JPH08215876A - Method and device for positioning substrate - Google Patents

Abstract

PURPOSE: To process always highly efficiently a substrate in whichever axial direction objects to be machined may be aligned more between the two axes in a prescribed rectangular coordinate system on that substrate. CONSTITUTION: The device is provided with a stage 36 movable on the XY coordinate. The moving speed of this stage is faster in the X direction than in the Y direction. In a prealignment device 18, the flat of a wafer W is irradiated with a light beam so as to detect a part of it photoelectrically; and thereby, after detecting a positional relation in the rotary direction between the flat and the X or Y axis, the wafer W with objects to be machined aligned more in the direction parallel to the flat is rotated so that the flat is in parallel to the X axis, while the wafer W with objects aligned more in the direction vertical to the flat is rotated in such vertical direction. Thus, after the positioning of the rotary direction of the wafer, the wafer W on the stage 36 is machined as the stage 36 is relatively scanned against a laser light.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate positioning method and apparatus, and more particularly, to a substrate mounted on a stage while relatively scanning the stage in the directions of two orthogonal axes with respect to a laser beam. A device for processing workpieces arranged substantially along a predetermined orthogonal coordinate system, for example, a laser repair for making pattern defects of various kinds of semiconductor wafers good by cutting redundant circuit switching fuses. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate positioning method suitable for pre-alignment of a wafer in an apparatus or the like and the apparatus.

[0002]

2. Description of the Related Art First, the flow of operation of a wafer pre-alignment apparatus in a conventional laser repair apparatus or the like will be described with reference to FIG.

As shown in FIG. 10 (A), a transfer arm (not shown) is mounted on a wafer rotating / up-and-down moving mechanism (hereinafter appropriately referred to as "center-up") 102 provided at substantially the center of the pre-alignment apparatus 100. Wafer W
When the wafers W are transferred, the wafer W is transferred to the plurality of guides 1 radially arranged on the main body of the pre-alignment apparatus 100.
Are centered by wafer centering mechanisms 108, 108, ... Sliding along 06, 106, ....
The centering mechanism 108 is controlled by a control means (not shown), and the control means immediately retracts the centering mechanism 108 after the centering is completed (see FIG. 10B).

Next, the center-up 102 is rotationally driven by a control means (not shown), and as a result, FIG.
As shown in (B), the wafer W rotates. During the rotation of the wafer W, an orientation flat (a linear notch formed in a part of the outer periphery of the wafer W: hereinafter, referred to as "flat" as appropriate) is obtained by a flat detection sensor 110 including a transmission or reflection photosensor. The position of the OF is detected. The control means (not shown) monitors the output of the flat detection sensor 110, and when it judges that the flat OF is detected based on the output of the flat detection sensor 110, the predetermined angle center up 102 is further rotated from that point. The rotation of the wafer W is stopped at the position. This is the moving direction of a wafer stage (not shown) in which the flat OF of the wafer W moves two-dimensionally in the XY plane (the redundant circuit switching fuse (workpiece) on the wafer W is processed on this stage). This is because the wafer W is rotationally positioned so that the flat OF becomes parallel to the X axis.

After the wafer W is rotationally positioned in this way, the control means presses the positioning hammer 112 onto the wafer W. As a result, the wafer W is moved from the position shown by the dotted line to the position shown by the solid line in FIG.
Positioning fixing pin 1 that moves to form a positioning mechanism
Wafer W pressed against 14a, 114b, 114c
Is accurately positioned.

After this positioning, the control means retracts the positioning hammer 112 and moves the center up 102.
Is driven up and stopped, and is made to stand by at that position to wait for a transfer arm (not shown) to move below the wafer W. When the transfer arm moves below the wafer W, the control means lowers the center-up 102. As a result, the wafer W is transferred to the transfer arm while being positioned (pre-aligned), and is mounted on the wafer holder (not shown) on the wafer stage by the transfer arm.

Next, FIG. 1 shows the workpiece to be processed inside the wafer.
The description will be made with reference to FIGS.

As shown in FIG. 11A, the wafer W
Inside, a plurality of IC chips 1 with wiring patterns processed
There are sixteen. In one IC chip 116, FIG.
There are one or more workpiece alignments 118 and 120 parallel and orthogonal to the flat OF, as shown enlarged in 1 (B).

FIG. 12 shows an enlarged view of the elliptical portion D of FIG. 11 (B). As shown in FIG. 12, the rows 118 and 120 of the workpieces include a plurality of workpieces 122 and 12 that are orthogonal or parallel to the flat OF.
4 (for example, a redundant circuit switching fuse). Incidentally. The crosses in FIG. 12 indicate processing points. Only the workpiece with this X mark is processed. The number of the workpieces 122 and 124, the arrangement position in the IC chip 116, and the arrangement manner are various depending on the type of the wafer W. Therefore, some wafers have a large number of workpieces in the direction parallel to the flat OF, and some wafers have a large number of workpieces in the orthogonal direction.

The wafer W on the wafer stage is processed, for example, by the flow indicated by the arrow in FIG. That is, as shown by the arrows in FIG. 13, the laser beam for processing aligns 118 the workpieces on the chip 116 in the direction parallel to the flat OF, or the rows 118 of the workpieces orthogonal to the flat OF. While moving along 120, the workpiece 122 or 124 constituting the workpiece is processed. In this way, the IC chip 11 on the wafer W is radiated by the laser light which is relatively scanned in a zigzag pattern by the movement between blocks.
When the array 118, 120 of the workpieces at the left end portion in 6 is processed, the laser light moves (moves between the workpieces) toward the next workpiece in the chip 116. When this process is sequentially repeated and the processing in the IC chip is completed,
The laser light moves to the next chip (moves between chips), and the same processing is repeated.

