JPH08206875A - Joined body - Google Patents

Joined body

Info

Publication number
JPH08206875A
JPH08206875A JP28678195A JP28678195A JPH08206875A JP H08206875 A JPH08206875 A JP H08206875A JP 28678195 A JP28678195 A JP 28678195A JP 28678195 A JP28678195 A JP 28678195A JP H08206875 A JPH08206875 A JP H08206875A
Authority
JP
Japan
Prior art keywords
alloy
joining
joining layer
joined
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28678195A
Other languages
Japanese (ja)
Other versions
JP2777707B2 (en
Inventor
Tomoo Tanaka
智雄 田中
Masaya Ito
正也 伊藤
Katsumi Miyama
克己 見山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP28678195A priority Critical patent/JP2777707B2/en
Publication of JPH08206875A publication Critical patent/JPH08206875A/en
Application granted granted Critical
Publication of JP2777707B2 publication Critical patent/JP2777707B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Pressure Welding/Diffusion-Bonding (AREA)
  • Ceramic Products (AREA)

Abstract

PURPOSE: To obtain a high-strength joined body by incorporating a prescribed range of Cu into the aluminum base phase in a joining layer in case of joining members at least either of which consist of Al or Al alloy via this joining layer. CONSTITUTION: The member 2 consisting of the Al or Al alloy is joined via the joining layer 4 to the other member 3. The other member 3 is an Al or Al alloy member, member of another different material or ceramic member. The Cu is incorporated at 0.5 to 4.8wt.% into the aluminum base phase 5 in the joining layer 4. The joining layer 4 consists mainly of the Al alloy and the prescribed amt. of the Cu to be incorporated into the aluminum base phase 5 in the joining layer 4 may be previously incorporated into a brazing filler metal or may be supplied by the diffusion from the Al alloy member or may be supplied by previously forming a Cu film by a method, such as plating, vapor depositing or sputtering, on the surface of other different materials or the Al or Al alloy member in the case of joining by a brazing filler metal.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本願発明は、アルミニウム
(Al)若しくはアルミニウム合金(Al合金)部材同
士を、又は他の異種材料からなる部材とを接合した接合
体に関し、主に産業用部品、構造用部品として用いられ
る接合体に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a joined body in which aluminum (Al) or aluminum alloy (Al alloy) members are joined to each other, or members made of other different materials, mainly for industrial parts and structures. The present invention relates to a joined body used as a component.

【0002】[0002]

【従来の技術】Al若しくはAl合金からなる部材同士
を、又は他の異種材料からなる部材とをろう材にて接合
する場合、2成分系のろう材としてAl−Si共晶組成
(例えばJIS BA4045)のろう材、又は3成分
系のろう材としてAl−Si共晶にCuを4重量%添加
して若干の低融点化を図ったJISBA4145若しく
はAl−Ge−Si、Al−Si−Mg等の合金系のろ
う材が用いられる。
2. Description of the Related Art When joining members made of Al or Al alloy, or members made of other dissimilar materials with a brazing material, an Al-Si eutectic composition (for example JIS BA4045) is used as a two-component brazing material. ), Or as a three-component brazing material such as JISBA4145 or Al-Ge-Si, Al-Si-Mg, etc. in which 4 wt% of Cu is added to Al-Si eutectic to lower the melting point to some extent. An alloy type brazing material is used.

【0003】[0003]

