２の配管を有する第１の洗浄手段であって、前記容器に前記被洗浄物が収容され且つ前記容器が前記蓋で密閉された状態で前記第１及び第２の配管装着孔に前記第１及び第２の配管をそれぞれ装着して前記第１及び第２の配管を介して前記洗浄槽に第１種の洗浄液を循環させることにより前記被洗浄物を洗浄し、その洗浄の終了後に前記第２の配管を介して前記洗浄槽から前記第１種の洗浄液を抜取り且つ前記洗浄槽から前記第１及び第２の配管を取外すものと、
前記第１及び第２の配管装着孔の一方及び他方にそれぞれ着脱可能な第３及び第４の配管を有する第２の洗浄手段であって、前記第１の洗浄手段による配管取外しの終了後に前記第１及び第２の配管装着孔の一方及び他方に前記第３及び第４の配管をそれぞれ装着して前記第３及び第４の配管を介して前記洗浄槽に前記第１種の洗浄液とは異なる第２種の洗浄液を循環させることにより前記被洗浄物を洗浄するものと、
前記洗浄槽を第１の洗浄位置からそれとは別の第２の洗浄位置に搬送する搬送手段とを備え、
前記第１の洗浄手段は前記第１の洗浄位置において前記第１種の洗浄液による洗浄と前記第１種の洗浄液の抜取りと前記第１及び第２の配管の取外しとを行ない、前記第２の洗浄手段は前記第２の洗浄位置において前記第２種の洗浄液による洗浄を行ない、前記第１の洗浄手段は、前記第２の洗浄手段が洗浄を行なっているときに前記第１の洗浄位置において前記洗浄槽と同様の構成の他の洗浄槽の複数の配管装着孔に前記第１及び第２の配管をそれぞれ装着して前記第１及び第２の配管を介して該他の洗浄槽に前記第１種の洗浄液を循環させることにより該他の洗浄槽内の被洗浄物を洗浄するものである洗浄装置。A cleaning tank having a container for containing an object to be cleaned through an upper opening and a lid for sealing the container at the upper opening, and a liquid supply pipe and a drain pipe are respectively attached and detached. Provided with possible first and second pipe mounting holes;
A first cleaning means having first and second pipes respectively used as the liquid supply pipe and the drain pipe, wherein the object to be cleaned is accommodated in the container, and the container is sealed with the lid. In this state, the first and second pipes are mounted in the first and second pipe mounting holes, respectively, and the first type cleaning liquid is circulated to the cleaning tank through the first and second pipes. Thus, the object to be cleaned is cleaned, and after the cleaning is completed, the first type of cleaning liquid is extracted from the cleaning tank via the second pipe, and the first and second pipes are removed from the cleaning tank. things and,
A second cleaning means having third and fourth pipes detachably attached to one and the other of the first and second pipe mounting holes, respectively, after the completion of the pipe removal by the first cleaning means; The third and fourth pipes are respectively attached to one and the other of the first and second pipe mounting holes, and the cleaning liquid of the first type is supplied to the cleaning tank via the third and fourth pipes. Cleaning the object to be cleaned by circulating different types of cleaning liquids ;
Transporting means for transporting the cleaning tank from the first cleaning position to a second cleaning position different from the first cleaning position;
The first cleaning means performs cleaning with the first type of cleaning liquid, extraction of the first type of cleaning liquid, and removal of the first and second pipes at the first cleaning position, The cleaning means performs cleaning with the second type of cleaning liquid at the second cleaning position, and the first cleaning means performs the cleaning at the first cleaning position when the second cleaning means is cleaning. The first and second pipes are respectively attached to a plurality of pipe mounting holes of another cleaning tank having the same configuration as the cleaning tank, and the other cleaning tank is connected to the other cleaning tank via the first and second pipes. A cleaning apparatus for cleaning an object to be cleaned in the other cleaning tank by circulating the first type cleaning liquid .