Here, in the conventional apparatus, the relative scanning of the laser light for the above-described processing with respect to the wafer W is performed by scanning the wafer stage in the X direction (direction parallel to the flat OF) and the Y direction (direction orthogonal thereto). It was done by moving to. Therefore, the processing of the workpieces 122 forming the array 118 of workpieces parallel to the flat OF is performed during the movement of the wafer stage in the X direction, and the array of workpieces orthogonal to the flat OF is provided. The processing of the object to be processed 124 that constitutes 120 was performed during the movement of the wafer stage in the Y direction.

[0012]

The movement speeds of the wafer stage in the X direction and the Y direction are usually different from each other. Here, for example, consider a case where the moving speed in the X direction is higher than that in the Y direction.

FIG. 14 shows the flow of wafer processing for two wafer types. In this figure, the upper stage shows the wafer type, the middle stage shows the state of the wafer after pre-alignment, and the lower stage shows the state of the wafer placed on the wafer stage. In the case of the wafer type W1 as shown in FIG. 14A, the processing efficiency is high because there are many workpieces arranged in a direction parallel to the flat OF, but FIG.
For wafer type W2 such as 4 (B), flat O
Since many workpieces are arranged in the direction orthogonal to F, the processing efficiency becomes extremely low.

As described above, there is a disadvantage that the processing efficiency is different depending on whether there are many arrangements of workpieces parallel to the orientation flat or many arrangements of workpieces orthogonal to the orientation flat. It was

The present invention has been made in view of the above disadvantages of the prior art, and an object thereof is to arrange a large number of workpieces on a substrate in either of the two axes of a predetermined orthogonal coordinate system. Even so, it is an object of the present invention to provide a substrate positioning method and apparatus capable of always processing the substrate with high efficiency.

[0016]

According to the first aspect of the present invention,
A first direction and a second direction orthogonal to the stage with respect to the laser light.
Used in a device for processing a workpiece arranged substantially along a predetermined orthogonal coordinate system on a substrate placed on the stage while performing relative scanning in different directions at different scanning speeds, A method of positioning a substrate in which the substrate is positioned in the rotational direction prior to irradiating the workpiece, the method comprising irradiating a notch provided in a part of an outer periphery of the substrate with a light beam. By photoelectrically detecting the part,
A first step of detecting the positional relationship between the notch and the first or second direction in the rotational direction; an axis having a large number of workpieces to be machined out of the two axes of the orthogonal coordinate system, 1,
And a second step of rotating the substrate based on the detected positional relationship so as to be substantially parallel to the direction in which the scanning speed is fast in the second direction.

According to a second aspect of the present invention, the stage is preliminarily set on a substrate mounted on the stage while relatively scanning the stage with respect to the laser light in different first and second directions at different scanning speeds. Used in a device for processing a work piece arranged substantially along the orthogonal coordinate system, and performing positioning of the board in the rotational direction of the work piece prior to irradiating the work piece with the laser beam. In the rotation direction of the notch and the first or second direction by irradiating the notch provided in a part of the outer periphery of the substrate with a light beam and photoelectrically detecting the part. A first step of detecting the positional relationship between the notches; positioning at the first predetermined position or the second predetermined position selected according to the number of workpieces to be machined in which the notches are arranged in each axial direction of the orthogonal coordinate system. To be,
A second step of rotating the substrate based on the detected positional relationship.

In this case, the substrate is arranged so that the axis having a large number of workpieces to be machined out of the two axes of the orthogonal coordinate system is substantially parallel to the direction in which the inward scanning speed in the first and second directions is high. It may be rotated.

According to a fourth aspect of the present invention, the stage is moved relative to the laser beam in a first direction and a second direction orthogonal to each other at different scanning speeds, and a predetermined amount is set on a substrate placed on the stage. Substrate positioning device for use in a device for processing a work piece arranged substantially along the rectangular coordinate system, and for positioning the board in the rotational direction of the work piece before irradiating the work piece with the laser light. In the rotation direction of the notch and the first or second direction by irradiating the notch provided in a part of the outer periphery of the substrate with a light beam and photoelectrically detecting the part. Detecting means for detecting the positional relationship of the substrate; a rotating mechanism for holding the substrate and rotating the substrate in a plane parallel to the first and second directions; and the notches arranged in each axial direction of the orthogonal coordinate system. Selected according to the number of workpieces to be processed The first to be positioned at a predetermined position or a second predetermined position that has a control means for controlling the rotating mechanism on the basis of the detected positional relationship.

In this case, the first positioning means for positioning the substrate whose cutout is positioned at the first predetermined position at the first position at the same rotation angle, and the second cutout are provided.
Second positioning means for positioning the substrate positioned at the predetermined position at the second position at the same rotation angle may be further provided.

Alternatively, instead of the first positioning means and the second positioning means, center deviation detecting means may be provided for detecting the center deviation amount of the substrate in a non-contact manner while the substrate is being rotated by the rotating mechanism.

When the first positioning means and the second positioning means are not provided, the first checking means for detecting whether or not the notch is positioned at the first predetermined position, and the notch as the second Second check means for detecting whether or not it has been positioned at a predetermined position.

[0023]

According to the first aspect of the present invention, the notch and the first or the first notch are formed by irradiating the notch provided on a part of the outer periphery of the substrate with a light beam and photoelectrically detecting the part. After detecting the positional relationship between the two directions and the rotational direction, the two axes of the Cartesian coordinate system, which have a large number of workpieces to be machined, are substantially parallel to the direction in which the inner scanning speed in the first and second directions is high. As described above, the substrate is rotated based on the detected positional relationship.
After the substrate is positioned in the rotational direction in this way, when the substrate on the stage is processed while the stage is relatively scanned with respect to the laser light, whichever of the two axes of the Cartesian coordinate system is used. Even if the substrate has many objects to be added,
It can always be processed with high efficiency.

In this case, the positional relationship between the notch and the predetermined orthogonal coordinate system in the rotational direction can be arbitrarily determined. Moreover, since it is known at the time of rotational positioning, the notch may be anywhere on the outer peripheral portion of the substrate. Absent.