【発明が解決しようとする課題】しかし、3成分系のろ
う材を用いて接合された接合体は、これらのろう材が低
融点化を図るために合金元素を数%添加しているので、
両部材間の継手部である接合層(合金ろう材)に金属間
化合物(相)を生成する。その金属間化合物が所定量よ
り多く存在すると耐力は高くなるものの高すぎると、逆
にもろくなる。そのもろさは、Al若しくはAl合金部
材同士の接合体においても生じ問題であったが、特に、
Al若しくはAl合金部材同士を他の異種材料からなる
部材とをろう材にて接合した接合体においては顕著だっ
た。それは、例えばセラミックスや超硬などの低膨張材
と接合した接合体の場合、Alとこれらの低膨張材と
は、熱膨張係数が大きく異なるため、接合時のろう材を
溶融するための熱により継手部である接合層に大きな熱
残留応力が発生する。その結果、その応力により金属間
化合物相から破壊が生じる可能性が非常に高かった。一
方、JISBA4045等のAl−Si2元共晶系のろ
う材で接合された接合体は、前記の様な継手部である接
合層中に金属間化合物(相)は生成されにくいが、その
金属間化合物(相)が生成されにくい分、継手部である
接合層の耐力が低いため、接合層と接合される部材との
間で破断する前に継手部である接合層自体が降伏してし
まい、低強度の接合体しか得られなかった。このように
従来は、部材同士を接合する場合、例えばろう材による
接合の場合ではろう材の組成等の接合前の状態、接合方
法については、十分検討されていたが、接合後の接合層
の状態(組成等)に関しての研究、開発は不十分であっ
た。本願発明の目的は、Al若しくはAl合金からなる
部材同士を、又は他の異種材料の部材とを接合した高強
度な接合体を提供することである。
However, in the joined body joined using the brazing filler metal of the three-component system, since these brazing filler metals contain several% of alloying elements in order to attain a low melting point,
An intermetallic compound (phase) is generated in the joining layer (alloy brazing material) which is the joint between both members. If the amount of the intermetallic compound is larger than the predetermined amount, the yield strength will be high, but if it is too high, it will be brittle. The brittleness was a problem even in a joined body of Al or Al alloy members, but in particular,
This was remarkable in a joined body in which Al or Al alloy members were joined to each other by members made of different materials with a brazing material. For example, in the case of a joined body that is joined to a low expansion material such as ceramics or cemented carbide, Al and these low expansion materials have large thermal expansion coefficients. Large thermal residual stress occurs in the joint layer, which is the joint portion. As a result, it was very likely that the stress would cause the fracture from the intermetallic compound phase. On the other hand, in a joined body joined with an Al-Si binary eutectic brazing material such as JIS BA4045, an intermetallic compound (phase) is hard to be generated in the joining layer which is the joint portion as described above, but Since the compound (phase) is less likely to be generated, since the yield strength of the joint layer that is the joint portion is low, the joint layer itself that is the joint portion yields before it breaks between the joint layer and the member to be joined, Only a low strength joint was obtained. Thus, conventionally, when joining members together, for example, in the case of joining with a brazing material, the state before joining, such as the composition of the brazing material, and the joining method have been sufficiently studied, but the joining layer Research and development regarding the state (composition, etc.) was insufficient. An object of the present invention is to provide a high-strength joined body in which members made of Al or Al alloy are joined or members made of other dissimilar materials are joined.

【0004】[0004]