それぞれ前記給液配管及び前記排液配管として用いられる第１及び第２の配管を有する洗浄手段であって、前記容器に前記被洗浄物が収容され且つ前記容器が前記蓋で密閉された状態で前記第１及び第２の配管装着孔に前記第１及び第２の配管をそれぞれ装着して前記第１及び第２の配管を介して前記洗浄槽に洗浄液を循環させることにより前記被洗浄物を洗浄し、その洗浄の終了後に前記第２の配管を介して前記洗浄槽から前記洗浄液を抜取り且つ前記洗浄槽から前記第１及び第２の配管を取外すものと、
前記第１及び第２の配管装着孔の一方及び他方にそれぞれ着脱可能な第３及び第４の配管を有する乾燥手段であって、前記洗浄手段による配管取外しの終了後に前記第１及び第２の配管装着孔の一方及び他方に前記第３及び第４の配管をそれぞれ装着して前記第３及び第４の配管を介して前記洗浄槽に乾燥ガスを循環させることにより前記被洗浄物を乾燥させるものと
を備えた洗浄装置。A cleaning tank having a container for containing an object to be cleaned through an upper opening and a lid for sealing the container at the upper opening, and a liquid supply pipe and a drain pipe are respectively attached and detached. Provided with possible first and second pipe mounting holes;
Cleaning means having first and second pipes used as the liquid supply pipe and the drain pipe, respectively, wherein the object to be cleaned is accommodated in the container and the container is sealed with the lid The first and second pipes are mounted in the first and second pipe mounting holes, respectively, and the cleaning object is circulated through the cleaning tank through the first and second pipes, thereby cleaning the object to be cleaned. Washing, and after the washing is finished, withdrawing the washing liquid from the washing tank through the second pipe and removing the first and second pipes from the washing tank;
A drying means having third and fourth pipes detachably attached to one and the other of the first and second pipe mounting holes, respectively, and after the pipe removal by the cleaning means is finished, the first and second pipes The third and fourth pipes are mounted on one and the other of the pipe mounting holes, respectively, and the object to be cleaned is dried by circulating a dry gas to the cleaning tank through the third and fourth pipes. A cleaning device equipped with things.
前記第１の被洗浄物の洗浄の終了後に前記第１の洗浄槽から前記第１の排液配管を介して前記第１種の洗浄液を抜取り且つ前記第１の洗浄槽から前記第１の給液配管及び前記第１の排液配管を取外すと共に、前記第２の洗浄物の洗浄の終了後に前記第２の洗浄槽から前記第２の排液配管を介して前記第２種の洗浄液を抜取り且つ前記第２の洗浄槽から前記第２の給液配管及び前記第２の排液配管を取外すステップと、
前記取外すステップの後、前記第１の洗浄槽を前記第２の洗浄位置に搬送すると共に、この搬送に同期して前記第２の洗浄槽を乾燥位置に搬送するステップと
を含む洗浄方法。At a first cleaning position with respect to a first cleaning tank in which a first object to be cleaned is accommodated through a first upper opening and the first upper opening is sealed by a first lid. The first liquid supply pipe and the first drain pipe are connected to circulate the first type of cleaning liquid to clean the first object to be cleaned, and the second upper opening opens the second The second liquid supply pipe and the second drainage liquid at the second cleaning position with respect to the second cleaning tank in which the object to be cleaned is accommodated and the second upper opening is sealed by the second lid. Connecting the pipe and circulating the second type of cleaning liquid to clean the second object to be cleaned;
After the cleaning of the first object to be cleaned, the first type of cleaning liquid is extracted from the first cleaning tank via the first drain pipe and the first supply from the first cleaning tank. The liquid pipe and the first drain pipe are removed, and the second type of cleaning liquid is extracted from the second cleaning tank via the second drain pipe after the second cleaning object is cleaned. And removing the second liquid supply pipe and the second drain pipe from the second cleaning tank,
And a step of transporting the first cleaning tank to the second cleaning position and transporting the second cleaning tank to the drying position in synchronization with the transport after the removing step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05847697A JP3972399B2 (en) | 1997-02-26 | 1997-02-26 | Cleaning device and cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05847697A JP3972399B2 (en) | 1997-02-26 | 1997-02-26 | Cleaning device and cleaning method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10242106A JPH10242106A (en) | 1998-09-11 |
| JP3972399B2 true JP3972399B2 (en) | 2007-09-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05847697A Expired - Fee Related JP3972399B2 (en) | 1997-02-26 | 1997-02-26 | Cleaning device and cleaning method |
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| Country | Link |
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| JP (1) | JP3972399B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19859469C2 (en) | 1998-12-22 | 2002-02-14 | Steag Micro Tech Gmbh | Device and method for treating substrates |
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| Publication number | Publication date |
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| JPH10242106A (en) | 1998-09-11 |
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