According to the second aspect of the present invention, the notch and the first or the first notch are formed by irradiating the notch provided on a part of the outer periphery of the substrate with a light beam and photoelectrically detecting the part. Two
After the positional relationship between the direction and the rotation direction is detected, the notch is positioned at the first predetermined position or the second predetermined position selected according to the number of workpieces to be machined arranged in each axial direction of the orthogonal coordinate system. As described above, the substrate is rotated based on the detected positional relationship. Therefore, the notch is located at the first predetermined position or the second position.
, The predetermined orthogonal coordinate system is substantially coincident with the first and second directions, and the axis of the orthogonal coordinate system on which the workpieces to be processed are lined up is the first, Second
The first predetermined position and the second predetermined position are set in advance so as to coincide with the direction in which the scanning speed is fast, so that the substrate is positioned in the rotational direction as in the first aspect of the invention. After that, when the substrate on the stage is processed while relatively scanning the stage with respect to the laser light, no matter which of the two axes of the Cartesian coordinate system has a large number of objects to be processed, the substrate is always processed. It can be processed with high efficiency.

In this case, after positioning the notch at the first predetermined position or the second predetermined position, the substrate is further rotated so that the number of workpieces to be machined is within the two axes of the orthogonal coordinate system. The many axes can be rotated so that they are substantially parallel to the direction in which the inward scan speeds in the first and second directions are fast. Therefore, the first predetermined position and the second predetermined position can be arbitrarily determined.

According to the fourth aspect of the present invention, the detecting means irradiates the notch provided on a part of the outer periphery of the substrate with the light beam and photoelectrically detects the part, thereby forming the notch and the first part. , Or the positional relationship in the rotation direction with the second direction is detected.
The control means detects the position such that the notch is positioned at the first predetermined position or the second predetermined position selected according to the number of workpieces to be machined arranged in each axial direction of the orthogonal coordinate system. The rotation mechanism is controlled based on the relationship. The rotation mechanism holds the substrate and rotates it in a plane parallel to the first and second directions, whereby the notch is positioned at the first predetermined position or the second predetermined position.

Therefore, the notch is located at the first predetermined position or the second position.
, The predetermined orthogonal coordinate system is substantially coincident with the first and second directions, and the axis of the orthogonal coordinate system on which the workpieces to be processed are lined up is the first, Second
By defining the first predetermined position and the second predetermined position in advance so as to coincide with the direction in which the scanning speed is fast, the stage is positioned with respect to the laser beam after the substrate is positioned in the rotation direction. When the substrate on the stage is processed while performing relative scanning on the substrate, it is possible to always process the substrate with high efficiency regardless of which of the two axes of the orthogonal coordinate system has a large number of objects to be added.

In this case, the first positioning means for positioning the substrate whose cutout is positioned at the first predetermined position at the first position at the same rotation angle and the second cutout are provided.
When the substrate positioned at the predetermined position is also provided with the second positioning unit that positions the substrate at the second position at the same rotation angle, the rotational position of the substrate can be reliably positioned.

Further, when the center shift detecting means for detecting the center shift amount of the substrate in a non-contact manner during the rotation of the substrate by the rotating mechanism is provided, the center shift can be corrected.
The substrate can be accurately positioned.

Further, a first check means for detecting whether or not the notch is positioned at the first predetermined position, and a second check for detecting whether or not the notch is positioned at the second predetermined position. In the case where the means is also provided, the positioning can be performed again if the positioning is not accurately performed, so that the rotational positioning of the substrate can be reliably performed.

[0032]

【Example】

<< First Embodiment >> Hereinafter, a laser repair apparatus of a first embodiment to which a substrate positioning apparatus according to the present invention is applied,
A description will be given based on FIGS. 1 to 4. In the following description, as the wafer W as the substrate, an orientation flat (hereinafter, appropriately referred to as “flat”) OF as a notch as described in the section of the conventional example described above is used.
Is provided in a part of the outer peripheral portion, and a wafer in which objects to be processed are arranged in a direction parallel or orthogonal to the flat OF is used (same in the second and third embodiments).

FIG. 1 shows a schematic structure of a laser repair apparatus 10 according to the first embodiment. The laser repair device 10 includes a wafer carrier table 14, a wafer transfer arm mechanism 16, a pre-alignment device 18 as a substrate positioning device, and an XY stage device 20.

The wafer carrier table 14 is a table on which the wafer carrier 12 containing the wafer W as a substrate is placed.

The wafer transfer arm mechanism 16 extracts the wafer W from the wafer carrier 12 placed on the wafer carrier table 14 and transfers it to the pre-alignment device 18, or the pre-alignment device 18 performs pre-alignment as described later. The wafer W is transferred to a wafer holder 40, which will be described later, while maintaining the rotation direction of the wafer W as it is. This wafer transfer arm mechanism 16
Has a transfer arm 22 that holds and transfers the wafer W, and an arm drive mechanism 24 that drives the transfer arm 22. The arm drive mechanism 24 is controlled by a controller 78 described later (see FIG. 3).

The XY stage device 20 is provided with a pedestal 26, a base plate 28 provided on the pedestal 26, and a reciprocal movement along the movement guides 30A and 30B on the base plate 28 in the Y-axis direction in FIG. The Y table 32 and an X table 36 as a stage provided on the Y table 32 so as to be capable of reciprocating along the movement guides 34A and 34B in the X axis direction orthogonal to the Y axis.
It is comprised including. Here, the Y table 32,
The X-table 36 is driven in the Y-axis direction and the X-axis direction by a motor (not shown) via a feed screw mechanism (not shown). Since these configurations are known, detailed description thereof will be omitted. In the case of this embodiment, the X table 3
The moving speed of 6 is set to be higher than the moving speed of the Y table 32.

One end of the mount 26 (lower end in FIG. 1)
The wafer carrier table 14, the wafer transfer arm mechanism 16, and the table 38 on which the pre-alignment device 18 is mounted are fixed on the top. A wafer holder 40 is provided on the X table 36.