【課題を解決するための手段】本願発明者は、種々の研
究を重ねた結果、接合体の強度、特に接合層の強度は、
接合層中に生成された金属間化合物の量に依存すること
を見い出し、更にその金属間化合物の量は、接合層中に
含まれるアルミ母相のCuの含有量を規定することによ
り、制御することができる手段を見い出した。そして、
その第一の手段は、少なくとも一方がAl又はAl合金
からなる部材を接合層を介して接合した接合体であっ
て、その接合層中のアルミ母相にCuが0.5〜4.8
重量%含まれている接合体である。その接合層は、Al
合金からなることが望ましい。その第2の手段は、Al
部材又はAl合金部材と他の異種材料の部材とを接合層
を介して接合した接合体であって、その接合層中のアル
ミ母相にCuが0.5〜4.8重量%含まれている接合
体である。その接合層は、Al合金からなることが望ま
しい。ここで「他の異種材料」とは、Al部材又はAl
合金部材と異なる材料をいい、例えばセラミックス材
料、或いは鋼、鉄系材料、チタン、チタン合金などの金
属材料、並びにAl部材又はAl合金部材であっても異
なる組成からなるもの等をいう。その第3の手段は、A
l又はAl合金からなる部材とセラミックス部材とを接
合層を介して接合した接合体であって、その接合層中の
アルミ母相にCuが0.5〜4.8重量%含まれている
接合体である。その接合層は、Al合金からなることが
望ましい。セラミックス部材は、窒化珪素焼結体 、炭
化珪素焼結体、サイアロン焼結体、アルミナ焼結体若し
くはジルコニア焼結体、又はこれらの焼結体の複合材の
いずれかであることが望ましい。その接合層中のアルミ
母相のCuの含有量が0.5%重量未満だと耐力が不充
分なため強度向上に寄与する効果が少なく、一方4.8
重量%を超えると金属間化合物Al2Cuの析出量が多
くなって脆さを増すので好ましくない。
As a result of various studies, the inventors of the present application have found that the strength of a bonded body, particularly the strength of a bonded layer, is
It was found that it depends on the amount of the intermetallic compound formed in the bonding layer, and the amount of the intermetallic compound is controlled by defining the Cu content of the aluminum matrix contained in the bonding layer. I have found a way to do it. And
The first means is a joined body in which at least one member made of Al or an Al alloy is joined via a joining layer, and Cu is contained in the aluminum matrix in the joining layer with 0.5 to 4.8.
It is a bonded body containing wt%. The bonding layer is Al
It is preferably composed of an alloy. The second means is Al
A joined body in which a member or an Al alloy member and a member made of another dissimilar material are joined via a joining layer, and the aluminum mother phase in the joining layer contains 0.5 to 4.8% by weight of Cu. It is a joined body. The joining layer is preferably made of Al alloy. Here, the "other dissimilar material" means an Al member or Al.
It refers to a material different from the alloy member, for example, a ceramic material, a metal material such as steel, an iron-based material, titanium, or a titanium alloy, and an Al member or an Al alloy member having a different composition. The third means is A
A joined body in which a member made of 1 or an Al alloy and a ceramic member are joined via a joining layer, and the aluminum mother phase in the joining layer contains Cu in an amount of 0.5 to 4.8% by weight. It is the body. The joining layer is preferably made of Al alloy. The ceramic member is preferably a silicon nitride sintered body, a silicon carbide sintered body, a sialon sintered body, an alumina sintered body, a zirconia sintered body, or a composite material of these sintered bodies. If the content of Cu in the aluminum matrix of the joining layer is less than 0.5% by weight, the yield strength is insufficient and the effect of improving the strength is small. On the other hand, 4.8.
If it exceeds 5% by weight, the precipitation amount of the intermetallic compound Al 2 Cu increases and brittleness increases, which is not preferable.

【0005】[0005]

【作用】アルミ母相に所定量のCuを含有せしめること
で母相の耐力を向上させつつ、更に脆い金属間化合物相
の生成を押さえつつも所定量生成させることにより、高
強度の接合体を得ることができる。
By increasing the amount of Cu contained in the aluminum mother phase, the yield strength of the mother phase can be improved, and the brittle intermetallic compound phase can be generated while suppressing the formation of the brittle intermetallic compound phase. Obtainable.

【0006】[0006]

【発明の実施の形態】本願発明の接合体について説明す
る(図1)。本願発明は、少なくとも一方がAl又はA
l合金からなる部材2を接合層4を介して接合した接合
体1であって、その接合層4中のアルミ母相5にCuが
0.5〜4.8重量%含まれている。他方の部材3は、
Al又はAl合金部材、他の異種材料の部材、セラミッ
クス部材である。接合層4は主にAl合金からなるが、
接合層4中のアルミ母相5に含まれる所定量のCuは、
ろう材で接合する場合、予めろう材に含有させても良い
し、あるいはAl合金部材からの拡散により供給、また
他の異種材料もしくはAl又はAl合金部材の表面にメ
ッキ、蒸着、スパッタ等の方法でCu膜を予め形成して
おくことにより供給してもよい。いずれの方法において
も図1に示す接合後の接合層(継手部)4のアルミ母相
5に所定量のCuが存在すればよい。また、他の直接接
合、固相拡散接合、ホットプレス等の接合方法を用いた
場合でも、接合層4中のアルミ母相5に所定量のCu
が、含まれればよい。接合層4中のアルミ母相5に含ま
れるCuの含有量の測定方法は、接合層4に存在する1
0〜200ミクロンのアルミ母相に、その中心部を狙っ
て、EPMA装置やSEM装置に付属のEDX,ED
S,WDSによる点分析を行うことにより、測定するこ
とができる。
BEST MODE FOR CARRYING OUT THE INVENTION A bonded body of the present invention will be described (FIG. 1). In the present invention, at least one is Al or A
In the joined body 1 in which the member 2 made of the 1-alloy is joined via the joining layer 4, the aluminum matrix 5 in the joining layer 4 contains 0.5 to 4.8% by weight of Cu. The other member 3 is
They are Al or Al alloy members, members of other different materials, and ceramic members. The bonding layer 4 is mainly made of Al alloy,
A predetermined amount of Cu contained in the aluminum matrix 5 in the bonding layer 4 is
When joining with a brazing material, it may be contained in the brazing material in advance, or supplied by diffusion from an Al alloy member, or by plating, vapor deposition, sputtering, etc. on the surface of another dissimilar material or Al or Al alloy member. Alternatively, the Cu film may be formed by forming it in advance. In either method, it is sufficient that a predetermined amount of Cu is present in the aluminum matrix 5 of the joining layer (joint portion) 4 after joining shown in FIG. Further, even when other bonding methods such as direct bonding, solid phase diffusion bonding and hot pressing are used, a predetermined amount of Cu is added to the aluminum matrix 5 in the bonding layer 4.
Should be included. The method for measuring the content of Cu contained in the aluminum matrix 5 in the bonding layer 4 is 1
Aiming at the center of an aluminum matrix of 0 to 200 microns, EDX and ED attached to EPMA and SEM devices
It can be measured by performing point analysis by S and WDS.

