JPH08204212A - Optical receiving module - Google Patents
Optical receiving moduleInfo
- Publication number
- JPH08204212A JPH08204212A JP7009016A JP901695A JPH08204212A JP H08204212 A JPH08204212 A JP H08204212A JP 7009016 A JP7009016 A JP 7009016A JP 901695 A JP901695 A JP 901695A JP H08204212 A JPH08204212 A JP H08204212A
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- package
- ground
- optical
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、高速光通信用の光受信
モジュールの構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an optical receiver module for high speed optical communication.
【０００２】[0002]
【従来の技術】高速光通信用光受信モジュールは、受光
素子、前置増幅器ＩＣおよびコンデンサを搭載したパッ
ケージ、光の入射に関わる光ファイバ、光ファイバから
の出射光を受光素子に収束するレンズが固定されたレン
ズ付きキャップおよびファイバサポータよりなる。2. Description of the Related Art An optical receiver module for high-speed optical communication is provided with a package including a light receiving element, a preamplifier IC and a capacitor, an optical fiber related to the incidence of light, and a lens that converges light emitted from the optical fiber to the light receiving element. It consists of a fixed lens cap and a fiber supporter.
【０００３】図４は上述した光受信モジュールにおける
従来のパッケージを表す説明図で、図４（ａ）は斜視
図、図４（ｂ）は側断面図を表している。受光素子（Ｐ
Ｄ）１０１、前置増幅器ＩＣ１０２およびコンデンサ１
０３が搭載されるパッケージ１０４は、多層セラミック
基板で形成される。このパッケージ１０４上に複数の配
線パターン１０５が形成され、各配線パターン１０５上
に受光素子１０１、前置増幅器ＩＣ１０２およびコンデ
ンサ１０３が搭載，接続されており、各配線パターン１
０５に電気信号の出力端子１０６、グランド端子１０７
および受光素子１０１、前置増幅器ＩＣ１０２の電源端
子１０８が接続されている。4A and 4B are explanatory views showing a conventional package in the above-described optical receiving module. FIG. 4A is a perspective view and FIG. 4B is a side sectional view. Light receiving element (P
D) 101, preamplifier IC 102 and capacitor 1
The package 104 on which 03 is mounted is formed of a multilayer ceramic substrate. A plurality of wiring patterns 105 are formed on the package 104, and the light receiving element 101, the preamplifier IC 102, and the capacitor 103 are mounted and connected on each wiring pattern 105.
Reference numeral 05 designates an output terminal 106 for an electric signal and a ground terminal 107.
Further, the light receiving element 101 and the power supply terminal 108 of the preamplifier IC 102 are connected.
【０００４】そして、グランド端子１０７と配線パター
ン１０５との間は、バイアホール１０９で接続されてい
るものである。The ground terminal 107 and the wiring pattern 105 are connected by a via hole 109.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上述し
た従来の光受信モジュールであると、グランド端子に接
続されている配線パターン上に前置増幅器ＩＣおよびコ
ンデンサが搭載されているが、配線パターンとグランド
端子とを接続するバイアホールが細いため、グランドラ
インのインダクタンスは大きく、高周波動作において、
動作周波数帯域内で共振が生じるという問題がある。However, in the above-mentioned conventional optical receiver module, the preamplifier IC and the capacitor are mounted on the wiring pattern connected to the ground terminal. Since the via hole connecting to the terminal is thin, the inductance of the ground line is large, and in high frequency operation,
There is a problem that resonance occurs within the operating frequency band.