Further, although not shown in FIG. 1,
Actually, in the central portion of the base plate 28, an objective lens forming an irradiation optical system of a processing laser beam for processing the wafer W placed on the wafer holder 40 is arranged at a predetermined interval in the front direction of the paper surface of FIG. It is provided in a separated position.

Next, the pre-alignment device 18, which is the main part of the present invention, will be described with reference to FIG. Figure 2
The upper main body 5 of the pre-alignment device 18 is shown in FIG.
A plan view is shown with 2 removed, as shown in FIG.
FIG. 1B schematically shows a bottom view of FIG. 1A, that is, a front view of the pre-alignment device 18.

This pre-alignment device 18 is shown in FIG.
As shown in (B), it has a square plate-shaped lower main body 50 facing each other at a predetermined interval, and an upper main body 52 having the same shape. The lower body 50 and the upper body 52 may have any shape or may have different shapes. A center up 54 as a rotation mechanism and a vertical movement mechanism is provided at the center of the lower body 50.
Further, the flat OF of the wafer W is placed on the lower main body 50.
A flat detection sensor 56 including a transmission type (or reflection type) photosensor for detecting the position of the flat OF by irradiating a light beam on the substrate and photoelectrically detecting a part of the transmitted light (or reflected light), and a wafer center. And a delivery mechanism (which will be described later).

The center-up 54 is in the shape of a cylinder (or may be in the shape of a quadrangle, or any shape), and is shown in FIG.
As shown by the arrows A and B, the structure is such that it can move up and down and rotate about the axis C. This center up 54
Is actually driven and controlled by a controller 78 described later via a center-up drive mechanism (not shown in FIG. 2) 84 (see FIG. 3).

The wafer centering mechanism is composed of a plurality of guide members 58 radially arranged on the lower main body 50 with the center-up 54 as a center, and a plurality of pins 60 reciprocating along the respective guide members 58. Has been done. These pins 60 are actually pin drive mechanisms (see FIG.
(Not shown) 86 via a controller 78 described later
Are simultaneously driven by the same distance (see FIG. 3).

On the other hand, on the upper main body 52, as shown in FIG. 2B, two fixing pin blocks 62 and 64 are provided so as to project downward. One fixed pin block 62 is arranged in the vicinity of one end of the upper main body 52 in parallel with one end face, and the other fixed pin block 64 is arranged in the vicinity of the other end face of the upper main body 52 orthogonal to the one end face. Are arranged in parallel with each other (see FIG. 2A). The one fixed pin block 62 is provided with three positioning pins 66A, 66B, 66C arranged along the longitudinal direction thereof so as to project downward, and the other fixed pin block 64 is provided along the longitudinal direction thereof. Positioning pins 6 arranged as
8A, 68B, and 68C are provided so as to project downward.
Further, a guide member 70 for a positioning hammer, which is arranged in a direction approaching and separating from the center up 54, is provided on the upper main body 52 so as to project downward, and a positioning hammer 72 is provided along the guide member 70. Are provided so that they can be moved back and forth. The positioning hammer 72 is actually driven and controlled by a controller 78 described later via a hammer driving mechanism (not shown in FIG. 2) 90 (see FIG. 3).

Here, the positioning pins 66A, 66C, 6
8B shows the wafer W after being rotationally positioned by the center-up 54 so that the flat OF comes to a position (first predetermined position) in which the flat OF is parallel to the X axis.
(A) is a pin that constitutes the first positioning means for positioning to the position (first position) shown by the solid line in FIG. 9A together with the positioning hammer 72, and the positioning pins 66B, 68A, 6
8C shows the wafer W after being rotationally positioned by the center-up 54 so that the flat OF comes to a position (second predetermined position) in which the flat OF is parallel to the Y axis.
It is a pin that constitutes second positioning means for positioning to the position (second position) indicated by the chain double-dashed line in (A) together with the positioning hammer 72.

Next, the control system of the apparatus 10 will be described. FIG. 3 shows a schematic configuration of this control system.
In this figure, an encoder 80 for detecting the rotation angle of the center-up 54 is provided at the input end of the controller 78.
The flat detection sensor 82 and the X table 36 described above.
A stage position detection sensor (normally composed of a light wave interferometer) 92 for detecting the position (XY coordinate position) is connected. On the other hand, at the output end of this controller 78,
A center-up drive mechanism 84, a pin drive mechanism 86, an arm drive mechanism 88, a hammer drive mechanism 90, and a stage drive system 94 that drives the X table 36 and the Y table 32 are connected.

The controller 78 is composed of a CPU (central processing unit), a ROM, a RAM, a microcomputer including an input interface, an output interface and the like.

Next, the overall operation of the laser repair apparatus 10 configured as described above will be described focusing on the control function of the controller 78.

The controller 78 controls the arm driving mechanism 88 to drive the transfer arm 22, extract the wafer W from the wafer carrier 12 placed on the wafer carrier table 14, and transfer the transfer arm 22 holding the wafer W.
Is moved between the upper main body 52 and the lower main body 50 which form the pre-alignment apparatus 18. Next, the controller 78 drives the center-up drive mechanism 84 to drive the center-up 54 upward to hold the wafer W from below, and controls the arm drive mechanism 88 to retract the transfer arm 22. Next, the controller 78 controls the center-up drive mechanism 84 so that the center-up 54 descends by a predetermined amount. As a result, the wafer W moves to the position shown by the chain double-dashed line in FIG. next,
The controller 78 drives the plurality of pins 60 forming the wafer centering mechanism toward the center-up 54 at the same speed via the pin drive mechanism 86. As a result, the pins 60 come into contact with the outer periphery of the wafer W to center the wafer W. The controller 78 immediately retracts each pin 60 to the original position after the centering is completed.