【0007】ー実験例ー 一方の部材2として、Al又はAl合金部材(大きさ:
20mm×15mm×10mm、材質:JIS AC2
A、JIS A1050、JIS A2024、JIS
A7075の4種類)を準備した。他方の部材3とし
て、Al又はAl合金部材、他の異種材料の部材、セラ
ミックス部材をそれぞれ準備した(大きさ:20mm×
15mm×厚3mm)。他の異種材料の部材は、セラミ
ックス部材としてSi34焼結体 、SiC焼結体、サ
イアロン焼結体、Al23焼結体 、ZrO2焼結体の5
種類、炭素鋼部材としてS15C(JIS規格)を準備
した。セラミックス部材の接合面に蒸着法によるメタラ
イズ膜を予め形成した。そのメタライズ膜の構成は、セ
ラミックス部材2から順にTi1000オングストロー
ム/Mo1000オングストローム/Ni1000オン
グストロームのものと、Al2000オングストローム
のみのものと2種類準備した。ろう材は、JIS BA
4045(Al−10%Si)、BA4145(Al−
10%Si−4%Cu)、Al−27%Cu−5%S
i、Al−22%Cu−4%Si−20Zn、Al−1
4%Cu−3%Si−50Znの5種類を準備した。こ
れらを表1、表2に示す組合せで、表中記載の条件でろ
う付を行なった。得られた接合体1は、せん断試験によ
り強度を測定すると共に、破断後の試料を接合面に対し
て垂直に切断し、EPMA装置を用いて接合層(継手
部)のアルミ母相5中のCuの含有量を測定した。
-Experimental Example-As one member 2, an Al or Al alloy member (size:
20mm × 15mm × 10mm, material: JIS AC2
A, JIS A1050, JIS A2024, JIS
4 types of A7075) were prepared. As the other member 3, an Al or Al alloy member, a member made of another dissimilar material, or a ceramic member was prepared (size: 20 mm ×).
15 mm x 3 mm thick). Other members made of different materials include Si 3 N 4 sintered bodies, SiC sintered bodies, sialon sintered bodies, Al 2 O 3 sintered bodies, and ZrO 2 sintered bodies as ceramic members.
S15C (JIS standard) was prepared as the type and carbon steel member. A metallized film was previously formed on the bonding surface of the ceramic member by a vapor deposition method. Two kinds of metallized films were prepared in order from the ceramic member 2, one having Ti 1000 angstrom / Mo 1000 angstrom / Ni 1000 angstrom and the other having only Al 2000 angstrom. The brazing material is JIS BA
4045 (Al-10% Si), BA4145 (Al-
10% Si-4% Cu), Al-27% Cu-5% S
i, Al-22% Cu-4% Si-20Zn, Al-1
Five kinds of 4% Cu-3% Si-50Zn were prepared. These were brazed with the combinations shown in Table 1 and Table 2 under the conditions described in the table. The strength of the obtained joined body 1 was measured by a shear test, the sample after breaking was cut perpendicularly to the joining surface, and the aluminum matrix 5 in the joining layer (joint portion) was cut using an EPMA apparatus. The Cu content was measured.

