JPH08223732A - Stripping apparatus for removing semiconductive coating from cable - Google Patents

Abstract

PURPOSE: To obtain a stripping apparatus by which an outer semiconductive layer can be stripped simply and uniformly. CONSTITUTION: A able fitting part 11 is fitted to, and arranged at, a part in which an outer semiconductive layer 4 at the edge of a power cable is exposed. Then, the cable fitting part 11 is slid on the circumferential face of the outer semiconductive layer 4, and the outer layer 4 is cut by a cutting edge 15. At this time, a roller 16 turns the outer layer 4, and the intervale between an arm 13 supporting the cutting edge 14 and the outer layer 4 is maintained to be constant.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cable outer conductor stripping device capable of easily stripping an outer semiconductive layer of a power cable.

[0002]

2. Description of the Related Art FIG. 3 is a schematic view showing an example of a CV cable (crosslinked polyethylene insulated power cable). This C
In the V cable, the center conductor 1 is formed by twisting a plurality of conductors, and an inner semiconductive layer 2 is provided around the center conductor 1. An insulator layer 3 made of cross-linked polyethylene is provided around the inner semiconductive layer 2, and an outer semiconductive layer 4 is provided around the insulator layer 3. A semiconductive cloth tape 5 is wound around the outer semiconductive layer 4, and a metal shielding layer 6 formed by winding, for example, a copper tape around the semiconductive cloth tape 5.
Is provided. A cloth tape 7 is provided around the metal shielding layer 6.
Is wound, and the cloth tape 7 is covered with a vinyl sheath 8.

By the way, in connecting a CV cable or the like, it is necessary to peel off the outer semiconductive layer to expose the insulating layer. Conventionally, when the outer semiconductive layer is peeled off, an operator scrapes off the outer semiconductive layer with, for example, a corner of glass. In this case, normally, the operator strips off a part of the outer semiconductive layer in the circumferential direction in the cable longitudinal direction, and when the insulator layer is exposed, the stripping is stopped and the insulator layer is exposed. The stripping of the outer semiconductive layer of the portion adjacent in the circumferential direction of the portion is started.

[0004]

However, conventionally,
The peeling of the outer semiconductive layer of the power cable is performed manually by the operator, which requires skill and is complicated, and there is a problem in that the variation in the peeling thickness is large. There is also a problem in that when the external semiconductive layer is stripped off, the insulating layer may be deeply scratched or the insulating layer may be excessively scraped off. Further, since it is a manual work, the insulating layer after the external semiconductive layer is stripped off may have an angular shape.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a cable outer conductor stripping device capable of stripping the outer semiconductive layer easily and uniformly.

[0006]

A cable outer conductor stripping device according to the present invention is a cable outer conductor stripping device for stripping an outer semiconductive layer of a power cable, the cable being capable of being fitted to the power cable. A grip portion, an extension portion supported by the cable grip portion and extending in a central axis direction of the cable grip portion, and a cutting blade supported by the extension portion and in contact with the outer semiconductive layer of the power cable. It is characterized by

[0007]

In the present invention, after the cable grip portion is fitted to the power cable with the external semiconductive layer exposed, the cable grip portion is slid with respect to, for example, the peripheral surface of the power cable to form the extension portion. The outer semiconductive layer is moved in the circumferential direction.
Then, the cutting blade supported by the extending portion also moves in the circumferential direction of the cable, so that the outer semiconductive layer is cut by the tip portion of the blade. In the present invention, as described above, since the outer semiconductive layer is stripped off by moving the cutting blade in the circumferential direction of the cable, it is extremely easy and no skill is required, and the insulating layer is not damaged. Inconvenience can be prevented, and the peripheral surface of the insulating layer is finished smoothly.

In this case, if a guide member for keeping the distance between the extending portion and the outer semiconductive layer constant is attached to the extending portion, the cutting depth by the cutting blade is surely kept constant. The outer semiconductive layer can be peeled off with a more uniform thickness.

[0009]

Embodiments of the present invention will now be described with reference to the accompanying drawings. FIG. 1 is a schematic front view showing a cable outer conductor stripping device according to an embodiment of the present invention, and FIG. 2 is a schematic side view thereof. The cable outer conductor stripping device according to the present embodiment supports a ring-shaped cable gripping portion 11, a rod 12 protruding in the radial direction of the cable gripping portion 11 from an outer peripheral surface of the cable gripping portion 11, and supported by the rod 12. The arm 13 extending in the axial direction of the cable gripping portion 11, the cutting blade 14 fixed to the tip of the arm 13 and protruding toward the cable circumferential surface, and slightly fixed to the rod 12 side of the cutting blade 14 of the arm 13. The roller support portion 15 is provided with a roller 16, and the roller 16 is disposed on the roller support portion 15 so that the rotation axis is parallel to the central axis of the cable grip portion 11. Further, as shown in FIG. 2, the tip of the cutting blade 14 projects slightly toward the cable center side from the roller 16, and the projecting length (hereinafter, referred to as the margin) x can be adjusted.