【０００６】[0006]
【課題を解決するための手段】上述した課題を解決する
ため、本発明は、光素子および電子素子を搭載する基板
の表面に前記光素子および電子素子が接続されるグラン
ド用の配線パターンを形成するとともに、この配線パタ
ーンと異なる層にグランド用の配線パターンを形成し、
両配線パターン間を複数個のバイアホールで電気的に接
続し、前記配線パターンの少なくとも一方と、グランド
端子を接続したものである。In order to solve the above-mentioned problems, the present invention forms a ground wiring pattern for connecting an optical element and an electronic element on the surface of a substrate on which the optical element and the electronic element are mounted. At the same time, form a wiring pattern for ground on a layer different from this wiring pattern,
The two wiring patterns are electrically connected by a plurality of via holes, and at least one of the wiring patterns is connected to the ground terminal.
【０００７】[0007]
【作用】上述した構成を有する本発明は、基板表面のグ
ランド用の配線パターンとこの配線パターンと異なる層
に形成したグランド用の配線パターンとの間を複数本の
バイヤホールで電気的に接続したので、グランド電流は
各バイアホールを通ってグランド端子へ流れる。In the present invention having the above-described structure, the ground wiring pattern on the surface of the substrate and the ground wiring pattern formed on a layer different from this wiring pattern are electrically connected by a plurality of via holes. Therefore, the ground current flows through each via hole to the ground terminal.
【０００８】[0008]
【実施例】図１は光受信モジュールにおける本発明の第
１の実施例のパッケージを表す説明図で、図１（ａ）は
斜視図、図１（ｂ）は側断面図を表している。図におい
て、１は受光素子（ＰＤ）、２は前置増幅器ＩＣ、３は
コンデンサで、これら受光素子１，前置増幅器ＩＣ２，
コンデンサ３はパッケージ４に搭載されている。1 is an explanatory view showing a package of a first embodiment of the present invention in an optical receiving module, FIG. 1 (a) is a perspective view, and FIG. 1 (b) is a side sectional view. In the figure, 1 is a light receiving element (PD), 2 is a preamplifier IC, 3 is a capacitor, and these light receiving element 1, preamplifier IC 2,
The capacitor 3 is mounted on the package 4.
【０００９】このパッケージ４は多層セラミック基板で
形成され、パッケージ４の表面（第１層）には複数の配
線パターン５が形成される。そして、所定の配線パター
ン５上に受光素子１、前置増幅器ＩＣ２およびコンデン
サ３が搭載，接続されている。６は出力用の配線パター
ン５と接続される出力端子、７はグランド用の配線パタ
ーン５と接続されるグランド端子、８は電源用の配線パ
ターン５と接続される電源端子である。The package 4 is formed of a multilayer ceramic substrate, and a plurality of wiring patterns 5 are formed on the surface (first layer) of the package 4. Then, the light receiving element 1, the preamplifier IC 2 and the capacitor 3 are mounted and connected on the predetermined wiring pattern 5. Reference numeral 6 is an output terminal connected to the output wiring pattern 5, reference numeral 7 is a ground terminal connected to the ground wiring pattern 5, and reference numeral 8 is a power supply terminal connected to the power supply wiring pattern 5.
【００１０】９はパッケージ４の第２層に形成されるグ
ランド用の配線パターン、１０は第１層のグランド用の
配線パターン５と配線パターン９とを結ぶ複数のバイア
ホールである。このバイアホール１０は、基板に開けた
微細な孔に銅タングステン等を詰め込んだものである。
なお、グランド端子７が接続されるバイアホール１０
は、２層目の配線パターン９を貫通して、パッケージ４
の裏面に到達している。Reference numeral 9 is a ground wiring pattern formed on the second layer of the package 4, and 10 is a plurality of via holes connecting the ground wiring pattern 5 and the wiring pattern 9 of the first layer. The via hole 10 is a fine hole formed in the substrate and filled with copper tungsten or the like.
The via hole 10 to which the ground terminal 7 is connected
Passes through the second-layer wiring pattern 9 and
Has reached the back side of.
【００１１】上記構成によると、第１層のグランド用の
配線パターン５と第２層のグランド用の配線パターン９
との間を複数本のバイヤホール１０で電気的に接続した
ので、配線パターン５からグランド端子７へ流れる電流
の流れが良くなり、高周波動作においても、インダクタ
ンスを小さく抑えることができる。図２は上記構成から
なるパッケージ４を搭載した光受信モジュールの構造を
表す一部断面図である。According to the above construction, the wiring pattern 5 for the first layer ground and the wiring pattern 9 for the second layer ground.
Since a plurality of via holes 10 are electrically connected between and, the flow of the current flowing from the wiring pattern 5 to the ground terminal 7 is improved, and the inductance can be suppressed to be small even in the high frequency operation. FIG. 2 is a partial cross-sectional view showing the structure of an optical receiver module equipped with the package 4 having the above structure.
【００１２】光受信モジュール２１は図１で説明したよ
うに受光素子１、前置増幅器ＩＣ２およびコンデンサ３
を搭載したパッケージ４、光の入射に関わる光ファイバ
２２、光ファイバ２２からの出射光を受光素子１に収束
するレンズ２３が固定されたレンズ付きキャップ２４お
よびファイバサポート２５よりなる。図３は光受信モジ
ュールにおける本発明の第２の実施例のパッケージを表
す説明図で、図３（ａ）は斜視図、図３（ｂ）は側断面
図を表している。The optical receiving module 21 has the light receiving element 1, the preamplifier IC 2 and the capacitor 3 as described with reference to FIG.
The package 4 is mounted with an optical fiber 22, an optical fiber 22 relating to the incidence of light, a lens cap 24 to which a lens 23 for converging the light emitted from the optical fiber 22 to the light receiving element 1 is fixed, and a fiber support 25. 3A and 3B are explanatory views showing a package of a second embodiment of the present invention in an optical receiving module, FIG. 3A is a perspective view and FIG. 3B is a side sectional view.
【００１３】図において、１は受光素子、２は前置増幅
器ＩＣ、３はコンデンサで、これら受光素子１，前置増
幅器ＩＣ２，コンデンサ３はパッケージ４に搭載されて
いる。このパッケージ４は多層セラミック基板で形成さ
れ、パッケージ４の表面（第１層）には複数の配線パタ
ーン５が形成される。そして、所定の配線パターン５上
に受光素子１、前置増幅器ＩＣ２およびコンデンサ３が
搭載，接続されている。In the figure, 1 is a light receiving element, 2 is a preamplifier IC, 3 is a capacitor, and these light receiving element 1, preamplifier IC 2 and capacitor 3 are mounted in a package 4. The package 4 is formed of a multilayer ceramic substrate, and a plurality of wiring patterns 5 are formed on the surface (first layer) of the package 4. Then, the light receiving element 1, the preamplifier IC 2 and the capacitor 3 are mounted and connected on the predetermined wiring pattern 5.
【００１４】６は出力用の配線パターン５と接続される
出力端子、７はグランド用の配線パターン５と接続され
るグランド端子、８は電源用の配線パターン５と接続さ
れる電源端子である。９はパッケージ４の第２層に形成
されるグランド用の配線パターン、１１は配線パターン
５と配線パターン９および配線パターン５と配線パター
ン９との間のパッケージ４に開けられたホール、１２は
前記ホール１１に埋め込まれた金属片である。この金属
片１２は、銅タングステンやコバール等で形成され、配
線パターン５側においては、金属辺１２の表面が配線パ
ターン５より露出しており、前置増幅器ＩＣ２やコンデ
ンサ３はこの金属片１２上に直接搭載される。また、配
線パターン９側においても、表面が配線パターン９より
露出しており、ここにグランド端子７と接続されるバイ
アホール１３が接続される。Reference numeral 6 is an output terminal connected to the output wiring pattern 5, reference numeral 7 is a ground terminal connected to the ground wiring pattern 5, and reference numeral 8 is a power supply terminal connected to the power supply wiring pattern 5. Reference numeral 9 is a wiring pattern for ground formed in the second layer of the package 4, 11 is a wiring pattern 5 and a wiring pattern 9 and a hole formed in the package 4 between the wiring pattern 5 and the wiring pattern 9, and 12 is the above-mentioned. It is a metal piece embedded in the hole 11. The metal piece 12 is formed of copper tungsten, kovar, or the like. On the wiring pattern 5 side, the surface of the metal side 12 is exposed from the wiring pattern 5, and the preamplifier IC 2 and the capacitor 3 are on the metal piece 12. Mounted directly on. Further, also on the wiring pattern 9 side, the surface is exposed from the wiring pattern 9, and the via hole 13 connected to the ground terminal 7 is connected thereto.
【００１５】上記構成によると、第１層のグランド用の
配線パターン５と第２層のグランド用の配線パターン９
との間を貫通するホール１１を設け、このホール１１に
金属片１２を埋め込んだので、配線パターン５からグラ
ンド端子７へ流れる電流の流れが良くなり、高周波動作
においても、インダクタンスをより小さく抑えることが
できる。また、金属片１２上に前置増幅器ＩＣ２やコン
デンサ３を直接搭載しているので、放熱性を良くするこ
とができる。According to the above structure, the wiring pattern 5 for the first layer ground and the wiring pattern 9 for the second layer ground.
Since the hole 11 penetrating between and is provided and the metal piece 12 is embedded in this hole 11, the flow of the current flowing from the wiring pattern 5 to the ground terminal 7 is improved, and the inductance can be suppressed to be smaller even in the high frequency operation. You can Further, since the preamplifier IC 2 and the capacitor 3 are directly mounted on the metal piece 12, heat dissipation can be improved.
【００１６】なお、上記構成からなる第２の実施例のパ
ッケージ４を搭載した光受信モジュールの構造は、図２
で説明したものと同様である。ここで、上記各実施例に
おいては、グランド用の配線パターンを例に説明した
が、電源用の配線パターンにも同様の構成を用いること
が可能であり、電源側の配線パターンに用いた場合で
も、インダクタンスを小さく抑えることができるもので
ある。The structure of the optical receiver module having the package 4 of the second embodiment having the above-mentioned structure is shown in FIG.
It is similar to that described in. Here, in each of the above embodiments, the ground wiring pattern is described as an example, but a similar configuration can be used for the power wiring pattern, and even when used for the power wiring line pattern. The inductance can be kept small.
【００１７】[0017]
【発明の効果】以上説明したように、本発明は、電子素
子を搭載するするために基板表面に形成されたグランド
用の配線パターンとこの配線パターンと異なる層に形成
された配線パターンとの間を複数個のバイアホールで接
続し、両配線パターンの少なくとも一方とグランド端子
を接続したので、グランドラインにおけるインダクタン
スを小さく抑えることができることになり、これによ
り、動作周波数帯域内で共振が生じることを防ぐことが
できるので、広帯域，高感度の受信特性が実現でき、高
速，高感度な光受信モジュールを提供することが可能と
なる。As described above, according to the present invention, between the wiring pattern for ground formed on the surface of the substrate for mounting the electronic element and the wiring pattern formed on a layer different from this wiring pattern. Is connected by a plurality of via holes, and at least one of both wiring patterns is connected to the ground terminal, so that the inductance in the ground line can be suppressed to a small value, which causes resonance in the operating frequency band. Since this can be prevented, it is possible to realize a broadband and high-sensitivity reception characteristic, and to provide a high-speed and high-sensitivity optical receiver module.
【図１】光受信モジュールにおける本発明の第１の実施
例のパッケージを表す説明図である。FIG. 1 is an explanatory diagram showing a package of a first embodiment of the present invention in an optical receiver module.
【図２】光受信モジュールの構造を表す一部断面図であ
る。FIG. 2 is a partial cross-sectional view showing the structure of an optical receiver module.
【図３】光受信モジュールにおける本発明の第２の実施
例のパッケージを表す説明図である。FIG. 3 is an explanatory diagram showing a package of a second embodiment of the present invention in an optical receiver module.
【図４】光受信モジュールにおける従来のパッケージを
表す説明図である。FIG. 4 is an explanatory diagram showing a conventional package in an optical receiver module.
２ 前置増幅器ＩＣ ３ コンデンサ ４ パッケージ ５ 配線パターン ７ グランド端子 ９ 配線パターン １０ バイアホール 2 Preamplifier IC 3 Capacitor 4 Package 5 Wiring pattern 7 Ground terminal 9 Wiring pattern 10 Via hole
Claims (2)
表面に前記光素子および電子素子が接続される配線パタ
ーンを形成するとともに、 この配線パターンと異なる層に配線パターンを形成し、 両配線パターン間を複数個のバイアホールで接続し、 前記配線パターンの少なくとも一方と、外部接続用端子
を接続したことを特徴とする光受信モジュール。1. A wiring pattern for connecting the optical element and the electronic element is formed on a surface of a substrate on which the optical element and the electronic element are mounted, and a wiring pattern is formed in a layer different from the wiring pattern. An optical receiving module, characterized in that a plurality of via holes are connected to each other, and at least one of the wiring patterns is connected to an external connection terminal.
表面に前記光素子および電子素子が接続される配線パタ
ーンを形成するとともに、 この配線パターンと異なる層に配線パターンを形成し、 両配線パターンおよび両配線パターン間の基板に穴を開
け、該穴に両配線パターンから露出するように金属片を
埋め込み、 この金属片と外部接続用端子を接続したことを特徴とす
る光受信モジュール。2. A wiring pattern for connecting the optical element and the electronic element is formed on a surface of a substrate on which the optical element and the electronic element are mounted, and a wiring pattern is formed in a layer different from the wiring pattern, and both wiring patterns are formed. An optical receiving module is characterized in that a hole is opened in a substrate between both wiring patterns, a metal piece is embedded in the hole so as to be exposed from the both wiring patterns, and the metal piece and an external connection terminal are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7009016A JPH08204212A (en) | 1995-01-24 | 1995-01-24 | Optical receiving module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7009016A JPH08204212A (en) | 1995-01-24 | 1995-01-24 | Optical receiving module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08204212A true JPH08204212A (en) | 1996-08-09 |
Family
ID=11708866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7009016A Pending JPH08204212A (en) | 1995-01-24 | 1995-01-24 | Optical receiving module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08204212A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002014917A1 (en) * | 2000-08-17 | 2002-02-21 | Matsushita Electric Industrial Co., Ltd. | Optical mounting board, optical module, optical transmitter/receiver, optical transmitting/receiving system, and method for manufacturing optical mounting board |
-
1995
- 1995-01-24 JP JP7009016A patent/JPH08204212A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002014917A1 (en) * | 2000-08-17 | 2002-02-21 | Matsushita Electric Industrial Co., Ltd. | Optical mounting board, optical module, optical transmitter/receiver, optical transmitting/receiving system, and method for manufacturing optical mounting board |
| EP1312946A1 (en) * | 2000-08-17 | 2003-05-21 | Matsushita Electric Industrial Co., Ltd. | Optical mounting board, optical module, optical transmitter/receiver, optical transmitting/receiving system, and method for manufacturing optical mounting board |
| US6964528B2 (en) | 2000-08-17 | 2005-11-15 | Matsushita Electric Industrial Co., Ltd. | Optical mount substrate, optical module, optical transmitter-receiver, optical transmitter-receiver system, and manufacturing method of optical mount substrate |
| EP1312946A4 (en) * | 2000-08-17 | 2006-05-03 | Matsushita Electric Ind Co Ltd | Optical mounting board, optical module, optical transmitter/receiver, optical transmitting/receiving system, and method for manufacturing optical mounting board |
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