【0008】[0008]

【表1】 [Table 1]

【0009】[0009]

【表2】 [Table 2]

【0010】表に示す結果の通り、Cuの含有量が本発
明の範囲内にある実施例の接合体(No.3〜10、N
o.16〜22)は、接合部材の種類及びろう材の組成
を問わず高強度であることがわかる。これに対して、本
発明の範囲外にある比較例の接合体(No.1〜2、N
o.11〜15、No.23〜25)は強度が低いことが
わかった。このうち、No.2、No.11〜13、N
o.15、No.23〜25は、実施例と同様な接合部材
等の組み合わせであるにも拘わらず、接合強度は低いも
のであった。接合温度及び時間を管理することにより接
合部材の種類及びろう材の組成を問わず、接合層中のア
ルミ母相5中のCuの含有量を0.5〜4.8重量%と
することができ、それによって、接合強度を高めること
ができる。
As can be seen from the results shown in the table, the bonded bodies (Nos. 3 to 10 and N of Examples) in which the Cu content is within the range of the present invention.
Nos. 16 to 22) have high strength irrespective of the kind of the joining member and the composition of the brazing material. On the other hand, the bonded bodies of Comparative Examples (Nos. 1-2 and N, which are outside the scope of the invention)
Nos. 11 to 15 and Nos. 23 to 25) were found to have low strength. Of these, No. 2, No. 11 to 13, N
In No. 15 and Nos. 23 to 25, the joining strength was low despite the combination of the joining members and the like similar to the examples. By controlling the joining temperature and time, the Cu content in the aluminum matrix 5 in the joining layer can be set to 0.5 to 4.8 wt% regardless of the type of joining member and the composition of the brazing material. It is possible to increase the bonding strength.

【0011】[0011]

【発明の効果】本願発明の接合体は、Al若しくはAl
合金部材同士を、又は他の異種材料の部材とを接合した
接合体であって、適度な耐力を有するものであり、高強
度な接合体である。また、本願発明の接合体も簡易な方
法で得ることができる。
The joined body of the present invention is made of Al or Al.
A joined body in which alloy members are joined to each other or members made of other dissimilar materials, which has appropriate proof stress and is a high-strength joined body. Further, the joined body of the present invention can be obtained by a simple method.

【図面の簡単な説明】[Brief description of drawings]

【図1】本願発明の接合体及びその接合層の断面を示す
模式図。
FIG. 1 is a schematic view showing a cross section of a bonded body and a bonding layer thereof according to the present invention.

【符号の説明】[Explanation of symbols]

1 接合体 2 Al又はAl合金部材 3 Al又はAl合金部材、他の異種材料の部材、セ
ラミックス部材 4 接合層 5 アルミ母層 6 析出物(Si、Mg、Cu等から成る)
DESCRIPTION OF SYMBOLS 1 Bonded body 2 Al or Al alloy member 3 Al or Al alloy member, member of other dissimilar materials, ceramic member 4 Bonding layer 5 Aluminum mother layer 6 Precipitate (made of Si, Mg, Cu, etc.)

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも一方がAl又はAl合金から
なる部材を接合層を介して接合した接合体であって、そ
の接合層中のアルミ母相にCuが0.5〜4.8重量%
含まれていることを特徴とする接合体。
1. A joined body, at least one of which is made of Al or an Al alloy, joined together through a joining layer, wherein Cu is contained in an aluminum matrix in the joining layer in an amount of 0.5 to 4.8% by weight.
A zygote characterized by being included.
【請求項2】 Al部材又はAl合金部材と他の異種材
料の部材とを接合層を介して接合した接合体であって、
その接合層中のアルミ母相にCuが0.5〜4.8重量
%含まれていることを特徴とする接合体。
2. A joined body obtained by joining an Al member or an Al alloy member and a member made of another dissimilar material via a joining layer,
A joined body, wherein the aluminum mother phase in the joining layer contains 0.5 to 4.8% by weight of Cu.
【請求項3】 Al又はAl合金からなる部材とセラミ
ックス部材とを接合層を介して接合した接合体であっ
て、その接合層中のアルミ母相にCuが0.5〜4.8
重量%含まれていることを特徴とする接合体。
3. A joined body in which a member made of Al or an Al alloy and a ceramic member are joined via a joining layer, and Cu is contained in the aluminum matrix in the joining layer in an amount of 0.5 to 4.8.
A joined body characterized by being contained in a weight percentage.
【請求項4】 前記接合層がAl合金からなることを特
徴とする請求項1〜3のいずれかに記載の接合体。
4. The bonded body according to claim 1, wherein the bonding layer is made of an Al alloy.
【請求項5】 セラミックス部材が、窒化珪素焼結体
、炭化珪素焼結体、サイアロン焼結体、アルミナ焼結
体若しくはジルコニア焼結体、又はこれらの焼結体の複
合材のいずれかであることを特徴とする請求項3又は4
記載の接合体。
5. The ceramic member is any one of a silicon nitride sintered body, a silicon carbide sintered body, a sialon sintered body, an alumina sintered body, a zirconia sintered body, or a composite material of these sintered bodies. Claim 3 or 4 characterized by the above.
The described conjugate.
JP28678195A 1994-10-07 1995-10-05 Joint Expired - Fee Related JP2777707B2 (en)

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EP1056321A2 (en) * 1999-05-28 2000-11-29 Denki Kagaku Kogyo Kabushiki Kaisha Circuit substrate
JP2001334387A (en) * 2000-05-26 2001-12-04 Furukawa Electric Co Ltd:The Low temperature brazing filler metal for joining aluminum alloy
JP2011148004A (en) * 2011-02-25 2011-08-04 Furukawa-Sky Aluminum Corp Low-temperature brazing filler metal for joining aluminum alloy
WO2012029816A1 (en) 2010-08-31 2012-03-08 美濃窯業株式会社 Boron carbide-containing ceramic bonded body and method for producing the bonded body
JP2012160642A (en) * 2011-02-02 2012-08-23 Mitsubishi Materials Corp Substrate for power module with heat sink, and manufacturing method of substrate for power module with heat sink, and power module
US9789671B2 (en) 2012-02-28 2017-10-17 Mino Ceramic Co., Ltd. Shock absorbing member
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1056321A2 (en) * 1999-05-28 2000-11-29 Denki Kagaku Kogyo Kabushiki Kaisha Circuit substrate
EP1056321A3 (en) * 1999-05-28 2003-03-19 Denki Kagaku Kogyo Kabushiki Kaisha Circuit substrate
JP2001334387A (en) * 2000-05-26 2001-12-04 Furukawa Electric Co Ltd:The Low temperature brazing filler metal for joining aluminum alloy
WO2012029816A1 (en) 2010-08-31 2012-03-08 美濃窯業株式会社 Boron carbide-containing ceramic bonded body and method for producing the bonded body
US9211600B2 (en) 2010-08-31 2015-12-15 Mino Ceramic Co., Ltd. Boron carbide-containing ceramic bonded body and method for producing the bonded body
JP2012160642A (en) * 2011-02-02 2012-08-23 Mitsubishi Materials Corp Substrate for power module with heat sink, and manufacturing method of substrate for power module with heat sink, and power module
JP2011148004A (en) * 2011-02-25 2011-08-04 Furukawa-Sky Aluminum Corp Low-temperature brazing filler metal for joining aluminum alloy
US9789671B2 (en) 2012-02-28 2017-10-17 Mino Ceramic Co., Ltd. Shock absorbing member
CN112638571A (en) * 2018-09-03 2021-04-09 住友电气工业株式会社 Welded structure of metal members and method for manufacturing welded structure of metal members
CN112638571B (en) * 2018-09-03 2022-11-08 住友电气工业株式会社 Welded structure of metal members and method for manufacturing welded structure of metal members
CN118081054A (en) * 2024-04-23 2024-05-28 哈尔滨工业大学 Method for realizing aluminum alloy reaction diffusion connection by depositing copper nano layer on interface

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