JPH08224905A - Light source device of optical scanning apparatus - Google Patents

Abstract

PURPOSE: To write an image of high accuracy by reducing the irregularity of the distance between a plurality of the laser beam output parts of a semiconductor laser device and the lens adjusting the beams emitted from the laser beam output parts to a parallel state, a divergent state and a convergent state to the utmost. CONSTITUTION: The attaching surface of LD1 parallel to a surface having a plurality of laser beam output parts arranged in one row and an LD holding part 2 are brought to a line contact state through an inclination adjusting member 7 of which the leading end is formed into a wedge shape. The LD1 is inclined centering around the contact part of the LD1 and the LD holding part 2 and the position of a plurality of the laser beam output parts arranged in one row of the LD1 is made variable to regulate the distance from the laser beam output parts to a collimation lens constant.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light source device of an optical scanning device in which a semiconductor laser device having a plurality of laser light output portions arranged in a line and a lens are integrated, and more particularly to improvement of reading accuracy. It is a thing.

[0002]

2. Description of the Related Art As a light source device for an optical scanning device such as a laser printer, a facsimile machine, a digital copying machine or the like, a semiconductor laser device having a plurality of laser light output portions arranged in a line and a plurality of semiconductor laser devices. A collimating lens that collimates the luminous flux emitted from the laser light output section is used. The distance between the plurality of laser light output sections of this semiconductor laser device and the collimating lens must be constant in order to irradiate a good light beam on the scanning surface. For this reason, as shown in the sectional view of FIG. 9, for example, a flange portion 12 having a plurality of laser light output portions arranged in a line on the front end face and a mounting face 11 parallel to the front end face at the rear portion 12 The laser light output part of the semiconductor laser device (hereinafter, referred to as LD) 1 provided with is inserted into the through hole 21 of the LD holding part 2 and the mounting surface 11 of the LD 1 and L
The LD holding member 3 is brought into contact with the mounting surface 22 of the D holding portion 2 and the LD holding member 3 is pressed against the rear end portion of the LD 1 while the LD holding member 3 is LDed.
The LD 1 is held by the LD holding unit 2 by being attached to the holding unit 2. The LD holding portion 2 holding the LD 1 is provided with the through hole 41.
Is attached to one surface of the mounting portion of the collimating lens flange 4, and the lens holder 6 to which the collimating lens 5 is fixed is attached to the through hole 41 of the collimating lens flange 4 from the other side, and the LD 1 and the collimating lens 5 are attached. They are integrated and managed so that the distance between the LD 1 and the collimating lens 5 is constant.

[0003]

However, as described above, the distance between the laser light output section of the LD1 and the collimating lens 5 is controlled to be constant by the mechanical precision between the LD1 and the mounting surface 22 of the LD holding section 2. In this case, the distance between the entire LD 1 and the collimating lens 5 can be controlled to be constant, but the distance between the collimating lens 5 and each of the plurality of laser light output sections arranged in a line. However, the distance between each laser light output section and the collimating lens 5 may vary slightly in some cases. When the distance between each laser light output section of the LD 1 and the collimating lens 5 varies in this way, the light beams emitted from each laser light output section pass through the collimating lens 5 and become parallel. However, the image forming position of each light beam deviates from the predetermined image forming position due to slight divergence or convergence.

In recent years, more highly accurate writing has been demanded, and in order to satisfy this requirement, the variation in the distance between each laser light output section of the LD 1 and the collimating lens 5 should be minimized to idealize. There is a demand for forming an image of the light beam emitted from each laser light output portion at a specific image forming position.

The present invention has been made in order to meet such a demand, and a plurality of laser light output parts of a semiconductor laser device and luminous fluxes emitted from the respective laser light output parts are in a parallel state, An object of the present invention is to obtain a light source device of an optical scanning device capable of writing a highly accurate image by minimizing the variation in the distance from the lens adjusted to the divergent state or the convergent state.

[0006]

SUMMARY OF THE INVENTION A light source device for an optical scanning device according to the present invention is a semiconductor laser device having a plurality of laser light output portions arranged in a line, and a plurality of laser devices. And a lens for adjusting the light flux emitted from the light output unit to a parallel state, a divergent state, or a convergent state, and an LD holding unit holding a semiconductor laser device is attached to the lens holding unit holding the lens. In a light source device of an optical scanning device in which a laser device and a lens are integrated, a mounting surface of a semiconductor laser device parallel to a surface having a plurality of laser light output portions and an LD holding portion are provided with a plurality of lasers. -The semiconductor laser is contacted with a line passing through the center of the laser light output unit and at a plurality of points orthogonal to the line connecting the plurality of laser light output units, and contacting the rear surface of the semiconductor laser device.
A plurality of pressing members for fixing the laser device to the LD holding portion.
It is characterized in that a distance varying mechanism for varying the distance to the LD holding portion is provided at positions on both sides of the semiconductor laser device on an extension of the line connecting the laser light output portions.

A pair of mounting screws for screwing the distance varying mechanism of the holding member, which comes into contact with the rear surface of the semiconductor laser device and fixes the semiconductor laser device to the LD holding portion, into the LD holding portion.
It may be configured by an elastic member provided between the head of the mounting screw and the pressing member.

Further, a mounting screw for screwing the distance varying mechanism provided in the fixing portion of the holding member for contacting the rear surface of the semiconductor laser device and fixing the semiconductor laser device to the LD holding portion into the LD holding portion. And an elastic member provided between the head of the mounting screw and the pressing member, and a plurality of layers from the side surface of the LD holding portion.
It may be composed of a position adjusting screw that pressurizes in the direction parallel to the line connecting the light output portions, and a compression spring provided at a position facing the position adjusting screw with the semiconductor laser device sandwiched therebetween.

The mounting surface of the semiconductor laser device and the LD holding portion are brought into contact with each other via an inclination adjusting member which is fitted into the LD holding portion and has a wedge-shaped tip. When a fixed cross section is contacted via a pin with a circular or triangular shape, a steel ball fixed on the mounting surface of the LD holding part, or a wedge-shaped ridge directly attached to the LD holding part good. In this case, it is advisable to provide a recess in the contact portion of the mounting surface of the semiconductor laser device.

A wedge-shaped protrusion provided on the mounting surface of the semiconductor laser device may be brought into contact with the mounting surface of the LD holding portion. In this case, it is advisable to provide a recess at the contact portion of the LD holding portion.

[0011]

According to the present invention, the mounting surface of the semiconductor laser device parallel to the surface having the plurality of laser light output portions arranged in a line and the LD holding portion are provided with the plurality of laser light output portions. The semiconductor laser device and the semiconductor laser device are connected to each other at a line or at a plurality of points which are orthogonal to the line connecting the plurality of laser light output parts through the central part of the laser section.
The semiconductor laser device is tilted around the contact portion of the D holding portion as a fulcrum, and the position of each of the plurality of laser light output portions arranged in a line in the semiconductor laser device is changed to change each laser. Adjust the distance from the light output unit to the lens to be constant.

As a distance varying mechanism for tilting and fixing the semiconductor laser device, a pressing member for fixing the semiconductor laser device to the LD holding portion is passed through and screwed into the LD holding portion.
An elastic member is provided between the heads of the pair of mounting screws and the pressing member, and the screwing depth of each mounting screw is changed to change the elastic force of the elastic member. The tilt angle of the semiconductor laser device is adjusted by changing the mounting angle.

Further, as a distance varying mechanism for tilting and fixing the semiconductor laser device, the mounting angle of the pressing member can be varied as described above, and a plurality of laser light outputs from the side surface of the LD holding portion. The position adjustment screw that applies pressure in the direction parallel to the line connecting the parts, and the semiconductor laser device are provided with a compression spring that is provided at a position opposite to the position adjustment screw. Can also be changed to directly change the inclination of the semiconductor laser device.

The mounting surface of the semiconductor laser device and L
For the D holding part, the LD holding part is provided with a tilt adjusting member having a wedge-shaped tip, a pin having a circular or triangular cross section is mounted on the mounting surface of the LD holding part, or a steel is mounted on the mounting surface of the LD holding part. By attaching a sphere or by providing a wedge-shaped protrusion on the LD holding portion and contacting these tip portions with the mounting surface of the semiconductor laser device, the mounting surface of the semiconductor laser device and L
The D holding portion can be in line contact or point contact.
In this case, if a concave portion is provided in the contact portion of the mounting surface of the semiconductor laser device, the direction of the line connecting the plurality of laser light output portions of the semiconductor laser device is directed to the protrusion of the LD holding portion or the direction of the line. It is possible to make the direction of the ridge exactly orthogonal.

Even if a wedge-shaped protrusion is provided on the mounting surface of the semiconductor laser device and the tip of the protrusion is brought into contact with the flat mounting surface of the LD holding portion, the mounting surface of the semiconductor laser device is And LD
The holding part can be in line contact. Also in this case, if a recess is provided in the contact portion of the LD holding portion, L is set with respect to the direction of the line connecting the plurality of laser light output portions of the semiconductor laser device.
The line that comes into contact with the D holding portion can be accurately drawn.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a semiconductor laser according to an embodiment of the present invention.
It is a perspective view which shows the positioning part of the holding mechanism of the device. As shown in the figure, the positioning portion of the semiconductor laser device (hereinafter referred to as LD) 1 is the LD holding portion 2 and the tilt adjusting member 7.
Have and. The LD 1 has a plurality of laser light output portions arranged in a line in the X direction on the front end surface, and a flange portion 12 having a mounting surface 11 parallel to the front end surface on the rear portion. The tilt adjusting member 7 has a through hole 71 into which the leading end of the LD 1 is inserted, the leading end is formed in a wedge shape, and the rear end is fitted and fixed in the through hole 21 of the LD holding part 2. Has been formed. The inclination adjusting member 7 is formed so that the intersecting line 72 formed by the wedge-shaped tip faces in the Z direction which is orthogonal to the X direction which is the direction of the line connecting the plurality of laser light output portions arranged in a line in the LD 1. It is formed so as to be positioned at and fixed to the LD holding portion 2. The collimating lens flange 4 and the lens holder 6 for holding the collimating lens 5 and fixing the LD holding portion 2 are exactly the same as those shown in FIG.

The mounting mechanism for fixing the LD 1 to the LD holding portion 2 via the tilt adjusting member 7 has a pair of mounting holes 31 at the ends in the X direction, as shown in the sectional view of FIG. LD pressing member 3 that presses the portion against the rear end of LD 1, mounting screw 8 that penetrates through a pair of mounting holes 31 and is screwed into LD holding portion 2, head of mounting screw 8 and LD pressing member. 3 and a compression spring 9 arranged between them.

The LD1 holding mechanism and mounting mechanism constructed as described above are used to fix the LD1 to the collimating lens flange 4 to adjust the distance between the laser light output portion of the LD1 and the collimating lens 5. In this case, first, as shown in FIG. 9, the LD holding part 2 is held by the collimator lens 5 holding the collimator lens 5.
It is fixed to the lens flange 4. Next, as shown in FIG. 2, the inclination adjusting member 7 penetrates the LD holding portion 2 by L.
Position and attach to the D holding part fixing hole 21. afterwards,
The tip of the LD1 is inserted into the through hole 71 in the center of the tilt adjusting member 7, and the line connecting the plurality of laser light output parts of the LD1 is orthogonal to the intersection line 72 formed by the wedge-shaped tip of the tilt adjusting member 7. The mounting surface 11 of the LD 1 is brought into contact with the intersection line 72 formed by the wedge-shaped tip of the tilt adjusting member 7 while being positioned. The mounting screw 8 is screwed into the LD holding portion 2 while pressing the rear end portion of the LD 1 with the LD holding member 3, and the LD 1 is fixed to the LD holding portion 2 via the inclination adjusting member 7. This LD1
Is fixed to the LD holding unit 2 via the tilt adjusting member 7, the elastic force of the compression spring 9 is changed by changing the screwing depth of each mounting screw 8, and each is arranged in the X direction. The pressing force applied from the compression spring 9 to the LD pressing member 3 is changed. When the pressing force applied to the LD pressing member 3 is different in the mounting position in the X direction, the LD pressing member 3, that is, the LD 1 is rotated about the intersection line 72 formed by the wedge-shaped tip of the tilt adjusting member 7 as a fulcrum and the pressing force difference is generated. Inclination by a certain small angle according to. Therefore, the positions of the plurality of laser light output portions of the LD1 arranged in the X direction can be changed by a minute distance in the Y direction which is the optical axis direction of the collimating lens 5.
The distance between the light output section and the collimating lens 5 can be made constant. Therefore, the parallelism of each light beam emitted from each laser light output section of the LD 1 and passing through the collimating lens 5 can be made equal.

In the above embodiment, the mounting mechanism for fixing the LD 1 to the LD holding portion 2 via the tilt adjusting member 7 is composed of the LD pressing member 3, the pair of mounting screws 8 and the compression spring 9. However, as shown in the sectional view of FIG.
The pressing member 3 can be tilted by a pair of mounting screws 8 and a compression spring 9, and a position adjusting screw 10 for pressing the tip of the LD1 from the side surface of the LD holding part 2 in the X direction and a tip of the LD1 are sandwiched between them. The inclination angle of the LD 1 may be directly changed by the compression spring 101 provided at a position facing the adjustment screw 10. By directly changing the tilt angle of the LD1 in this manner, the tilt angle of the LD1 can be easily changed even if a printed circuit board or the like having a driving circuit is attached to the rear portion of the LD1.

In the above embodiment, the case where the LD 1 is fixed to the LD holding portion 2 via the tilt adjusting member 7 has been described. However, as shown in the perspective view of FIG. A pin 23 having a circular or triangular cross section may be fixed directly or through a groove so as to be in line contact with the mounting surface 11 of the LD 1. By using the pin 23 in this way, a fulcrum for inclining the LD 1 can be formed with a simple structure.

In the above embodiment, the tilt adjusting member 7 and the pin 23 are used to bring the mounting surface 11 of the LD 1 into line contact with the tilt adjusting member 7, but as shown in the perspective view of FIG. A steel ball 24 is fixed near the through hole 21 of the mounting surface 22 of the LD holding part 2 to attach the mounting surface 11 of the LD1.
A fulcrum for inclining the LD 1 may be configured by making point contact with the LD 1. By thus making the mounting surface 11 of the LD1 and the tilt adjusting member 7 point-contact with each other to make the fulcrum for tilting the LD1 smaller, the tilt angle of the LD1 can be adjusted more accurately.

In the above embodiment, the tilt adjusting member 7, the pin 23 or the steel ball 24 is used to make a line contact or a point contact between the mounting surface 11 of the LD 1 and the tilt adjusting member 7, but FIG. As shown in the perspective view of FIG. 3, a wedge-shaped protrusion 25 may be directly provided on the mounting surface 22 of the LD holding portion 2, or a hemispherical protrusion may be provided. By thus providing the LD holding portion 2 with the fulcrum for inclining the LD 1 directly, the position of the fulcrum can be accurately provided.

As shown in each of the above embodiments, the LD holding portion 2
The tilt adjusting member 7 or the pin 23, the steel ball 24 or the L attached to the
When the tip end of the projection 25 directly provided on the D holding portion 2 is used as a fulcrum for inclining the LD 1, as shown in the perspective view of FIG. 7, a plurality of lasers arranged in a line on the mounting surface 11 of the LD 1 are arranged. If a groove 13 having a semicircular cross section is provided in the Z direction orthogonal to the X direction which is the direction of the line connecting the laser light output portions 12 and the groove 13 is aligned with the tip of the tilt adjusting member 7 or the like, the laser light is emitted. The position of the line connecting the output sections 12 can be accurately positioned, the LD 1 can be stably tilted, and the distance between each laser light output section 12 and the collimating lens 5 can be adjusted accurately. You can

In each of the above-described embodiments, the fulcrum for inclining the LD 1 by attaching the inclination adjusting member 7 or the like to the LD holding portion 2 is L.
Although the case where it is provided on the D holding portion 2 side has been described, as shown in FIG. 8, the Z direction orthogonal to the X direction which is the direction of the line connecting the plurality of laser light output portions 12 to the mounting surface 11 of the LD 1. A wedge-shaped protrusion 14 may be provided, and the tip end of the protrusion 14 may be brought into contact with the mounting surface 22 of the LD holding part 2 so that the LD 1 and the LD holding part 2 are in line contact. In this case LD1
Since the ridges 14 can be manufactured with high precision at the same time when manufacturing, the position of the fulcrum can be accurately determined. Also in this case, a plurality of laser light output portions 12 are accurately formed by forming a groove having a semicircular or V-shaped cross section which engages with the protrusion 14 on the mounting surface 22 of the LD holding portion 2. Can be positioned.

[0025]

As described above, according to the present invention, the mounting surface of the semiconductor laser device, which is parallel to the surface having the plurality of laser light output portions arranged in a line, and the plurality of LD holding portions are provided. Ray
The semiconductor laser device and the LD holding unit are contacted at a line or at a plurality of points that pass through the center of the laser light output unit and are orthogonal to the line connecting the plurality of laser light output units. By tilting the semiconductor laser device and varying the positions of the laser light output parts arranged in a line in the semiconductor laser device, the light beams emitted from the laser light output parts are made parallel. Since the distance between each laser light output section and the lens for adjusting the state, divergence state or convergence state is adjusted to be constant, each light flux emitted from a plurality of laser light output sections and passed through the lens Can be made equivalent, and each light beam can be imaged at a predetermined image formation position. Therefore, a highly accurate image can be written on the scanning surface.

Further, as a distance varying mechanism for tilting and fixing the semiconductor laser device, a pair of screws are inserted into the LD holding part through a holding member for fixing the semiconductor laser device to the LD holding part. An elastic member is provided between the head of the mounting screw and the pressing member, and the screwing depth of each mounting screw is changed to change the elastic force of the elastic member. By adjusting the tilt angle of the semiconductor laser device by varying the distance, the distance between each laser light output section of the semiconductor laser device and the lens can be accurately adjusted with a simple structure.

Further, as a distance varying mechanism for tilting and fixing the semiconductor laser device, the mounting angle of the pressing member can be varied as described above, and a plurality of laser light outputs can be output from the side surface of the LD holding portion. The position adjustment screw that applies pressure in the direction parallel to the line connecting the parts, and the semiconductor laser device are provided with a compression spring that is provided at a position opposite to the position adjustment screw. By directly changing the inclination of the semiconductor laser device by changing the angle of the semiconductor laser device, even if a printed circuit board or the like having a driving circuit is attached to the rear portion of the semiconductor laser device, the semiconductor laser device can be easily changed. The tilt angle can be changed.

The mounting surface of the semiconductor laser device and L
For the D holding part, the LD holding part is provided with a tilt adjusting member having a wedge-shaped tip, a pin having a circular or triangular cross section is mounted on the mounting surface of the LD holding part, or a steel is mounted on the mounting surface of the LD holding part. By attaching a sphere or by providing a wedge-shaped protrusion on the LD holding portion and contacting these tip portions with the mounting surface of the semiconductor laser device, the mounting surface of the semiconductor laser device and L
The fulcrum for inclining the semiconductor laser device can be formed easily and accurately by making line contact or point contact with the D holding part.

Further, when a recess is provided in the contact portion of the mounting surface of the semiconductor laser device, the direction of the line connecting the plurality of laser light output portions of the semiconductor laser device is set to the direction of the LD holding portion. The direction of the protrusion or the ridge can be made to be exactly orthogonal to each other, and the distance between each laser light output section and the lens can be adjusted stably and more accurately.

Further, a wedge-shaped projection is provided on the mounting surface of the semiconductor laser device, and the tip end of the projection is brought into contact with the flat mounting surface of the LD holding portion to form the mounting surface of the semiconductor laser device. The position of the fulcrum can be accurately determined by bringing the LD holding part into line contact. Also in this case, a plurality of laser light output portions are accurately positioned by providing a recessed groove on the mounting surface of the LD holding portion, which engages with the protrusion provided on the mounting surface of the semiconductor laser device. be able to.

[Brief description of drawings]

FIG. 1 is a perspective view showing a positioning portion of a holding mechanism of a semiconductor laser device according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a holding mechanism of the semiconductor laser device.

FIG. 3 is a sectional view showing a holding mechanism of a semiconductor laser device according to a second embodiment.

FIG. 4 is a perspective view showing an LD holding unit according to a third embodiment.

FIG. 5 is a perspective view showing an LD holding portion of a fourth embodiment.

FIG. 6 is a perspective view showing an LD holding portion of a fifth embodiment.

FIG. 7 is a perspective view showing a semiconductor laser device according to a sixth embodiment.

FIG. 8 is a perspective view showing a semiconductor laser device according to a seventh embodiment.

FIG. 9 is a cross-sectional view showing a structure of a conventional example.

[Explanation of symbols]

 1 Semiconductor Laser Device (LD) 2 LD Holding Part 3 LD Holding Member 4 Collimating Lens Flange 5 Collimating Lens 6 Lens Holder 7 Tilt Adjusting Member 8 Mounting Screw 9 Compression Spring 10 Position Adjusting Screw 101 Compression Spring 13 Groove 14 Projection Article 23 Pin 24 Steel ball 25 Projection

Claims (10)

[Claims] 1. A semiconductor laser device having a plurality of laser light output sections arranged in a line, and a light beam emitted from the plurality of laser light output sections in a parallel state, a divergent state, or a convergent state. A light source device of an optical scanning device in which a semiconductor laser device and a lens are integrated by attaching an LD holding part holding a semiconductor laser device to a lens holding part holding the lens, A semiconductor laser parallel to a surface having a plurality of laser light output portions
The mounting surface of the laser device and the LD holding portion are in contact with each other at a line or a plurality of points that pass through the central portions of the plurality of laser light output portions and are orthogonal to the line connecting the plurality of laser light output portions. Contact the rear surface of the semiconductor laser device and move the semiconductor laser device to L
A distance varying mechanism for varying the distance to the LD holding portion is provided at positions on both sides of the semiconductor laser device on an extension of a line connecting a plurality of laser light output portions of a holding member fixed to the D holding portion. A light source device of an optical scanning device characterized by the above. 2. A pair of mounting screws into which a distance varying mechanism of a holding member that contacts the rear surface of the semiconductor laser device and fixes the semiconductor laser device to the LD holding portion is screwed into the LD holding portion. The light source device of the optical scanning device according to claim 1, further comprising an elastic member provided between the head of the mounting screw and the pressing member. 3. A position adjusting screw for pressing in a direction parallel to a line connecting a plurality of laser light output parts from a side surface of the LD holding part and a position adjusting screw facing the position adjusting screw sandwiching the semiconductor laser device. The light source device of the optical scanning device according to claim 2, further comprising a compression spring provided at a position. 4. The mounting surface of the semiconductor laser device and the LD holding portion are brought into contact with each other via an inclination adjusting member fitted to the LD holding portion and having a wedge-shaped tip. 3. The light source device of the optical scanning device according to item 3. 5. The mounting surface of the semiconductor laser device and the LD holding portion are brought into contact with each other via a pin having a circular or triangular cross section fixed to the mounting surface of the LD holding portion.
A light source device of the optical scanning device described. 6. The optical scanning device according to claim 1, wherein the mounting surface of the semiconductor laser device and the LD holding portion are brought into contact with each other via a steel ball fixed to the mounting surface of the LD holding portion. Light source device. 7. The mounting surface of the semiconductor laser device is brought into contact with a wedge-shaped protrusion provided on the LD holding portion.
Alternatively, the light source device of the optical scanning device according to item 3. 8. The light source device for an optical scanning device according to claim 1, wherein a wedge-shaped protrusion provided on the mounting surface of the semiconductor laser device is brought into contact with the mounting surface of the LD holding portion. 9. A light source device for an optical scanning device according to claim 4, wherein the contact portion of the mounting surface of said semiconductor laser device has a recess. 10. The light source device of an optical scanning device according to claim 8, wherein the contact portion of the LD holding portion has a recess.