Next, the controller 78 again drives the center-up 54 by a predetermined amount via the center-up drive mechanism 84. As a result, the wafer W is
Move to the height position shown by the solid line in (B). Then
The controller 78 rotationally drives the center-up 54 via the center-up drive mechanism 84. As a result, the wafer W is rotated while being held by the center-up 54. During the rotation of the wafer W, the flat detection sensor 56 detects the position of the flat OF. The controller 78 monitors the output of the flat detection sensor 56, and when it determines that the flat OF is detected based on the output of the flat detection sensor 56, the workpiece on the wafer W stored in the internal memory in advance. Based on the information indicating whether there are more arrangements in parallel or perpendicular to the flat OF, the wafer W is rotationally positioned in a direction in which the flat OF is parallel to the X axis or parallel to the Y axis. The angle center up 54 is further rotated and stopped.

That is, in the present embodiment, the flat detection sensor 56 and the controller 78 irradiate the flat OF of the wafer with a light beam and photoelectrically detect a part of the flat OF, so that the flat OF and the X-axis or the Y-axis direction. And a controller 78 configured to detect a positional relationship in the rotational direction of the flat OF, the flat OF being selected according to the number of workpieces to be machined arranged in each axial direction of a predetermined orthogonal coordinate system. A control unit that controls the center-up 54 as a rotating mechanism is configured based on the detected positional relationship so as to be positioned at a predetermined position or a second predetermined position.

After the wafer W is rotationally positioned as described above, the controller 78 presses the positioning hammer 72 onto the wafer W via the hammer driving mechanism 90. As a result, the wafer W having many workpieces arranged in the direction parallel to the flat OF is positioned at the position shown by the solid line in FIG. 2A, and the workpieces arranged in the direction orthogonal to the flat OF are aligned. The large number of wafers W are positioned at the positions indicated by the chain double-dashed line in FIG.

After this positioning, the controller 78 retracts the positioning hammer 72 and raises and stops the center up 54, and waits at that position to control the arm drive mechanism 88 to control the transfer arm 22 for the wafer W. Move it down. Next, in the controller 78, the center up 54 is moved through the center up drive mechanism 84.
To lower. As a result, the wafer W is transferred to the transfer arm 22 while being positioned (pre-aligned). Next, the controller 78 controls the arm drive mechanism 88 to transfer the wafer W onto the wafer holder 40 on the X table 36 while maintaining the rotational direction of the wafer W.

Thereafter, the wafer W is sucked by the wafer holder 40, and the wafer W and the workpiece on the wafer W are processed in the same manner as the conventional example described above. This process controls the stage drive system 94 based on the processing position data and the output of the stage position detection sensor 92, so that the X table 36 is provided below an unillustrated objective lens.
Laser beam in both the X and Y directions, and the laser light is moved to the X table 36.
Is performed by performing relative scanning with respect to.

In FIG. 4, in the first embodiment, FIG.
The flow of processing when the same two kinds of wafer types as those in FIG.

In this figure, the upper stage shows the wafer type, the middle stage shows the state of the wafer after pre-alignment,
The lower stage shows the state of the wafer placed on the X table 36.

In the case of the wafer type W1 as shown in FIG. 4A, the arrangement 1 of the workpieces parallel to the flat OF is set.
Since there are many 18, in the pre-alignment device 18,
The flat OF is positioned so that it is parallel to the X-axis, and then transferred onto the X-table 36. On the other hand, FIG.
In the case of wafer type W2 as shown in (B), flat OF
Since there are many rows 120 of workpieces in the orthogonal direction with respect to
In the pre-alignment device 18, the flat OF is Y
After positioning so as to be in the direction parallel to the axis, it is transferred onto the X table 36.

By doing so, regardless of whether the workpieces in the wafer W are arranged in the horizontal direction or in the vertical direction with respect to the flat OF, the wafer W is positioned in the direction in which the processing speed becomes faster.

<< Second Embodiment >> Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, the pre-alignment device 18 of the first embodiment described above is used.
Instead of the above, only a pre-alignment device 74 as a substrate positioning device is provided, which is different from the first embodiment, and the other parts are the same as the first embodiment. Therefore, only the configuration of the pre-alignment device 74 will be described,
The description of the configuration of the other parts is omitted. Further, the same or similar components as those of the pre-alignment apparatus 18 of the first embodiment described above are designated by the same reference numerals, and the description thereof will be simplified or omitted.

FIG. 5 shows the structure of the pre-alignment device 74 according to the second embodiment. In FIG. 5 (A),
A plan view of the prealignment device 74 with the upper main body 52 removed is shown, and FIG. 5B shows a bottom view of FIG. 5A, that is, a front view of the prealignment device 74. ing.

The pre-alignment device 74 has the same construction on the lower main body 50 side as that of the first embodiment, and the upper main body side 5
Only the configuration on the two side is different. The upper body 52 is provided with first and second U-shaped moving pin blocks 76A and 76B instead of the fixed pin blocks 62 and 64, and the central concave portions of these moving pin blocks 76A and 76B. And the third and fourth moving pin blocks 77A, 77 arranged as
B and are provided.

More specifically, the first moving pin block 76A is arranged in the vicinity of one end face of the upper main body 52 and in parallel with the one end face, and approaches and separates from the center up 54 along the Y-axis direction. It is configured to be able to reciprocate in any direction. In addition, the second moving pin block 76B is arranged in the vicinity of the other end surface of the upper main body 52 that is orthogonal to the one end surface thereof, in parallel with the other end surface thereof, and in the direction of approaching and separating from the center up 54 along the X-axis direction. It is configured to be reciprocally movable (see FIG. 5A). Further, the third moving pin block 77A can be reciprocated along the Y-axis direction between the central concave portions of the first moving pin block 76A, and similarly, the fourth moving pin block 77B can be moved to the second moving pin block 77B. The movable pin block 76B can be reciprocated along the X-axis direction between the central recesses. These moving pin blocks 76A,
76B, 77A and 77B are the controller 78 described above.
Is controlled by a pin block drive mechanism (not shown).

Wafer positioning pins 66A and 66C project downward from the first moving pin block 76A, and wafer positioning pins 68A and 68C project downward from the second moving pin block 76B. It is set up.
A wafer positioning pin 66B is provided on the third moving pin block 77A, and a wafer positioning pin 68B is provided on the fourth moving pin block 77A so as to project downward.

In this embodiment, the positioning hammer 72 and the wafer positioning pins 66A, 66C and 68B provided on the first and fourth moving pin blocks 76A and 77B, respectively.
And constitute a first positioning means for positioning the wafer W at the first position shown in FIG. 5 (A).
In addition, the positioning hammer 72 and the wafer positioning pins 68A, 68C and 66B provided on the second and third moving pin blocks 76B and 77A respectively position the wafer W at the second position shown in FIG. Positioning means is configured.

The other components of the pre-alignment device 74 are the same as in the first embodiment.

Next, the operation of the apparatus of the second embodiment thus constructed will be described. In the second embodiment as well, the controller 78 controls each part in the same manner as described in the first embodiment, and the position where the flat OF becomes parallel to the X axis in the same manner as in the first embodiment ( The wafer W is rotationally positioned so as to come to a position (first predetermined position) or a position (second predetermined position) that is parallel to the Y axis.

After the wafer W is rotationally positioned in this manner, the controller 78 drives the first positioning means or the second positioning means in accordance with the orientation of the flat OF of the wafer W to move the wafer W. Perform positioning.

That is, when the wafer W is rotationally positioned at the first predetermined position where the orientation of the flat OF is parallel to the X axis, the positioning hammer 72 and the first and fourth moving pin blocks 76A and 77B are respectively arranged. 5A is driven via the drive mechanism of FIG. 5A and the wafer positioning pins 66A, 66C, 68B perform positioning.
In this case, the second and third moving pin blocks 76B and 77
A is retreating.

On the other hand, when the wafer W is rotationally positioned at the second predetermined position where the orientation of the flat OF is parallel to the Y-axis, the positioning hammer 72 and the second and third moving pin blocks 76B and 77A are respectively arranged. 6 is driven via the drive mechanism of FIG. 6 to perform positioning by the wafer positioning pins 68A, 68C, 66B. In this case, the first and third moving pin blocks 76A and 77B are
It is evacuating.

After this positioning, the controller 78
With the positioning hammer 72, the moving pin block on which the positioning pins used for positioning the wafer W are mounted is retracted, and the center up 54 is driven to stop and stopped, and the arm drive mechanism 88 is controlled by waiting at that position. The wafer transfer arm 22 is moved below the wafer W. Thereafter, the controller 78 controls each part as in the first embodiment to transfer the wafer W onto the wafer holder 40 on the X table 36 while maintaining the orientation in the rotation direction.

Thereafter, the wafer W is held by the wafer holder 40.
Are adsorbed, and the wafer W is processed in the same manner as in the first embodiment.
The workpiece on the wafer W is processed.

As described above, according to the second embodiment, the same effect as that of the first embodiment can be obtained, and in the pre-alignment apparatus 74, an appropriate positioning pin is set according to the type of wafer and unnecessary. Since the positioning pins are retracted, it is possible to position the wafer W at the centered position by appropriately setting the moving amount of each moving pin block at the time of positioning, and it is possible to achieve higher accuracy. There is also an effect that pre-alignment of the wafer W can be realized.

<< Third Embodiment >> Next, a third embodiment of the present invention will be described with reference to FIGS. In the third embodiment, the pre-alignment device 18 of the first embodiment described above is used.
Instead of the above, only a pre-alignment device 96 as a substrate positioning device is provided, which is different from the first embodiment, and the other parts are the same as the first embodiment. Therefore, only the configuration of the pre-alignment device 96 will be described.
The description of the configuration of the other parts is omitted. Further, the same or equivalent components as those of the pre-alignment apparatus 18 of the first embodiment described above are designated by the same reference numerals, and the description thereof will be simplified or omitted.

FIG. 7 shows the structure of a pre-alignment device 96 according to the third embodiment.

The pre-alignment device 96 includes only the lower main body 50. At the center of the lower body 50, a center up 54 is provided as a rotating mechanism. Here, in the case of the third embodiment, the rotating mechanism does not necessarily have to move up and down, and may be configured to be rotatable.

Further, the center up 54 of the lower body 50
A flat detection sensor 97, which is an elongated transmissive or reflective photoelectric sensor, is arranged along the radial direction of the center-up 54 at a position separated by a predetermined distance from.

Further, at a position on the lower main body 50 which is separated from the center of rotation of the center-up 54 by the same distance as the radius of the wafer W in the Y-axis direction, a first positioning check sensor 98A as a first checking means. And a second positioning check sensor 98B as second checking means is provided at a position on the lower main body 50 that is separated from the center of rotation of the center-up 54 by the same distance as the radius of the wafer W in the X-axis direction. It is arranged. The first positioning check sensor 98A is a sensor for detecting whether or not the wafer W is rotationally positioned at a first predetermined position where the flat OF is parallel to the X axis, and the second positioning check sensor 98B is This is a sensor for detecting whether or not the wafer W is rotationally positioned at a second predetermined position where the flat OF is parallel to the Y axis. These sensors 98A, 98
B is composed of a circular transmissive or reflective photoelectric sensor.

FIG. 8 shows the schematic construction of the control system of the third embodiment. In this figure, an encoder 80 for detecting the rotation angle of the center-up 54, a flat detection sensor 97, and a stage position detection sensor for detecting the position of the X table (XY coordinate position) are provided at the input end of the controller 78 as the control means. 92 (generally composed of a light wave interferometer) and first and second positioning check sensors 98A, 98B are connected. On the other hand, at the output end of the controller 78, the center-up drive mechanism 8
4, an arm drive mechanism 88, and a stage drive system 94 that drives the X table 36 and the Y table 32 are connected.

Next, the operation of the thus constructed apparatus of the third embodiment will be described focusing on the control function of the controller 78.

The controller 78 controls the arm drive mechanism 88 to take out the wafer W from the wafer carrier 12 placed on the wafer carrier table 14 and move it to the center-up 54. Next, the controller 78 drives the center-up 84 upward to hold the wafer W from below and retract the wafer transfer arm 22. In this case, if the rotation mechanism does not have the vertical movement function, the transport arm 22 is configured to move up or down, or the tip end surface of the rotation mechanism coincides with the height position of the moving surface of the transport arm 22. Must be set to

Next, the controller 78 rotationally drives the center-up 54 through the center-up drive mechanism 84. As a result, the wafer W is rotated while being held by the center-up 54. While the wafer W is rotating,
The controller 78 monitors the output of the flat detection sensor 97 to center the fluctuation of the received light amount.
By detecting the rotation amount, the position of the flat OF and the center deviation amount (XY position deviation amount) of the wafer W are detected. That is, in the third embodiment, the flat detection sensor also serves as the center deviation detection means.

At the same time, in the controller 78, the flat OF is set on the X-axis based on the information which is preliminarily stored in the internal memory whether the workpieces on the wafer W are arranged in parallel or in a direction orthogonal to the flat OF. The center-up 54 is further rotated by a predetermined angle from the detection position of the flat OF so that the wafer W is rotationally positioned in a direction parallel to the Y axis or parallel to the Y-axis and stopped.

The center deviation of the wafer W may be detected first, and then the flat position may be detected.

As a result, the wafer W having a large number of workpieces arranged in the direction parallel to the flat OF is rotationally positioned at the first predetermined position shown in FIG.
The wafer W having a large number of workpieces arranged in a direction orthogonal to is rotationally positioned at the second predetermined position shown in FIG. 9 (B). Here, in the third embodiment, the controller 78 is
Based on the output of the positioning check sensor 98A or 98B, it is checked whether the flat OF faces the correct direction. Then, if the flat OF is oriented in the correct direction, the process proceeds to the next process. If it is not oriented in the correct direction, flat detection → rotational positioning → positioning check is performed again.

After the wafer W is thus positioned so that the flat OF faces the right direction, the controller 78 raises and stops the center-up 54 and stops it, and waits at that position to move the arm drive mechanism 88. The wafer transfer arm 22 is controlled to move below the wafer W. Next, the controller 78 lowers the center up 54. As a result, the wafer W is transferred to the transfer arm 22 while being positioned (pre-aligned). Next, the controller 78 controls the arm driving mechanism 88 to transfer the wafer W onto the wafer holder 40 on the X table 36 while maintaining the rotational direction of the wafer W. At this time, the controller 78 causes the arm drive mechanism 8
8 is controlled to correct the center deviation. The X table 36 and the Y table 32 may be finely moved via the stage drive system 94 to correct the center deviation.

After that, the wafer W is sucked by the wafer holder 40, and the wafer W and the workpiece on the wafer W are processed in the same manner as the conventional example described above.

Also according to the third embodiment described above, the first
In addition to obtaining the same effect as the embodiment, the center deviation of the wafer W can be detected by the flat detection sensor 97,
Since the center deviation can be corrected when the wafer W is transferred to the X table 36 after pre-alignment, a centering mechanism for the wafer W and a positioning mechanism such as a positioning hammer are unnecessary, and the structure of the pre-alignment apparatus is correspondingly provided. There is also an effect that can be simplified.

In the third embodiment described above, the flat detection sensor 97 also serves as the center deviation detecting means, but the center deviation detecting means may be provided separately from the flat detection sensor 97.

In the first to third embodiments, a single flat detection sensor for detecting the flat position during the rotation of the wafer W and a controller for monitoring the output of the flat detection sensor are used to determine the flatness and the X-direction. The case where the detection means for detecting the positional relationship in the rotational direction with respect to the axis or the Y-axis direction is exemplified, but the present invention is not limited to this, and the notch ( If a photoelectric sensor for irradiating a flat beam with a light beam and detecting the edge position at two or more positions of the notch is provided, and means for calculating the rotation amount of the substrate based on the output of this photoelectric sensor is provided, these The detecting means may be configured by

In the above first to third embodiments, the case where the wafer in which the objects to be processed are arranged along the direction parallel or orthogonal to the flat is used as the substrate.
The present invention is not applied only to such positioning of the substrate, and in short, any substrate can be used as long as the workpiece is arranged along a predetermined orthogonal coordinate system. The reason is that the positional relationship between the rectangular coordinate system and the notch in the rotational direction can be known in advance, and based on this, the axes of the predetermined rectangular coordinate system are made to substantially coincide with the relative scanning direction of the stage with respect to the laser light. Because you can.

In the first to third embodiments described above, the wafer W provided with the flat OF has been described as an example. However, a wafer having a notch (V-shaped notch) is used. The present invention can be similarly applied.

Further, in the above-mentioned first to third embodiments, the case where the laser light relatively scans the wafer W on the X table 36 by the movement of the X table 36 as the stage has been exemplified, but the stage is fixed. The laser light irradiation optical system including the objective lens may be two-dimensionally moved. Alternatively, both the stage and the laser light irradiation optical system may be two-dimensionally moved.

Further, in the above-mentioned first to third embodiments, the case where the pre-alignment device is provided separately from the X table as the stage is illustrated, but the positioning device according to the present invention may be provided on the stage. In this case, it is desirable to provide a positioning device having a center position deviation detecting means in that not only the rotation direction of the substrate but also the center positioning is possible.

Further, although the semiconductor wafer W is illustrated as the substrate in the first to third embodiments, the scope of application of the present invention is not limited to this, and for example, positioning of a liquid crystal substrate, a wiring substrate, etc. The same can be applied or applied to.

Similarly, in the above-mentioned embodiments, the case where the present invention is applied to the laser repair apparatus is illustrated, but the scope of application of the present invention is not limited to this, and the present invention is applicable to semiconductor elements such as steppers. Manufacturing equipment, liquid crystal substrate manufacturing equipment,
It is widely applicable to inspection devices and the like.

[0095]

As described above, according to the substrate positioning method and apparatus of the present invention, a large number of workpieces are arranged on the substrate in either of the two axes of the predetermined orthogonal coordinate system. In addition, there is an unprecedented excellent effect that the substrate can always be processed with high efficiency.

In particular, the greater the difference between the relative scanning speed of the stage with respect to the laser light in the first direction and the second direction, the more efficiently the substrate can be processed.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing a configuration of a laser repair device according to a first embodiment.

FIG. 2 is a diagram showing a schematic configuration of the alignment apparatus of FIG.

3 is a block diagram showing a schematic configuration of a control system of the apparatus of FIG.

FIG. 4 is a diagram for explaining the operation of the first embodiment and is a diagram showing a flow of processing two types of wafers.

FIG. 5 is a diagram showing a configuration of an alignment apparatus according to a second embodiment.

FIG. 6 is an operation explanatory diagram of the apparatus of FIG.

FIG. 7 is a diagram showing a configuration of an alignment apparatus according to a third embodiment.

FIG. 8 is a block diagram showing a schematic configuration of a control system of the device of the third embodiment.

FIG. 9 is a view for explaining the operation of the device of the third embodiment.

FIG. 10 is a diagram showing a flow of operations of a wafer pre-alignment apparatus in a conventional laser repair apparatus or the like.

11A and 11B are views for explaining a work piece inside a wafer, FIG. 11A is a view showing an arrangement of IC chips in a wafer W, and FIG. 11B is a view showing arrangements of work pieces in the IC chip. FIG.

FIG. 12 is an enlarged view showing a portion of an elliptical portion D of FIG. 11 (B).

FIG. 13 is a diagram showing a flow of processing (processing) of a workpiece in an IC chip.

FIG. 14 is a diagram for explaining a problem to be solved by the present invention and is a diagram showing a flow of processing two types of wafers in a conventional apparatus.

[Explanation of symbols]

10 Laser Repair Device 18 Positioning Device (Pre-Alignment Device) 36 X Table (Stage) 54 Center Up (Rotating Mechanism) 56 Flat Detection Sensor (Part of Detection Means) 66A, 66C, 68B Positioning Pins (of First Positioning Means) Part) 66B, 68A, 68C Positioning pin (part of second positioning means) 72 Positioning hammer (part of first and second positioning means) 78 Controller (part of control means, detection means) 97 Flat Detection sensor (part of detection means, center deviation detection means) 98A First positioning check sensor (first check means) 98B Second positioning check sensor (second check means) W Wafer (substrate) OF Orientation flat (Notch)

Claims (7)

[Claims] 1. A laser beam is relatively scanned in a first direction and a second direction which are orthogonal to each other with respect to a laser beam at different scanning speeds, and a substantially orthogonal coordinate system is formed on a substrate mounted on the stage. A method for positioning a substrate, which is used in a device for processing a workpiece arranged along a line, and performs positioning in the rotational direction of the substrate before irradiating the workpiece with the laser light, The positional relationship in the rotation direction between the notch and the first or second direction is detected by irradiating the notch provided on a part of the outer periphery of the with a light beam and photoelectrically detecting the part. A first step; an axis having a large number of workpieces to be machined out of the two axes of the Cartesian coordinate system is referred to as the first and second axes.
A second step of rotating the substrate based on the detected positional relationship so that the scanning speed is substantially parallel to the fast scanning direction. 2. The laser beam is relatively scanned in a first direction and a second direction which are orthogonal to each other at different scanning speeds, and is substantially in a predetermined orthogonal coordinate system on a substrate mounted on the stage. A method for positioning a substrate, which is used in a device for processing a workpiece arranged along a line, and performs positioning in the rotational direction of the substrate before irradiating the workpiece with the laser light, The positional relationship in the rotation direction between the notch and the first or second direction is detected by irradiating the notch provided on a part of the outer periphery of the with a light beam and photoelectrically detecting the part. A first step; wherein the notch is positioned at a first predetermined position or a second predetermined position selected according to the number of workpieces to be machined arranged in each axial direction of the orthogonal coordinate system, Based on the detected positional relationship Method for positioning a substrate and a second step of rotating the plate. 3. The substrate is such that an axis having a large number of workpieces to be machined out of the two axes of the Cartesian coordinate system is substantially parallel to the direction in which the scanning speed is fast in the first and second directions. The substrate positioning method according to claim 2, wherein the substrate is rotated as described above. 4. The laser beam is relatively scanned in a first direction and a second direction orthogonal to each other with respect to the laser beam at different scanning speeds, and a substantially orthogonal coordinate system is formed on a substrate mounted on the stage. A substrate positioning device, which is used in a device for processing a workpiece arranged along a line, for positioning the substrate in a rotational direction prior to irradiating the workpiece with the laser beam, the substrate comprising: The positional relationship in the rotation direction between the notch and the first or second direction is detected by irradiating the notch provided on a part of the outer periphery of the with a light beam and photoelectrically detecting the part. A detecting means; a rotating mechanism for holding the substrate and rotating the substrate in a plane parallel to the first and second directions; Depending on the first predetermined position or The second
A positioning device for controlling the rotating mechanism based on the detected positional relationship so that the substrate is positioned at a predetermined position. 5. A first positioning means for positioning the substrate, the notch being positioned at a first predetermined position, at the first position at the same rotation angle, and the notch being positioned at a second predetermined position. The substrate positioning apparatus according to claim 4, further comprising: second positioning means for positioning the formed substrate at a second position at the same rotation angle. 6. The substrate positioning apparatus according to claim 4, further comprising center deviation detecting means for detecting a center deviation amount of the substrate in a non-contact manner while the substrate is being rotated by the rotating mechanism. 7. A first check means for detecting whether or not the notch is positioned at a first predetermined position, and a second check means for detecting whether or not the notch is positioned at a second predetermined position. The check means according to claim 4 or 6 is further included.
The substrate positioning device described.