A method of stripping the outer conductive layer using the cable outer conductor stripping apparatus according to this embodiment will be described below. First, in the same manner as the conventional method, the sheath, the shielding layer and the like at the end of the power cable are stripped off to expose the outer semiconductive layer 4. Then, the cable grip 11 is fitted to the exposed portion of the outer semiconductive layer 4. In this case, the inner diameter of the cable grip portion 11 is set to be slightly larger than the outer diameter of the outer semiconductive layer 4, and the cable grip portion 11 is slidable with respect to the cable in the longitudinal direction and the circumferential direction. .

When the cable gripping portion 11 is fitted on the peripheral surface of the outer semiconductive layer 4 of the power cable, the roller 16 is adapted to come into contact with the outer semiconductive layer 4. Further, the protrusion x is adjusted according to the thickness of the outer semiconductive layer 4.

After the cable outer conductor stripping device according to this embodiment is attached to the cable end in this way, the arm 13
While sliding the cable fitting portion 11 in the circumferential direction of the outer semiconductive layer 4 while urging the cutting blade 14 toward the cable center direction, the cutting blade 14 is moved in the circumferential direction of the cable. As a result, the cutting blade 14
The external semiconductive layer 4 is stripped off by. In this case, since the stripping thickness is determined by the protrusion x, the outer semiconductive layer 4 can be stripped to a constant thickness. Also, blade 1
The cable grip 1 while moving 4 in the circumferential direction of the cable
By moving 1 in the longitudinal direction of the cable, the outer semiconductive layer can be stripped in the longitudinal direction of the cable by a predetermined length.

In this embodiment, after the cable gripping portion is fitted to the cable end portion, the cutting blade 14 is moved in the circumferential direction of the cable to easily and uniformly strip the outer semiconductive layer 4. Therefore, no skill is required, and there is no fear that the insulator layer 3 is flawed. Further, the stripping thickness can be set to a desired thickness by adjusting the protrusion x of the cutting blade 14. Further, in this embodiment, the outer semiconductive layer can be peeled off to a uniform thickness,
There is also an effect that the peripheral surface of the insulator layer 3 is finished smoothly.

In this embodiment, the case where the cable gripping portion slides on the peripheral surface of the outer semiconductive layer has been described, but the cable gripping portion can be fixed to the cable, and the outer peripheral surface of the cable gripping portion is fixed. A rail may be provided on the rod, and the rod may move along the rail in the circumferential direction of the cable gripping portion. Also in this case, the same effect as that of the above-described embodiment can be obtained. Further, the arm may be moved electrically.

[0015]

As described above, the cable outer conductor stripping device according to the present invention is provided with a cable grip portion, an extension portion supported by the cable grip portion, and a cutting blade supported by the extension portion. Therefore, the outer semiconductive layer can be stripped to a uniform thickness by, for example, sliding the cable gripping portion on the peripheral surface of the power cable and moving the cutting blade in the circumferential direction of the power cable. Thus, there is no fear of scratching the insulating layer, and the effect that the surface of the insulating layer is finished smoothly is achieved.

[Brief description of drawings]

FIG. 1 is a schematic front view showing a cable outer conductor stripping device according to an embodiment of the present invention.

FIG. 2 is a schematic side view of the same.

FIG. 3 is a schematic diagram showing an example of a CV cable.

[Explanation of symbols]

 1; central conductor 2; inner semiconductive layer 3; insulator layer 4; outer semiconductive layer 5; semiconductive cloth tape 6; metal shielding layer 7; cloth tape 8; sheath 11; cable grip portion 12; rod 13; Arm 14; Cutting blade 15; Roller support 16; Roller

Claims (2)

[Claims] 1. A cable outer conductor stripping device for stripping an outer semiconductive layer of a power cable, comprising: a cable grip portion capable of being fitted to the power cable; and a cable grip portion supported by the cable grip portion. A cable outer conductor stripping device comprising: an extension portion extending in the central axis direction; and a cutting blade supported by the extension portion and in contact with the outer semiconductive layer of the power cable. 2. A guide member is attached to the extension portion, the guide member being in contact with the outer semiconductive layer of the power cable to maintain a constant gap between the extension portion and the outer semiconductive layer of the power cable. The cable outer conductor stripping device according to claim 1, wherein: